CN106249546B - Negative photosensitive resin composition - Google Patents
Negative photosensitive resin composition Download PDFInfo
- Publication number
- CN106249546B CN106249546B CN201610388093.9A CN201610388093A CN106249546B CN 106249546 B CN106249546 B CN 106249546B CN 201610388093 A CN201610388093 A CN 201610388093A CN 106249546 B CN106249546 B CN 106249546B
- Authority
- CN
- China
- Prior art keywords
- photosensitive resin
- resin composition
- negative photosensitive
- insulating film
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 title claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 23
- 229920006243 acrylic copolymer Polymers 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 15
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims description 14
- -1 oxime ester compound Chemical class 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000011161 development Methods 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 7
- 239000000654 additive Substances 0.000 claims description 4
- 230000000996 additive effect Effects 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 38
- DNIAPMSPPWPWGF-UHFFFAOYSA-N propylene glycol Substances CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- XHZCGLONCCWGHA-UHFFFAOYSA-N ethyl propanoate;propane-1,2-diol Chemical compound CC(O)CO.CCOC(=O)CC XHZCGLONCCWGHA-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- FNBHVKBYRFDOJK-UHFFFAOYSA-N 1-butoxypropan-2-yl propanoate Chemical compound CCCCOCC(C)OC(=O)CC FNBHVKBYRFDOJK-UHFFFAOYSA-N 0.000 description 2
- ODDDCGGSPAPBOS-UHFFFAOYSA-N 1-ethoxypropan-2-yl propanoate Chemical compound CCOCC(C)OC(=O)CC ODDDCGGSPAPBOS-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- DOVZUKKPYKRVIK-UHFFFAOYSA-N 1-methoxypropan-2-yl propanoate Chemical compound CCC(=O)OC(C)COC DOVZUKKPYKRVIK-UHFFFAOYSA-N 0.000 description 2
- RVNBCIQRFGXLRD-UHFFFAOYSA-N 1-propoxypropan-2-yl propanoate Chemical compound CCCOCC(C)OC(=O)CC RVNBCIQRFGXLRD-UHFFFAOYSA-N 0.000 description 2
- RVGLEPQPVDUSOJ-UHFFFAOYSA-N 2-Methyl-3-hydroxypropanoate Chemical compound COC(=O)CCO RVGLEPQPVDUSOJ-UHFFFAOYSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 2
- XYVQFUJDGOBPQI-UHFFFAOYSA-N Methyl-2-hydoxyisobutyric acid Chemical compound COC(=O)C(C)(C)O XYVQFUJDGOBPQI-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- ILVGAIQLOCKNQA-UHFFFAOYSA-N propyl 2-hydroxypropanoate Chemical compound CCCOC(=O)C(C)O ILVGAIQLOCKNQA-UHFFFAOYSA-N 0.000 description 2
- 229940090181 propyl acetate Drugs 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- FUWDFGKRNIDKAE-UHFFFAOYSA-N 1-butoxypropan-2-yl acetate Chemical compound CCCCOCC(C)OC(C)=O FUWDFGKRNIDKAE-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 description 1
- ICPWFHKNYYRBSZ-UHFFFAOYSA-M 2-methoxypropanoate Chemical compound COC(C)C([O-])=O ICPWFHKNYYRBSZ-UHFFFAOYSA-M 0.000 description 1
- JVTAAEKCZFNVCJ-UHFFFAOYSA-M Lactate Chemical compound CC(O)C([O-])=O JVTAAEKCZFNVCJ-UHFFFAOYSA-M 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- YCCCTDWBNCWPAX-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C1=CC=CC=C1C(O)=O Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C1=CC=CC=C1C(O)=O YCCCTDWBNCWPAX-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- CQHKDHVZYZUZMJ-UHFFFAOYSA-N [2,2-bis(hydroxymethyl)-3-prop-2-enoyloxypropyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(CO)COC(=O)C=C CQHKDHVZYZUZMJ-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- PSSYEWWHQGPWGA-UHFFFAOYSA-N [2-hydroxy-3-[2-hydroxy-3-(2-hydroxy-3-prop-2-enoyloxypropoxy)propoxy]propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(O)COCC(O)COCC(O)COC(=O)C=C PSSYEWWHQGPWGA-UHFFFAOYSA-N 0.000 description 1
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- VXANATZLMNZGEV-UHFFFAOYSA-N butoxymethyl acetate Chemical compound CCCCOCOC(C)=O VXANATZLMNZGEV-UHFFFAOYSA-N 0.000 description 1
- IKRARXXOLDCMCX-UHFFFAOYSA-N butyl 2-butoxypropanoate Chemical compound CCCCOC(C)C(=O)OCCCC IKRARXXOLDCMCX-UHFFFAOYSA-N 0.000 description 1
- VUEYQLJAKGLDNR-UHFFFAOYSA-N butyl 2-ethoxyacetate Chemical compound CCCCOC(=O)COCC VUEYQLJAKGLDNR-UHFFFAOYSA-N 0.000 description 1
- FYRUCHOYGVFKLZ-UHFFFAOYSA-N butyl 2-ethoxypropanoate Chemical compound CCCCOC(=O)C(C)OCC FYRUCHOYGVFKLZ-UHFFFAOYSA-N 0.000 description 1
- VFGRALUHHHDIQI-UHFFFAOYSA-N butyl 2-hydroxyacetate Chemical compound CCCCOC(=O)CO VFGRALUHHHDIQI-UHFFFAOYSA-N 0.000 description 1
- IWPATTDMSUYMJV-UHFFFAOYSA-N butyl 2-methoxyacetate Chemical compound CCCCOC(=O)COC IWPATTDMSUYMJV-UHFFFAOYSA-N 0.000 description 1
- JDJWQETUMXXWPD-UHFFFAOYSA-N butyl 2-methoxypropanoate Chemical compound CCCCOC(=O)C(C)OC JDJWQETUMXXWPD-UHFFFAOYSA-N 0.000 description 1
- BMOACRKLCOIODC-UHFFFAOYSA-N butyl 3-butoxypropanoate Chemical compound CCCCOCCC(=O)OCCCC BMOACRKLCOIODC-UHFFFAOYSA-N 0.000 description 1
- MVWVAXBILFBQIZ-UHFFFAOYSA-N butyl 3-ethoxypropanoate Chemical compound CCCCOC(=O)CCOCC MVWVAXBILFBQIZ-UHFFFAOYSA-N 0.000 description 1
- MENWVOUYOZQBDM-UHFFFAOYSA-N butyl 3-hydroxypropanoate Chemical compound CCCCOC(=O)CCO MENWVOUYOZQBDM-UHFFFAOYSA-N 0.000 description 1
- NPCIWFUNUUCNOM-UHFFFAOYSA-N butyl 3-propoxypropanoate Chemical compound CCCCOC(=O)CCOCCC NPCIWFUNUUCNOM-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical class OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- HMONIZCCNGYDDJ-UHFFFAOYSA-N ethyl 2-butoxypropanoate Chemical compound CCCCOC(C)C(=O)OCC HMONIZCCNGYDDJ-UHFFFAOYSA-N 0.000 description 1
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 1
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 description 1
- GFUIDHWFLMPAGY-UHFFFAOYSA-N ethyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)O GFUIDHWFLMPAGY-UHFFFAOYSA-N 0.000 description 1
- ZANNOFHADGWOLI-UHFFFAOYSA-N ethyl 2-hydroxyacetate Chemical compound CCOC(=O)CO ZANNOFHADGWOLI-UHFFFAOYSA-N 0.000 description 1
- JLEKJZUYWFJPMB-UHFFFAOYSA-N ethyl 2-methoxyacetate Chemical compound CCOC(=O)COC JLEKJZUYWFJPMB-UHFFFAOYSA-N 0.000 description 1
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 description 1
- ZXONMBCEAFIRDT-UHFFFAOYSA-N ethyl 2-propoxyacetate Chemical compound CCCOCC(=O)OCC ZXONMBCEAFIRDT-UHFFFAOYSA-N 0.000 description 1
- GIRSHSVIZQASRJ-UHFFFAOYSA-N ethyl 3-butoxypropanoate Chemical compound CCCCOCCC(=O)OCC GIRSHSVIZQASRJ-UHFFFAOYSA-N 0.000 description 1
- UKDLORMZNPQILV-UHFFFAOYSA-N ethyl 3-hydroxypropanoate Chemical compound CCOC(=O)CCO UKDLORMZNPQILV-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- LLACVNYOVGHAKH-UHFFFAOYSA-N ethyl 3-propoxypropanoate Chemical compound CCCOCCC(=O)OCC LLACVNYOVGHAKH-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- QBVBLLGAMALJGB-UHFFFAOYSA-N methyl 2-butoxypropanoate Chemical compound CCCCOC(C)C(=O)OC QBVBLLGAMALJGB-UHFFFAOYSA-N 0.000 description 1
- PPFNAOBWGRMDLL-UHFFFAOYSA-N methyl 2-ethoxyacetate Chemical compound CCOCC(=O)OC PPFNAOBWGRMDLL-UHFFFAOYSA-N 0.000 description 1
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 description 1
- YSGBMDFJWFIEDF-UHFFFAOYSA-N methyl 2-hydroxy-3-methylbutanoate Chemical compound COC(=O)C(O)C(C)C YSGBMDFJWFIEDF-UHFFFAOYSA-N 0.000 description 1
- VABBJJOSOCPYIT-UHFFFAOYSA-N methyl 2-methoxypropanoate Chemical compound COC(C)C(=O)OC VABBJJOSOCPYIT-UHFFFAOYSA-N 0.000 description 1
- AVVSSORVCLNBOS-UHFFFAOYSA-N methyl 2-propoxyacetate Chemical compound CCCOCC(=O)OC AVVSSORVCLNBOS-UHFFFAOYSA-N 0.000 description 1
- VBCSBEIIIFLVQV-UHFFFAOYSA-N methyl 3-butoxypropanoate Chemical compound CCCCOCCC(=O)OC VBCSBEIIIFLVQV-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- DMHHINXESLPPMV-UHFFFAOYSA-N methyl 3-propoxypropanoate Chemical compound CCCOCCC(=O)OC DMHHINXESLPPMV-UHFFFAOYSA-N 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- DAZXVJBJRMWXJP-UHFFFAOYSA-N n,n-dimethylethylamine Chemical compound CCN(C)C DAZXVJBJRMWXJP-UHFFFAOYSA-N 0.000 description 1
- GNVRJGIVDSQCOP-UHFFFAOYSA-N n-ethyl-n-methylethanamine Chemical compound CCN(C)CC GNVRJGIVDSQCOP-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- GYOCIFXDRJJHPF-UHFFFAOYSA-N propyl 2-butoxypropanoate Chemical compound CCCCOC(C)C(=O)OCCC GYOCIFXDRJJHPF-UHFFFAOYSA-N 0.000 description 1
- ADOFEJQZDCWAIL-UHFFFAOYSA-N propyl 2-ethoxyacetate Chemical compound CCCOC(=O)COCC ADOFEJQZDCWAIL-UHFFFAOYSA-N 0.000 description 1
- GXKPKHWZTLSCIB-UHFFFAOYSA-N propyl 2-ethoxypropanoate Chemical compound CCCOC(=O)C(C)OCC GXKPKHWZTLSCIB-UHFFFAOYSA-N 0.000 description 1
- FIABMSNMLZUWQH-UHFFFAOYSA-N propyl 2-methoxyacetate Chemical compound CCCOC(=O)COC FIABMSNMLZUWQH-UHFFFAOYSA-N 0.000 description 1
- CYIRLFJPTCUCJB-UHFFFAOYSA-N propyl 2-methoxypropanoate Chemical compound CCCOC(=O)C(C)OC CYIRLFJPTCUCJB-UHFFFAOYSA-N 0.000 description 1
- BMVTVMIDGMNRRR-UHFFFAOYSA-N propyl 2-propoxyacetate Chemical compound CCCOCC(=O)OCCC BMVTVMIDGMNRRR-UHFFFAOYSA-N 0.000 description 1
- HJIYVZIALQOKQI-UHFFFAOYSA-N propyl 3-butoxypropanoate Chemical compound CCCCOCCC(=O)OCCC HJIYVZIALQOKQI-UHFFFAOYSA-N 0.000 description 1
- IYVPXMGWHZBPIR-UHFFFAOYSA-N propyl 3-ethoxypropanoate Chemical compound CCCOC(=O)CCOCC IYVPXMGWHZBPIR-UHFFFAOYSA-N 0.000 description 1
- KNCDNPMGXGIVOM-UHFFFAOYSA-N propyl 3-hydroxypropanoate Chemical compound CCCOC(=O)CCO KNCDNPMGXGIVOM-UHFFFAOYSA-N 0.000 description 1
- JCMFJIHDWDKYIL-UHFFFAOYSA-N propyl 3-methoxypropanoate Chemical compound CCCOC(=O)CCOC JCMFJIHDWDKYIL-UHFFFAOYSA-N 0.000 description 1
- YTUFRRBSSNRYID-UHFFFAOYSA-N propyl 3-propoxypropanoate Chemical compound CCCOCCC(=O)OCCC YTUFRRBSSNRYID-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Liquid Crystal (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
The present invention relates to a negative photosensitive resin composition, and more particularly, to a negative photosensitive resin composition which is used for forming an organic insulating film on a substrate having a color filter pattern formed thereon in the production of a liquid crystal display device having a color filter array (array) structure, and which has excellent flatness and excellent sensitivity, resolution, and adhesiveness.
Description
Technical Field
The present invention relates to a negative photosensitive resin composition, and more particularly, to a negative photosensitive resin composition which is used for forming an organic insulating film on a substrate having a color filter pattern formed thereon in the production of a liquid crystal display device having a color filter array (array) structure, and which has excellent flatness and excellent sensitivity, resolution, and adhesiveness.
Background
In recent years, many efforts have been made to improve the luminance of a display for a liquid crystal display device. As a method for improving brightness, liquid crystal display device manufacturers in order to improve a cooperation margin
In addition, a COT liquid crystal display device having a COT structure and a white (white) structure in which a color filter is formed on the same substrate as the thin film transistor array element is manufactured using an organic insulating film.
In the COT structure, since the color filter is located on the thin film transistor array substrate, many problems occur in the reliability of the liquid crystal display device, and it is desired to solve the problems occurring in the reliability by using an organic insulating film.
However, in the case of a COT liquid crystal display device having a white structure, there is a difference in height (step) between a white (white) region and an RGB color region, and an insulating layer formed by applying a conventional organic insulating film is not flat and takes a semicircular shape, and in this case, the step between the center portion and the edge portion of the pattern becomes large. If the difference in level of the pattern becomes large, a decrease in luminance occurs due to the difference in refractive index at different positions. .
Therefore, there is a strong demand for the development of an organic insulating film for improving the flatness, which can planarize the difference in level between the white region and the RGB color region of the COT liquid crystal display device having a white structure.
Disclosure of Invention
In order to solve the problems of the conventional techniques described above, an object of the present invention is to provide a negative photosensitive resin composition having excellent flatness, sensitivity, resolution, and adhesion by including ethoxylated dipentaerythritol hexaacrylate having a specific structure.
Another object of the present invention is to provide a display element including an organic insulating film formed by the above method for forming an organic insulating film.
In order to achieve the above object, the present invention provides a negative photosensitive resin composition comprising:
a) an acrylic copolymer, a copolymer of acrylic acid,
b) ethoxylated dipentaerythritol hexaacrylate of the following chemical formula 1,
c) a photo-initiator,
d) a solvent;
[ chemical formula 1]
In the formula, a to f are each independently an integer of 2 to 36.
Preferably, the negative photosensitive resin composition is characterized by comprising:
a) 100 parts by weight of an acrylic copolymer,
b) 10 to 300 parts by weight of the ethoxylated dipentaerythritol hexaacrylate of chemical formula 1,
c) 0.1 to 30 parts by weight of a photoinitiator,
d) 10-500 parts by weight of a solvent.
In addition, the invention provides a method for forming an organic insulating film of a display element using the negative photosensitive resin composition.
The negative photosensitive resin composition according to the present invention can significantly improve the difference in level between a white (white) region and an RGB color region when used as an organic insulating film in a display for a COT liquid crystal display device having a white structure, by providing an organic insulating film having excellent flatness, sensitivity, resolution, and adhesion.
Detailed Description
The present invention is described in detail below.
The negative photosensitive resin composition of the present invention is characterized by comprising: a) an acrylic copolymer, b) ethoxylated dipentaerythritol hexaacrylate of the following chemical formula 1, c) a photoinitiator, d) a solvent,
[ chemical formula 1]
In the formula, a to f are each independently an integer of 2 to 36.
Preferably, the negative photosensitive resin composition is characterized by comprising:
a) 100 parts by weight of an acrylic copolymer,
b) 10 to 300 parts by weight of the ethoxylated dipentaerythritol hexaacrylate of chemical formula 1,
c) 0.1 to 30 parts by weight of a photoinitiator,
d) 10-500 parts by weight of a solvent.
In the negative photosensitive resin composition of the present invention, as the acrylic copolymer of the above-mentioned a), a known acrylic copolymer used in the negative photosensitive resin composition can be used, and the acrylic copolymer can be contained in an amount of 100 parts by weight relative to the total weight of the composition.
The acrylic copolymer of a) above preferably has a polystyrene-equivalent weight average molecular weight (Mw) of 3000 to 30000. In the case of the organic insulating film having a polystyrene-reduced weight average molecular weight of less than 3000, there is a problem that the developability, the residual film rate, and the like are reduced or the pattern development, the heat resistance, and the like are deteriorated, and in the case of the interlayer insulating film having a polystyrene-reduced weight average molecular weight of more than 30000, there is a problem that the pattern development is deteriorated.
The ethoxylated dipentaerythritol hexaacrylate of b) used in the present invention has the structure of the above chemical formula 1. Preferably, in the above chemical formula 1, a to f are each independently an integer of 10 to 25, more preferably, a to f are the same integer. In this case, the step of the COT substrate having a white structure can be significantly improved.
The content of the ethoxylated dipentaerythritol hexaacrylate represented by the chemical formula 1 of the above b) is preferably 10 to 300 parts by weight, more preferably 50 to 200 parts by weight, based on 100 parts by weight of the acrylic copolymer of the above a). When the content is less than 10 parts by weight, it is difficult to expect improvement of the level difference of the COT substrate having a white structure, and when the content exceeds 300 parts by weight, there is a problem that the resolution and the adhesiveness are lowered.
The photoinitiator of c) used in the present invention may be a known photoinitiator used for a negative photosensitive resin composition, and preferably, an oxime ester compound may be used.
The content of the photoinitiator is preferably 0.1 to 30 parts by weight based on 100 parts by weight of the acrylic copolymer of a). When the content is less than 0.1 part by weight, the residual film ratio is deteriorated due to low sensitivity, and when the content exceeds 30 parts by weight, the developability is deteriorated and the resolution is lowered.
The solvent of d) used in the present invention provides flatness to the organic insulating film and prevents uneven coating to form a uniform pattern profile.
The solvent may be a known solvent generally used for a negative photosensitive resin composition for forming an organic insulating film, and specific examples thereof include propylene glycol monoethyl propionate
Propylene glycol alkyl ether acetates such as propylene glycol methyl ether propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionate and propylene glycol butyl ether propionate; alcohols such as methanol and ethanol; ethers such as tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as methyl cellosolve acetate and ethyl cellosolve acetate; diethylene glycols such as diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and diethylene glycol dimethyl ether; propylene glycol monoalkyl ethers such as propylene glycol methyl ether, propylene glycol ethyl ether, propylene glycol propyl ether, and propylene glycol butyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate and propylene glycol butyl ether acetate; aromatic hydrocarbons such as toluene and xylene; ketones such as methyl ethyl ketone, cyclohexanone, and 4-hydroxy-4-methyl-2-pentanone; or methyl acetate, ethyl acetate, propyl acetate, butyl acetate, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-2-methylpropionate, methyl glycolate, ethyl glycolate, butyl glycolate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate, methyl 2-hydroxy-3-methylbutyrate, methyl methoxyacetate, ethyl methoxyacetate, propyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, propyl ethoxyacetate, butyl ethoxyacetate, methyl propoxylacetate, ethyl propoxylacetate, propyl propoxylacetate, ethyl propoxyphyllacetate, methyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, ethyl lactate, propyl lactate, butyl lactate, methyl 3-hydroxypropionate, ethyl, Propoxy butyl acetate, butoxy methyl acetate, butoxy ethyl acetate, butoxy propyl acetate, butoxy butyl acetate, 2-methoxypropionic acid methyl ester, 2-methoxypropionic acid ethyl ester, 2-methoxypropionic acid propyl ester, 2-methoxypropionic acid butyl ester, 2-ethoxypropionic acid methyl ester, 2-ethoxypropionic acid ethyl ester, 2-ethoxypropionic acid propyl ester, 2-ethoxypropionic acid butyl ester, 2-butoxypropionic acid methyl ester, 2-butoxypropionic acid ethyl ester, 2-butoxypropionic acid propyl ester, 2-butoxypropionic acid butyl ester, 3-methoxypropionic acid methyl ester, 3-methoxypropionic acid ethyl ester, 3-methoxypropionic acid propyl ester, 3-ethoxypropionic acid methyl ester, 3-ethoxypropionic acid ethyl esterEsters, such as propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, methyl 3-propoxypropionate, ethyl 3-propoxypropionate, propyl 3-propoxypropionate, butyl 3-propoxypropionate, methyl 3-butoxypropionate, ethyl 3-butoxypropionate, propyl 3-butoxypropionate, and butyl 3-butoxypropionate. One or more of them may be mixed and used as required.
In particular, the solvent is preferably selected from propylene glycol monoethyl propionate which has excellent solubility and reactivity with each component and is easy to form a coating film
Propylene glycol alkyl ether acetates such as propylene glycol methyl ether propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionate, and propylene glycol butyl ether propionate.
Preferably, the solvent is contained in an amount of 10 to 500 parts by weight based on 100 parts by weight of the acrylic copolymer a).
In addition, the negative photosensitive resin composition of the present invention may further include a polyfunctional monomer having an ethylenically unsaturated bond. Specific examples of the polyfunctional monomer include mixtures of one or more monomers selected from dipentaerythritol hexaacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, phthalic acid diacrylate, polyethylene glycol diacrylate, tetraethylene glycol diacrylate, tricyclodecane dimethanol diacrylate, triglycerol diacrylate, triacryloxyethyl isocyanurate, trimethylolpropane triacrylate derivatives, and methacrylates thereof.
The content of the polyfunctional monomer having an ethylenically unsaturated bond and the total content of the ethoxylated dipentaerythritol hexaacrylate represented by the chemical formula 1 of the above b) are 10 to 300 parts by weight, preferably 50 to 200 parts by weight, based on 100 parts by weight of the acrylic copolymer of the above a).
In order to improve specific physical properties as required, the negative photosensitive resin composition of the present invention may further include conventional additives used in various negative photosensitive resin compositions, and preferably, the additives may be a silane coupling agent or a surfactant.
Preferably, the additives are used independently in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the acrylic copolymer of a).
In addition, the present invention provides a method for forming an organic insulating film of a display device using the negative photosensitive resin composition.
Preferably, the above-mentioned organic insulating film forming method provides an organic insulating film forming method of a display element including the steps of coating the negative photosensitive resin composition of the present invention on a substrate, heat-treating, developing, and then curing.
In the present invention, the heat treatment and curing may be performed at a normal temperature for the negative photosensitive resin composition.
In this case, the thickness of the organic insulating film formed by the above method, various conditions, and the like are not particularly limited, and may be set in a range used for general device fabrication. Therefore, it is needless to say that a known method can be appropriately selected and used by those skilled in the art for other matters than the negative photosensitive resin composition. More specifically, the method of forming the organic insulating film using the negative photosensitive resin composition for the display element is exemplified as follows.
First, the negative photosensitive resin composition of the present invention is applied to the surface of a substrate by a spray method, a roll coating method, a spin coating method, or the like, and the solvent is removed by prebaking, thereby forming a coating film. In this case, the heat treatment is preferably performed at a temperature of 80 to 130 ℃ for 1 to 5 minutes.
Then, the coating film formed as described above is irradiated with visible light, ultraviolet light, far ultraviolet light, electron beam, X-ray, or the like according to a pattern prepared in advance, developed with a developing solution, and unnecessary portions are removed to form a predetermined pattern.
The developing solution is preferably an alkaline aqueous solution, and specifically, inorganic bases such as sodium hydroxide, potassium hydroxide, sodium carbonate and the like can be used; primary amines such as n-propylamine; secondary amines such as diethylamine and n-propylamine; tertiary amines such as trimethylamine, methyldiethylamine, dimethylethylamine and triethylamine; alkanolamines such as dimethylethanolamine, methyldiethanolamine, and triethanolamine; or an aqueous solution of a quaternary ammonium salt such as tetramethylammonium hydroxide or tetraethylammonium hydroxide. In this case, the developer may be used by dissolving the alkali compound at a concentration of 0.1 to 10% by weight, and an appropriate amount of a water-soluble organic solvent such as methanol or ethanol and a surfactant may be added.
Further, after the development with the developer, the organic insulating film may be dried to form a pattern by removing unnecessary portions by washing with ultrapure water for 50 to 180 seconds, and the pattern may be selectively irradiated with light such as ultraviolet rays and then cured at a temperature of 150 to 250 ℃ for 30 to 90 minutes by a heating device such as an oven to obtain a final organic insulating film.
Further, the present invention can provide a display element including an organic insulating film formed by the above method for forming an organic insulating film of a display element.
The organic insulating film can be used as an organic insulating film for various displays, and is particularly suitable for a display for a COT liquid crystal display device having a white structure.
Hereinafter, preferred examples are disclosed to aid understanding of the present invention, but the following examples merely illustrate the present invention, and the scope of the present invention is not limited to the following examples.
Examples 1 to 6: production of negative photosensitive resin composition
An acrylic copolymer having a weight average molecular weight (Mw) of 5000, ethoxylated dipentaerythritol hexaacrylate represented by chemical formula 1, an oxime ester photoinitiator, dipentaerythritol hexaacrylate as an ethylenically unsaturated polyfunctional monomer, a silane coupling agent, and a surfactant were mixed according to the composition described in table 1 below, and propylene glycol monoethyl propionate as a solvent was added to the mixture
And dissolved, and then filtered with a 0.2 μm microporous filter to prepare a negative photosensitive resin composition coating solution.
Comparative example: production of negative photosensitive resin composition
A negative photosensitive resin composition was produced in the same manner as in examples 1 to 6 above, except that a conventional polyfunctional monomer was used instead of the ethoxylated dipentaerythritol hexaacrylate represented by chemical formula 1, and the composition shown in table 1 below was used.
[ Table 1]
Test of
The negative photosensitive resin compositions produced in examples 1 to 6 and comparative examples were used to evaluate physical properties by the following methods, and the results are shown in table 2.
1. Preparing a COT substrate having a white structure
A Red (Red Color) resist (resist) was coated on a cleaned glass plate, and then pre-baked on a hot plate at 90 ℃ for 100 seconds. The exposure was performed with an exposure of 100mJ/sq.cm using a photomask, and then development was performed for 60 seconds using a 0.04% KOH developing solution, and curing was further performed for 30 minutes in a Convection Oven (Convection Oven) at 230 ℃.
In the above method, Green (Green) and Blue (Blue) resists are applied, respectively, and then cured (curing) is performed. The white pattern is formed by a dark pattern of a photomask in a Red (Red Color) resist exposure process.
The thickness of the RGB color after curing was formed to be 2.5 μm.
2. Organic insulating film Process
The prepared COT substrate having a white structure was coated with a photosensitive resin composition for an organic insulating film, and then prebaked on a hot plate at 90 ℃ for 100 seconds. After exposure with a photomask at an exposure of 5 to 70mJ/sq.cm, development was carried out for 100 seconds using a 2.38% TMAH developer, and curing was further carried out for 30 seconds in a Convection Oven (Convection Oven) at 230 ℃.
1) Difference of height
After the organic insulating film step 2 was performed on the COT substrate having the white structure 1, the step difference was measured by Tencor, which is a contact thickness measuring device, with the optimum sensitivity of the organic insulating film in the white region and the RGB color region.
2) Sensitivity of the probe
The organic insulating film process was performed at different exposure amounts by the same process as the above-described 1) step measurement method, and then the time when the thickness of the organic insulating film was saturated in RGB colors was designated as the optimum sensitivity.
3) Resolution power
The pore size of the organic insulating film was measured at the white portion at the optimum sensitivity by an optical microscope through the same procedure as in the step measurement method of 1) above.
4) Adhesion force
The measurement was performed by the same procedure as the method for measuring the height difference of 1) above, and then the size of the pattern from which the organic film was peeled was measured by an optical microscope.
[ Table 2]
As can be seen from table 2, the negative photosensitive resin compositions of examples 1 to 6 according to the present invention exhibited a significant effect of improving the level difference as compared with the compositions of comparative examples.
Claims (8)
1. A negative photosensitive resin composition for an organic insulating film of a display device including a white region and an RGB region, comprising:
a) 100 parts by weight of an acrylic copolymer,
b) 10 to 300 parts by weight of ethoxylated dipentaerythritol hexaacrylate of the following chemical formula 1,
c) 0.1 to 30 parts by weight of a photoinitiator,
d) 10-500 parts by weight of a solvent;
chemical formula 1
In the formula, a to f are each independently an integer of 10 to 25.
2. The negative photosensitive resin composition according to claim 1, wherein a to f of b) the ethoxylated dipentaerythritol hexaacrylate of chemical formula 1 are the same integer.
3. The negative photosensitive resin composition according to claim 1, wherein the photoinitiator is an oxime ester compound.
4. The negative photosensitive resin composition according to claim 1, further comprising a polyfunctional monomer having an ethylenically unsaturated bond.
5. The negative photosensitive resin composition according to claim 1, further comprising an additive.
6. A method of forming an organic insulating film of a display element, comprising: a method of coating the negative photosensitive resin composition according to any one of claims 1 to 5 on a substrate, prebaking, and then performing exposure, development, and curing.
7. A display element comprising the organic insulating film according to claim 6.
8. The display element according to claim 7, which is a COT liquid crystal display device having a white structure.
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| KR1020150078709A KR102438341B1 (en) | 2015-06-03 | 2015-06-03 | Negative photosensitive resin composition |
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| JPH1062986A (en) * | 1996-08-21 | 1998-03-06 | Fuji Photo Film Co Ltd | Radiation sensitive colored composition |
| KR100685933B1 (en) * | 2003-08-25 | 2007-02-22 | 엘지.필립스 엘시디 주식회사 | Manufacturing method of liquid crystal display device |
| JP2006234849A (en) * | 2005-02-21 | 2006-09-07 | Nec Lcd Technologies Ltd | Liquid crystal display device and driving method used for the liquid crystal display device |
| JP5164409B2 (en) * | 2006-09-28 | 2013-03-21 | 富士フイルム株式会社 | PHOTOCURABLE COMPOSITION, COLOR FILTER, ITS MANUFACTURING METHOD, AND SOLID-STATE IMAGING DEVICE |
| JP2008250295A (en) * | 2007-03-05 | 2008-10-16 | Fujifilm Corp | Colored photosensitive composition for color filter, color filter, method for producing the same, and liquid crystal display device |
| KR101265313B1 (en) * | 2009-12-22 | 2013-05-16 | 주식회사 엘지화학 | Photo-sensitive composition to improve adhesion of patterns |
| JP5526868B2 (en) * | 2010-03-03 | 2014-06-18 | Ｊｓｒ株式会社 | Radiation-sensitive resin composition, display element spacer and protective film, and method for forming them |
| WO2013051805A2 (en) * | 2011-10-02 | 2013-04-11 | Kolon Industries, Inc | Photosensitive resin composition |
| KR101688464B1 (en) * | 2011-10-02 | 2016-12-22 | 코오롱인더스트리 주식회사 | Photopolymerizable Resin Composition |
| KR101848094B1 (en) * | 2011-12-02 | 2018-04-12 | 엘지디스플레이 주식회사 | RESIN COMPOSITION FOR SPACER AND METHOD OF FABRICATING COT type Array Substrate Method USING the same |
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| KR20160142672A (en) | 2016-12-13 |
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