CN106240127A - A kind of manufacture method of halogen-free flame-retardant copper-clad plate - Google Patents

A kind of manufacture method of halogen-free flame-retardant copper-clad plate Download PDF

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Publication number
CN106240127A
CN106240127A CN201610600076.7A CN201610600076A CN106240127A CN 106240127 A CN106240127 A CN 106240127A CN 201610600076 A CN201610600076 A CN 201610600076A CN 106240127 A CN106240127 A CN 106240127A
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China
Prior art keywords
halogen
clad plate
manufacture method
free flame
parts
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Pending
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CN201610600076.7A
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Chinese (zh)
Inventor
李洪彬
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Chongqing Dekai Industry Ltd By Share Ltd
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Chongqing Dekai Industry Ltd By Share Ltd
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Priority to CN201610600076.7A priority Critical patent/CN106240127A/en
Publication of CN106240127A publication Critical patent/CN106240127A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/22—Halogen free composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

The invention discloses the manufacture method of a kind of halogen-free flame-retardant copper-clad plate, its step includes: join glue: prepare glue by following parts by weight of component, and mix homogeneously: nitrogen-containing epoxy thermoset 50～70 parts, phosphorous epoxy resin 30～50 parts, polyphenylene oxide resin 50～75 parts, DICY firming agent 20～50 parts, firming agent accelerator 0.05～1 part, inorganic filler 30～80 parts, solvent 200～400 parts；Gluing；Overlapping, compacting.The present invention uses has the most halogen-containing nitrogen-containing epoxy thermoset and phosphorous epoxy resin as matrix resin, add the polyphenylene oxide resin that thermostability is high, electrical property is excellent, add DICY firming agent, firming agent accelerator, inorganic filler and solvent, through overbaking, overlapping, compressing.Copper-clad plate after compressing, has higher Tg value and good electrical property, and fire resistance can reach V 0 grade (UL94 standard).

Description

A kind of manufacture method of halogen-free flame-retardant copper-clad plate
Technical field
The present invention is the manufacture method of a kind of halogen-free flame-retardant copper-clad plate, belongs to copper-clad plate technical field.
Background technology
After the harmful substance of European Union and China's Mainland limits instruction ROHS implements successively, comprise lead, cadmium, hydrargyrum, Cr VI, The materials such as PBBs and PBDEs must not be used for manufacturing electronic product or its assembly；Green peace organization (GreenPeace) the greening policy that present stage promotes energetically, it is desirable to all of manufacturer gets rid of the bromine in its electronic product completely Flame retardant and polrvinyl chloride, have unleaded and halogen-free environment-friendly electronic concurrently to meet.But still there is a lot of circuit board row at present Industry can use bromine-containing compound, because brominated flame retardant flame retardant effect is excellent, and cost is relatively low；Halogenide when ignition, Can discharge the hydrogen halide that a large amount of toxicity is big, corrosivity is strong, this gas not only pollutes environment, also can cause health Certain infringement, and in Hydrocarbon in the case of there is bromine and chlorine, can produce two English in low temperature partial combustion process Deng extremely toxic substance.Therefore, it is necessary to it is preferable to develop a kind of combination property, and without halogen, the copper-clad plate that flame retardant effect is good Manufacture method, is the problems referred to above to solve.
Summary of the invention
The deficiency existed for prior art, it is an object of the present invention to provide the making side of a kind of halogen-free flame-retardant copper-clad plate Method.
To achieve these goals, the present invention is to realize by the following technical solutions: a kind of halogen-free flame-retardant covers copper The manufacture method of plate, its step includes:
1) glue is joined: prepare glue, and mix homogeneously by following parts by weight of component；
2) gluing: by glass fabric gluing, dries at vertical gluing machine and prepares prepreg, gluing speed be 17～ 22m/min, controls parameter: gelation time is 100～130S, and resin content is 40～50%, fluidity 20%～30%；
3) overlapping, suppress: pressing parameter controls: vacuum: 0～0.01Mpa, pressure: 450～550PSI, heat up speed Rate: 2～3 DEG C/min, temperature of heat plate: 120～230 DEG C, the press time 120～180min；
The chemical structural formula of described nitrogen-containing epoxy thermoset is:
The chemical structural formula of described phosphorous epoxy resin is:
Further, the nitrogen content in described glue is 4.0～8.0wt%, and phosphorus content is 1.25～3wt%.
Further, described firming agent accelerator be 2-ethyl-4-methylimidazole, 2-methylimidazole, 2-ethyl imidazol(e) or One or more in 2-phenylimidazole.
Further, described inorganic filler is micron-class superfine aluminium hydroxide and/or silicon dioxide, and its particle diameter D50 is 1.6-3.2um。
Further, during described solvent elects acetone, butanone or propylene glycol methyl ether acetate as one or more.
Beneficial effects of the present invention: the present invention uses has the most halogen-containing nitrogen-containing epoxy thermoset and phosphorous epoxy resin work For matrix resin, add the polyphenylene oxide resin that thermostability is high, electrical property is excellent, add DICY firming agent, firming agent accelerator, Inorganic filler and solvent, through overbaking, overlapping, compressing.Copper-clad plate after compressing, has higher Tg value with good Electrical property, and fire resistance can reach V-0 level (UL94 standard).
Detailed description of the invention
For the technological means making the present invention realize, creation characteristic, reach purpose and be easy to understand with effect, below in conjunction with Detailed description of the invention, is expanded on further the present invention.
Unless stated otherwise, the glue component that the present invention relates to all can be by being either commercially available.
A kind of manufacture method of the halogen-free flame-retardant copper-clad plate of the present invention, its step includes:
1) glue is joined: prepare glue, and mix homogeneously by following parts by weight of component；
2) gluing: by glass fabric gluing, dries at vertical gluing machine and prepares prepreg, gluing speed be 17～ 22m/min, controls parameter: gelation time is 100～130S, and resin content is 40～50%, fluidity 20%～30%；
3) overlapping, suppress: pressing parameter controls: vacuum: 0～0.01Mpa, pressure: 450～550PSI, heat up speed Rate: 2～3 DEG C/min, temperature of heat plate: 120～230 DEG C, the press time 120～180min；
The chemical structural formula of described nitrogen-containing epoxy thermoset is:
The chemical structural formula of described phosphorous epoxy resin is:
The present invention uses has the most halogen-containing nitrogen-containing epoxy thermoset and phosphorous epoxy resin as matrix resin, by containing N structure and the cooperative flame retardant effect of phosphor-containing structure, be 4.0wt% at nitrogen content, when phosphorus content is 1.25wt%, i.e. can reach The fire-retardant rank of UL94V-0.It addition, by adding the polyphenylene oxide resin that thermostability is high, electrical property is excellent, improve the electricity of copper-clad plate Performance.
The preparation of embodiment one halogen-free flame-retardant copper-clad plate
1) modulation (weight portion) of insulating barrier glue formula:
Each component is sufficiently mixed uniform 8h, glue gel time 255S.
2) gluing: by glass fabric gluing, dries at vertical gluing machine and prepares prepreg, and gluing speed is 20m/ Min, controls parameter: gelation time is 120S, and resin content is 40%, fluidity 25%；
3) overlap, suppress: according to product thickness requirement, control pressing parameter:
Vacuum: 0.005Mpa；
Pressure: 500PSI；
Heating rate: 2 DEG C/min；
Temperature of heat plate: 120～230 DEG C；
Press time: 150min；
Wherein during temperature of heat plate 230 degree, the most also it is high pressure 500PSI, now runs about 55min；
Finally by sheet material outward appearance, interior material test passes, then pack shipment.
The preparation of embodiment two halogen-free flame-retardant copper-clad plate
1) modulation (weight portion) of insulating barrier glue formula:
Each component is sufficiently mixed uniform 8h, glue gel time 255S.
2) gluing: by glass fabric gluing, dries at vertical gluing machine and prepares prepreg, and gluing speed is 22m/ Min, controls parameter: gelation time is 120S, and resin content is 45%, fluidity 20%；
3) overlap, suppress: according to product thickness requirement, control pressing parameter:
Vacuum: 0.005Mpa；
Pressure: 500PSI；
Heating rate: 2 DEG C/min；
Temperature of heat plate: 120～230 DEG C；
Press time: 150min；
Wherein during temperature of heat plate 230 degree, the most also it is high pressure 500PSI, now runs about 55min；
Finally by sheet material outward appearance, interior material test passes, then pack shipment.
The preparation of embodiment three halogen-free flame-retardant copper-clad plate
1) modulation (weight portion) of insulating barrier glue formula:
Each component is sufficiently mixed uniform 8h, glue gel time 255S.
2) gluing: by glass fabric gluing, dries at vertical gluing machine and prepares prepreg, and gluing speed is 22m/ Min, controls parameter: gelation time is 120S, and resin content is 45%, fluidity 20%；
3) overlap, suppress: according to product thickness requirement, control pressing parameter:
Vacuum: 0.01Mpa；
Pressure: 550PSI；
Heating rate: 2 DEG C/min；
Temperature of heat plate: 120～230 DEG C；
Press time: 150min；
Wherein during temperature of heat plate 230 degree, the most also it is high pressure 550PSI, now runs about 60min；
Finally by sheet material outward appearance, interior material test passes, then pack shipment.
By step and with reference to the glue in above three embodiment, the test data of prepared halogen-free flame-retardant copper-clad plate For:
The ultimate principle of the present invention and principal character and advantages of the present invention are more than shown and described, for this area skill For art personnel, it is clear that the invention is not restricted to the details of above-mentioned one exemplary embodiment, and without departing substantially from the present invention spirit or In the case of basic feature, it is possible to realize the present invention in other specific forms.Therefore, no matter from the point of view of which point, all should be by Embodiment regards exemplary as, and is nonrestrictive, the scope of the present invention by claims rather than on state Bright restriction, it is intended that include all changes fallen in the implication of equivalency and scope of claim in the present invention In.Should not be considered as limiting involved claim by any reference in claim.
Although moreover, it will be appreciated that this specification is been described by according to embodiment, but the most each embodiment only wraps Containing an independent technical scheme, this narrating mode of description is only that for clarity sake those skilled in the art should Description can also be formed those skilled in the art through appropriately combined as an entirety, the technical scheme in each embodiment May be appreciated other embodiments.

Claims (5)

1. a manufacture method for halogen-free flame-retardant copper-clad plate, its step includes:
1) glue is joined: prepare glue, and mix homogeneously by following parts by weight of component；
Nitrogen-containing epoxy thermoset 50～70；
Phosphorous epoxy resin 30～50；
Polyphenylene oxide resin 50～75；
DICY firming agent 20～50；
Firming agent accelerator 0.05～1；
Inorganic filler 30～80；
Solvent 200～400；
2) gluing: by glass fabric gluing, dries at vertical gluing machine and prepares prepreg, and gluing speed is 17～22m/ Min, controls parameter: gelation time is 100～130S, and resin content is 40～50%, fluidity 20%～30%；
3) overlap, suppress: pressing parameter controls: vacuum: 0～0.01Mpa, pressure: 450～550PSI, heating rate: 2 ～3 DEG C/min, temperature of heat plate: 120～230 DEG C, press time 120～180min；
The chemical structural formula of described nitrogen-containing epoxy thermoset is:
The chemical structural formula of described phosphorous epoxy resin is:
The manufacture method of a kind of halogen-free flame-retardant copper-clad plate the most according to claim 1, it is characterised in that: in described glue Nitrogen content be 4.0～8.0wt%, phosphorus content is 1.25～3wt%.
The manufacture method of a kind of halogen-free flame-retardant copper-clad plate the most according to claim 2, it is characterised in that: described firming agent Accelerator is one or more in 2-ethyl-4-methylimidazole, 2-methylimidazole, 2-ethyl imidazol(e) or 2-phenylimidazole.
The manufacture method of a kind of halogen-free flame-retardant copper-clad plate the most according to claim 2, it is characterised in that: described inorganic fill out Material is micron-class superfine aluminium hydroxide and/or silicon dioxide, and its particle diameter D50 is 1.6-3.2um.
The manufacture method of a kind of halogen-free flame-retardant copper-clad plate the most according to claim 2, it is characterised in that: described solvent selects For in acetone, butanone or propylene glycol methyl ether acetate one or more.
CN201610600076.7A 2016-07-27 2016-07-27 A kind of manufacture method of halogen-free flame-retardant copper-clad plate Pending CN106240127A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019127992A1 (en) * 2017-12-29 2019-07-04 洛阳尖端技术研究院 Prepreg, composite material, and preparation methods therefor and uses thereof

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CN103694644A (en) * 2013-12-30 2014-04-02 景旺电子科技(龙川)有限公司 Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof
CN104002525A (en) * 2014-04-18 2014-08-27 南通诺德电子有限公司 Making method for high TG halogen-free LOW Dk/Df copper-clad plate
CN105348743A (en) * 2015-12-07 2016-02-24 浙江华正新材料股份有限公司 Halogen-free resin composition, prepreg and laminated board
CN105778848A (en) * 2016-04-28 2016-07-20 中山新高电子材料股份有限公司 Low-dielectric-constant adhesive for flexible printed circuit boards and application method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103694644A (en) * 2013-12-30 2014-04-02 景旺电子科技(龙川)有限公司 Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof
CN104002525A (en) * 2014-04-18 2014-08-27 南通诺德电子有限公司 Making method for high TG halogen-free LOW Dk/Df copper-clad plate
CN105348743A (en) * 2015-12-07 2016-02-24 浙江华正新材料股份有限公司 Halogen-free resin composition, prepreg and laminated board
CN105778848A (en) * 2016-04-28 2016-07-20 中山新高电子材料股份有限公司 Low-dielectric-constant adhesive for flexible printed circuit boards and application method thereof

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019127992A1 (en) * 2017-12-29 2019-07-04 洛阳尖端技术研究院 Prepreg, composite material, and preparation methods therefor and uses thereof

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Application publication date: 20161221