CN106231806A - Fixing, the stripper apparatus of microwave circuit boards and method for screening solder paste - Google Patents

Fixing, the stripper apparatus of microwave circuit boards and method for screening solder paste Download PDF

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Publication number
CN106231806A
CN106231806A CN201610650464.6A CN201610650464A CN106231806A CN 106231806 A CN106231806 A CN 106231806A CN 201610650464 A CN201610650464 A CN 201610650464A CN 106231806 A CN106231806 A CN 106231806A
Authority
CN
China
Prior art keywords
circuit boards
microwave circuit
template
matrix
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610650464.6A
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Chinese (zh)
Inventor
李辉
杜鹃
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Radio Equipment Research Institute
Original Assignee
Shanghai Radio Equipment Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Radio Equipment Research Institute filed Critical Shanghai Radio Equipment Research Institute
Priority to CN201610650464.6A priority Critical patent/CN106231806A/en
Publication of CN106231806A publication Critical patent/CN106231806A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0195Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention relates to fixing, the stripper apparatus of a kind of microwave circuit boards for screening solder paste, comprise: matrix, inside is provided with vacuum chamber, and top surface is offered multiple and vacuum chamber the first adsorption hole;Vacuum pump, is connected with vacuum chamber, utilizes vacuum pump that internal vacuum chamber extracts air, maintains the pressure differential between internal vacuum chamber and the external world;Template, is arranged on baseline top, utilizes first adsorption hole absorption the fixed form on baseline top surface;Run through in this template and offer multiple second adsorption hole, microwave circuit boards is arranged on die head, utilize the second adsorption hole in template to adsorb and fix microwave circuit boards and carry out screening solder paste.The invention still further relates to fixing, the release method of a kind of microwave circuit boards for screening solder paste.Present configuration is simple, easy to use, can adjust template and the planform of matrix according to the geomery of microwave circuit boards, meets fixing, the demoulding requirement of various microwave circuit boards during screening solder paste.

Description

Fixing, the stripper apparatus of microwave circuit boards and method for screening solder paste
Technical field
The present invention relates to a kind of fixing, stripper apparatus and the method for microwave circuit boards, specifically refer to a kind of simple use Fixing, the stripper apparatus of microwave circuit boards during screening solder paste and method.
Background technology
In prior art, fixing, the release method of common printed circuit board when there is screening solder paste, and according to this Manufacture screen process press, such as QSY-340 type screen process press.To printed circuit board (PCB) when this screen process press has a Printing Paste It is fixed and the device of the demoulding.But the fixing and stripper apparatus of this screen process press be suitable only for thickness at more than 1mm and There is the printed circuit board (PCB) of certain rigidity, and require that printed circuit board (PCB) must have at least 3 through holes, by this through hole, print Printed circuit board (PCB) can be supported and fixing by the fixing thimble of brush machine.Therefore, this screen process press is not suitable at microwave Carrying out Printing Paste on circuit board, because the thickness of microwave circuit boards is at about 0.254mm, and flexibility is bigger.
Based on above-mentioned, need badly at present and propose the fixing of a kind of microwave circuit boards for screening solder paste and demoulding dress Put.
Summary of the invention
It is an object of the invention to provide fixing, stripper apparatus and the side of a kind of microwave circuit boards for screening solder paste Method, simple in construction, easy to use, template and the planform of matrix can be adjusted according to the shape and size of microwave circuit boards, full Fixing, the demoulding requirement of various microwave circuit boards during foot screening solder paste.
For achieving the above object, the present invention provides fixing, the demoulding of a kind of microwave circuit boards for screening solder paste Device, comprises: matrix, is internally provided with vacuum chamber, and top surface offers multiple and vacuum chamber the first adsorption hole; Vacuum pump, is connected with the vacuum chamber of described matrix, utilizes vacuum pump that the internal vacuum chamber of matrix is extracted air, maintains vacuum Pressure differential between chamber interior and the external world;Template, is arranged on described baseline top, utilizes the first of baseline top surface to adsorb Hole absorption fixed form;Run through in this template and offer multiple second adsorption hole, microwave circuit boards is arranged on described mould The top of plate, utilizes the second adsorption hole in template to adsorb and fixes microwave circuit boards and carry out screening solder paste.
The bottom of described matrix is provided with base plate, and matrix, more than the base area of matrix, is fixedly installed on by its area The center of this base plate.
The edge of described base plate offers multiple detent, by fixing screw, fixes and regulate the peace of matrix Holding position.
Multiple first adsorption holes offered on the top surface of described matrix are arranged in array.
The profile of the figure that multiple second adsorption holes offered in described template rearrange and microwave circuit boards is mutually Join, microwave circuit boards is adsorbed and is fixed on the position with the second adsorption hole restriction.
Described vacuum pump is connected with the vacuum chamber of described matrix by trachea.
The present invention also provides for fixing, the release method of a kind of microwave circuit boards for screening solder paste, comprises following Step:
S1, when carrying out the silk screen printing of microwave circuit boards, template is placed on the top of matrix, then microwave circuit boards is placed on The top of template, and it is positioned in template the figure rearranged by the second adsorption hole;
S2, open vacuum pump, the internal vacuum chamber of matrix is extracted air, keeps the pressure between internal vacuum chamber and the external world Difference;
S3, utilize first adsorption hole on baseline top surface template adsorbed and be fixed on matrix, utilize second in template Microwave circuit boards is adsorbed and is fixed in template by adsorption hole, completes the fixing of microwave circuit boards;
S4, on microwave circuit boards, place plates for screen printing, make the small opening of plates for screen printing and the pad one on microwave circuit boards One is corresponding, and Printing Paste on plates for screen printing;
S5, complete the silk screen printing of microwave circuit boards after, take off plates for screen printing, close vacuum pump, internal vacuum chamber is with extraneous Between pressure difference ends, microwave circuit boards is taken off from template, completes the demoulding of microwave circuit boards.
Multiple first adsorption holes offered on the top surface of described matrix are arranged in array.
The profile of the figure that multiple second adsorption holes offered in described template rearrange and microwave circuit boards is mutually Join, microwave circuit boards is adsorbed and is fixed on the position with the second adsorption hole restriction.
Fixing, the stripper apparatus of the microwave circuit boards for screening solder paste provided by the present invention and method, manufacture Low cost, flexible and changeable, it is particularly suitable for the screening solder paste of small lot microwave circuit boards;Can be according to outside microwave circuit boards Shape dimensional requirement makes various matched templates, and by suitably changing size or the structure of matrix so that the present invention Device can be suitably used for multiple occasion, fixing, the stripper apparatus of microwave circuit boards when being the screening solder paste of a kind of Simple And Practical.
Accompanying drawing explanation
Fig. 1 is fixing, the structural representation of stripper apparatus of the microwave circuit boards for screening solder paste in the present invention Figure.
Detailed description of the invention
Below in conjunction with Fig. 1, describe a preferred embodiment of the present invention in detail.
As it is shown in figure 1, fixing, the stripper apparatus of the microwave circuit boards for screening solder paste provided for the present invention, Comprise: matrix 1, be internally provided with vacuum chamber, top surface offers multiple and vacuum chamber the first adsorption hole 5;Very Empty pump 8, is connected with the vacuum chamber of described matrix 1, utilizes vacuum pump 8 that the internal vacuum chamber of matrix 1 is extracted air, remains true Pressure differential between empty chamber interior and the external world;Template 3, is arranged on described matrix 1 top, utilizes the of matrix 1 top surface One adsorption hole 5 absorption fixed form 3;Run through in this template 3 and offer multiple second adsorption hole 4, microwave circuit boards is arranged At the top of described template 3, utilize the second adsorption hole 4 in template 3 to adsorb and fix microwave circuit boards and carry out silk screen printing Soldering paste.
The bottom of described matrix 1 is provided with base plate 9, and its area, more than the base area of matrix 1, sets fixing for matrix 1 Put the center at this base plate 9.
The edge of described base plate 9 offers multiple detent 2, by fixing screw 6, fixes and regulates matrix 1 Installation site.
Multiple first adsorption holes 5 offered on the top surface of described matrix 1 are arranged in array.
The profile phase of the figure that multiple second adsorption holes 4 offered in described template 3 rearrange and microwave circuit boards Coupling, adsorbs microwave circuit boards and is fixed on the position limited with the second adsorption hole 4.Microwave according to different overall dimensions Circuit board, corresponding can customize the various templates 3 matched with it, thus meet the screening solder paste of various microwave circuit boards Fixing, demoulding demand.
Described vacuum pump 8 is connected with the vacuum chamber of described matrix 1 by trachea 7.
The present invention also provides for fixing, the release method of a kind of microwave circuit boards for screening solder paste, comprises following Step:
S1, when carrying out the silk screen printing of microwave circuit boards, template 3 is placed on the top of matrix 1, then microwave circuit boards is put Put the top in template 3, and be positioned in template 3 figure rearranged by the second adsorption hole 4;
S2, open vacuum pump 8, the internal vacuum chamber of matrix 1 is extracted air, keeps the pressure between internal vacuum chamber and the external world Difference;
S3, utilize the first adsorption hole 5 of matrix 1 top surface template 3 adsorbed and be fixed on matrix 1, utilize in template 3 Microwave circuit boards is adsorbed and is fixed in template 3 by the second adsorption hole 4, completes the fixing of microwave circuit boards;
S4, on microwave circuit boards, place plates for screen printing, make the small opening of plates for screen printing and the pad one on microwave circuit boards One is corresponding, and Printing Paste on plates for screen printing;
S5, complete the silk screen printing of microwave circuit boards after, take off plates for screen printing, close vacuum pump 8, due to internal vacuum chamber with Pressure difference ends between the external world such that it is able to taken off from template 3 by microwave circuit boards smoothly, completes the de-of microwave circuit boards Mould.
Multiple first adsorption holes 5 offered on the top surface of described matrix 1 are arranged in array.
The profile phase of the figure that multiple second adsorption holes 4 offered in described template 3 rearrange and microwave circuit boards Coupling, adsorbs microwave circuit boards and is fixed on the position limited with the second adsorption hole 4.
In sum, the microwave circuit boards for screening solder paste provided by the present invention fixing, stripper apparatus and Method, by the principle of vac sorb, is fixed on template and microwave circuit boards on matrix, then carries out silk screen printing weldering Cream, finally closes vacuum pump, completes the demoulding of microwave circuit boards.
Fixing, the stripper apparatus of the microwave circuit boards for screening solder paste provided by the present invention and method, can have The problem that effect solves the screening solder paste on microwave circuit boards.Apparatus of the present invention low cost of manufacture, flexible and changeable, the suitableeest Close the screening solder paste of small lot microwave circuit boards.Owing to the microwave circuit boards of different profiles can be determined by template, therefore, The present invention can require to make various matched templates according to the overall dimensions of microwave circuit boards;And by suitably changing Become size or the structure of matrix so that apparatus of the present invention can be suitably used for multiple occasion, be the silk screen printing weldering of a kind of Simple And Practical Fixing, the stripper apparatus of microwave circuit boards during cream.
Although present disclosure has been made to be discussed in detail by above preferred embodiment, but it should be appreciated that above-mentioned Description is not considered as limitation of the present invention.After those skilled in the art have read foregoing, for the present invention's Multiple amendment and replacement all will be apparent from.Therefore, protection scope of the present invention should be limited to the appended claims.

Claims (9)

1. fixing, the stripper apparatus of the microwave circuit boards for screening solder paste, it is characterised in that comprise:
Matrix (1), is internally provided with vacuum chamber, and top surface offers multiple and vacuum chamber the first adsorption hole (5);
Vacuum pump (8), is connected with the vacuum chamber of described matrix (1), utilizes the vacuum pump (8) internal vacuum chamber to matrix (1) Extraction air, maintains the pressure differential between internal vacuum chamber and the external world;
Template (3), is arranged on described matrix (1) top, utilizes first adsorption hole (5) of matrix (1) top surface to adsorb also Fixed form (3);Run through in described template (3) and offer multiple second adsorption hole (4), microwave circuit boards is arranged on described The top of template (3), utilize the second adsorption hole (4) in template (3) to adsorb and fix microwave circuit boards and carry out silk screen printing Soldering paste.
2. fixing, the stripper apparatus of the microwave circuit boards for screening solder paste as claimed in claim 1, its feature exists In, the bottom of described matrix (1) is provided with base plate (9), and matrix (1), more than the base area of matrix (1), is fixed by its area It is arranged on the center of this base plate (9).
3. fixing, the stripper apparatus of the microwave circuit boards for screening solder paste as claimed in claim 2, its feature exists In, the edge of described base plate (9) offers multiple detent (2), by fixing screw (6), fixes and regulates matrix (1) installation site.
4. fixing, the stripper apparatus of the microwave circuit boards for screening solder paste as claimed in claim 1, its feature exists In, multiple first adsorption holes (5) that the top surface of described matrix (1) is offered are arranged in array.
5. fixing, the stripper apparatus of the microwave circuit boards for screening solder paste as claimed in claim 1, its feature exists In, the figure that multiple second adsorption holes (4) that described template (3) is offered rearrange and microwave circuit boards profile mutually Join, microwave circuit boards is adsorbed and is fixed on the position limited with the second adsorption hole (4).
6. fixing, the stripper apparatus of the microwave circuit boards for screening solder paste as claimed in claim 1, its feature exists In, described vacuum pump (8) is connected with the vacuum chamber of described matrix (1) by trachea (7).
7. fixing, the release method of the microwave circuit boards for screening solder paste, it is characterised in that comprise following step Rapid:
S1, when carrying out the silk screen printing of microwave circuit boards, template (3) is placed on the top of matrix (1), then by microwave circuit boards It is placed on the top of template (3), and is positioned in template (3) figure rearranged by the second adsorption hole (4);
S2, open vacuum pump (8), the internal vacuum chamber of matrix (1) is extracted air, keeps between internal vacuum chamber and the external world Pressure differential;
S3, utilize first adsorption hole (5) of matrix (1) top surface template (3) adsorbed and be fixed on matrix (1), utilize Microwave circuit boards is adsorbed and is fixed in template (3) by the second adsorption hole (4) in template (3), completes consolidating of microwave circuit boards Fixed;
S4, on microwave circuit boards, place plates for screen printing, make the small opening of plates for screen printing and the pad one on microwave circuit boards One is corresponding, and Printing Paste on plates for screen printing;
S5, complete the silk screen printing of microwave circuit boards after, take off plates for screen printing, close vacuum pump (8), internal vacuum chamber is with outer Pressure difference ends between boundary, takes off microwave circuit boards from template (3), completes the demoulding of microwave circuit boards.
8. fixing, the release method of the microwave circuit boards for screening solder paste as claimed in claim 7, its feature exists In, multiple first adsorption holes (5) that the top surface of described matrix (1) is offered are arranged in array.
9. fixing, the release method of the microwave circuit boards for screening solder paste as claimed in claim 7, its feature exists In, the figure that multiple second adsorption holes (4) that described template (3) is offered rearrange and microwave circuit boards profile mutually Join, microwave circuit boards is adsorbed and is fixed on the position limited with the second adsorption hole (4).
CN201610650464.6A 2016-08-10 2016-08-10 Fixing, the stripper apparatus of microwave circuit boards and method for screening solder paste Pending CN106231806A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610650464.6A CN106231806A (en) 2016-08-10 2016-08-10 Fixing, the stripper apparatus of microwave circuit boards and method for screening solder paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610650464.6A CN106231806A (en) 2016-08-10 2016-08-10 Fixing, the stripper apparatus of microwave circuit boards and method for screening solder paste

Publications (1)

Publication Number Publication Date
CN106231806A true CN106231806A (en) 2016-12-14

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ID=57547874

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Application Number Title Priority Date Filing Date
CN201610650464.6A Pending CN106231806A (en) 2016-08-10 2016-08-10 Fixing, the stripper apparatus of microwave circuit boards and method for screening solder paste

Country Status (1)

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CN (1) CN106231806A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1863437A (en) * 2005-05-09 2006-11-15 华泰电子股份有限公司 Printing device and use method thereof
CN201067992Y (en) * 2007-07-27 2008-06-04 佛山市顺德区汉达精密电子科技有限公司 Printing appliance
JP2010212643A (en) * 2009-03-09 2010-09-24 Samsung Electro-Mechanics Co Ltd Mask support device and printing device for printed circuit board equipped therewith
TW201034923A (en) * 2009-03-26 2010-10-01 Kuan-Chieh Su Vacuum haptor for adsorbing passive component's tray
CN103568506A (en) * 2012-08-08 2014-02-12 鸿富锦精密工业(深圳)有限公司 Screen printing device
CN105235366A (en) * 2015-11-09 2016-01-13 惠州Tcl移动通信有限公司 Printed circuit board (PCB) fixing device of solder paste printer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1863437A (en) * 2005-05-09 2006-11-15 华泰电子股份有限公司 Printing device and use method thereof
CN201067992Y (en) * 2007-07-27 2008-06-04 佛山市顺德区汉达精密电子科技有限公司 Printing appliance
JP2010212643A (en) * 2009-03-09 2010-09-24 Samsung Electro-Mechanics Co Ltd Mask support device and printing device for printed circuit board equipped therewith
TW201034923A (en) * 2009-03-26 2010-10-01 Kuan-Chieh Su Vacuum haptor for adsorbing passive component's tray
CN103568506A (en) * 2012-08-08 2014-02-12 鸿富锦精密工业(深圳)有限公司 Screen printing device
CN105235366A (en) * 2015-11-09 2016-01-13 惠州Tcl移动通信有限公司 Printed circuit board (PCB) fixing device of solder paste printer

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Application publication date: 20161214