CN106216856A - 双焦点激光加工系统及其加工方法 - Google Patents
双焦点激光加工系统及其加工方法 Download PDFInfo
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- CN106216856A CN106216856A CN201610702499.XA CN201610702499A CN106216856A CN 106216856 A CN106216856 A CN 106216856A CN 201610702499 A CN201610702499 A CN 201610702499A CN 106216856 A CN106216856 A CN 106216856A
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- laser
- led wafer
- laser beam
- focus
- polaroid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/704—Beam dispersers, e.g. beam wells
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Dicing (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610702499.XA CN106216856B (zh) | 2016-08-22 | 2016-08-22 | 双焦点激光加工系统及其加工方法 |
Applications Claiming Priority (1)
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CN201610702499.XA CN106216856B (zh) | 2016-08-22 | 2016-08-22 | 双焦点激光加工系统及其加工方法 |
Publications (2)
Publication Number | Publication Date |
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CN106216856A true CN106216856A (zh) | 2016-12-14 |
CN106216856B CN106216856B (zh) | 2019-04-16 |
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CN201610702499.XA Active CN106216856B (zh) | 2016-08-22 | 2016-08-22 | 双焦点激光加工系统及其加工方法 |
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CN (1) | CN106216856B (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108500477A (zh) * | 2018-03-29 | 2018-09-07 | 大族激光科技产业集团股份有限公司 | Led晶圆片的切割方法及切割装置 |
CN108515273A (zh) * | 2018-03-29 | 2018-09-11 | 大族激光科技产业集团股份有限公司 | Led晶圆片的切割装置及切割方法 |
CN109175700A (zh) * | 2018-10-30 | 2019-01-11 | 奔腾激光(温州)有限公司 | 一种具有自清洁功能的激光焊接方法 |
CN109848573A (zh) * | 2017-11-30 | 2019-06-07 | 北京中科镭特电子有限公司 | 一种激光切割装置 |
CN109865938A (zh) * | 2017-12-05 | 2019-06-11 | 株式会社迪思科 | 晶片的加工方法 |
CN110291627A (zh) * | 2019-04-15 | 2019-09-27 | 厦门市三安光电科技有限公司 | 一种led芯粒及led芯片的隐形切割方法 |
CN111014948A (zh) * | 2019-11-29 | 2020-04-17 | 大族激光科技产业集团股份有限公司 | 双焦点激光加工系统及方法 |
CN113894426A (zh) * | 2020-06-22 | 2022-01-07 | 大族激光科技产业集团股份有限公司 | 一种半导体晶片的激光加工方法及系统 |
CN115335184A (zh) * | 2020-04-06 | 2022-11-11 | 浜松光子学株式会社 | 激光加工装置和激光加工方法 |
WO2022252137A1 (zh) * | 2021-06-02 | 2022-12-08 | 泉州三安半导体科技有限公司 | 发光二极管及其制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005161330A (ja) * | 2003-11-28 | 2005-06-23 | Sumitomo Heavy Ind Ltd | レーザ加工方法及び装置 |
CN1826206A (zh) * | 2003-05-30 | 2006-08-30 | Xsil技术有限公司 | 光束的双焦点聚焦 |
TW201248203A (en) * | 2011-05-18 | 2012-12-01 | Uni Via Technology Inc | Apparatus and method for transforming a laser beam |
CN203197464U (zh) * | 2013-04-24 | 2013-09-18 | 伊欧激光科技(苏州)有限公司 | 利用偏光特性的多重激光加工装置 |
TW201628753A (zh) * | 2014-11-10 | 2016-08-16 | 康寧公司 | 使用多焦點之透明物品的雷射處理 |
-
2016
- 2016-08-22 CN CN201610702499.XA patent/CN106216856B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1826206A (zh) * | 2003-05-30 | 2006-08-30 | Xsil技术有限公司 | 光束的双焦点聚焦 |
JP2005161330A (ja) * | 2003-11-28 | 2005-06-23 | Sumitomo Heavy Ind Ltd | レーザ加工方法及び装置 |
TW201248203A (en) * | 2011-05-18 | 2012-12-01 | Uni Via Technology Inc | Apparatus and method for transforming a laser beam |
CN203197464U (zh) * | 2013-04-24 | 2013-09-18 | 伊欧激光科技(苏州)有限公司 | 利用偏光特性的多重激光加工装置 |
TW201628753A (zh) * | 2014-11-10 | 2016-08-16 | 康寧公司 | 使用多焦點之透明物品的雷射處理 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109848573A (zh) * | 2017-11-30 | 2019-06-07 | 北京中科镭特电子有限公司 | 一种激光切割装置 |
CN109865938A (zh) * | 2017-12-05 | 2019-06-11 | 株式会社迪思科 | 晶片的加工方法 |
CN109865938B (zh) * | 2017-12-05 | 2022-04-08 | 株式会社迪思科 | 晶片的加工方法 |
CN108500477A (zh) * | 2018-03-29 | 2018-09-07 | 大族激光科技产业集团股份有限公司 | Led晶圆片的切割方法及切割装置 |
CN108515273A (zh) * | 2018-03-29 | 2018-09-11 | 大族激光科技产业集团股份有限公司 | Led晶圆片的切割装置及切割方法 |
CN109175700A (zh) * | 2018-10-30 | 2019-01-11 | 奔腾激光(温州)有限公司 | 一种具有自清洁功能的激光焊接方法 |
CN110291627A (zh) * | 2019-04-15 | 2019-09-27 | 厦门市三安光电科技有限公司 | 一种led芯粒及led芯片的隐形切割方法 |
CN111014948A (zh) * | 2019-11-29 | 2020-04-17 | 大族激光科技产业集团股份有限公司 | 双焦点激光加工系统及方法 |
CN111014948B (zh) * | 2019-11-29 | 2022-04-15 | 大族激光科技产业集团股份有限公司 | 双焦点激光加工系统及方法 |
CN115335184A (zh) * | 2020-04-06 | 2022-11-11 | 浜松光子学株式会社 | 激光加工装置和激光加工方法 |
CN113894426A (zh) * | 2020-06-22 | 2022-01-07 | 大族激光科技产业集团股份有限公司 | 一种半导体晶片的激光加工方法及系统 |
WO2022252137A1 (zh) * | 2021-06-02 | 2022-12-08 | 泉州三安半导体科技有限公司 | 发光二极管及其制作方法 |
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Publication number | Publication date |
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CN106216856B (zh) | 2019-04-16 |
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Effective date of registration: 20210906 Address after: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Patentee after: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Patentee after: Shenzhen Han's micromachining Software Technology Co.,Ltd. Address before: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
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Effective date of registration: 20211028 Address after: 518000 Han's laser office building 301325, No. 29, Gaoxin North Sixth Road, songpingshan community, Xili street, Nanshan District, Shenzhen, Guangdong Patentee after: Shenzhen Han's micromachining Software Technology Co.,Ltd. Address before: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Patentee before: Shenzhen Han's micromachining Software Technology Co.,Ltd. |
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