CN106216423A - A kind of production technology of ceramic copper-clad base plate high connductivity oxygen-free copper stripe - Google Patents
A kind of production technology of ceramic copper-clad base plate high connductivity oxygen-free copper stripe Download PDFInfo
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- CN106216423A CN106216423A CN201610637402.1A CN201610637402A CN106216423A CN 106216423 A CN106216423 A CN 106216423A CN 201610637402 A CN201610637402 A CN 201610637402A CN 106216423 A CN106216423 A CN 106216423A
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- copper
- oxygen
- less
- base plate
- stripe
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 162
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 159
- 239000010949 copper Substances 0.000 title claims abstract description 159
- 239000000919 ceramic Substances 0.000 title claims abstract description 32
- 238000005516 engineering process Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000005097 cold rolling Methods 0.000 claims abstract description 32
- 238000000137 annealing Methods 0.000 claims abstract description 25
- 238000005266 casting Methods 0.000 claims abstract description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000001301 oxygen Substances 0.000 claims abstract description 13
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 13
- 238000002161 passivation Methods 0.000 claims abstract description 13
- 238000004140 cleaning Methods 0.000 claims abstract description 9
- 239000002585 base Substances 0.000 claims description 25
- 238000003723 Smelting Methods 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- 238000002360 preparation method Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 10
- 239000002994 raw material Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 8
- 238000010894 electron beam technology Methods 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 239000003610 charcoal Substances 0.000 claims description 6
- 238000005253 cladding Methods 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- 230000003746 surface roughness Effects 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- 239000000243 solution Substances 0.000 claims description 4
- DYUQAZSOFZSPHD-UHFFFAOYSA-N Phenylpropyl alcohol Natural products CCC(O)C1=CC=CC=C1 DYUQAZSOFZSPHD-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 239000003513 alkali Substances 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000000498 cooling water Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- -1 phenylpropyl alcohol triazole Chemical class 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 238000005554 pickling Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 230000002441 reversible effect Effects 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 10
- 238000004134 energy conservation Methods 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000005096 rolling process Methods 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000001291 vacuum drying Methods 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/02—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
Abstract
The present invention relates to the production technology of a kind of ceramic copper-clad base plate high connductivity oxygen-free copper stripe, comprise the following steps: (1) high purity copper founding；(2) continuous up-casting technology prepares copper bar；(3) copper strip billet is produced with continuously extruded unit；(4) cold mill complex rolling；(5) annealing；(6) cold rolling；(7) aligning；(8) Cleaning and Passivation；(9) cut.The ceramic copper-clad base plate high connductivity oxygen-free copper stripe that the present invention produces has copper content height, oxygen content is low, conductivity is high, plastic deformation ability is high and surface quality advantages of higher, and this technological process is short, efficient, energy-conservation.
Description
Technical field
The present invention relates to technical field of nonferrous metal processing, especially relate to a kind of ceramic copper-clad base plate high connductivity anaerobic
The production technology of copper strips.
Background technology
Power electronic devices and power model are widely used in Aeronautics and Astronautics, high-speed railway, electric automobile, wind-powered electricity generation, the sun
The fields such as energy, intelligent grid, high-end equipment, robot, high-power IGBT device extensive market；Ceramic copper-clad plate had both had pottery
High-termal conductivity, high electrical insulating properties, high mechanical properties, the characteristic such as low bulk, there is again the high conductivity of oxygen-free copper metal and excellent
Different welding performance, is the indispensable key foundation material of IGBT power module package.Ceramic copper-clad plate is by high connductivity
A kind of composite cermet substrate that oxygen-free copper is at high temperature bonded directly to ceramic surface and is formed, it had both had the height of pottery
The characteristics such as heat conductivity, high electrical insulating properties, high mechanical properties, low bulk, have again high conductivity and the excellence of oxygen-free copper metal
Welding performance, and various figure can be etched as PCB, it is that field of power electronics power module package connects chip
Critical material with heat radiation substrate.
Aluminium oxide and aluminium nitride ceramic copper-clad substrate substrate are the core key parts in device encapsulation.Domestic aluminium oxide,
Aluminum nitride ceramic substrate has started to domesticize, but the high-performance ceramic copper-clad base plate whole dependence on import of high connductivity oxygen-free copper stripe,
Become the bottleneck of restriction domestic production IGBT device.Traditional handicraft prepares the preparation of ceramic copper-clad base plate high connductivity oxygen-free copper stripe
Technique is: the multi-pass cold rolling multi-pass annealing of vacuum drying oven melting ingot casting heating hot rolling milling face is cleaned cold
Roll cleaning to cut.The copper strips that this technique produces, can not meet needs at aspects such as copper content, oxygen content, conductivitys.
Summary of the invention
For the existing problems of prior art, it is an object of the invention to provide a kind of ceramic copper-clad base plate high connductivity anaerobic
The production technology of copper strips, the ceramic copper-clad base plate high connductivity oxygen-free copper stripe purity that this invention produces is high, oxygen content is low, conductivity
High, surface quality height, technological process simultaneously is short, efficient, energy-conservation.
For reaching above-mentioned purpose, the present invention is achieved by the following technical solutions:
The production technology of a kind of ceramic copper-clad base plate high connductivity oxygen-free copper stripe, comprises the following steps:
(1) high purity copper founding: with No. 1 standard cathode copper as raw material, uses vacuum electron beam melting, solidification, removes impurity element.
(2) continuous up-casting copper bar: as raw material, high purity copper is entered in smelting apparatus with the high purity copper of preparation in step (1)
Row fusing, uses Linesless charcoal or graphite flakes to cover copper liquid surface, uses and draw copper bar on traction link seat.
(3) continuously extruded: with the copper bar of preparation in step (2) as raw material, use continuously extruded unit to produce copper strip billet；
(4) cold rolling: to use cold mill complex that copper strips blank is rolled；
(5) annealing: use bright annealing equipment that cold rolling rear copper strips is annealed；
(6) cold rolling: to use reversible hydraulic cold mill complex that the copper strips after annealing is rolled；
(7) aligning: use aligning unit that copper strips template is controlled；
(8) Cleaning and Passivation: the copper strips after cold rolling is carried out passivation, utilizes alkali liquor that copper strips carries out defat, defat reserving liquid tank
Use oily water separation technique, use the sulfuric acid solution of 10% that copper strips is carried out pickling, use the pin brush rough polishing and 5000 of 600 mesh
Mesh 3M brush carries out essence throwing, by the phenylpropyl alcohol triazole aqueous solution Passivation Treatment that concentration is 0.2% at 75 DEG C after polishing；
(9) cut: use cutting apparatus that copper strips is cut.
The one-tenth of the high purity copper ingot casting in described step (1) is grouped into: copper content be more than 99.999%, oxygen content≤
0.0005%, conductivity >=102.5%IACS；Electron gun working vacuum degree during described vacuum electron beam melting is less than 3 × 10- 3Pa, working chamber's vacuum is less than 3 × 10-2Pa, accelerating potential 30KV.Cooling water flow is more than 380l/h, and hauling speed is
2mm/min。
In described step (2), smelting apparatus includes crystallizer, smelting furnace and holding furnace, and the leaving water temperature of crystallizer is for being less than
28 DEG C, the temperature of described smelting furnace is 1135 DEG C, and the temperature of holding furnace is 1130 DEG C；Described smelting furnace uses the wooden carbon dried
Covering, the granularity of described Linesless charcoal is 30mm-38mm, and cladding thickness is 150mm-180mm；Described holding furnace uses graphite phosphorus sheet to cover
Lid, cladding thickness is 30mm-35mm.
Bar speed of drawing in described step (2) is 20mm/min, and drawing shank diameter is Ф 30mm；The continuous up-casting of described preparation
The copper content of copper bar be more than 99.999%, oxygen content≤0.0005%, conductivity >=102.5%IACS.
In described step (3), continuous extruder rotating speed is 2.5r/min；The copper strip billet width of preparation is 330mm, and thickness is
20mm, the horizontal tolerance of copper strip billet is less than 0.007mm, and the horizontal tolerance of copper strip billet is less than 0.007mm.
In described step (4), cold rolling pass is assigned as 20mm-15mm-10mm-6mm-4mm-2.5mm-1.5mm-1mm；Roll
Pressing pressure≤5000KN, mill speed≤80m/min, roll forward pull 32-35KN, backward pull 51-55KN.
Annealing temperature in described step (5) is 210 DEG C, annealing time 6h；Bright annealing equipment uses hydrogen and nitrogen
Mixed gas is as protective gas, and wherein hydrogen accounts for 15%；Programming rate is 60 DEG C/h, 15 hours cool times；After annealing,
The tensile strength of copper strips is less than 210MPa, and elongation percentage is more than 55%, and the grain size of copper strips is 0.005-0.01mm.
Cold rolling in described step (6) is two passes, and cold rolling pass is assigned as 1mm-0.75mm-0.6mm；Draught pressure
≤1000KN；The gloss level of roll wherein used is less than 0.1 μm；The tensile strength of described cold rolling rear copper strips is 350-
360MPa, hardness HV is 106-116, and conductivity is more than 101.5%IACS, and copper strip surface roughness is less than 0.35 μm.
In described step (7), forward pull controls at 0.5-0.8KN, and backward pull controls copper strips after 0.2-0.3KN, aligning
Template is less than 5I, and thickness deviation is less than ± 0.001mm.
In described step (9), gap blade is 0.06mm, and the drafts of cutter shaft is 0.30mm；The side camber of every meter of copper strips
Degree is less than 1mm less than 1mm, the transverse curvature degree of every meter of copper strips, and the torsion resistance of every meter of copper strips is less than 5 °.
The production technology of the present invention a kind of ceramic copper-clad base plate high connductivity oxygen-free copper stripe has the advantages that
1, using vacuum electron beam melting technique, go the removal of impurity, wherein the copper content of high purity copper ingot casting is more than 99.999%；Use
High purity copper is raw material, utilizes Shang Yin technical battery cast copper bar, utilizes the online degasification of copper liquid, deoxidation equipment to ensure the high-performance of copper material,
Wherein copper content is more than 99.999%, oxygen content≤0.0005%, conductivity >=102.5%IACS.
2, continual extruding technology is used to combine with cold rolling technology, it is provided that the copper strips of excellent performance, wherein tensile strength
For 350-360MPa, hardness HV:106-116, conductivity is more than 101.5%IACS, and copper strip surface roughness is less than 0.35 μm.
3, flow process of the present invention is short, efficient, energy-conservation.The present invention saves ingot casting heating, hot rolling, cutting edge compared with traditional handicraft
Etc. operation, providing the benefit that energy efficient more than 30%, lumber recovery reaches more than 75%.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is further illustrated, but protection scope of the present invention is not limited to
This.
Embodiment 1
The production procedure of 1 one kinds of ceramic copper-clad base plate high connductivity oxygen-free copper stripes of the present embodiment is: draw in high purity copper founding even
The continuously extruded cold rolled annealed cold rolling aligning Cleaning and Passivation of cast copper bar is cut.
It concretely comprises the following steps:
(1) high purity copper founding: with No. 1 standard cathode copper as raw material, uses vacuum electron beam melting, solidification, removes impurity element.
The one-tenth of high purity copper ingot casting is grouped into: copper content be more than 99.999%, oxygen content≤0.0005%, conductivity >=102.5%IACS；
Electron gun working vacuum degree during described vacuum electron beam melting is less than 3 × 10-3Pa, working chamber's vacuum is less than 3 × 10- 2Pa, accelerating potential 30KV.Cooling water flow is more than 380l/h, and hauling speed is 2mm/min.
(2) continuous up-casting
, to be melted in smelting apparatus by high purity copper as raw material with the high purity copper of preparation in step (1), use Linesless charcoal or stone
Ink scale covers copper liquid surface, uses and draws copper bar on traction link seat.
Smelting apparatus includes crystallizer, smelting furnace and holding furnace, and the leaving water temperature of crystallizer is less than 28 DEG C, described melting
The temperature of stove is 1135 DEG C, and the temperature of holding furnace is 1130 DEG C；Described smelting furnace uses the wooden carbon dried to cover, described Linesless charcoal
Granularity be 30mm-38mm, cladding thickness is 150mm-180mm；Described holding furnace uses graphite phosphorus sheet to cover, and cladding thickness is
30mm-35mm。
It is provided with compartment between fusing stove and holding furnace, described fusing stove, is connected by stream ditch between compartment and holding furnace, institute
State stream ditch and exceed furnace bottom 300mm, online depassing unit is installed in described compartment, is filled with in copper liquid by online depassing unit
The CO (carbon monoxide converter) gas of 99.996%, and by controlled rotation graphite shaft and rotor, by the CO (carbon monoxide converter) gas press-in copper of metering
In liquid and be dispersed as micro-bubble so that it is be uniformly dispersed in copper liquid, source outlet pressure 1.5MPa, flow 2.5Nm3/ h,
Described rotor speed control is at 100-120r/min.
The bar speed of drawing of continuous up-casting is 20mm/min, and drawing shank diameter is Ф 30mm.The one-tenth of continuous up-casting copper bar is grouped into
For: copper content is more than 99.9992%, and oxygen content is 0.0002%, and conductivity is 102.7%IACS.
(3) continuously extruded
With the copper bar of preparation in step (2) as raw material, continuously extruded unit is used to produce copper strip billet；Continuous extruder rotating speed is
2.5r/min；The copper strip billet width of preparation is 330mm, and thickness is 20mm, and the horizontal tolerance of copper strip billet is less than 0.007mm, copper strips
The horizontal tolerance of base is less than 0.007mm.
(4) cold rolling
Using cold mill complex that copper strips blank is carried out two passes, cold rolling pass is assigned as 20mm-15mm-10mm-6mm-
4mm-2.5mm-1.5mm-1mm；Draught pressure≤5000KN, mill speed≤80m/min, roll forward pull 32-35KN, posttension
Power 51-55KN.
(5) annealing
Use bright annealing equipment that cold rolling rear copper strips is annealed；Annealing temperature is 210 DEG C, annealing time 6h；Bright annealing
Equipment uses hydrogen and nitrogen mixed gas as protective gas, and wherein hydrogen accounts for 15%；Programming rate is 60 DEG C/h, cooling
15 hours time；After annealing, the tensile strength of copper strips is less than 210MPa, and elongation percentage is more than 55%, and the grain size of copper strips is 0.005-
0.01mm。
(6) cold rolling
Using reversible hydraulic cold mill complex to roll the copper strips after annealing, cold rolling is two passes, and cold rolling pass distributes
For 1mm-0.75mm-0.6mm；Draught pressure 800KN；The gloss level of roll wherein used is less than 0.05 μm；Described cold rolling after
The tensile strength of copper strips is 360MPa, and hardness HV is 110, conductivity 102%IACS, copper strip surface roughness 0.20 μm.
(7) aligning: using aligning unit to be controlled copper strips template, forward pull controls at 0.6KN, and backward pull controls
0.22KN, the template 3I of copper strips after aligning, thickness deviation is less than ± 0.001mm.
(8) Cleaning and Passivation
Copper strips after cold rolling being carried out passivation, utilizes alkali liquor that copper strips carries out defat, defat reserving liquid tank uses oil-water separation
Technology, uses the sulfuric acid solution of 10% that copper strips is carried out pickling, uses the pin brush rough polishing of 600 mesh and 5000 mesh 3M brush to carry out essence
Throw, by the phenylpropyl alcohol triazole aqueous solution Passivation Treatment that concentration is 0.2% at 75 DEG C after polishing.
(8) cut
Use cutting apparatus that copper strips is cut.Gap blade is 0.06mm, and the drafts of cutter shaft is 0.30mm；Every meter of copper strips
Side camber degree less than 1mm, the transverse curvature degree of every meter of copper strips is less than 1mm, and the torsion resistance of every meter of copper strips is less than 5 °.
Embodiment 2
The production procedure of the present embodiment 2 ceramic copper-clad base plate high connductivity oxygen-free copper stripe is: continuous up-casting is continuously extruded cold
Roll the most cold rolling Cleaning and Passivation of annealing to cut.Lacking the step of high purity copper melting, other step is same as in Example 1.
Embodiment 3
The production procedure of the present embodiment 3 ceramic copper-clad base plate high connductivity oxygen-free copper stripe is: high purity copper melting continuous up-casting
The most cold rolling cold rolled annealed Cleaning and Passivation is cut, and lacks continuously extruded step, and other step is same as in Example 1.
Comparative example 1
Traditional handicraft is used to prepare ceramic copper-clad base plate high connductivity oxygen-free copper stripe:
The multi-pass cold rolling multi-pass annealing of vacuum drying oven melting ingot casting heating hot rolling milling face is cleaned cold rolling
Cleaning is cut.
Performance test and analysis
Carrying out performance test and analysis by technology well known in the art, analytical structure is as follows:
The copper strips that the present embodiment 1 prepares, wherein copper content 99.9992%, oxygen content is 0.0002%, and the tensile strength of copper strips is
360MPa, hardness HV is 110, conductivity 102%IACS, copper strip surface roughness 0.20 μm, meets ceramic copper-clad base plate high
The needs of conduction oxygen-free copper stripe.
The conductivity of the copper material that embodiment 2-3 prepares is less than 99.97% less than 101%IACS, copper content.
The copper strips oxygen content that comparative example 1 prepares is more than 0.005%, and copper content is less than 99.97%, and energy consumption is the biggest.
In sum, the technological process of production of the present invention is short, efficient, energy-conservation, and the copper strips prepared has the performance of excellence.
Above-described embodiment is only used for illustrating the inventive concept of the present invention, rather than the restriction to rights protection of the present invention,
All changes utilizing this design that the present invention carries out unsubstantiality, all should fall into protection scope of the present invention.
Claims (10)
1. the ceramic copper-clad base plate production technology of high connductivity oxygen-free copper stripe, it is characterised in that comprise the following steps:
(1) high purity copper founding: with No. 1 standard cathode copper as raw material, uses vacuum electron beam melting, solidification, removes impurity element；
(2) continuous up-casting copper bar: as raw material, high purity copper is melted in smelting apparatus with the high purity copper of preparation in step (1)
Change, use Linesless charcoal or graphite flakes to cover copper liquid surface, use and draw copper bar on traction link seat;
(3) continuously extruded: with the copper bar of preparation in step (2) as raw material, use continuously extruded unit to produce copper strip billet；
(4) cold rolling: to use cold mill complex that copper strips blank is rolled；
(5) annealing: use bright annealing equipment that cold rolling rear copper strips is annealed；
(6) cold rolling: to use reversible hydraulic cold mill complex that the copper strips after annealing is rolled；
(7) aligning: use aligning unit that copper strips template is controlled；
(8) Cleaning and Passivation: the copper strips after cold rolling is carried out passivation, utilizes alkali liquor that copper strips carries out defat, defat reserving liquid tank
Use oily water separation technique, use the sulfuric acid solution of 10% that copper strips is carried out pickling, use the pin brush rough polishing and 5000 of 600 mesh
Mesh 3M brush carries out essence throwing, by the phenylpropyl alcohol triazole aqueous solution Passivation Treatment that concentration is 0.2% at 75 DEG C after polishing；
(9) cut: use cutting apparatus that copper strips is cut；
Copper strips prepared by the production technology of described a kind of ceramic copper-clad base plate high connductivity oxygen-free copper stripe: copper content is more than
99.999%, oxygen content≤0.0005%, tensile strength is 350-360MPa, and hardness HV is 106-116, and conductivity is more than 101.5%
IACS, copper strip surface roughness is less than 0.35 μm, and the side camber degree of every meter of copper strips is less than 1mm, the transverse curvature of every meter of copper strips
Degree is less than 5 ° less than 1mm, the torsion resistance of every meter of copper strips.
The production technology of a kind of ceramic copper-clad base plate high connductivity oxygen-free copper stripe the most as claimed in claim 1, it is characterised in that: institute
The one-tenth stating the high purity copper ingot casting in step (1) is grouped into: copper content be more than 99.999%, oxygen content≤0.0005%, conductivity
≥102.5%IACS；Electron gun working vacuum degree during described vacuum electron beam melting is less than 3 × 10-3Pa, working chamber's vacuum
Degree is less than 3 × 10-2Pa, accelerating potential 30KV；Cooling water flow is more than 380l/h, and hauling speed is 2mm/min.
3. profit requires the production technology of a kind of ceramic copper-clad base plate high connductivity oxygen-free copper stripe described in 1, it is characterised in that: described step
Suddenly in (2), smelting apparatus includes crystallizer, smelting furnace and holding furnace, and the leaving water temperature of crystallizer is less than 28 DEG C, described melting
The temperature of stove is 1135 DEG C, and the temperature of holding furnace is 1130 DEG C；Described smelting furnace uses the wooden carbon dried to cover, described Linesless charcoal
Granularity be 30mm-38mm, cladding thickness is 150mm-180mm；Described holding furnace uses graphite phosphorus sheet to cover, and cladding thickness is
30mm-35mm。
The production technology of a kind of ceramic copper-clad base plate high connductivity oxygen-free copper stripe the most as claimed in claim 1, it is characterised in that: institute
The bar speed of drawing stated in step (2) is 20mm/min, and drawing shank diameter is Ф 30mm；The copper of the continuous up-casting copper bar of described preparation contains
Measure more than 99.999%, oxygen content≤0.0005%, conductivity >=102.5%IACS.
The production technology of a kind of ceramic copper-clad base plate high connductivity oxygen-free copper stripe the most as claimed in claim 1, it is characterised in that: institute
Stating continuous extruder rotating speed in step (3) is 2.5r/min；The copper strip billet width of preparation is 330mm, and thickness is 20mm, copper strip billet
Horizontal tolerance less than 0.007mm, the horizontal tolerance of copper strip billet is less than 0.007mm.
The production technology of a kind of ceramic copper-clad base plate high connductivity oxygen-free copper stripe the most as claimed in claim 1, it is characterised in that: institute
State cold rolling pass in step (4) and be assigned as 20mm-15mm-10mm-6mm-4mm-2.5mm-1.5mm-1mm；Draught pressure≤
5000KN, mill speed≤80m/min, roll forward pull 32-35KN, backward pull 51-55KN.
The production technology of a kind of ceramic copper-clad base plate high connductivity oxygen-free copper stripe the most as claimed in claim 1, it is characterised in that: institute
Stating the annealing temperature in step (5) is 210 DEG C, annealing time 6h；Bright annealing equipment uses hydrogen and nitrogen mixed gas to make
For protective gas, wherein hydrogen accounts for 15%；Programming rate is 60 DEG C/h, 15 hours cool times；After annealing, the tension of copper strips
Intensity is less than 210MPa, and elongation percentage is more than 55%, and the grain size of copper strips is 0.005-0.01mm.
The production technology of a kind of ceramic copper-clad base plate high connductivity oxygen-free copper stripe the most as claimed in claim 1, it is characterised in that: institute
Stating cold rolling in step (6) is two passes, and cold rolling pass is assigned as 1mm-0.75mm-0.6mm；Draught pressure≤1000KN；
The gloss level of roll wherein used is less than 0.1 μm；The tensile strength of described cold rolling rear copper strips is 350-360MPa, and hardness HV is
106-116, conductivity is more than 101.5%IACS, and copper strip surface roughness is less than 0.35 μm.
The production technology of a kind of ceramic copper-clad base plate high connductivity oxygen-free copper stripe the most as claimed in claim 1, it is characterised in that: institute
Stating forward pull in step (7) and control at 0.5-0.8KN, backward pull controls the template of copper strips after 0.2-0.3KN, aligning and is less than
5I, thickness deviation is less than ± 0.001mm.
The production technology of a kind of ceramic copper-clad base plate high connductivity oxygen-free copper stripe the most as claimed in claim 1, it is characterised in that:
In described step (9), gap blade is 0.06mm, and the drafts of cutter shaft is 0.30mm；The side camber degree of every meter of copper strips is less than
1mm, the transverse curvature degree of every meter of copper strips is less than 1mm, and the torsion resistance of every meter of copper strips is less than 5 °.
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| CN110899355A (en) * | 2019-11-29 | 2020-03-24 | 金川集团股份有限公司 | Production method of ultra-long high-conductivity copper tube |
| CN115354163A (en) * | 2022-07-15 | 2022-11-18 | 西安斯瑞先进铜合金科技有限公司 | Preparation method of fine-grain high-purity oxygen-free copper plate |
| CN115584410A (en) * | 2022-10-11 | 2023-01-10 | 沈阳宏远电磁线股份有限公司 | High-purity oxygen-free copper pipe and preparation method and application thereof |
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