CN106206525A - Chip pin routing pin - Google Patents
Chip pin routing pin Download PDFInfo
- Publication number
- CN106206525A CN106206525A CN201610567593.9A CN201610567593A CN106206525A CN 106206525 A CN106206525 A CN 106206525A CN 201610567593 A CN201610567593 A CN 201610567593A CN 106206525 A CN106206525 A CN 106206525A
- Authority
- CN
- China
- Prior art keywords
- vertical side
- stitch
- inclined plane
- fixed pedestal
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Snaps, Bayonet Connections, Set Pins, And Snap Rings (AREA)
Abstract
The invention discloses a kind of chip pin routing pin, including fixed pedestal；It is fixed with stitch on described fixed pedestal；Described stitch is column；Described stitch includes the vertical side being perpendicular to described fixed pedestal；Also include the non-perpendicular side relative to described vertical side；Described non-perpendicular side includes the first inclined plane being connected with described fixed pedestal and the second inclined plane being connected with described first inclined plane；Described stitch bottom is horizontal bottom surface；On the basis of the horizontal plane of fixed pedestal, described first inclined plane is tilted towards near the direction of described vertical side by the direction away from described vertical side, and its angle of inclination is more than 90 °；Described second inclined plane is tilted towards near the direction of described vertical side by the direction away from described vertical side, and its angle of inclination the invention enables the bottom of stitch to fix more firm less than 90 °, and effectively having disperseed the power in vertical direction so that stitch is more firm, is hardly damaged.
Description
Technical field
The present invention relates to semiconductor assembly and test field, be specifically related to a kind of chip pin routing pin.
Background technology
Semiconductor chip after encapsulation, has external pin, is used for connecting power supply etc..External pin is by big line
Pin, is fixed on stamped metal on semiconductor chip.In the prior art, the shape of routing pin is as it is shown in figure 1, be wedge
Shape.But the routing pin of this kind of shape is thin especially due to diameter, so being easy to fracture in operation, the proportion of goods damageds are high.
Summary of the invention
For the deficiencies in the prior art, the invention discloses a kind of chip pin routing pin.
Technical scheme is as follows:
A kind of chip pin routing pin, including fixed pedestal；It is fixed with stitch on described fixed pedestal；Described stitch is post
Shape；Described stitch includes the vertical side being perpendicular to described fixed pedestal；Also include relative to described vertical side is non-perpendicular
Side；Described non-perpendicular side includes the first inclined plane being connected with described fixed pedestal and is connected with described first inclined plane
The second inclined plane connect；Described stitch bottom is horizontal bottom surface；On the basis of the horizontal plane of fixed pedestal, described first inclines
Inclined-plane is tilted towards near the direction of described vertical side by the direction away from described vertical side, and its angle of inclination is more than
90°；Described second inclined plane is tilted towards near the direction of described vertical side by the direction away from described vertical side, and its
Angle of inclination is less than 90 °.
The method have the benefit that:
The present invention has redesigned the micro-shape of routing pin, the wherein existence of vertical side so that the volume of routing pin
Unaffected, when carrying out pin and getting ready, will not be stopped by chip circuit, and the existence of the most non-perpendicular side so that
The bottom of stitch is fixing more firm, and has effectively disperseed the power in vertical direction so that stitch is more firm, is hardly damaged.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of prior art.
Fig. 2 is the schematic diagram of the present invention.
Detailed description of the invention
Fig. 2 is the schematic diagram of the present invention.The present invention includes fixed pedestal 1.It is fixed with stitch on fixed pedestal 1.Stitch is
Column.Stitch includes the vertical side 2 being perpendicular to fixed pedestal 1.Also include the non-perpendicular side relative to vertical side 2.Non-
Vertical side includes the first inclined plane 3 being connected with fixed pedestal 1 and the second inclined plane 4 being connected with the first inclined plane 3.
Stitch bottom is horizontal bottom surface 5.On the basis of the horizontal plane of fixed pedestal 1, the first inclined plane 3 is by away from vertical side 2
Direction tilt towards near the direction of vertical side 2, and its angle of inclination is more than 90 °.Second inclined plane 4 is by away from vertical side
The direction in face 2 tilts towards near the direction of vertical side 2, and its angle of inclination is less than 90 °.
First inclined plane 3 and the second inclined plane 4 combine, and effectively reduce in the vertical direction that stitch is subjected to
Power, it is to avoid stitch always by the situation of stitch pedestal fracture, adds the service life of stitch.And it is vertical owing to being provided with
Straight sided, will not be stopped by chip during can making the use of stitch, does not affect stitch and uses process normally.
Above-described is only the preferred embodiment of the present invention, the invention is not restricted to above example.It is appreciated that this
Skilled person the most directly derive or associate other improve and become
Change, within being all considered as being included in protection scope of the present invention.
Claims (1)
1. a chip pin routing pin, it is characterised in that include fixed pedestal (1)；Described fixed pedestal is fixed with pin on (1)
Foot；Described stitch is column；Described stitch includes the vertical side (2) being perpendicular to described fixed pedestal (1)；Also include relative to
The non-perpendicular side of described vertical side (2)；Described non-perpendicular side includes that be connected with described fixed pedestal (1) first inclines
Inclined-plane (3) and the second inclined plane (4) being connected with described first inclined plane (3)；Described stitch bottom is horizontal bottom surface
(5)；On the basis of the horizontal plane of fixed pedestal (1), described first inclined plane (3) is by the direction away from described vertical side (2)
Tilt towards near the direction of described vertical side (2), and its angle of inclination is more than 90 °；Described second inclined plane (4) by away from
The direction of described vertical side (2) tilts towards near the direction of described vertical side (2), and its angle of inclination is less than 90 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610567593.9A CN106206525A (en) | 2016-07-18 | 2016-07-18 | Chip pin routing pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610567593.9A CN106206525A (en) | 2016-07-18 | 2016-07-18 | Chip pin routing pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106206525A true CN106206525A (en) | 2016-12-07 |
Family
ID=57493353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610567593.9A Withdrawn CN106206525A (en) | 2016-07-18 | 2016-07-18 | Chip pin routing pin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106206525A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112992706A (en) * | 2021-01-25 | 2021-06-18 | 上海磬采电力科技开发有限公司 | Chip pin wire bonding needle device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4418858A (en) * | 1981-01-23 | 1983-12-06 | Miller C Fredrick | Deep bonding methods and apparatus |
| US5503321A (en) * | 1993-10-07 | 1996-04-02 | Nec Corporation | Bonding tool employed in ultrasonic compression bonding apparatus |
| JP2011171429A (en) * | 2010-02-17 | 2011-09-01 | Seidensha Electronics Co Ltd | Wiring device, ultrasonic bonding apparatus, and ultrasonic welding device |
-
2016
- 2016-07-18 CN CN201610567593.9A patent/CN106206525A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4418858A (en) * | 1981-01-23 | 1983-12-06 | Miller C Fredrick | Deep bonding methods and apparatus |
| US5503321A (en) * | 1993-10-07 | 1996-04-02 | Nec Corporation | Bonding tool employed in ultrasonic compression bonding apparatus |
| JP2011171429A (en) * | 2010-02-17 | 2011-09-01 | Seidensha Electronics Co Ltd | Wiring device, ultrasonic bonding apparatus, and ultrasonic welding device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112992706A (en) * | 2021-01-25 | 2021-06-18 | 上海磬采电力科技开发有限公司 | Chip pin wire bonding needle device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20161207 |
|
| WW01 | Invention patent application withdrawn after publication |