CN106198357B - Test cavity configuration, sheath flow device, particle analyzer and test chamber processing method - Google Patents
Test cavity configuration, sheath flow device, particle analyzer and test chamber processing method Download PDFInfo
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- CN106198357B CN106198357B CN201610777169.7A CN201610777169A CN106198357B CN 106198357 B CN106198357 B CN 106198357B CN 201610777169 A CN201610777169 A CN 201610777169A CN 106198357 B CN106198357 B CN 106198357B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume, or surface-area of porous materials
- G01N15/10—Investigating individual particles
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume, or surface-area of porous materials
- G01N15/10—Investigating individual particles
- G01N2015/1006—Investigating individual particles for cytology
Abstract
The present invention relates to particle analysis equipment technical field, in particular to a kind of test cavity configuration, sheath flow device, particle analyzer and test chamber processing method.Test cavity configuration provided by the present invention, including matrix and cover board, it is rectangular groove that cross section is formed on matrix, the opened top of groove and either flush with matrix, cover board is bonded in the top surface of matrix and forms the test chamber for allowing particle to pass therethrough under the drive of sheath fluid with the top surface of closed pockets, can be counted and/or classify when particle passes through test chamber.Due to the top surface of groove and the either flush of matrix, during bonding cover board and matrix top surface, the position for needing to bond is relatively fewer, is relatively low to cover board and the requirement of matrix relative position, therefore, processing technology can effectively be simplified, reduce difficulty of processing, reduce processing cost.
Description
Technical field
The present invention relates to particle analysis equipment technical field, in particular to a kind of test cavity configuration, sheath flow device, particle analysis
Instrument and test chamber processing method.
Background technique
Sheath flow device is the important component in the particle analyzers such as cellanalyzer, and sheath flow device includes the survey with test chamber
Cavity configuration is tried, when flowing through test chamber one by one by the particles such as haemocyte that sheath fluid wraps up, may be implemented pair based on Coulter principle
The particle countings such as haemocyte can also realize the classification to particles such as haemocytes using the reflection and scattering of laser.Test chamber is logical
It is often the square hole of 0.15-1mm, dimension precision requirement is higher, and surfaces externally and internally requirement is flat and smooth, and surface roughness at least exists
Ra0.4 or more, the mode with inside cutting be difficult to obtain, so, currently used mode is using multiple splicing blocks
It is spliced into test chamber.
Fig. 1 shows test cavity configuration in the prior art.As shown in Figure 1, existing test cavity configuration 1 ', including four
In the splicing block 11 ' of cube, the long short face alternately bonded of four splicing blocks 11 ' makes Formation cross-section between four splicing blocks 11 '
Rectangular test chamber 12 '.In order to form test chamber 12 ', needs first to carry out surface processing to four splicing blocks 11 ', make each splicing
The size and surface roughness of block 11 ' meet required precision, four splicing blocks 11 ' are then navigated to respective positions, to phase
The surface mutually contacted is bonded, and Formation cross-section is rectangular test chamber 12 ', later again to the outer surface of four splicing blocks 11 '
The processing such as grinding and buffing is carried out, the test cavity configuration 1 ' for meeting required precision is obtained.
Although aforesaid way can obtain the test cavity configuration 1 ' for meeting required precision, due in process, often
The adjacent surface of a coherent mass 11 ' is required to bond, and the position for needing to be bonded is relatively more, and to the opposite of four splicing blocks 11 '
Status requirement is stringent, and therefore, processing technology is complicated, and difficulty of processing is larger, and processing cost is higher.In addition, based on this existing
Bonding mode, the thickness h of each splicing block 11 ' ' directly affect the splicing block 11 ' and when other splicing blocks 11 ' are bonded
Bond area, therefore, in order to guarantee enough bond areas, so that bonding process is smoothly implemented, four splicing blocks 11 ' are necessary
Thicker thickness is all had, however this is resulted in the use process of existing test cavity configuration 1 ', it can not be directly using micro-
, there is inconvenient observation in the particle that sem observation is flowed through from test chamber 12 '.
Summary of the invention
A technical problem to be solved by this invention is: existing test cavity configuration, and processing technology is complicated, difficulty of processing
Larger, processing cost is higher.
In order to solve the above-mentioned technical problem, first aspect present invention provides a kind of sheath flow device for particle analyzer
Test cavity configuration.The test cavity configuration includes matrix and cover board, and it is rectangular groove, the top of groove that cross section is formed on matrix
Face is opened wide and the either flush with matrix, and cover board, which is bonded in the top surface of matrix and is formed with the top surface of closed pockets, allows particle in sheath
The test chamber passed therethrough under the drive of liquid can be counted and/or classify when particle passes through test chamber.
Optionally, first substrate with a thickness of 0.15-1.5mm.
Optionally, the plate thickness of tetrabasal is 0.15-1.5mm.
Second aspect of the present invention additionally provides a kind of sheath flow device.The sheath flow device includes test cavity configuration of the invention.
Third aspect present invention additionally provides a kind of particle analyzer.The particle analyzer includes sheath flow device of the invention.
Optionally, particle analyzer is cellanalyzer.
Fourth aspect present invention additionally provides a kind of test chamber processing method.The processing method is for processing survey of the invention
Try cavity configuration, successively the following steps are included:
Pocket Machining step: processing forms matrix, makes the top surface that rectangular cross section, top surface and matrix are formed on matrix
Concordant and opened top groove；With
It closes step in top surface: cover board is bonded in the top surface of matrix, make the top surface of cover closure groove, form test chamber.
Optionally, Pocket Machining step successively the following steps are included:
Be open procedure of processing: processing first substrate, and processing runs through the top and bottom of first substrate on the first substrate
And cross section is rectangular opening；With
The second substrate: being bonded in the bottom surface of first substrate by open bottom face closure step, makes the second substrate closing opening
Bottom surface forms groove.
Optionally, in opening procedure of processing, opening does not run through the left and right end face of first substrate；Processing method further includes setting
Set the clout excision step after step is closed in top surface: the left and right two sections of material of excision test cavity configuration makes opening through the
The left and right end face of one substrate.
Optionally, Pocket Machining step the following steps are included:
Processing forms third substrate, tetrabasal and the 5th substrate, keeps third substrate and the 5th substrate height equal and big
In the height of tetrabasal；
Plate face, the plate face of the plate face of tetrabasal and the 5th substrate for successively bonding third substrate from left to right later, make
It is rectangular and opened top that the top surface of tetrabasal and third substrate and the 5th substrate plate face relative to each other, which surround cross section,
Groove.
Optionally, in Pocket Machining step, processing forms at least two groove on matrix；Processing method further includes
Cutting step after top surface closing step is set: overall structure being split, at least two test cavity configurations are obtained.
Test cavity configuration provided by the present invention, test chamber are formed by the top surface of the groove on cover closure matrix
, due to the top surface of groove and the either flush of matrix, during bonding cover board and matrix top surface, need to bond
Position it is relatively fewer, cover board and the requirement of matrix relative position are relatively low, therefore, can effectively simplify processing work
Skill reduces difficulty of processing, reduces processing cost.
By the way that exemplary embodiment of the present invention is described in detail referring to the drawings, other feature of the invention and
Its advantage will become apparent.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other drawings based on these drawings.
Fig. 1 shows the cross-sectional view for testing cavity configuration in the prior art.
Fig. 2 shows the cross-sectional views of the test cavity configuration of first embodiment of the invention.
Fig. 3 a- Fig. 3 c shows the process of test cavity configuration shown in Fig. 2, wherein Fig. 3 a show first substrate in Fig. 2,
State when the second substrate and unglued cover board, Fig. 3 b are not cut off after showing first substrate in Fig. 2, the second substrate and cover board bonding
State when expectation, Fig. 3 c show the state after first substrate in Fig. 2, the second substrate and cover board bonding and excision expectation.
Fig. 4 a-4b shows the batch processes of test cavity configuration shown in Fig. 2, wherein Fig. 4 a is shown as shape when bonding
State, Fig. 4 b show the state cut after bonding.
Fig. 5 shows the cross-sectional view of the test cavity configuration of second embodiment of the invention.
Fig. 6 shows the configuration schematic diagram of test cavity configuration shown in Fig. 5.
Fig. 7 shows the batch processes of test cavity configuration shown in Fig. 5.
In figure:
1 ', cavity configuration is tested；11 ', splicing block；12 ', test chamber；
1, cavity configuration is tested；
11, matrix；111, first substrate；1111, it is open；112, the second substrate；113, third substrate；114, the 4th base
Plate；115, the 5th substrate；
12, cover board；
13, test chamber.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Below
Description only actually at least one exemplary embodiment be it is illustrative, never as to the present invention and its application or make
Any restrictions.Based on the embodiments of the present invention, those of ordinary skill in the art are in no development creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as authorizing part of specification.
In the description of the present invention, it is to be understood that, components are limited using the words such as " first ", " second ", only
It is merely for convenience of distinguishing corresponding components, there is no Stated otherwise such as, there is no particular meanings for above-mentioned word, therefore not
It can be interpreted as limiting the scope of the invention.
In the description of the present invention, it is to be understood that, the noun of locality such as " front, rear, top, and bottom, left and right ", " it is laterally, vertical,
Vertically, orientation or positional relationship indicated by level " and " top, bottom " etc. is normally based on orientation or position shown in the drawings and closes
System；The noun of locality " inside and outside " refers to inside and outside the profile relative to each component itself.
Fig. 2-Fig. 7 shows two embodiments of the present invention for the test cavity configuration of sheath flow device.Referring to Fig. 2-Fig. 7, originally
Cavity configuration 1, including matrix 11 and cover board 12 are tested provided by invention, it is rectangular groove that cross section is formed on matrix 11,
The opened top of the groove and either flush with matrix 11, cover board 12 are bonded in the top surface of matrix 11 with the top of closed pockets
Face, forms the test chamber 13 for allowing particle to pass therethrough under the drive of sheath fluid, and particle can be counted when passing through test chamber 13
And/or classification.
Test cavity configuration 1 provided by the present invention, test chamber 13 are by the groove on 12 closed base 11 of cover board
What top surface was formed, top surface and the either flush of matrix 11 due to groove, the adhesive surface between cover board 12 and matrix 11 is
Plane need to only glue the top surface of a plate face of cover board 12 and matrix 11 during bonding cover board 12 and matrix 11
Knot, so, compared with the existing technology in each coherent mass be both needed to two different surfaces of bonding and to four coherent mass
Relative position requires stringent situation, and the present invention can effectively reduce the bonded part in test chamber process, and can show
The requirement reduced to cover board 12 and 11 relative position of matrix is write, and then can effectively simplify processing technology, difficulty of processing is reduced, subtracts
Few processing cost.
Moreover, because in the present invention, cover board 12 is bonded by its plate face and the top surface of matrix 11, and therefore, cover board
12 plate thickness size has no effect on the bond area of cover board 12 Yu matrix 11, so, the plate thickness of cover board 12 of the invention can be set
It is set to smaller value.Based on this, it is preferable that cover board 12 of the invention can be set to be capable of light transmission, such as cover board 12 can be
Coverslip, the advantages of this arrangement are as follows, it can use microscope and directly observe particle by cover board 12 in test chamber 13
Mobility status.
Fig. 2-Fig. 3 c shows first embodiment of the invention test cavity configuration.As shown in Fig. 2-Fig. 3 c, in first implementation
In example, test cavity configuration 1 is including matrix 11, the cover board 12 being set to above matrix 11 and between matrix 11 and cover board 12
Test chamber 13, the cross section of test chamber 13 is that rectangular and top and bottom are all closed, and particle can be by under the drive of sheath fluid
One passes through test chamber 13 and is counted and/or classifies.
As shown in Fig. 2, in this embodiment, matrix 11 includes first substrate 111 and the second substrate 112, wherein the first base
Plate 111 is from top to bottom set gradually with the second substrate 112, this makes the top of the top plate face formation matrix 11 of first substrate 111
Face, the bottom panel of the second substrate 112 form the bottom surface of matrix 11.
As shown in Figure 3a, in this embodiment, it is rectangular opening 1111 that first substrate 111, which is equipped with cross section, this is opened
Mouth 1111 runs through the top and bottom of first substrate 111, this makes the opened top of opening 1111 and puts down with the top surface of matrix 11
Together, and the bottom surface of opening 1111 is also unlimited and concordant with the bottom surface of first substrate 111.
In conjunction with Fig. 2 and Fig. 3 a it is found that the second substrate 112 is bonded in lower section namely the second substrate 112 of first substrate 111
Top surface be bonded in the bottom surface of first substrate 111, this closes the open bottom surface of opening 1111 by the second substrate 112,
To make the groove for being formed with rectangular cross section, opened top and top surface Yu 11 either flush of matrix on matrix 11.
Cover board 12 is bonded in the top surface of matrix 11, so that the top surface of the groove on matrix 11 is also closed, to make matrix
It is the test chamber 13 that rectangular and top and bottom are closed that cross section is formed between 11 and cover board 12.
As it can be seen that in this embodiment, test chamber 13 is to be rectangular by the cross section on 12 closed base 11 of cover board and push up
Face open wide and with the groove of 11 either flush of matrix and formed, and the groove on matrix 11 is then by 112 envelope of the second substrate
It closes the bottom surface that the cross section being located on first substrate 111 is the open opening 1111 in rectangular and top and bottom and is formed.
During using 12 closed pockets top surface of cover board, top surface and the either flush of matrix 11 due to groove, because
This, the adhesive surface between cover board 12 and matrix 11 is plane, so, it only need to be by the top surface of the bottom panel of cover board 12 and matrix 11
It is bonded, the closing to groove top surface can be realized, bonded without the other faces again to cover board 12, also, viscous
During tying cover board 12 and matrix 11, also it need to only make the bottom panel of cover board 12 opposite with the top surface of matrix 11, and
Strict demand is had no to the relative position of cover board 12 and matrix 11.As it can be seen that mistake of the embodiment in bonding cover board 12 and matrix 11
Cheng Zhong, bonded part is less, lower to cover board 12 and the requirement of 11 relative position of matrix.
And during forming groove, since the adhesive surface of the second substrate 112 and first substrate 111 is also plane, because
This, also only need to the bottom panel of top plate face and first substrate 111 to the second substrate 112 bond, can be realized split
The closing of the bottom surface of mouth 1111, forms the groove of required opened top.So the embodiment bonding the second substrate 112 with
During first substrate 111, bonded part is also less, wants to relative position between the second substrate 112 and first substrate 111
Ask relatively low.
As the above analysis, in the whole process of test chamber 13, which need to only be bonded the second substrate 112
The plate face that the plate face and first substrate 111 being in contact with first substrate 111 are in contact with cover board 12, and to the second substrate
112, the relative position of first substrate 111 and cover board 112 has no strict demand.So the embodiment can effectively simplify processing
Technique reduces difficulty of processing, reduces processing cost；And difficulty of processing reduces, and can also be effectively reduced rejection rate, improve at
Product rate further increases production efficiency, and further decreases production cost.
In this embodiment, cover board 12 is coverslip, enables 12 light transmission of cover board and plate thickness is smaller, in order to direct benefit
Mobility status of the particle in test chamber 13 is directly observed by cover board 12 with microscope.The thickness h of cover board 12 can be set to
0.15-1.5mm, wherein preferably, can be set to 0.15-0.5mm, it is highly preferred that can be set to 0.17mm, so not only
Allow to using microscope through directly mobility status of the observation particle in test chamber 13 of cover board 12, but also can make to show
The image that micro mirror is directly observed is more clear accurately.It, can not only be as existing as it can be seen that the test cavity configuration 1 of the embodiment
The resolution and observation to particle are equally realized in technology using laser, additionally it is possible to increase the view mode of microscope direct observing,
Be conducive to improve the ease of use of particle analyzer, and improve the precision of analysis of particle analyzer.
Moreover, because cover board 12 is unrelated with the thickness of cover board 12 with the bond area of matrix 11, therefore, using with above-mentioned
The cover board 12 of plate thickness, can't change the bond area of cover board 12 Yu matrix 11, therefore, still be able to easily bond cover board 12
With matrix 11.Also, since bond area is larger, Cohesion reliability is higher, even if cover board 12 is born during the work time
The bonding of pressure, cover board 12 and matrix 11 is also not susceptible to fail, so that entirely the structure of test cavity configuration 1 is stronger, work
It is higher to make reliability.
In contrast with the embodiment, test cavity configuration 1 ' in the prior art as shown in Figure 1, if by upper part
The thickness h of two coherent mass 11 ' ' be set as identical as the thickness h of the present embodiment cover board 12, then it will directly affect two coherent mass
Bond area between 11 ', so that bond area between the two is too small, bonding difficulty is excessive, and even resulting at all can not be at
Function bonding；Further, that is, allow to bonding to complete, but since bond area is too small, Cohesion reliability is also too low, and one
Denier bears pressure, then two coherent mass 11 ' are easy to misplace under pressure, causes test chamber 12 ' to fail, not only can
Cause entirely to test cavity configuration 1 ' and scrap, can also cause unnecessary trouble to the normal work of particle analyzer.
In addition, the test cavity configuration 1 based on the embodiment, the size of the square-section of test chamber 13 is by first substrate 111
Plate thickness and be open 1111 width determine, so, in order to meet test chamber 13 sectional dimension requirement, first substrate 111
Plate thickness can be set to 0.15-1.5mm, wherein preferably, can be set to 0.15-0.5mm.In this embodiment, first
The plate thickness of substrate 111 is set as 0.2mm, can not only preferably meet the sectional dimension requirement of test chamber 13 in this way, be more convenient for
Particle passes therethrough one by one, and due to processing opening 1111 when cutting depth it is smaller, cut it is more convenient, also more hold
Easily guarantee the flatness and roughness of the side wall of opening 1111.
Illustrate the procedure of processing of the test cavity configuration 1 of the first embodiment below with reference to Fig. 3 a- Fig. 3 c.
Firstly, as shown in Figure 3a, needing first to process by specified size and precision to form cover board 12, first substrate 111 and the
Two substrates 112, and processing section on first substrate 111 is opening that is rectangular and running through 111 top and bottom of first substrate
1111.By Fig. 3 a it is found that in order to easy to process, and guarantee the integrality of first substrate 111, in order to the reality of subsequent job step
It applies, in this embodiment, opening 1111 is processed into the opening namely first substrate for not running through 111 or so end face of first substrate
111 length is greater than the length of opening 1111.So the opening 1111 processed in the step only has top and bottom to open wide.
Later, as shown in Figure 3b, the second substrate 112 is bonded on the bottom surface of first substrate 111, makes the second substrate 112
The bottom surface of closing opening 1111, forms the matrix 11 with required groove；Then cover board 12 is bonded in first substrate 111 again
On top surface, make the top surface of 12 closed pockets of cover board, forms the test cavity configuration 1 with test chamber 13.A left side for test chamber 13 at this time
Right end face closure.
Subsequently, as shown in Figure 3c, the left and right two sections of material of excision test cavity configuration 1, makes opening 1111 through first
The left and right end face of substrate 111, even if also the left and right end face of test chamber 13 is opened wide, so that particle can be by 13 or so end face of test chamber
In one flow into test chamber 13 and from 13 or so end face of test chamber another outflow test chamber 13, realize particle testing
Flowing in chamber 13.
Finally, can also polish each outer surface.
It further, in order to improve the production efficiency, can also be according to mode shown in Fig. 4 a and Fig. 4 b to first embodiment
Test cavity configuration 1 produced in batches.By Fig. 4 a and Fig. 4 b it is found that realize batch production process, only first need to process to be formed
Larger-sized cover board 12, first substrate 111 and the second substrate 112 when than individually producing, and shape is processed on first substrate 111
At two or more openings 1111, the second substrate 112 is equally bonded in the bottom surface of first substrate 111 later
The matrix 11 at least two grooves is formed, then cover board 12 is equally bonded in again the top surface of first substrate 111, can obtained
The test chamber 13 being all closed to multiple left and right end faces；Finally overall structure is split again, cut-off rule A is can make each survey
Examination 13 or so end face of chamber can disposably obtain multiple test cavity configurations 1 subject to opening wide, and realize that the batch of test cavity configuration 1 is raw
It produces, further increases production efficiency.
In figs. 4 a and 4b, multiple 1111 interval settings of opening, since a length is longer (to be surveyed relative to directly processing
Try chamber 13 and set several times of length) opening 1111, process the relatively short opening 1111 of multiple length, it is easier to guarantee processing
Therefore precision is arranged the opening 111 at multiple intervals, is more convenient for processing, and machining accuracy is higher.
Fig. 5 and Fig. 6 shows the test cavity configuration of second embodiment of the invention.As shown in Figure 5 and Figure 6, in second reality
It applies in example, test cavity configuration 1 still includes matrix 11, cover board 12 and test chamber 13, and wherein test chamber 13 is still to pass through cover board
Cross section on 12 closed bases 11 be rectangular and opened top and with the groove of 11 either flush of matrix and formed, and with the
The difference of one embodiment essentially consists in, and the generation type of the groove on matrix 11 is different.Therefore, below only to it is first real
The difference for applying example is illustrated, and is referred to first embodiment in place of not specified (NS) and is understood.
By Fig. 5 and Fig. 6 it is found that in this second embodiment, the groove on matrix 11 is by the identical base of two height
Plate is spliced with a lesser substrate of height.Specifically, as shown in figure 5, the matrix 11 of the embodiment includes from left to right
Third substrate 113, tetrabasal 114 and the 5th substrate 115 set gradually, the plate face that three is in contact are bonded to one another, wherein
Third substrate 113 is equal with 115 height of the 5th substrate and is greater than the height of tetrabasal 114, and the bottom surface of three keeps concordant,
The top surface and third substrate 113 and the 5th substrate 115 plate face relative to each other for allowing for tetrabasal 114 in this way surround transversal
Face is rectangular and opened top groove.
In this second embodiment, the size of the square-section of test chamber 13 by tetrabasal 114 plate thickness and third
The decision of the difference in height of substrate 113 and the 5th substrate 115 and tetrabasal 114, so, in order to meet the sectional dimension of test chamber 13
It is required that similar with first substrate 111 in first embodiment, the plate thickness of the tetrabasal 114 of the embodiment (is in Fig. 5
The distance of left and right end face) it can be set to 0.15-1.5mm, wherein preferably, can be set to 0.15-0.5mm, it is highly preferred that
It can be set to 0.2mm, can preferably meet the sectional dimension requirement of test chamber 13 in this way, particle of being more convenient for therefrom leads to one by one
It crosses.
As shown in fig. 6, forming the procedure of processing of second embodiment test cavity configuration 1 can carry out as follows: firstly, processing
Then third substrate 113, tetrabasal 114, the 5th substrate 115 and the cover board 12 being sized successively bond from left to right
Plate face, the plate face of the plate face of tetrabasal 114 and the 5th substrate 115 of three substrates 113, it is rectangular and top surface that being formed, which has section,
Then the matrix 11 of open groove bonds the bottom surface of cover board 12 and the top surface of matrix 11, makes the top surface of 12 closed pockets of cover board,
Form the test cavity configuration 1 with test chamber 13.
As it can be seen that being based on the second embodiment, third substrate 113,115 phase of tetrabasal 114 and the 5th substrate need to be only bonded
The surface that the plate face and cover board 12 of contact are in contact with matrix 11, can form test chamber 13.Due to cover board 12 and matrix 11
It is bonded by single plane, bonded part is less, and to relative position without strict demand, and therefore, bonding process is more
Add convenience and high-efficiency, bonding difficulty is lower, also, since bond area is larger, and hence it is also possible to improve being firmly bonded property, improves
Test the functional reliability of cavity configuration 1.And when bonding third substrate 113, tetrabasal 114 and five substrates 115, also it is
It is bonded to one another by the biggish single plane of area, therefore, bonded part is also less, strict demand is also had no to relative position,
Being firmly bonded property is also higher.So the second embodiment also can effectively simplify processing technology, processing cost is reduced, improves life
Efficiency is produced, and improves the functional reliability of test cavity configuration 1.
Certainly, it is based on the second embodiment, also can be realized the batch production of test cavity configuration 1.As shown in fig. 7, only needing
By the corresponding lengthening of the length of third substrate 113, tetrabasal 114, the 5th substrate 115 and cover board 12, later further in accordance with aforementioned step
Suddenly it is bonded, is finally split at each cut-off rule B again, can disposably obtain multiple test cavity configurations 1, realized and survey
The batch production for trying cavity configuration 1, further increases production efficiency.Each cut-off rule B is can satisfy the length dimension of test chamber 13
Subject to.
In summary two embodiments can be seen that the structure that the present invention tests cavity configuration by changing, can effectively letter
Change processing technology, reduce processing cost, improve production efficiency, and improves the test functional reliability of cavity configuration and easy to use
Property.
Test cavity configuration 1 of the invention can be applied to the sheath flow device of particle analyzer, be particularly suitable for blood cell analysis
The sheath flow device of instrument.Therefore, the present invention also provides a kind of sheath flow devices with present invention test cavity configuration 1 and one kind to have
The particle analyzer of sheath flow device of the present invention.
In addition, being used to process test cavity configuration 1 of the invention the present invention also provides a kind of test chamber processing method.
Processing method provided by the present invention successively the following steps are included:
Pocket Machining step: processing forms matrix 11, makes to be formed with rectangular cross section, top surface and matrix 11 on matrix 11
Either flush and opened top groove；With
It closes step in top surface: cover board 12 is bonded in the top surface of matrix 11, make the top surface of 12 closed pockets of cover board, formed and surveyed
Try chamber 13.
Wherein, when processing the test cavity configuration 1 of first embodiment, Pocket Machining step can successively include following step
It is rapid:
Be open procedure of processing: processing first substrate 111, and processing runs through the top of first substrate 111 on first substrate 111
Face and bottom surface and cross section are rectangular opening 1111；With
The second substrate 112: being bonded in the bottom surface of first substrate 111 by open bottom face closure step, makes 112 envelope of the second substrate
The bottom surface of make and break mouth 1111 forms groove.
Moreover, when the opening 1111 in above-mentioned opening procedure of processing does not run through the left and right end face of first substrate 111, processing
Method can further include the clout excision step being arranged in after top surface closing step a: left side for excision test cavity configuration 1
Right two sections of material makes opening 1111 through the left and right end face of first substrate 111.
And when process second embodiment test cavity configuration 1 when, Pocket Machining step then can successively the following steps are included:
Processing forms third substrate 113, tetrabasal 114 and the 5th substrate 115, makes third substrate 113 and the 5th substrate
115 height are equal and are greater than the height of tetrabasal 114；
Successively bond plate face, the plate face of tetrabasal 114 and the 5th substrate 115 of third substrate 113 from left to right later
Plate face, surround the top surface of tetrabasal 114 and third substrate 113 and the 5th substrate 115 plate face relative to each other transversal
Face is rectangular and opened top groove.
In addition, processing method of the invention can also be in Pocket Machining step in matrix 11 in order to realize batch production
Upper processing forms at least two groove；It and further comprise the cutting step being arranged in after top surface closing step: to entirety
Structure is split, and obtains at least two test cavity configurations 1.
The foregoing is merely exemplary embodiment of the present invention, are not intended to limit the invention, all in spirit of the invention
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of test cavity configuration (1), the sheath flow device for particle analyzer, which is characterized in that including matrix (11) and cover board
(12), it is rectangular groove, the opened top of the groove and and described matrix that cross section is formed in described matrix (11)
(11) either flush, the cover board (12) be bonded in the top surface of described matrix (11) with close the top surface of the groove formed it is fair
Perhaps the test chamber (13) that particle passes therethrough under the drive of sheath fluid, particle can be counted when passing through the test chamber (13)
And/or classification, described matrix (11) include the third substrate (113) that plate face successively bonds from left to right, tetrabasal (114) and
The bottom surface of 5th substrate (115), the third substrate (113), the tetrabasal (114) and the 5th substrate (115) is flat
Together, the third substrate (113) is equal with the 5th substrate (115) height and is greater than the height of the tetrabasal (114),
The top surface of the tetrabasal (114) and the third substrate (113) and the 5th substrate (115) plate face relative to each other
Surrounding cross section is rectangular and opened top the groove.
2. testing cavity configuration (1) according to claim 1, which is characterized in that the plate thickness of the tetrabasal (114) is
0.15-1.5mm。
3. test cavity configuration (1) according to claim 1 or claim 2, which is characterized in that the cover board (12) being capable of light transmission.
4. according to claim 3 test cavity configuration (1), which is characterized in that the cover board (12) with a thickness of 0.15-
1.5mm。
5. a kind of sheath flow device, which is characterized in that including any test cavity configuration (1) of claim 1-4.
6. a kind of particle analyzer, which is characterized in that including sheath flow device as claimed in claim 5.
7. particle analyzer according to claim 6, which is characterized in that the particle analyzer is cellanalyzer.
8. a kind of test chamber processing method, for processing the test cavity configuration (1) as described in claim 1-4 is any, feature
Be, the processing method successively the following steps are included:
Pocket Machining step: processing forms described matrix (11), makes to be formed with that cross section is rectangular, top surface on described matrix (11)
With the either flush of described matrix (11) and the groove of opened top；With
It closes step in top surface: the cover board (12) is bonded in the top surface of described matrix (11), the cover board (12) is made to close institute
The top surface for stating groove forms the test chamber (13)；
Wherein, the Pocket Machining step the following steps are included:
Processing form third substrate (113), tetrabasal (114) and the 5th substrate (115), make the third substrate (113) and
5th substrate (115) height is equal and is greater than the height of the tetrabasal (114)；
Successively bond the plate face of the third substrate (113), the plate face of the tetrabasal (114) and described from left to right later
The plate face of 5th substrate (115) makes top surface and the third substrate (113) and the described 5th of the tetrabasal (114)
It is rectangular and opened top the groove that substrate (115) plate face relative to each other, which surrounds cross section,.
9. processing method according to claim 8, which is characterized in that in the Pocket Machining step, in described matrix
(11) processing forms at least two groove on；The processing method further includes after setting closes step in the top surface
Cutting step: overall structure is split, at least two test cavity configurations (1) are obtained.
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| NL1014217C2 (en) * | 2000-01-28 | 2001-07-31 | Cellvision Technologies B V I | Counting chamber with reference and method for manufacturing a counting chamber with reference. |
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| JP5157629B2 (en) * | 2008-05-14 | 2013-03-06 | ソニー株式会社 | Channel substrate |
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| CN2927037Y (en) * | 2006-02-22 | 2007-07-25 | 陈奎发 | Particle accounting board |
| CN201229288Y (en) * | 2008-07-28 | 2009-04-29 | 南京千盛医疗设备制造有限公司 | Quantitatively counting plate |
| CN102175589A (en) * | 2011-01-20 | 2011-09-07 | 重庆天海医疗设备有限公司 | Flow type counting chamber and urine sample sampling method thereof |
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