CN106183361B - 一种复合膜下压模块 - Google Patents
一种复合膜下压模块 Download PDFInfo
- Publication number
- CN106183361B CN106183361B CN201610675016.1A CN201610675016A CN106183361B CN 106183361 B CN106183361 B CN 106183361B CN 201610675016 A CN201610675016 A CN 201610675016A CN 106183361 B CN106183361 B CN 106183361B
- Authority
- CN
- China
- Prior art keywords
- composite membrane
- cantilever
- air cylinder
- lower air
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/0015—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610675016.1A CN106183361B (zh) | 2016-08-16 | 2016-08-16 | 一种复合膜下压模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610675016.1A CN106183361B (zh) | 2016-08-16 | 2016-08-16 | 一种复合膜下压模块 |
Publications (2)
Publication Number | Publication Date |
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CN106183361A CN106183361A (zh) | 2016-12-07 |
CN106183361B true CN106183361B (zh) | 2018-02-23 |
Family
ID=57522763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201610675016.1A Active CN106183361B (zh) | 2016-08-16 | 2016-08-16 | 一种复合膜下压模块 |
Country Status (1)
Country | Link |
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CN (1) | CN106183361B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7959759B2 (en) * | 2006-12-29 | 2011-06-14 | Chieh Hua Liao | Apparatus and method for manufacturing double layer air cylinder type air enclosure |
CN202702787U (zh) * | 2012-06-04 | 2013-01-30 | 昆山友来电子有限公司 | 吸附贴膜机 |
CN206106601U (zh) * | 2016-08-16 | 2017-04-19 | 苏州恒铭达电子科技有限公司 | 一种复合膜下压模块 |
-
2016
- 2016-08-16 CN CN201610675016.1A patent/CN106183361B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7959759B2 (en) * | 2006-12-29 | 2011-06-14 | Chieh Hua Liao | Apparatus and method for manufacturing double layer air cylinder type air enclosure |
CN202702787U (zh) * | 2012-06-04 | 2013-01-30 | 昆山友来电子有限公司 | 吸附贴膜机 |
CN206106601U (zh) * | 2016-08-16 | 2017-04-19 | 苏州恒铭达电子科技有限公司 | 一种复合膜下压模块 |
Also Published As
Publication number | Publication date |
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CN106183361A (zh) | 2016-12-07 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 215301 Suzhou Province, Kunshan City, the Palestinian town of East Road, No. 251, No. Applicant after: Suzhou Heng Ming Da electronic Polytron Technologies Inc Address before: 215301 Suzhou Province, Kunshan City, the Palestinian town of East Road, No. 251, No. Applicant before: Suzhou Hengmingda Electronic Technology Co., Ltd. |
|
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Shipai Town Tower Road Kunshan city Suzhou city 215312 Jiangsu province No. 1568 Applicant after: Suzhou Heng Ming Da electronic Polytron Technologies Inc Address before: 215301 Suzhou Province, Kunshan City, the Palestinian town of East Road, No. 251, No. Applicant before: Suzhou Heng Ming Da electronic Polytron Technologies Inc |
|
GR01 | Patent grant | ||
GR01 | Patent grant |