CN106181124A - A kind of composite soldering of moistening guide and preparation method thereof - Google Patents
A kind of composite soldering of moistening guide and preparation method thereof Download PDFInfo
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- CN106181124A CN106181124A CN201610748841.XA CN201610748841A CN106181124A CN 106181124 A CN106181124 A CN 106181124A CN 201610748841 A CN201610748841 A CN 201610748841A CN 106181124 A CN106181124 A CN 106181124A
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- China
- Prior art keywords
- filler metal
- metal alloy
- solder
- layer
- brazing filler
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Abstract
The invention discloses the composite soldering of a kind of moistening guide, including tin layers and the brazing filler metal alloy layer of composite rolling, outer surface in tin layers and brazing filler metal alloy layer is the most spray deposited brazing flux layer, forms the composite soldering finished product of four-layer structure.The thickness of tin layers and brazing filler metal alloy layer can adjust according to joint filling and the joint filling size of solder between 0.01 ~ 20mm, and the thickness of brazing flux layer goes the complexity of oxide film dissolving to adjust between 0.01 ~ 10mm according to workpiece.During preparation, stannum band and brazing filler metal alloy band are put into composite rolling in finishing rolling mill, form tin layers in uniform thickness on the surface of brazing filler metal alloy layer, then the outer surface at tin layers and brazing filler metal alloy layer deposits a layer thickness uniform brazing flux layer in thermal spraying mode, forms the composite soldering finished product of four-layer structure.Preparation method energy-conserving and environment-protective of the present invention, in solder, the high and thick degree of Theil indices is uniform, and beautiful appearance, owing to carrying brazing flux, achieves automatic, accurate, the quantitative interpolation of brazing flux in soldering.
Description
Technical field
The present invention relates to a kind of brazing material, especially relate to the composite soldering of a kind of moistening guide, the invention still further relates to
The preparation method of this composite soldering.
Background technology
Liquid metal all belongs to viscous liquid, and its mobile performance can be weighed by the viscosity of liquid metal.Liquid metal viscosity
The biggest, then its mobility is the poorest, and the degree of superheat of viscosity and liquid metal is inversely proportional to.Therefore, when brazing temperature one timing, solder
Fusion temperature the lowest, then the degree of superheat of liquid solder is the biggest, thus causes the viscosity of liquid solder to reduce, mobility strengthen.
During the fusing temperature rise of solder, the degree of superheat reduces, and viscosity increases, and mobility weakens.
Silver-base solder fusing point is moderate, soldering processes performance is superior, has good bonding strength, electric conductivity and corrosion-resistant
Property, it is widely used in industries such as machinery, household electrical appliances, instruments.The main alloy element of silver solder is Ag, Cu, Zn, is full
Foot different performance requirement, is generally additionally added the low melting point elements such as Sn, Cd.The silver-base solder containing cadmium, compared with cadmium-free silver-base solder, has
There are lower solid-liquid liquidus temperature, good soldering processes performance, are widely applied in a very long time, but cadmium
It is toxic element, the mankind are had significant damage.Silver-base solder adds Sn element, solder fusing point can be significantly reduced, change
Its wettability kind, it is nontoxic to add tin element, is increasingly becoming the replacement solder containing cadmium silver-base solder.And tradition AgCuZnSn pricker
Material, adds Sn element by distribution in AgCuZn solder alloy, then use melting, cast, roll, extrude, drawing
Producing etc. operation, the solder of processing mainly has BAg25CuZnSn, BAg30CuZnSn, BAg40CuZnSn,
BAg45CuZnSn, BAg56CuZnSn etc., meet RoHs and WEEE command request.But the AgCuZnSn solder that said method produces
In Sn content low, too high, solder plasticity can be caused to significantly reduce, easily become fragile, it is difficult to be become by conventional processing method
Type.
Copper base solder main alloy element is Cu, for meeting different performance requirements, and the unit such as Zn, Sn, P to be added
Element, fusing point is higher, adds Sn element and can significantly reduce solder fusing point, improve its wettability in copper base solder.With money base pricker
As material, tradition CuZnSn solder, in CuZn solder alloy, add Sn element by distribution, then use melting, water
Cast, roll, extrude, the operation such as drawing produces, and the Sn content in the CuZnSn solder that this method produces is low, such as HS221,
Theil indices only has 1%, otherwise also results in its plasticity and reduces, and solder is difficult to shape.
Summary of the invention
It is an object of the invention to provide a kind of wettability, joint filling, the composite soldering of moistening guide that has excellent formability,
The present invention also provides for the preparation method of this composite soldering.
For achieving the above object, the present invention can take following technical proposals:
The composite soldering of moistening guide of the present invention, including tin layers and the brazing filler metal alloy layer of composite rolling, at tin layers and pricker
The outer surface of material alloy-layer is the most spray deposited brazing flux layer, forms the composite soldering finished product of four-layer structure.
The thickness of described tin layers and brazing filler metal alloy layer according to the joint filling of solder and joint filling size can 0.01 ~ 20mm it
Between adjust, the thickness of described brazing flux layer goes the complexity of oxide film dissolving to adjust between 0.01 ~ 10mm according to workpiece.
Described brazing filler metal alloy layer is the one in silver-base solder, copper base solder.
The preparation method of the composite soldering of moistening guide of the present invention is as follows:
Stannum band and brazing filler metal alloy band are put into composite rolling in finishing rolling mill, is formed in uniform thickness on the surface of brazing filler metal alloy layer
Tin layers, then the outer surface at tin layers and brazing filler metal alloy layer deposits a layer thickness uniform brazing flux layer in thermal spraying mode, is formed
The composite soldering finished product of four-layer structure.
The brazing filler metal alloy layer of the present invention can be the one in silver-base solder, copper base solder, and brazing flux is general brazing flux.
The present invention compared to use tradition melting, cast, roll, extrude, money base that the technique such as drawing produces or cuprio contain
Tin solder, composite soldering Theil indices prepared by the present invention is high and can accurately control, and during soldering, uses the moistening guide of low melting point tin
In mechanism, i.e. heating process, low melting point tin is sprawled rapidly and is come, and treats that high-melting-point brazing filler metal alloy is completely melt to be filled up completely with low
The region that fusing point stannum is sprawled, and be combined with stannum generation solid solution, make the wettability of composite soldering and gap filling performance significantly be carried
High；Preparation method the most of the present invention uses the tradition such as plating, hot-dip, thermal spraying, chemical plating relative to brazing filler metal alloy belt surface
Method deposition tin layers, not only energy-conserving and environment-protective, the solder Theil indices height of preparation and tin thickness uniformity, beautiful appearance, stannum unit
The utilization rate of element is high；The mode simultaneously using thermal spraying deposits brazing flux at brazing filler metal alloy layer and tin layers surface, and brazing flux is with vitreous body
Form is attached to brazing filler metal alloy surface, and adhesive strength is high；The composite soldering prepared due to the present invention carries brazing flux, in brazing process
Achieve automatic, accurate, the quantitative interpolation of brazing flux.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention.
Detailed description of the invention
As it is shown in figure 1, the composite soldering of moistening guide of the present invention, tin layers 1 and solder including composite rolling are closed
Layer gold 2, outer surface in tin layers 1 and brazing filler metal alloy layer 2 is the most spray deposited brazing flux layer 3, makes finished product composite soldering form four
Rotating fields.
Wherein the thickness of tin layers 1 and brazing filler metal alloy layer 2 according to the joint filling of solder and the big I of joint filling 0.01 ~ 20mm it
Between be adjusted, the thickness of brazing flux layer 3 goes the complexity of oxide film dissolving to adjust between 0.01 ~ 10mm according to workpiece.
The preparation method of the composite soldering of moistening guide of the present invention is as follows:
Stannum band and brazing filler metal alloy band are put into composite rolling in finishing rolling mill, is allowed to be formed on the surface of brazing filler metal alloy layer 2 thickness
Uniform tin layers 1, then the outer surface at tin layers 1 and brazing filler metal alloy layer 2 deposits the uniform pricker of a layer thickness in thermal spraying mode
Oxidant layer 3, forms the wettability of four-layer structure, joint filling, mouldability excellence, carries the composite soldering finished product of brazing flux.
Brazing filler metal alloy uses the one in silver-base solder, copper base solder, and brazing flux is general brazing flux.In preparation process, solder
Alloy strip have to pass through strict deoil, acid cleaning process, it is ensured that the one side oil-free compound with stannum band, free from admixture, non-oxidation.
The preparation method describing composite soldering of the present invention in detail below by specific embodiment and the technology effect being had
Really.
Embodiment 1
The BAg25CuZn alloy strip that brazing filler metal alloy selects thickness to be 0.2mm, stannum tape thickness is 0.1mm, rolls through finishing rolling mill multiple tracks
System forms tin thickness 0.02mm, the BAgCuZnSn brazing filler metal alloy band of brazing filler metal alloy layer thickness 0.18mm, then uses thermal spraying
Form at two surfaces of brazing filler metal alloy band deposition FB102 brazing fluxes, brazing flux layer thickness is 0.1mm.Through chemical analysis, Theil indices is
8.68%, the BAgCuZnSn solder of this kind of Theil indices by conventional melting, cast, extrude, the operation such as rolling is difficult to process
Come.Through dsc analysis, relative to matrix BAg25CuZn solder, solder fusing point prepared by this method reduces nearly 60 DEG C.According to state
Family standard GB/T 11364-2008 " solder wetting test method ", solder prepared by matrix solder and the present invention carries out moistening
Property contrast test.The Q235 carbon steel sheet central authorities that the solder 200mg present invention prepared is placed in 40mm × 40mm, thickness is 2mm, adopt
Covering matrix solder with the FB102 brazing flux preparing solder equal in quality, brazing flux is 200mg plus matrix solder weight, is placed in
40mm × 40mm, thickness are the Q235 carbon steel sheet central authorities of 2mm.It is respectively put in RSL-5 moistening stove heating, is treated brazing filler metal melts
Rear insulation 40～50 s, cleans up after room temperature natural cooling, and the solder wetting area prepared through calculating the present invention is almost
The twice of matrix solder.Prove that composite soldering prepared by the present invention is compared matrix solder wetting area and is significantly increased.
Embodiment 2
The BAg30CuZn alloy strip that brazing filler metal alloy selects thickness to be 0.2mm, stannum tape thickness is 0.1mm, rolls through finishing rolling mill multiple tracks
The BAgCuZnSn brazing filler metal alloy band that system formation tin thickness is 0.01mm, brazing filler metal alloy layer thickness is 0.18mm, then uses heat
The form of spraying is at two surface deposition FB102 brazing fluxes of brazing filler metal alloy band, and brazing flux layer thickness is 0.1mm.Through chemical analysis, stannum contains
Amount is 8.12%, the BAgCuZnSn solder of this kind of Theil indices by conventional melting, cast, extrude, the operation such as rolling is difficult to add
Work is out.Through dsc analysis, relative to matrix BAg30CuZn solder, solder fusing point prepared by the inventive method reduces nearly 55
℃.According to standard GB/T/T 11364-2008 " solder wetting test method ", solder prepared by matrix solder and the present invention
Carry out wettability contrast test.The Q235 carbon steel that the solder 200mg present invention prepared is placed in 40mm × 40mm, thickness is 2mm
Plate central authorities, use the FB102 brazing flux with its solder equal in quality to cover matrix solder, and brazing flux plus matrix solder weight is
200mg, be placed in 40mm × 40mm, thickness be 2mm Q235 carbon steel sheet central authorities.It is respectively put in RSL-5 moistening stove heating,
After brazing filler metal melts, it is incubated 40～50 s, cleans up after room temperature natural cooling, through calculating solder wetting prepared by the present invention
Area is almost 1.8 times of matrix solder.Prove that composite soldering prepared by the present invention is compared matrix solder wetting area and significantly increased
Add.
Embodiment 3
The BAg45CuZn alloy strip that brazing filler metal alloy selects thickness to be 0.2mm, stannum tape thickness is 0.1mm, rolls through finishing rolling mill multiple tracks
The BAgCuZnSn brazing filler metal alloy band that system formation tin thickness is 0.03mm, brazing filler metal alloy layer thickness is 0.18mm, then uses heat
The form of spraying is at two surface deposition FB102 brazing fluxes of brazing filler metal alloy band, and brazing flux layer thickness is 0.1mm.Through chemical analysis, stannum contains
Amount is 7.56%, the BAgCuZnSn solder of this kind of Theil indices by conventional melting, cast, extrude, the operation such as rolling is difficult to add
Work is out.Through dsc analysis, relative to matrix BAg45CuZn solder, solder fusing point prepared by this method reduces nearly 50 DEG C.Root
According to standard GB/T/T 11364-2008 " solder wetting test method ", the solder of matrix solder and preparation carries out wettability
Contrast test.The solder 200mg of preparation is placed in 40mm × 40mm, thickness be 2mm Q235 carbon steel sheet central authorities, use and prepare
The FB102 brazing flux of solder equal in quality covers matrix solder, and brazing flux is 200mg plus matrix solder weight, be placed in 40mm ×
40mm, thickness are the Q235 carbon steel sheet central authorities of 2mm.It is respectively put in RSL-5 moistening stove heating, is incubated after brazing filler metal melts
40～50 s, clean up after room temperature natural cooling, and the solder wetting area prepared through calculating the present invention is almost matrix pricker
1.7 times of material.Freshly prepd solder is compared matrix solder wetting area and is significantly increased.
Embodiment 4
The BCu62Zn alloy strip that brazing filler metal alloy selects thickness to be 0.2mm, stannum tape thickness is 0.1mm, rolls through finishing rolling mill multiple tracks
The BCuZnSn brazing filler metal alloy band that formation tin thickness is 0.04mm, brazing filler metal alloy layer thickness is 0.18mm, then uses thermal spraying
Form at two surfaces of brazing filler metal alloy band deposition YJ2 brazing fluxes, brazing flux layer thickness is 0.1mm.Through chemical analysis, Theil indices is
9.73%, the BCuZnSn solder of this kind of Theil indices by conventional melting, cast, extrude, the operation such as rolling is difficult to process.
Through dsc analysis, relative to matrix BCu62Zn solder, nearly 65 DEG C of solder fusing point reduction prepared by this kind of method.Mark according to country
Quasi-GB/T 11364-2008 " solder wetting test method ", matrix solder and freshly prepd solder carry out wettability to having a competition
Test.Freshly prepd solder 200mg is placed in 40mm × 40mm, thickness be 2mm Q235 carbon steel sheet central authorities, use with freshly prepared pricker
The YJ2 brazing flux of material equal in quality covers matrix solder, and brazing flux is 200mg plus matrix solder weight, is placed in 40mm × 40mm, thickness
The Q235 carbon steel sheet central authorities that degree is 2mm.It is respectively put in RSL-5 moistening stove heating, after brazing filler metal melts, is incubated 40～50
S, cleans up after room temperature natural cooling, and through calculating, freshly prepd solder wetting area is almost 1.5 times of matrix solder.
Freshly prepd solder is compared matrix solder wetting area and is significantly increased.
Embodiment 5
The BCu60Zn alloy strip that brazing filler metal alloy selects thickness to be 0.2mm, stannum tape thickness is 0.1mm, rolls through finishing rolling mill multiple tracks
The BCuZnSn brazing filler metal alloy band that formation tin thickness is 0.05mm, brazing filler metal alloy layer thickness is 0.18mm, then uses thermal spraying
Form at two surfaces of brazing filler metal alloy band deposition YJ2 brazing fluxes, brazing flux layer thickness is 0.1mm.Through chemical analysis, Theil indices is
9.05%, the BCuZnSn solder of this kind of Theil indices by conventional melting, cast, extrude, the operation such as rolling is difficult to process.
Through dsc analysis, relative to matrix BCu60Zn solder, nearly 60 DEG C of solder fusing point reduction prepared by this kind of method.Mark according to country
Quasi-GB/T 11364-2008 " solder wetting test method ", matrix solder and freshly prepd solder carry out wettability to having a competition
Test.Freshly prepd solder 200mg is placed in 40mm × 40mm, thickness be 2mm Q235 carbon steel sheet central authorities, use with freshly prepared pricker
The YJ2 brazing flux of material equal in quality covers matrix solder, and brazing flux is 200mg plus matrix solder weight, is placed in 40mm × 40mm, thickness
The Q235 carbon steel sheet central authorities that degree is 2mm.It is respectively put in RSL-5 moistening stove heating, after brazing filler metal melts, is incubated 40～50
S, cleans up after room temperature natural cooling, and through calculating, freshly prepd solder wetting area is almost 1.3 times of matrix solder.
Freshly prepd solder is compared matrix solder wetting area and is significantly increased.
Claims (4)
1. the composite soldering of a moistening guide, it is characterised in that: it includes tin layers (1) and the brazing filler metal alloy layer of composite rolling
(2), outer surface in described tin layers (1) and brazing filler metal alloy layer (2) is the most spray deposited brazing flux layer (3), forms four-layer structure
Composite soldering finished product.
The composite soldering of moistening guide the most according to claim 1, it is characterised in that: the thickness of described tin layers (1) is
0.01 ~ 20mm, the thickness of described brazing filler metal alloy layer (2) is 0.01 ~ 20mm, and the thickness of described brazing flux layer (3) is 0.01 ~ 10mm.
The composite soldering of moistening guide the most according to claim 1 and 2, it is characterised in that: described brazing filler metal alloy layer (2) is
One in silver-base solder, copper base solder.
4. described in claim 1, the preparation method of the composite soldering of moistening guide is as follows:
Stannum band and brazing filler metal alloy band are put into composite rolling in finishing rolling mill, forms thickness on the surface of brazing filler metal alloy layer (2) equal
Even tin layers (1), then to deposit a layer thickness in thermal spraying mode uniform for the outer surface at tin layers (1) and brazing filler metal alloy layer (2)
Brazing flux layer (3), formed four-layer structure composite soldering finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610748841.XA CN106181124A (en) | 2016-08-30 | 2016-08-30 | A kind of composite soldering of moistening guide and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610748841.XA CN106181124A (en) | 2016-08-30 | 2016-08-30 | A kind of composite soldering of moistening guide and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106181124A true CN106181124A (en) | 2016-12-07 |
Family
ID=57527312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610748841.XA Pending CN106181124A (en) | 2016-08-30 | 2016-08-30 | A kind of composite soldering of moistening guide and preparation method thereof |
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| Country | Link |
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| CN (1) | CN106181124A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112338389A (en) * | 2020-10-27 | 2021-02-09 | 国网河南省电力公司电力科学研究院 | Laminated strip-shaped self-brazing solder for aluminum copper brazing and preparation method thereof |
| CN114918574A (en) * | 2022-06-21 | 2022-08-19 | 浙江亚通焊材有限公司 | Tin-based composite solder and preparation method thereof |
-
2016
- 2016-08-30 CN CN201610748841.XA patent/CN106181124A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112338389A (en) * | 2020-10-27 | 2021-02-09 | 国网河南省电力公司电力科学研究院 | Laminated strip-shaped self-brazing solder for aluminum copper brazing and preparation method thereof |
| CN114918574A (en) * | 2022-06-21 | 2022-08-19 | 浙江亚通焊材有限公司 | Tin-based composite solder and preparation method thereof |
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Application publication date: 20161207 |
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