CN106170876B - Nozzle head, manufacture the method for the nozzle head and the liquid supply apparatus with the nozzle head - Google Patents
Nozzle head, manufacture the method for the nozzle head and the liquid supply apparatus with the nozzle head Download PDFInfo
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- CN106170876B CN106170876B CN201580000944.1A CN201580000944A CN106170876B CN 106170876 B CN106170876 B CN 106170876B CN 201580000944 A CN201580000944 A CN 201580000944A CN 106170876 B CN106170876 B CN 106170876B
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Nozzles (AREA)
Abstract
The present invention relates to a kind of nozzle head, a kind of method for manufacturing the nozzle head, and comprising：Nozzle head, it is included：Nozzle plate；Nozzle tip, it has nozzle bore upwardly and downwardly to pass through the nozzle tip from the face-down projection of following table of the nozzle plate；Avoid dimple, it is formed on the periphery of the nozzle tip, and is recessed from the lower surface of the nozzle plate towards the upper surface of the nozzle plate；And dimple is introduced, it is formed on the upper surface of the nozzle plate, so that the pipeline that must be used to supply liquid is connected to the introducing dimple.
Description
Technical field
The present invention relates to a kind of nozzle head, a kind of method for manufacturing the nozzle head and a kind of liquid with the nozzle head
Body supply arrangement, and it is used to persistently projecting the nozzle head of fine liquid flow, described in a kind of manufacture more specifically to a kind of
The method of nozzle head and a kind of liquid supply apparatus with the nozzle head.
Background technology
With the fast development of the information industry constantly upgraded, high-speed transfer information allows people can not be by time and place
Limitation send and receive mail, voice and image.
CRT-led information delivery medias have been developed, now such as LCD, PDP, LED and UHD etc big rule
Mould flat-panel monitor (it may be suitable for ergonomics function and high functionality) and such as high-speed mobile communications terminal, PDA
Quickly increasing with the small-size display of web-tablet etc, and monitor market is due to convenience and according to need
That asks flies up continuous development.
High quality and low-power consumption due to flat-panel monitor, various application markets become more and more active, and OLED after
As display of future generation by common concern after LCD and PDP.
Since the Tang of Kodak successfully sent high brightness in 1987 from the organic material with stack architecture
Since light, OLED has been achieved for many technical progress so far.
OLED has fabulous screen quality in terms of brightness, contrast, response speed, color rendering degree and visibility,
And because technique is simple cost is very low, therefore OLED is considered as so-called preferable display.
However, OLED service lifes are shorter and qualification rate is relatively low, therefore commercialization has difficulties, due to LCD correlation techniques
Rapid advances greatly limit OLED and enter market, therefore OLED commercialization receives delay.
In recent years, because almost all technical problems of world display industry are solved, thus Japan and
The relevant enterprise that Taiwan includes South Korea has begun to volume production OLED.
OLED is such a display device, wherein by positive electrode and negative electrode be injected into hole in organic film and
Electronics couples to form exciton again each other, and the energy sent when exciton returns to stable state is again converted into light, lights simultaneously.
Simplest OLED, which is included, is used to projecting the negative electrode of electronics, the positive electrode for projecting hole and for luminous
Organic film, and functional layer is further included, functional layer explanation projects and transmits electronics and hole, to improve carrier again
Coupling and the characteristics of luminescence.
Organic film forms technology and includes the extensive deposition technology using fine metal mask (FMM), uses laser
Patterning techniques, and the printing technology using liquid-based ink material.
Extensive deposition technique classification deposits source technology and included according to related skill into deposition source technology and mask technique
Spot deposition source, the linear deposition source for extensive deposition in recent years, gas aggradation technology and the hanging down according to deposition direction of art
Straight and level deposition source, and mask technique includes aligner mechanism technology and pattern mask technology.
In addition, printing technology can be included using macromolecular LED solution and conducting solution, hectograph, notch board and flexographic plate
Inkjet printing.
Printing technology, which has, to be used to liquid is moved into nozzle head and discharges the structure of liquid.
Meanwhile when it is expected using printing technology to form OLED pixel, it is necessary to fine by nozzle head and constantly penetrate
Go out liquid.
In order to meet these requirements, the nozzle of various structures and shape is had been developed for, but in terms of continuing liquid jet
In the presence of limitation, because the structure of these nozzles is more complicated, and liquid jet stream is larger.
The content of the invention
The purpose of the present invention is attempt to solve the above problems, and provides a kind of nozzle head and manufacture the side of the nozzle head
Method, the nozzle head can from it is initial with projecting phase fine and constantly liquid jet stream, and can freely adjusting
The supply and interruption of the liquid projected from nozzle.
The present invention also provides a kind of liquid supply apparatus with nozzle head, and the nozzle head can be evenly coated with
100nm or thinner film, without producing bad products.
According to an aspect of the present invention, there is provided a kind of nozzle head, it includes：Nozzle plate；Nozzle tip, it is from described
The face-down projection of following table of nozzle plate, and nozzle bore upwardly and downwardly passes through the nozzle tip；Avoid dimple, it is formed
It is recessed towards the upper surface of the nozzle plate on the periphery of the nozzle tip, and from the lower surface of the nozzle plate
Fall into；And dimple is introduced, it is formed on the upper surface of the nozzle plate so that the pipeline for supplying liquid couples
To the introducing dimple.
According to another aspect of the present invention, there is provided a kind of nozzle head, it includes：Nozzle plate；Nozzle tip, it is from institute
The face-down projection of following table of nozzle plate is stated, and nozzle bore upwardly and downwardly passes through the nozzle tip；Avoid dimple, its shape
Into recessed towards the upper surface of the nozzle plate on the periphery of the nozzle tip, and from the lower surface of the nozzle plate
Fall into；Hole is vacuum formed, it is arranged to separate with the nozzle tip, and passes through upper surface and the following table of the nozzle plate
Face；Mobile dimple, it is recessed on the lower surface of the nozzle plate, and makes described to be vacuum formed hole and the avoidance
Dimple connects；And a sheet glass, it is attached to the lower surface of the nozzle plate, and wherein described a piece of glass
Hole is carried in face of the part of the nozzle tip.
The flowing space is formed between the bottom of the mobile dimple and the upper surface of the glass, and liquid flows through the stream
Dynamic space, or vacuum put on the flowing space.
The solution feed line that is connected with nozzle bore and with it is described be vacuum formed vacuum/cleaning liquid that hole connects and apply manage
Line is connected to the upper surface of the nozzle plate.
The solution feed line and the vacuum/cleaning liquid apply pipeline and are connected to nozzle backboard, and nozzle is carried on the back
Plate is attached to the upper surface of the nozzle plate.
The circular dimple that diameter is more than the diameter of the nozzle tip is formed around the nozzle tip of the nozzle plate,
Be divided into circumference of the guide groove of some along the nozzle tip formed the circular dimple and the nozzle tip it
Between, and the flowing space is formed in the circular dimple and described is vacuum formed between hole.
Two or more nozzle tips are vacuum formed hole with one or more and formed in the nozzle plate.
The nozzle plate has rectangular shape, and the flowing space is prolonged along two neighboring edges of the nozzle plate
Stretch, it is described be vacuum formed hole formed in one described flowing space one end in two edges, and with along
Two or more nozzle tips of the flowing space connection at another edge can be parallel to this another edge arrangement
In a row.
Connection space is formed in the nozzle tip and between the flowing space at another edge.
The cross-sectional area of the flowing space of one in two edges is more than the flowing space along another edge
Cross-sectional area, and along another edge the flowing space cross-sectional area be more than connection space cross-sectional area.
For be aligned nozzle tip guide bar formed the flowing space along another edge with it is described another
Between bar edge.
Form two groups of flowing spaces, and the nozzle tip, to be vacuum formed hole, the connection space and the flowing empty
Between connect, and form nozzle tip in two groups of flowing spaces and be disposed parallel to another edge.
One or more solution feed lines are installed, and a solution feed line is connected to one or more nozzle tips
End.
Liquid is fetched by being vacuum formed hole so that the application of liquid stops, and works as and release during operation is vacuum formed
Put and apply liquid when being vacuum formed.
It is vacuum formed the time and is vacuum formed release time and is controlled to apply various shapes.
According to another aspect of the present invention, there is provided a kind of liquid supply apparatus, it includes：Nozzle head, wherein middle store up
Deposit groove and be connected to and be vacuum formed hole, and vavuum pump and accumulator tank are connected respectively to intermediate storage groove.
Cleaning liquid supply pump and cleaning liquid accumulator tank are all connected to intermediate storage groove simultaneously.
First clean unit, which is connected to, is vacuum formed hole and intermediate storage groove.
Intermediate storage groove is connected to from the second clean unit of the independent branch of vavuum pump.
According to another aspect of the present invention, there is provided a kind of method for manufacturing nozzle head, methods described include：(1) pass through
Etching will form the upper surface of the nozzle plate of nozzle bore and form introducing dimple wherein；(2) in the nozzle plate
Diaphragm is formed on lower surface；(3) it is right to the avoidance dimple institute around the nozzle tip with nozzle bore and the nozzle tip
The region for the diaphragm answered is patterned；(4) photoresist is coated on the diaphragm by patterning, and
And the part of the photoresist corresponding to the nozzle bore is patterned；(5) by primary etch in the spray
Nozzle dimple is formed in mouth substrate；(6) photoresist is removed from the nozzle plate；And (7) are lost by two level
Carve the avoidance dimple formed around nozzle bore and the nozzle tip；And (8) remove the diaphragm.
Methods described further comprises：(9) after step (8), around sheet glass engagement to the avoidance dimple
The nozzle plate lower surface.
Methods described further comprises：After the step (8), on the surface of the nozzle tip and described avoid dimple
Hydrophobic coating is formed on bottom surface.
Methods described further comprises：After the step (9), on the surface of the nozzle tip, described avoid dimple
Hydrophobic coating is formed on bottom and the surface of the glass.
In step (4), the diameter of the part by patterning of photoresist corresponding to nozzle bore is more than nozzle bore
The diameter of the part by patterning of corresponding diaphragm.
From the bottom of the nozzle dimple to the height and the depth of the avoidance dimple of the top plate of the introducing dimple
Spend identical.
The primary etch and two level etching are anisotropic etchings.
The diaphragm is formed by TEOS (tetraethyl orthosilicate).
The present invention can from it is initial with projecting phase fine and constantly liquid jet stream, and can freely adjusting
The supply and interruption of the liquid projected from nozzle, and a kind of method for manufacturing the nozzle head.
In addition, the present invention can be evenly coated with 100nm or thinner film, and bad product will not be produced.
In addition, the present invention can perform easily by nozzle head is vacuum formed/suction operation, or cleaned in a site
Nozzle head.
Brief description of the drawings
By the detailed description carried out below in conjunction with accompanying drawing can clearly understand the present invention it is above-mentioned and other
Target, feature and advantage, wherein：
Fig. 1 is the perspective view for the configuration for illustrating nozzle head according to an embodiment of the invention；
Fig. 2 is Fig. 1 longitdinal cross-section diagram；
Fig. 3 is the perspective view for the configuration for illustrating nozzle head according to another embodiment of the invention；
Fig. 4 is Fig. 3 longitdinal cross-section diagram；
Fig. 5 is the procedure chart that explanation is used to manufacture the nozzle method for making head of Fig. 1 nozzle；
Fig. 6 is the procedure chart that explanation is used to manufacture the nozzle method for making head of Fig. 3 nozzle；
Fig. 7 is the longitdinal cross-section diagram for the configuration for illustrating nozzle head according to another embodiment of the invention；
Fig. 8 is the upward view of the configuration for the nozzle head for illustrating Fig. 7；
Fig. 9 is the view of the configuration of liquid supply apparatus of the explanation with the nozzle head according to the present invention；
Figure 10 is described wherein by the profile of the liquid supply apparatus liquid jet with the nozzle head according to the present invention
Photo；
Figure 11 A are the views of the ON/OFF for the vacuum suction for illustrating the periodic variation according to the present invention, and Figure 11 B
It is the photo that explanation actually forms pattern in the panel；
Figure 12 is to illustrate the reality that rectangular patterns are wherein formed by the liquid supply apparatus with nozzle head according to the present invention
The view of example；
Figure 13 A are looking up for the configuration for the nozzle plate for illustrating the nozzle head with multiinjector tip according to the present invention
Figure；And
Figure 13 B are facing upward for another example for the nozzle backboard for illustrating the nozzle head with multiinjector tip according to the present invention
View.
Embodiment
Hereinafter, nozzle head, the manufacture spray will be described in detail according to an exemplary embodiment of the invention referring to accompanying drawing
The method of mouth and the liquid supply apparatus with the nozzle head.
<First embodiment>
Fig. 1 to 4 illustrates configuration and the structure of the nozzle head according to the first embodiment of the present invention.
As described, nozzle plate 10, nozzle bore 20 included according to the nozzle head 100 of the present invention, avoid dimple 30 and draw
Enter dimple 60.
Nozzle plate 10 includes silicon substrate, and has upper and lower surface.
Nozzle bore 20 passes through the upper and lower surface of nozzle plate 10, and is supplied by the upper surface of nozzle plate 10
Solution projected by the lower surface of nozzle plate 10.
If necessary, multiple nozzle bores 20 being spaced apart can be formed.
The introducing dimple 60 connected with nozzle bore 20 is formed on the upper surface of nozzle plate 10.
Dimple 60 is introduced to be formed in the porch that liquid is incorporated into and be connected to a part of liquid supply apparatus,
It will be described below.
Avoid dimple 30 to be formed on the lower surface of nozzle plate 10 relative to the concave surface of nozzle bore 20, towards nozzle plate
10 upper surface.
Avoid dimple 30 and be formed as annular shape, it is centrally located in nozzle bore 20.
The diameter for introducing dimple 60 is more than the diameter of nozzle bore 20, and less than the diameter for avoiding dimple 30.
If the diameter for introducing dimple 60 is more than the diameter for avoiding dimple 30, the liquid supplied may apply high pressure
To nozzle interior.
Nozzle tip 15 forms a part for nozzle plate 10, and nozzle tip 15 is arranged in nozzle bore 20 with avoiding dimple 30
Between.
Nozzle tip 15 has the shape of hollow posts so that nozzle bore 20 is formed inside nozzle tip 15, and is avoided
Dimple 30 is formed outside nozzle tip 15, and nozzle 20 and avoidance dimple 30 are spaced apart by nozzle tip 15.
In an embodiment of the present invention, nozzle tip 15 protrudes towards the lower surface of nozzle plate 10, that is to say, that in liquid
The side that body projects projects upwards, and avoids dimple 30 and be arranged in around nozzle tip 15.
According to said structure, when the liquid projected by nozzle bore 20 is attached to the lower surface of nozzle tip 15 so that just
When forming the globule in the injection level that begins, the avoidance dimple 30 formed around nozzle tip 15 can make the size of liquid drop diminish,
And liquid can be prevented to be spread out to the phenomenon of the periphery of nozzle bore 20.
The projecting height of nozzle tip 15 is identical positioned at the height for avoiding the part around dimple 30 with nozzle plate 10.
Hydrophobic coating 70 forms on the surface of nozzle tip 15, avoids the bottom of dimple 30 and the surface of nozzle plate 10
On.
The phenomenon for causing hydrophobic coating 70 to be peeled off due to reusing nozzle head and washer jet can be prevented.
Hydrophobic coating 70 needs strong hydrophobic property and strong physics and chemical characteristic (resistance).
Meanwhile as illustrated in figs. 3 and 4, a sheet glass 40 can be added on the lower surface of nozzle plate 10.
Glass 40 forms a step relative to nozzle surface, accordingly it is possible to prevent due to reuse nozzle head and clearly
There is the phenomenon peeled off in the hydrophobic coating 70 that washing nozzle causes to be formed at the tip of nozzle tip 15.
Certainly, because glass 40 is attached to the upper surface of base plate avoided around dimple 30, nozzle tip 15 is dashed forward
It is lower than the surface of glass 40 to go out height.
Equally, hydrophobic coating 70 is also formed on the surface of glass 40, so as to prevent due to reusing nozzle
Head and washer jet cause hydrophobic coating 70 phenomenon peeled off occur.
Particularly, because glass 40 is attached to the circumference for avoiding dimple 30, so as to due to glass 40 and nozzle tip 15
Tip between difference in height formed a step, a kind of effect can be realized by the structure, can be sprayed in Reusability
The tip of nozzle tip 15 is blocked during mouth in cleaning or wiping process, to avoid physics and chemical contact.
It is therefore advantageous to hydrophobic coating 70 is formed in glass 40, avoidance dimple 30 and nozzle tip 15.
In other words, hydrophobic coating 70 is a part coated with hydrophobic material, and can be prevented by attached
It is connected to the phenomenon of the outside long range diffusion of liquid of the injection of nozzle bore 20 of nozzle tip 15 and the like.That is, pass through
Allow contact angle to become big, the less stream of diameter can be formed in liquid jet.
Avoid because hydrophobic coating 70 is also formed in addition to nozzle tip 15 in dimple 30 and glass 40, spray
The mutually exclusive reaction in lower surface of mouth so that even if the surface of cleaning liquid or other liquid contact nozzle heads, can also stand
Surface i.e. with nozzle head separates.
It can thus be avoided interference liquid jet, and fabulous application function can be maintained.
The above-mentioned plane atomizer for finely projecting specifically can be used for the solution for such as forming OLED pixel etc
The continuous injection method of technique, and can be used in the fluid supply unit of other purposes.
Hereinafter by the method referring to the descriptions of Fig. 5 and 6 manufacture according to the nozzle of the first embodiment of the present invention.
First, as illustrated in fig. 5, included according to the method for the manufacture nozzle head of the present invention：First step S100, passes through
Etching will wherein form the upper surface of the nozzle plate 10 of nozzle bore 20 (referring to Fig. 1), be formed and introduce dimple 60；Second step
S200, diaphragm 50 is formed on the lower surface of nozzle plate 10；Third step S300, for the nozzle tip with nozzle bore 20
The region of the diaphragm 50 corresponding to avoidance dimple 30 around end 15 and nozzle tip 15 is patterned；Four steps
S400, photoresist 80 is coated on the diaphragm 50 by patterning, and the part corresponding to nozzle bore 20 is carried out
Patterning；5th step S500, nozzle dimple 21 is formed on the lower surface of nozzle plate 10 by primary etch；6th step
S600, photoresist PR is removed from nozzle plate 10；7th step S700, it is etched in by two level around nozzle tip 15
Form nozzle bore 20 and avoid dimple 30；And the 8th step S800, remove diaphragm 50.
As illustrated by Fig. 5 A, first step S100 is the nozzle plate 10 that nozzle bore 20 will be wherein formed by etching
The step of upper surface is to form introducing dimple 60.Introducing dimple 60 has cylinder form, and corresponding to liquid supply when institute
The entrance passed through.
The shape for introducing dimple 60 can not be cylinder, as long as and introducing the shape of dimple 60 and being easily coupled to liquid
Body supply arrangement, any shape are all applicable.
Nozzle plate 10 can be etched by using known anisotropic etching (dry-etching) to form introducing dimple
60。
Meanwhile because compared with nozzle bore 20 and avoidance dimple 30, accurately realize the shape for the design for introducing dimple 60
Necessity it is relatively low, it is possible to using Wet-type etching method, and other known method is also possible.
Next, as illustrated in Fig. 5 B, in second step S200, protection is formed on the lower surface of nozzle plate 10
Film 50.Diaphragm 50 performs some parts of function of effectively protecting nozzle plate 10, when performing erosion in the following step
During carving technology, etch process is performed not at these parts.
Material of the tetraethyl orthosilicate (TEOS) as diaphragm 50 can be used, and such as SiO2 or SiN can be used
Etc another material diaphragm, this material has stronger resistance in silicon etching process.
Meanwhile the diaphragm using TEOS methods is formed by deposition process, and TEOS is suitable as according to the present invention
Protective coating material because TEOS even in silicon etch during for a long time exposure can also perform diaphragm function.
In third step S300, as illustrated in fig. 5 c, to the outer surface of the nozzle tip 15 comprising nozzle bore 20 and
The region of the diaphragm 50 corresponding to avoidance dimple 30 around nozzle tip 15 is patterned.
The Patternized technique of diaphragm 50 can be used by photomask, exposed and developed known common method.
Next, in four steps S400, as illustrated by Fig. 5 D, light is coated on the diaphragm 50 by patterning
Resist 80 is caused, and the part of the photoresist 80 corresponding to nozzle bore 20 is patterned.
Photoresist 80 can be coated by the conventional known method of such as spin-coating method etc.
It is because passing through the part to the photoresist 80 corresponding to nozzle bore 20 that photoresist 80, which obtains patterning,
Primary etch is carried out, can complete to avoid the etching of dimple 30 and the etching of nozzle bore 20 simultaneously.
In this case, it is preferred that the part by patterning for corresponding to nozzle bore 20 of photoresist 80
Diameter is more than the diameter of the part by patterning for corresponding to nozzle bore of diaphragm 50.
Because, it is not easy to make the process of the diameter and diaphragm 50 of the part by patterning of photoresist 80
The diameter of the part of patterning is identical, and when the diameter of the part by patterning of photoresist 80 is smaller, can not
Obtain the predetermined diameter of nozzle bore 20.
That is, in nozzle manufacturing process, because TEOS diaphragm 50 is formed under upper photoresist 80
To perform defencive function during etching on layer, so when being patterned to photoresist 80, can be comparatively easy
Perform the auxiliary operation of such as alignment etc.
Next, as illustrated in Fig. 5 E, in the 5th step S500, by primary etch nozzle plate 10 following table
Nozzle dimple 21 is formed on face.
Primary etch can include anisotropic etching (dry-etching) known to use to etch nozzle plate 10.
Certainly, etched although conventional Wet-type etching method can be used to perform silicon, preferably application is more accurate
Dry etching method, because should accurately realize nozzle bore 20 and avoid the shape of the design of dimple 30.
In the 6th step S600, as illustrated in fig. 5f, photoresist PR is removed.
For example, by the dry method of application such as O2 plasma methods etc, can be readily removable photic
Resist PR.
By the minimizing technology of such as O2 plasma methods etc, diaphragm 50 will not be removed.
That is, by the conventional special removal agent of photoresist 80, TEOS diaphragms 50 will not be removed.
Next, as illustrated by Fig. 5 G, in the 7th step S700, etch to form nozzle bore 20 and nozzle by two level
Avoidance dimple 30 around tip 15.
It can be used and primary etch identical condition in two level etching.
In addition, nozzle dimple 21 is formed by primary etch, and it is preferably recessed from the bottom of nozzle dimple 21 to introducing
The height of 60 top plates of seat is identical with the depth for avoiding dimple 30.
Using this configuration, same time point can be etched in by two level and forms nozzle dimple 20 and avoids dimple 30.
Next, as illustrated in Fig. 5 H, in the 8th step S800, diaphragm is removed using suitable minimizing technology
50。
The dry type plasma body method in O2 to CF4 gases by generally adding scheduled volume, can easily remove by
The diaphragm that such as TEOS etc material is formed.
As illustrated by Fig. 5 I, after the 8th step S800, following steps can be added：In the table of nozzle tip 15
Hydrophobic coating 70 is formed on the surface in face, the bottom for avoiding dimple 30 and substrate 10.
Hydrophobic coating needs strong hydrophobic property and strong physics and chemical characteristic (resistance).
Currently used product includes 3M FC, Asahi Glass CYTOPTM, DupontAF、Seco
Top Clean SafeTM, and other known products with strong hydrophobic property can be used.
For example, 3M FC (fluorocarbon) are liquid hydrophobic paper tinsels, and 3M FC-722 can use FC-40 with 1:4
Ratio dilution.
3M FC are coated with spin-coating method (1500rpm, 1 minute), and can be by the way that 3M FC are fixed on a surface
Coated by the method that (about 115 DEG C, 20 minutes) are baked in baker.
Furthermore, it is possible to using the coating method by plasma method, and methods described use comprising such as CF4 or
C4F8 etc fluorine-based gas causes the surface of substrate to have hydrophobicity.
There can be hydrophobicity by depositing the surface, and for example, can be in the deposition process
Use Seco Top Clean SafeTM。
Asahi Glass CYTOPTMWith Dupont'sAF is the solvable of such as fluorinated polymer material etc
Material, and can be coated with by spin-coating method.
By the technique, Fig. 1 and 2 nozzle head is completed.
Meanwhile as illustrated by Fig. 6 I, after the 8th step S800, the 9th step S900 can be added, by a piece of glass
Glass 40 be joined to avoid dimple 30 around nozzle plate 10 lower surface (Fig. 6 A to 6H corresponding to and Fig. 5 A to 5H identical works
Skill).
Step from the surface stepping of nozzle is formed by glass 40, and accordingly it is possible to prevent as described below due to weight
Cause the hydrophobic coating 70 of the formation at the tip of nozzle tip 15 is peeling-off to show using nozzle head and washer jet again
As.
Glass 40 and nozzle plate 10 can be engaged with each other by anodic bonding method and following phenomenon：If at high temperature
Apply voltage, two surfaces can be engaged with each other by electrostatic force.
The method in addition to above-mentioned glass 40 engages can be used.
That is, after being formed by the step of engagement and chemoresistance plastics are formed, can be with after silicon processing
Perform the engagement by binder.
Silicon joint method can include many known methods (for example, congruent melting engagement and directly engagement), and for example,
Congruent melting engagement is use a kind of specific method of phenomenon, and this phenomenon is, when two kinds of metals meet predetermined condition (composition material,
Material ratio, temperature and pressure) when, under the minimum fusing point of both metals, two kinds of metallic surfaces easily melt and sticked
Each other.
As illustrated by Fig. 6 J, after the 9th step S900, following steps can be added：In the table of nozzle tip 15
Hydrophobic coating 70 is formed on the surface in face, the bottom for avoiding dimple 30 and glass 40.
The forming method of hydrophobic coating is as described above, thus will no longer be repeated.
By Fig. 6 A to 6J technique, the nozzle head with the structure illustrated in Fig. 3 and 4 is completed.
Therefore, according to manufacturing method according to the invention, can accurately manufacture one kind liquid jet while can make liquid
The more fine nozzle head of the size of body stream.
In addition, according to the present invention, because the spray with about 40 μm of fine diameter can be formed accurately by MEMS
Nozzle aperture, it is possible to be evenly coated with 100nm or thinner film.
<Second embodiment>
Fig. 7 to 13 illustrates that nozzle head according to the second embodiment of the present invention and the liquid supply comprising the nozzle head are set
Standby configuration.
As described, included according to the nozzle head 1000 of the present invention：Nozzle plate 10；Nozzle tip 15 is from nozzle plate 10
The face-down projection of following table；Nozzle bore 20, it upwardly and downwardly passes through nozzle tip 15 and nozzle plate 10, and liquid passes through nozzle
Project in hole 20；Avoid dimple 30, it is formed on the periphery of nozzle tip 15, and is sprayed from the lower surface of nozzle plate 10 direction
The upper surface depression of mouth substrate 10；Hole 90 is vacuum formed, it is arranged to separate with nozzle tip 15, and passes through nozzle plate 10
Upper and lower surface；Mobile dimple 31, it is recessed on the lower surface of nozzle plate 10, and make to be vacuum formed hole 90 with
Avoid hole 30 to connect；And a sheet glass 40, it is attached to the lower surface of nozzle plate 10, and wherein faces nozzle tip 15
Part carry hole.
It is preferred that solution feed line 200 and vacuum/cleaning liquid, which apply pipeline 300, is connected to nozzle plate 10
Upper surface.
The flowing space 32 is formed between the bottom of mobile dimple 31 and the upper surface of glass 40, will pass through vacuum/clear
Wash liq applies the applying vacuum of pipeline 300 or flowed for cleaning liquid.
Solution feed line 200 and vacuum/cleaning liquid apply pipeline 300 and are connected to nozzle backboard 400, and nozzle is carried on the back
Plate 400 can be attached to the upper surface of nozzle plate 10.
Fig. 7 illustrates the upward view of nozzle head 1000.
As illustrated in figure 7, diameter is formed around the nozzle tip 15 of nozzle plate 10 and is more than the straight of nozzle tip 15
The circular of footpath avoids dimple 30, is formed and is divided between circle avoidance dimple 30 and nozzle tip 15 along the circumference of nozzle tip 15
The guide groove 15b of some, and avoid dimple 30 in circle and be vacuum formed to be formed between hole 90 there is the flowing space
32 mobile dimple 31.
Because it is being directed to flow after the impartial divisions of groove 15b from the liquid that nozzle tip 15 projects, it is possible to more
Definitely fetch liquid.
As illustrated by Figure 13 A, two or more nozzle tips 15 are vacuum formed hole 90 with one or more and can formed
In nozzle plate 10.
Particularly, nozzle plate 10 has rectangular shape, two adjacent edges of the flowing space 32 along nozzle plate 10
Edge extend, be vacuum formed hole 90 and formed in one flowing space 32a one end in this two edges, and with along another
Two or more nozzle tips 15 of the flowing space 32b connections of a line edge can be arranged to parallel to this another edge
A line.
Using the configuration, maximum number nozzle tip 15 can use arranged at predetermined intervals at one of nozzle plate 10
On edge, and uniformly and suction operation can be smoothly performed.
Connection space 35 is formed in nozzle tip 15 and between the flowing space 32b at another edge, so as to
Smoothly suction operation can be performed by the flowing space 32.
The flowing that the cross-sectional area of the flowing space 32a of one in two edges is more than along another edge is empty
Between 32b cross-sectional area, and the cross-sectional area of the flowing space 32a along another edge is more than connection space 35
Cross-sectional area.
Therefore, smoothly suction operation is performed from nozzle tip 15 to vavuum pump (not shown).
Guide bar 17 for being directed at nozzle tip 15 is formed in the flowing space 32a along another edge and institute
State between another edge.
As described, guide bar 17 plays a part of guiding, between the adjustment nozzle when number of nozzle increases by twice
Interval, its method of adjustment is by arranging the flowing space 32a and 32b so that the flowing space 32a and 32b are faced each other.
Form two groups of flowing spaces 32a and 32b, and nozzle tip 15, be vacuum formed hole 90 and connection space 35 and institute
State flowing space connection.The nozzle tip 15 formed in this two groups of flowing spaces 32a and 32b is disposed parallel to described another
Bar edge.
One or more solution feed lines 200 are installed, a solution feed line 200 is connected to one or more nozzles
Tip 15.
Specifically, if two nozzle tips 15 are connected to a solution feed line 200, its structure becomes more
Simply so that it can be with easy to manufacture.
Meanwhile as illustrated in figure 9, it is middle in the liquid applying apparatus 2000 with the nozzle head according to the present invention
Accumulator tank 500 is connected to vacuum cleaned liquid and applies pipeline 300, and vavuum pump 550 and accumulator tank 520 are connected respectively to centre
Accumulator tank 500.
Therefore, when operated vacuum pumps 550, which cause vacuum to be applied to vacuum/cleaning liquid, applies pipeline 300, from nozzle tip
The liquid of the discharge of end 15 is introduced in intermediate storage groove 500.
Meanwhile cleaning liquid supply pump 600 and cleaning liquid accumulator tank 510 are all connected to intermediate storage groove 500 simultaneously.
Therefore, if operation cleaning liquid supply pump 600, the cleaning liquid in cleaning liquid accumulator tank 510 is via true
Sky/cleaning liquid applies pipeline 300 through the flowing space 32 with washer jet tip 15.
Accumulator tank 520 is the component for collecting the application liquid being contained in intermediate storage groove 500 and the like matter, and
And when the application liquid condition being collected into is good, it can be recycled.
The clean unit 2 560 being individually branched off from vavuum pump 550 is connected to intermediate storage groove 500.
The liquid in conduit path between intermediate storage groove 500 and vavuum pump 550 be cleaned unit 2 560 collect and
It is contained in intermediate storage groove 500.
Clean unit 1 320 is connected to vacuum/cleaning liquid and applies pipeline 300 and intermediate storage groove 500, and flow tube is online
Cleaning liquid can be contained in cleaning liquid accumulator tank 510, and can be recycled.
Valve 1 to 7 is connected to intermediate storage groove 500, cleaning liquid accumulator tank 510, accumulator tank 520, vacuum installed in one
In the path of pump 550, clean unit 1 320 and clean unit 2 560, and the path can open according to operator scheme
And closing.
Hereinafter, the example for applying liquid using the aforesaid liquid supply arrangement with nozzle head will be described with reference to fig. 9.
In the following description, an example will be described, wherein using liquid supply apparatus from the beginning to the end in a section
Perform application, and intersegmental in another section application is performed again after one.
(1) cleaning model
As illustrated by table 1, the operation of washer jet is performed before using nozzle head supply liquid.
[table 1]
In order to realize this operation, all valves (valve 1 to 7) are remained turned-off, and then valve 1,3 and 2 is opened successively.
By operating cleaning liquid supply pump 600, pipeline 300 is applied by vacuum/cleaning liquid and supplies cleaning liquid
To nozzle tip 15.
Therefore, nozzle tip 15 is cleaned very clean.
In this step, holding is supplied by the liquid of nozzle bore 20 to be blocked.
(2) purification pattern
As illustrated by table 2, by closed in the valve 2 opened and valve 7 open while operate clean unit 1
320, remaining all cleaning liquids in conduit path are released and arrive cleaning liquid accumulator tank 510.
Therefore, maintain there is no the clean state of remaining cleaning liquid on conduit path.
[table 2]
(3) vacuum suction mode 1
As illustrated by table 3, the valve 7 and 3 having already turned on is closed, and clean unit 1 320 is closed.
Meanwhile by opening valve 4 and operated vacuum pumps 550.
Therefore, the applying vacuum of pipeline 300, and the liquid discharged by nozzle tip 15 are applied to vacuum/cleaning liquid
It is contained in intermediate storage groove 500.
[table 3]
(4) aspirate stop mode 1/ and apply pattern (starting to be coated with)
As illustrated by table 4, after the valve 1 opened is closed and valve 5 is opened, clean unit 2 560 is operated.
The liquid in conduit path between intermediate storage groove 500 and vavuum pump 550 is cleaned unit 2 560 and neatly pushed away
Go out to intermediate storage groove 500.
Valve 2,3,6 and 7 continues to remain turned-off.
When the vacuum state that vacuum/cleaning liquid applies pipeline 300 is broken, liquid continues to supply by nozzle tip 15
To panel.
Untill the application that the step is maintained on the section for performing and applying terminates.
[table 4]
(5) it is vacuum formed/suction mode 2 (applying stopping/intermediate storage)
As illustrated by table 5, valve 5 is closed and the operation of clean unit 2 560 stops, and valve 1 is opened.
Valve 2,3,6 and 7 continues to remain turned-off.
Therefore, vacuum is applied to vacuum/cleaning liquid application pipeline 300, and the liquid discharged by nozzle tip 15
It is contained in intermediate storage groove 500.
Pattern 4 and 5 can be used optionally to control coating (application).
That is, when discharging liquid, stopping suction being controlled to be applied and be sucked by vacuum, so that direction will
The region being applied in is presented to nozzle tip 15 expects.
[table 5]
(6) take-back model
As illustrated by table 6, valve 1 and 4 is closed and valve 5 and 6 is opened, and operates clean unit 2 560.
Valve 2,3 and 7 remains in that closing.
Therefore, the liquid being contained in intermediate storage groove 500 flows to accumulator tank 520.
[table 6]
Via step 1 to 6, liquid is completed through nozzle tip 15 to be applied to the process on panel.
(7) vacuum suction mode 3
As illustrated by table 7, valve 5 and 6 is closed, and valve 4 and 1 is opened, and valve 2,3 and 7 is closed.
In this state, predetermined space moving nozzle tip 15 can be used.
[table 7]
(8) aspirate stop mode 2/ and apply pattern (starting to be coated with)
Presented by predetermined space to nozzle tip 15 expect when, by the sustainable supply liquid of nozzle tip 15 to panel, because
The vacuum state for applying pipeline 300 for vacuum/cleaning solution is broken, as illustrated by table 8.
Meanwhile the liquid being contained in intermediate storage groove 500 is moved to accumulator tank 520 and by operating clean unit 2
And reclaimed.
[table 8]
According to the present invention, as long as being vacuum formed/aspirating such shirtsleeve operation by opening and closing, pass through without changing
The flow velocity for the liquid that nozzle tip 15 projects, it is possible to it is determined that applying.
If the profile by the liquid projected according to the nozzle of the present invention is actually to be shot using CCD camera, such as
It is illustrated in fig. 10, then never occur liquid (referring to Figure 10 A) due to being vacuum formed and aspirating, and if be vacuum formed
Closed with suction, liquid will continue to project (referring to Figure 10 B).
That is, project liquid accumulation to panel this shortcoming without.
It is easier using the attribute for being vacuum formed and aspirating to coat strip pattern.
That is, as illustrated in Figure 11 A and 11B, if being vacuum formed and aspirating in predetermined a period of time with predetermined
Flow velocity is closed, at the same the switch periods for being vacuum formed and aspirating change, then can form highly uniform width and thickness
Pattern, and if not performing and being vacuum formed and aspirate, liquid would not touch panel, so as to form not patterned section.
Meanwhile as illustrated in Figure 12, if installing multiple nozzles and rightly application vacuum suction and suction release,
Can applies multiple rectangular patterns with predetermined area.
Meanwhile as illustrated by Figure 13 A, the multiinjector tip 15 with multiple nozzle tips can be formed, and at this
In the case of kind, nozzle backboard 400 necessarily has appropriate configuration.
Figure 13 B illustrate the various configurations of the nozzle backboard 400 for multiinjector tip 15.
As illustrated by Figure 13 A, the nozzle body with the shape of plate includes 18 nozzle tips 15 altogether, wherein nine
The individual center arrangement for being respectively relative to nozzle body, and hole 90 is vacuum formed comprising two, for forming vacuum.
Left and right vacuum/cleaning liquid for being vacuum formed or supplying cleaning liquid applies pipeline 300 and is respectively formed at
On the left side of nozzle backboard 400 and right side, and six solution feed lines 200 are formed to be each responsible for three nozzle tips 15.
Although embodiments of the invention have been described so far, however, it is understood that the invention is not restricted to this, but base
The scope that embodiments of the invention are equivalent in sheet falls within the scope of the present invention.Those skilled in the art is not departing from this
Various modifications can be carried out in the case of the scope of invention.
Claims (27)
1. a kind of nozzle head, it includes：
One nozzle plate；
One nozzle tip, it is from the face-down projection of following table of the nozzle plate, and a nozzle bore upwardly and downwardly passes through institute
State nozzle tip；
One avoids dimple, and it is formed on the periphery of the nozzle tip, and from the lower surface of the nozzle plate towards institute
State the upper surface depression of nozzle plate；
One is vacuum formed hole, and it is arranged to separate with the nozzle tip, and through the upper surface of the nozzle plate with
Surface；
One movement dimple, it is recessed on the lower surface of the nozzle plate, and make it is described be vacuum formed hole with it is described
Avoid dimple connection；And
One sheet glass, it is attached to the lower surface of the nozzle plate, and the one of wherein described glass faces the spray
The part at sharp-tongued end carries hole.
2. nozzle head according to claim 1, wherein a flowing space formed the bottom of the mobile dimple with it is described
Between the upper surface of glass, wherein liquid flows through the flowing space or vacuum and puts on the flowing space.
3. nozzle head according to claim 1, connect wherein a solution feed line and one vacuum/cleaning liquid apply pipeline
The upper surface of the nozzle plate is connected to, wherein the solution feed line connects with a nozzle bore, and the vacuum/clear
Wash liq applies pipeline and connected with the hole that is vacuum formed.
4. nozzle head according to claim 3, wherein the solution feed line and the vacuum/cleaning liquid apply pipe
Line is connected to a nozzle backboard, and the nozzle backboard is attached to the upper surface of the nozzle plate.
5. nozzle head according to claim 3, wherein diameter are more than a circular dimple shape of the diameter of the nozzle tip
Into around the nozzle tip of the nozzle plate, one is divided into circle of the guide groove of some along the nozzle tip
Week and formed between the circular dimple and the nozzle tip, and a flowing space formed the circular dimple with it is described
It is vacuum formed between hole.
6. nozzle head according to claim 1, two of which or more nozzle tip and one or more are vacuum formed
Hole is formed in the nozzle plate.
7. nozzle head according to claim 6, wherein the nozzle plate has a rectangular shape, a flowing space is along institute
The adjacent two edge extension of nozzle plate is stated, the hole that is vacuum formed is formed one 's in two edges
The end of the flowing space, and two or more nozzle tips connected with the flowing space along another edge
End can be arranged in a row parallel to another edge.
8. nozzle head according to claim 7 a, wherein connection space is formed in the nozzle tip and along described another
Between the flowing space of a line edge.
9. nozzle head according to claim 8, wherein the flowing space of one in two edges
Cross-sectional area is more than the cross-sectional area of the flowing space along another edge, and along another edge
The cross-sectional area of the flowing space is more than the cross-sectional area of the connection space.
10. nozzle head according to claim 7, wherein for be aligned a guide bar of the nozzle tip formed along
Between the flowing space at another edge and another edge.
11. nozzle head according to claim 8, two groups of flowing spaces are formed with, and it is the nozzle tip, described true
Sky forms hole, the connection space connects with the flowing space, and forms the nozzle in two groups of flowing spaces
Tip is disposed parallel to another edge.
12. nozzle head according to claim 5, wherein one or more solution feed lines are installed, and a solution
Supply pipeline is connected to one or more nozzle tips.
13. nozzle head according to claim 1, wherein being vacuum formed hole by described during an operation being vacuum formed
Liquid is fetched, to cause the application of liquid to stop, and applies the liquid when being vacuum formed described in release.
14. nozzle head according to claim 13, wherein one be vacuum formed the time and one be vacuum formed release time by
Control to apply various shapes.
15. a kind of liquid supply apparatus, it includes：
One nozzle head according to any one of claim 1 to 14,
A wherein intermediate storage groove is vacuum formed hole described in being connected to, and vavuum pump and accumulator tank are connected respectively among described and stored up
Deposit groove.
16. liquid supply apparatus according to claim 15, wherein a cleaning liquid supply pump and cleaning liquid storage
Groove is all connected to the intermediate storage groove simultaneously.
17. liquid supply apparatus according to claim 15, wherein one first clean unit is connected to described be vacuum formed
Hole and the intermediate storage groove.
18. liquid supply apparatus according to claim 15, wherein one individually purifies from the second of the vavuum pump branch
Unit is connected to the intermediate storage groove.
19. a kind of method for manufacturing nozzle head, methods described include：
(1) an introducing dimple is formed by etching the upper surface of a nozzle plate that will wherein form a nozzle bore；
(2) diaphragm is formed on the lower surface of the nozzle plate；
(3) guarantor corresponding to dimple is avoided to one around the nozzle tip with a nozzle bore and the nozzle tip
One region of cuticula is patterned；
(4) photoresist is coated on the diaphragm by patterning, and to described photic anti-corresponding to the nozzle bore
A part for erosion agent is patterned；
(5) a nozzle dimple is formed in the nozzle plate by primary etch；
(6) photoresist is removed from the nozzle plate；And
(7) nozzle bore and the avoidance dimple around the nozzle tip are formed by two level etching；And
(8) diaphragm is removed.
20. according to the method for claim 19, it further comprises：(9) after step (8), a sheet glass is engaged
The lower surface of the nozzle plate around to the avoidance dimple.
21. according to the method for claim 19, it further comprises：After step (8), in the table of the nozzle tip
Hydrophobic coating is formed on face and the bottom surface for avoiding dimple.
22. according to the method for claim 20, it further comprises：After step (9), in the table of the nozzle tip
Hydrophobic coating is formed on the surface in face, the bottom for avoiding dimple and the glass.
23. the method according to any one of claim 19 to 22, wherein in step (4), corresponding to the nozzle bore
The photoresist by patterning part diameter be more than the nozzle bore corresponding to the diaphragm warp
Cross the diameter of the part of patterning.
24. the method according to any one of claim 19 to 22, wherein drawing from the bottom of the nozzle dimple to described
The height for entering the top plate of dimple is identical with the depth of the avoidance dimple.
25. the method according to any one of claim 19 to 22, wherein the primary etch and two level etching are
Anisotropic etching.
26. the method according to any one of claim 19 to 22, wherein the diaphragm is by TEOS (silicic acid tetrems
Ester) formed.
27. a kind of nozzle head, made by its method according to any one of claim 19 to 22.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140180605A KR101649340B1 (en) | 2014-12-15 | 2014-12-15 | Method for manufacturing nozzle head based on mems and the nozzle head |
| KR10-2014-0180605 | 2014-12-15 | ||
| KR1020150012835A KR101639774B1 (en) | 2015-01-27 | 2015-01-27 | Method for manufacturing nozzle head based on mems and the nozzle head |
| KR10-2015-0012835 | 2015-01-27 | ||
| PCT/KR2015/007980 WO2016098984A1 (en) | 2014-12-15 | 2015-07-30 | Nozzle head, manufacturing method for nozzle head and liquid supply apparatus comprising nozzle head |
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| Publication Number | Publication Date |
|---|---|
| CN106170876A CN106170876A (en) | 2016-11-30 |
| CN106170876B true CN106170876B (en) | 2018-02-06 |
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| CN201580000944.1A Active CN106170876B (en) | 2014-12-15 | 2015-07-30 | Nozzle head, manufacture the method for the nozzle head and the liquid supply apparatus with the nozzle head |
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| Country | Link |
|---|---|
| CN (1) | CN106170876B (en) |
| TW (1) | TWI613094B (en) |
| WO (1) | WO2016098984A1 (en) |
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| JP2018054429A (en) * | 2016-09-28 | 2018-04-05 | 株式会社Ｓｃｒｅｅｎホールディングス | Detection method and detection device |
| KR102505266B1 (en) * | 2016-12-30 | 2023-02-28 | 어플라이드 머티어리얼스, 인코포레이티드 | Spray bar design for uniform liquid flow distribution on the substrate |
| US11139183B2 (en) * | 2018-05-24 | 2021-10-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for dry wafer transport |
| CN110426916B (en) * | 2019-08-05 | 2023-07-14 | 常州瑞择微电子科技有限公司 | Device and method for offset printing removal of photomask protective film |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000297761A (en) * | 1999-04-14 | 2000-10-24 | Hitachi Ltd | Micro-pump and chemical analyzer |
| KR20070024153A (en) * | 2005-08-26 | 2007-03-02 | 주식회사 디지아이 | Nozzle element of head using semiconductor process and manufacturing method thereof |
| JP2009113351A (en) * | 2007-11-07 | 2009-05-28 | Seiko Epson Corp | Nozzle substrate made of silicon, liquid droplet discharge head with nozzle substrate made of silicon, liquid droplet discharge apparatus equipped with liquid droplet discharge head, and method for manufacturing nozzle substrate made of silicon |
| KR20140055193A (en) * | 2012-10-30 | 2014-05-09 | 주식회사 선익시스템 | Nozzle shield to minimize the thermal deformation |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5023488B2 (en) * | 2005-03-09 | 2012-09-12 | セイコーエプソン株式会社 | Device mounting structure and device mounting method, droplet discharge head, drive unit, and semiconductor device |
| KR101687015B1 (en) * | 2010-11-17 | 2016-12-16 | 삼성전자주식회사 | Nozzle plate and method of manufacturing the same |
-
2015
- 2015-07-30 CN CN201580000944.1A patent/CN106170876B/en active Active
- 2015-07-30 WO PCT/KR2015/007980 patent/WO2016098984A1/en active Application Filing
- 2015-09-08 TW TW104129633A patent/TWI613094B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000297761A (en) * | 1999-04-14 | 2000-10-24 | Hitachi Ltd | Micro-pump and chemical analyzer |
| KR20070024153A (en) * | 2005-08-26 | 2007-03-02 | 주식회사 디지아이 | Nozzle element of head using semiconductor process and manufacturing method thereof |
| JP2009113351A (en) * | 2007-11-07 | 2009-05-28 | Seiko Epson Corp | Nozzle substrate made of silicon, liquid droplet discharge head with nozzle substrate made of silicon, liquid droplet discharge apparatus equipped with liquid droplet discharge head, and method for manufacturing nozzle substrate made of silicon |
| KR20140055193A (en) * | 2012-10-30 | 2014-05-09 | 주식회사 선익시스템 | Nozzle shield to minimize the thermal deformation |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016098984A1 (en) | 2016-06-23 |
| CN106170876A (en) | 2016-11-30 |
| TWI613094B (en) | 2018-02-01 |
| TW201620722A (en) | 2016-06-16 |
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