CN106170876A - Nozzle head, manufactures the method for this nozzle head and has the liquid supply apparatus of this nozzle head - Google Patents
Nozzle head, manufactures the method for this nozzle head and has the liquid supply apparatus of this nozzle head Download PDFInfo
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- CN106170876A CN106170876A CN201580000944.1A CN201580000944A CN106170876A CN 106170876 A CN106170876 A CN 106170876A CN 201580000944 A CN201580000944 A CN 201580000944A CN 106170876 A CN106170876 A CN 106170876A
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- dimple
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- nozzle plate
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- 238000000059 patterning Methods 0.000 claims description 16
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 11
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
Abstract
The present invention relates to a kind of nozzle head, a kind of method manufacturing described nozzle head, and comprise: nozzle head, it comprises: nozzle plate；Nozzle tip, it towards lower process, and has nozzle bore upwardly and downwardly through described nozzle tip from the lower surface of described nozzle plate；Avoiding dimple, it is formed on the periphery of described nozzle tip, and caves in from the lower surface of described nozzle plate towards the upper surface of described nozzle plate；And introducing dimple, it is formed on the described upper surface of described nozzle plate, so that being connected to described introducing dimple for the pipeline for liquid.
Description
Technical field
The present invention relates to a kind of nozzle head, a kind of method manufacturing described nozzle head and a kind of liquid with described nozzle head
Body supply arrangement, and more specifically to a kind of nozzle head for persistently penetrating fine liquid stream, a kind of manufacture described
The method of nozzle head and a kind of liquid supply apparatus with described nozzle head.
Background technology
Along with the fast development of the continuous information industry of upgrading, high-speed transfer information allows the people can not be by time and place
Restriction send and receive mail, voice and image.
CRT-led information delivery media has been developed, the big rule of the most such as LCD, PDP, LED and UHD etc
Mould flat faced display (it may be suitable for ergonomics function and high functionality) and such as high-speed mobile communications terminal, PDA
The most quickly increase with the small-size display of web-tablet etc, and monitor market due to convenience according to need
That asks flies up development.
Due to high-quality and the low-power consumption of flat faced display, various application markets become increasingly to enliven, and OLED continues
As display of future generation by common concern after LCD and PDP.
Since the Tang of Kodak successfully sent high brightness from the organic material with stack architecture in 1987
Since light, OLED has been achieved for many technical progress up to now.
OLED has fabulous screen quality in terms of brightness, contrast, response speed, color rendering degree and visibility,
And because technique is simple so cost is the lowest, therefore OLED is considered so-called preferable display.
But, OLED service life is shorter and qualification rate is relatively low, and therefore commercialization has difficulties, due to LCD correlation technique
Rapid advances greatly limit OLED and come into the market, therefore the commercialization of OLED receives delay.
In recent years, owing to similar all technical problems of world display industry are solved, thus Japan and
Taiwan includes that the relevant enterprise of Korea S has begun to volume production OLED.
OLED is such a display device, the hole being wherein injected in organic film by anelectrode and negative electrode and
Electronics couples to form exciton the most again, and the energy sent when exciton returns steady statue is again converted into light, the most luminous.
Simplest OLED comprises the negative electrode for penetrating electronics, for penetrating the anelectrode in hole and for luminescence
Organic film, and comprise functional layer further, functional layer explanation injection and transmission electronics and hole, to improve carrier again
Coupling and the characteristics of luminescence.
Organic film forms technology and comprises and use the extensive deposition technology of fine metal mask (FMM), use laser
Patterning techniques, and use the printing technology of liquid base oils ink material.
Extensive deposition technique classification becomes sedimentary origin technology and mask technique, and sedimentary origin technology comprises according to relevant skill
The spot deposition source of art, the linear deposition source of extensive deposition in recent years, gas aggradation technology and hanging down according to deposition direction
Straight and level deposition source, and mask technique comprises aligner mechanism technology and pattern mask technology.
Additionally, printing technology can comprise uses macromolecular LED solution and conducting solution, hectograph, notch board and flexographic plate
Inkjet printing.
Printing technology has the structure for liquid moves to nozzle head and drain.
Meanwhile, when expectation application printing technology forms OLED pixel, it is necessary to finely and constantly penetrated by nozzle head
Go out liquid.
In order to meet these requirements, have been developed for the nozzle of various structure and shape, but continue liquid jet aspect
Exist and limit, this is because the complicated structure of these nozzles, and liquid jet stream is bigger.
Summary of the invention
It is an object of the invention to attempt to solve the problems referred to above, and a kind of nozzle head is provided and manufactures the side of described nozzle head
Method, described nozzle head from initially injection phase fine ground and constantly liquid jet stream, and can freely can adjust
From supply and the interruption of the liquid of nozzle injection.
The present invention also provides for a kind of liquid supply apparatus with nozzle head, and described nozzle head can be evenly coated with
The thin film of 100nm or thinner, without producing bad product.
According to an aspect of the present invention, it is provided that a kind of nozzle head, comprising: nozzle plate；Nozzle tip, it is from described
The lower surface of nozzle plate is towards lower process, and nozzle bore is upwardly and downwardly through described nozzle tip；Avoiding dimple, it is formed
On the periphery of described nozzle tip and recessed towards the upper surface of described nozzle plate from the lower surface of described nozzle plate
Fall into；And introducing dimple, it is formed on the described upper surface of described nozzle plate so that couple for the pipeline for liquid
To described introducing dimple.
According to another aspect of the present invention, it is provided that a kind of nozzle head, comprising: nozzle plate；Nozzle tip, it is from institute
State the lower surface of nozzle plate towards lower process, and nozzle bore is upwardly and downwardly through described nozzle tip；Avoid dimple, its shape
Become on the periphery of described nozzle tip and recessed towards the upper surface of described nozzle plate from the lower surface of described nozzle plate
Fall into；Being vacuum formed hole, it is arranged to separate with described nozzle tip, and passes upper surface and the following table of described nozzle plate
Face；Mobile dimple, it cave on the described lower surface of described nozzle plate, and is vacuum formed hole and described avoidance described in making
Dimple connects；And sheet glass, it is attached to the described lower surface of described nozzle plate, and faced by wherein said sheet glass
The part band of described nozzle tip is porose.
The flowing space is formed between bottom and the upper surface of described glass of described mobile dimple, and liquid flows through described stream
Move space, or vacuum puts on the described flowing space.
The solution feed line that connects with nozzle bore and be vacuum formed vacuum/cleaning liquid that hole connects apply pipe with described
Line is connected to the upper surface of described nozzle plate.
Described solution feed line and described vacuum/cleaning liquid apply pipeline and are connected to nozzle backboard, and the nozzle back of the body
Plate is attached to the upper surface of described nozzle plate.
Diameter is formed at around the nozzle tip of described nozzle plate more than the circular dimple of the diameter of described nozzle tip,
Be divided into the guide groove of some along the circumference of described nozzle tip be formed at described circular dimple and described nozzle tip it
Between, and the flowing space is formed at described circular dimple and described is vacuum formed between hole.
Two or more nozzle tips are vacuum formed hole with one or more and are formed in described nozzle plate.
Described nozzle plate has rectangular shape, and the described flowing space is prolonged along two neighboring edges of described nozzle plate
Stretch, described in be vacuum formed described flowing space one end of one that hole is formed in described two edges, and with along
Two or more nozzle tips of the described flowing space connection at another edge can be parallel to this another edge and arrange
In a row.
Connection space is formed at described nozzle tip and between the flowing space at another edge described.
The cross-sectional area of the flowing space of in two edges is more than the flowing space along another edge
Cross-sectional area, and the cross-sectional area of the flowing space along another edge described is more than the cross-sectional area of connection space.
For be directed at the guide bar of nozzle tip be formed at the flowing space along another edge described with described another
Between bar edge.
Form two groups of flowing spaces, and described nozzle tip, be vacuum formed hole, described connection space and described flowing sky
Between connect, and the nozzle tip being formed in described two groups of flowing spaces is disposed parallel to another edge described.
One or more solution feed line is installed, and a solution feed line is connected to one or more nozzle tip
End.
Liquid is fetched by being vacuum formed hole so that the applying of liquid stops during being vacuum formed operation, and when release
Put applying liquid when being vacuum formed.
It is vacuum formed the time and is controlled release time to apply various shape with being vacuum formed.
According to another aspect of the present invention, it is provided that a kind of liquid supply apparatus, comprising: nozzle head, wherein centre is stored up
Deposit groove and be connected to be vacuum formed hole, and vacuum pump and accumulator tank are connected respectively to intermediate storage groove.
Cleaning liquid supply pump and cleaning liquid accumulator tank are all connected to intermediate storage groove simultaneously.
First clean unit is connected to be vacuum formed hole and intermediate storage groove.
It is connected to intermediate storage groove from the second clean unit of the independent branch of vacuum pump.
According to another aspect of the present invention, it is provided that a kind of method manufacturing nozzle head, described method includes: (1) is passed through
It is etched in the upper surface of the nozzle plate that wherein will form nozzle bore and forms introducing dimple；(2) at described nozzle plate
Protecting film is formed on lower surface；(3) right to the avoidance dimple institute having around the nozzle tip of nozzle bore and described nozzle tip
The region of the described protecting film answered patterns；(4) at the described photoresist that coats on the protecting film of patterning, and
And the part of the described photoresist corresponding to described nozzle bore is patterned；(5) by primary etch in described spray
Mouth substrate is formed nozzle dimple；(6) from described nozzle plate, described photoresist is removed；And (7) are by two grades of erosions
Carve the avoidance dimple formed around nozzle bore and described nozzle tip；And (8) remove described protecting film.
Described method farther includes: sheet glass, after step (8), is joined to around described avoidance dimple by (9)
The lower surface of described nozzle plate.
Described method farther includes: after step (8), at the surface of described nozzle tip and described avoidance dimple
Hydrophobic coating is formed on bottom surface.
Described method farther includes: after step (9), on the surface of described nozzle tip, described avoidance dimple
Hydrophobic coating is formed on the surface of bottom and described glass.
In step (4), the diameter of the part through patterning of the photoresist that nozzle bore is corresponding is more than nozzle bore
The diameter of the part through patterning of corresponding protecting film.
From the described bottom of described nozzle dimple to height and described avoidance dimple deep of the top board of described introducing dimple
Spend identical.
Described primary etch and described two grades of etchings are anisotropic etchings.
Described protecting film is formed by TEOS (tetraethyl orthosilicate).
The present invention from initially injection phase fine ground and constantly liquid jet stream, and can freely can adjust
From supply and the interruption of the liquid of nozzle injection, and a kind of method manufacturing described nozzle head.
Additionally, the present invention can be evenly coated with the thin film of 100nm or thinner, and bad product will not be produced.
Additionally, the present invention can perform to be vacuum formed/vacuuming operation easily by nozzle head, or clean in a site
Nozzle head.
Accompanying drawing explanation
By the detailed description carried out below in conjunction with accompanying drawing can clearly understand the above-mentioned of the present invention and other
Target, feature and advantage, wherein:
Fig. 1 is the perspective view that the configuration of nozzle head according to an embodiment of the invention is described；
Fig. 2 is the longitdinal cross-section diagram of Fig. 1；
Fig. 3 is the perspective view of the configuration that nozzle head according to another embodiment of the invention is described；
Fig. 4 is the longitdinal cross-section diagram of Fig. 3；
Fig. 5 is the procedure chart of the nozzle head manufacture method that the nozzle for manufacturing Fig. 1 is described；
Fig. 6 is the procedure chart of the nozzle head manufacture method that the nozzle for manufacturing Fig. 3 is described；
Fig. 7 is the longitdinal cross-section diagram of the configuration that nozzle head according to another embodiment of the invention is described；
Fig. 8 is the upward view of the configuration of the nozzle head of explanatory diagram 7；
Fig. 9 is the view that explanation has the configuration of the liquid supply apparatus of the nozzle head according to the present invention；
Figure 10 is to describe wherein by having the profile of the liquid supply apparatus liquid jet of the nozzle head according to the present invention
Photo；
Figure 11 A is the open/close view of the vacuum draw that the periodic variation according to the present invention is described, and Figure 11 B
It it is the photo illustrating to actually form pattern in the panel；
Figure 12 is that the reality wherein being formed rectangular patterns by the liquid supply apparatus with nozzle head according to the present invention is described
The view of example；
Figure 13 A is looking up of the configuration of the nozzle plate that the nozzle head with multiinjector tip according to the present invention is described
Figure；And
Figure 13 B is facing upward of another example of the nozzle backboard that the nozzle head with multiinjector tip according to the present invention is described
View.
Detailed description of the invention
Hereinafter, nozzle head will be described according to an exemplary embodiment of the invention in detail referring to accompanying drawing, manufacture described spray
The method of mouth and the liquid supply apparatus with described nozzle head.
<first embodiment>
Fig. 1 to 4 illustrates configuration and the structure of the nozzle head according to the first embodiment of the present invention.
As described, comprise nozzle plate 10, nozzle bore 20 according to the nozzle head 100 of the present invention, avoid dimple 30 and draw
Enter dimple 60.
Nozzle plate 10 comprises silicon substrate, and has upper and lower surface.
Nozzle bore 20 is through the upper and lower surface of nozzle plate 10, and is supplied by the upper surface of nozzle plate 10
Solution penetrated by the lower surface of nozzle plate 10.
If desired, multiple nozzle bore 20 being spaced apart can be formed.
The dimple 60 that introduces connected with nozzle bore 20 is formed on the upper surface of nozzle plate 10.
Introduce dimple 60 and be formed in the porch that liquid is incorporated into and the part being connected to liquid supply apparatus,
Will be described below.
Avoid dimple 30 to be formed on the lower surface of nozzle plate 10 relative to nozzle bore 20 concave surface, towards nozzle plate
The upper surface of 10.
Avoiding dimple 30 and be formed as annular shape, it is centrally located in nozzle bore 20.
Introduce the diameter diameter more than nozzle bore 20 of dimple 60, and less than avoiding the diameter of dimple 30.
If introducing the diameter diameter more than avoidance dimple 30 of dimple 60, then high pressure may be applied by the liquid supplied
To nozzle interior.
Nozzle tip 15 forms a part for nozzle plate 10, and nozzle tip 15 is arranged in nozzle bore 20 and avoids dimple 30
Between.
Nozzle tip 15 has the shape of hollow posts so that it is internal that nozzle bore 20 is formed at nozzle tip 15, and avoids
It is outside that dimple 30 is formed at nozzle tip 15, and nozzle 20 and avoidance dimple 30 are spaced apart by nozzle tip 15.
In an embodiment of the present invention, nozzle tip 15 highlights towards the lower surface of nozzle plate 10, say, that at liquid
The side of body injection projects upwards, and avoids dimple 30 and be arranged in around nozzle tip 15.
According to said structure, when the liquid penetrated by nozzle bore 20 is attached to the lower surface of nozzle tip 15 so that just
When forming the globule in the injection level that begins, the avoidance dimple 30 formed around nozzle tip 15 can make the size of liquid drop diminish,
And it is possible to prevent liquid to be out-diffusion to the phenomenon of nozzle bore 20 periphery.
The height that the projecting height of nozzle tip 15 is positioned at the part avoided around dimple 30 with nozzle plate 10 is identical.
Hydrophobic coating 70 is formed at the surface of nozzle tip 15, the bottom avoiding dimple 30 and the surface of nozzle plate 10
On.
It is possible to prevent the phenomenon owing to reusing nozzle head and washer jet causes hydrophobic coating 70 to be peeled off.
Hydrophobic coating 70 needs strong hydrophobic property and strong physics and chemical characteristic (resistance).
Meanwhile, as illustrated in figs. 3 and 4, sheet glass 40 can be added on the lower surface of nozzle plate 10.
Glass 40 forms a step relative to nozzle surface, accordingly it is possible to prevent owing to reusing nozzle head with clear
Wash the phenomenon of the hydrophobic coating 70 appearance stripping that nozzle causes being formed at the tip of nozzle tip 15.
Certainly, because glass 40 is attached to avoid the upper surface of base plate around dimple 30, so nozzle tip 15 is prominent
The surface going out aspect ratio glass 40 is low.
Equally, hydrophobic coating 70 is also formed on the surface of glass 40, such that it is able to prevent owing to reusing nozzle
Head and washer jet cause hydrophobic coating 70 phenomenon peeled off occur.
Particularly, because glass 40 is attached to avoid the circumference of dimple 30, thus due to glass 40 and nozzle tip 15
Tip between difference in height form a step, a kind of effect can be realized by described structure, can spray at Reusability
At the tip cleaning or blocking in wiping process nozzle tip 15 during mouth, to avoid physics and chemical contact.
It is therefore advantageous to hydrophobic coating 70 is formed at glass 40, avoids in dimple 30 and nozzle tip 15.
In other words, hydrophobic coating 70 is coated with a part of hydrophobic material, and is possible to prevent by attached
The phenomenon of liquid of nozzle bore 20 injection receiving nozzle tip 15 and the like outwards long range diffusion.It is to say, pass through
Allow contact angle become big, the stream that diameter is less can be formed when liquid jet.
Because hydrophobic coating 70 is also formed in avoiding in dimple 30 and glass 40 in addition to nozzle tip 15, so spray
The mutually exclusive reaction of lower surface of mouth so that though cleaning liquid or the surface of other liquid contact nozzle head, it is also possible to vertical
The i.e. surface with nozzle head separates.
It can thus be avoided interference liquid jet, and fabulous application function can be maintained.
The above-mentioned plane atomizer for fine injection may be used for such as being formed the solution of OLED pixel etc specifically
The continuous injection method of technique, and may be used in the fluid supply unit of other purposes.
Hereinafter the method manufacturing the nozzle according to the first embodiment of the present invention will be described referring to Fig. 5 and 6.
First, as illustrated in fig. 5, comprise according to the method manufacturing nozzle head of the present invention: first step S100, pass through
Etching wherein will form the upper surface of the nozzle plate 10 of nozzle bore 20 (seeing Fig. 1), be formed and introduce dimple 60；Second step
S200, forms protecting film 50 on the lower surface of nozzle plate 10；Third step S300, for having the nozzle tip of nozzle bore 20
The region avoiding the protecting film 50 corresponding to dimple 30 around end 15 and nozzle tip 15 patterns；4th step
S400, coats photoresist 80 on the protecting film 50 through patterning, and carries out the part corresponding to nozzle bore 20
Patterning；5th step S500, forms nozzle dimple 21 by primary etch on the lower surface of nozzle plate 10；6th step
S600, removes photoresist PR from nozzle plate 10；7th step S700, is etched in around nozzle tip 15 by two grades
Form nozzle bore 20 and avoid dimple 30；And the 8th step S800, remove protecting film 50.
As illustrated by Fig. 5 A, first step S100 is wherein will to form the nozzle plate 10 of nozzle bore 20 by etching
Upper surface forms the step introducing dimple 60.Introduce dimple 60 and there is cylinder form, and supply time institute corresponding to liquid
The entrance passed.
The shape introducing dimple 60 can not be cylinder, as long as and introducing the shape of dimple 60 and be easily coupled to liquid
Body supply arrangement, any shape is all applicable.
Introducing dimple can be formed by using known anisotropic etching (dry-etching) etching nozzle plate 10
60。
Meanwhile, because compared with nozzle bore 20 and avoidance dimple 30, accurately realize introducing the shape of the design of dimple 60
Necessity relatively low, it is possible to use Wet-type etching method, and other known method be also possible.
It follows that as illustrated by Fig. 5 B, in second step S200, the lower surface of nozzle plate 10 forms protection
Film 50.Protecting film 50 performs effectively to protect the some parts of function of nozzle plate 10, when performing erosion in the following step
During carving technology, at these parts, do not perform etch process.
Tetraethyl orthosilicate (TEOS) can be used as the material of protecting film 50, and such as SiO2 or SiN can be used
Etc the protecting film of another kind of material, this material has stronger resistance in silicon etching process.
Meanwhile, formed the protecting film using TEOS method by deposition process, and TEOS is suitable as according to the present invention
Protective coating material, even if because TEOS long-time exposure during silicon etches also can perform protecting film function.
In third step S300, as illustrated in fig. 5 c, to comprise nozzle bore 20 nozzle tip 15 outer surface and
The region avoiding the protecting film 50 corresponding to dimple 30 around nozzle tip 15 patterns.
The Patternized technique of protecting film 50 can use by photomask, exposed and developed known common method.
It follows that in the 4th step S400, as illustrated by Fig. 5 D, the protecting film 50 through patterning coats light
Cause resist 80, and the part of the photoresist 80 corresponding to nozzle bore 20 is patterned.
Photoresist 80 can be coated by the conventional known method of such as spin-coating method etc.
Photoresist 80 obtains patterning and is because, by the part to the photoresist 80 corresponding to nozzle bore 20
Carry out primary etch, can complete to avoid etching and the etching of nozzle bore 20 of dimple 30 simultaneously.
In this case, it is preferred that the part through patterning corresponding to nozzle bore 20 of photoresist 80
Diameter is more than the diameter of the part through patterning corresponding to nozzle bore of protecting film 50.
This is because, it is not easy to make diameter and the process of protecting film 50 of the part through patterning of photoresist 80
The diameter of the part of patterning is identical, and when the diameter through the part of patterning of photoresist 80 is less, it is impossible to
Obtain the predetermined diameter of nozzle bore 20.
It is to say, in nozzle manufacture process, because the protecting film of TEOS 50 is formed at photoresist 80 times
To perform defencive function during etching on Ceng, so when photoresist 80 is patterned, can be comparatively easy
Perform the auxiliary operation of such as alignment etc.
It follows that as illustrated by Fig. 5 E, in the 5th step S500, by primary etch in the following table of nozzle plate 10
Nozzle dimple 21 is formed on face.
Primary etch can comprise the known anisotropic etching (dry-etching) of use and etch nozzle plate 10.
Certainly, although conventional Wet-type etching method can be used to perform silicon etching, but preferably application is more accurate
Dry etching method, because the shape of the design of nozzle bore 20 and avoidance dimple 30 should accurately be realized.
In the 6th step S600, as illustrated in fig. 5f, photoresist PR is removed.
For example, by applying the dry method of such as O2 plasma method etc, can be readily removable photic
Resist PR.
By the minimizing technology of such as O2 plasma method etc, protecting film 50 will not be removed.
It is to say, remove agent by the conventional special of photoresist 80, TEOS protecting film 50 will not be removed.
It follows that as illustrated by Fig. 5 G, in the 7th step S700, form nozzle bore 20 and nozzle by two grades of etchings
Avoidance dimple 30 around most advanced and sophisticated 15.
Two grades of etchings can use the condition identical with primary etch.
Additionally, form nozzle dimple 21 by primary etch, and preferably recessed to introducing bottom nozzle dimple 21
The height of seat 60 top boards is identical with the degree of depth avoiding dimple 30.
Use this configuration, identical time point can be etched in by two grades and form nozzle dimple 20 and avoid dimple 30.
It follows that as illustrated by Fig. 5 H, in the 8th step S800, use suitable minimizing technology to remove protecting film
50。
By adding the dry type plasma body method in O2 to the CF4 gas of scheduled volume generally, can easily remove by
The protecting film that the material of such as TEOS etc is formed.
As illustrated by Fig. 5 I, after the 8th step S800, following steps can be added: at the table of nozzle tip 15
Hydrophobic coating 70 is formed on the surface of face, the bottom of avoidance dimple 30 and substrate 10.
Hydrophobic coating needs strong hydrophobic property and strong physics and chemical characteristic (resistance).
Currently used product comprises CYTOPTM, Dupont's of 3M FC, Asahi GlassAF、Seco
Top Clean SafeTM, and other can be used to have the known product of strong hydrophobic property.
For example, 3M FC (fluorocarbon) is liquid hydrophobic paper tinsel, and 3M FC-722 can be with FC-40 with 1:4
Ratio dilution.
3M FC spin-coating method (1500rpm, 1 minute) coats, and can be by being fixed on a surface by 3M FC
Coated by the method being baked (about 115 DEG C, 20 minutes) in baker.
Furthermore, it is possible to use by the coating process of plasma method, and described method use comprise such as CF4 or
The fluorine-based gas of C4F8 etc makes the surface of substrate have hydrophobicity.
Described surface can be made to have a hydrophobicity by deposition, and for example, can be in described deposition process
Use the Top Clean Safe of SecoTM。
The CYTOP of Asahi GlassTMWith Dupont'sAF be such as fluorinated polymer material etc can
Molten material, and can be coated with by spin-coating method.
By described technique, complete the nozzle head of Fig. 1 and 2.
Meanwhile, as illustrated by Fig. 6 I, after the 8th step S800, the 9th step S900 can be added, by sheet glass
40 are joined to avoid the lower surface of the nozzle plate 10 around dimple 30, and (Fig. 6 A to 6H corresponds to the work identical with Fig. 5 A to 5H
Skill).
The step of surface stepping from nozzle is formed by glass 40, and accordingly it is possible to prevent as described below due to weight
Nozzle head and washer jet is used to cause peeling-off the showing of hydrophobic coating 70 formed at the tip of nozzle tip 15 again
As.
Glass 40 and nozzle plate 10 can be engaged with each other by anodic bonding method and following phenomenon: if at high temperature
Applying voltage, two surfaces can be engaged with each other by electrostatic force.
The method in addition to above-mentioned glass 40 engages can be used.
It is to say, after the step by engaging is formed and chemoresistance plastics are formed, after silicon processes, permissible
Perform the joint by adhesive.
Silicon joint method can comprise many known methods (such as, congruent melting engages and direct joint), and for example,
Congruent melting engage be the method using specific a kind of phenomenon, this phenomenon is, when two kinds of metals meet predetermined condition (composition material,
Material ratio, temperature and pressure) time, under the minimum fusing point of both metals, two kinds of metallic surfaces easily melt and stick
Each other.
As illustrated by Fig. 6 J, after the 9th step S900, following steps can be added: at the table of nozzle tip 15
Hydrophobic coating 70 is formed on the surface of face, the bottom of avoidance dimple 30 and glass 40.
The forming method of hydrophobic coating is as it has been described above, thus will no longer be repeated.
By the technique of Fig. 6 A to 6J, complete to have the nozzle head of the structure of explanation in Fig. 3 and 4.
Therefore, according to manufacturing method according to the invention, can accurately manufacture one can make liquid by liquid jet simultaneously
The nozzle head that the size of body stream is the finest.
Additionally, according to the present invention, because the spray of the fine diameter with about 40 μm can be formed accurately by MEMS
Nozzle aperture, it is possible to be evenly coated with the thin film of 100nm or thinner.
<the second embodiment>
Fig. 7 to 13 explanation nozzle head according to the second embodiment of the present invention sets with the liquid supply comprising described nozzle head
Standby configuration.
As described, comprise according to the nozzle head 1000 of the present invention: nozzle plate 10；Nozzle tip 15 is from nozzle plate 10
Lower surface towards lower process；Nozzle bore 20, it is upwardly and downwardly through nozzle tip 15 and nozzle plate 10, and liquid passes through nozzle
Hole 20 is penetrated；Avoiding dimple 30, it is formed on the periphery of nozzle tip 15, and from the lower surface of nozzle plate 10 towards spray
The upper surface depression of mouth substrate 10；Being vacuum formed hole 90, it is arranged to separate with nozzle tip 15, and through nozzle plate 10
Upper and lower surface；Mobile dimple 31, it cave on the lower surface of nozzle plate 10, and make to be vacuum formed hole 90 and
Avoid hole 30 to connect；And sheet glass 40, it is attached to the lower surface of nozzle plate 10, and wherein in the face of nozzle tip 15
Part carries porose.
It is preferred that solution feed line 200 and vacuum/cleaning liquid apply pipeline 300 is connected to nozzle plate 10
Upper surface.
The flowing space 32 is formed between bottom and the upper surface of glass 40 of mobile dimple 31, in order to by vacuum/clear
Wash liq applies pipeline 300 and applies vacuum or flow for cleaning liquid.
Solution feed line 200 and vacuum/cleaning liquid apply pipeline 300 and are connected to nozzle backboard 400, and the nozzle back of the body
Plate 400 can be attached to the upper surface of nozzle plate 10.
Fig. 7 illustrates the upward view of nozzle head 1000.
As illustrated in figure 7, around the nozzle tip 15 of nozzle plate 10, form diameter and be more than the straight of nozzle tip 15
The circular of footpath avoids dimple 30, and the circumference along nozzle tip 15 is formed between circle avoidance dimple 30 and nozzle tip 15 and is divided into
The guide groove 15b of some, and circle avoid dimple 30 and be vacuum formed between hole 90 formation there is the flowing space
The mobile dimple 31 of 32.
Because flowing after being directed to groove 15b equalization and dividing from the liquid of nozzle tip 15 injection, it is possible to more
Fetch liquid definitely.
As illustrated by Figure 13 A, two or more nozzle tips 15 are vacuum formed hole 90 with one or more and can be formed
In nozzle plate 10.
Particularly, nozzle plate 10 has rectangular shape, and the flowing space 32 is along two adjacent edges of nozzle plate 10
Edge extends, and is vacuum formed flowing space 32a one end of one that hole 90 is formed in these two edges, and with along separately
Article one, two or more nozzle tips 15 that flowing space 32b at edge connects can be parallel to this another edge and be arranged to
A line.
Using described configuration, maximum number nozzle tip 15 can use arranged at predetermined intervals at one of nozzle plate 10
On edge, and can uniformly and be smoothly performed vacuuming operation.
Connection space 35 is formed at nozzle tip 15 and between flowing space 32b at another edge described, in order to
Vacuuming operation smoothly can be performed by the flowing space 32.
The cross-sectional area of flowing space 32a of in two edges is empty more than the flowing along another edge
Between the cross-sectional area of 32b, and the cross-sectional area of flowing space 32a along another edge described is more than connection space 35
Cross-sectional area.
Therefore, vacuuming operation smoothly is performed from nozzle tip 15 to vacuum pump (not shown).
It is formed at flowing space 32a along another edge described and institute for being directed at the guide bar 17 of nozzle tip 15
State between another edge.
As described, guide bar 17 plays the effect of guiding, for adjusting between nozzle when number of nozzle increases twice
Interval, its method of adjustment is by arranging flowing space 32a and 32b so that flowing space 32a and 32b face each other.
Form two groups of flowing spaces 32a and 32b, and nozzle tip 15, be vacuum formed hole 90 and connection space 35 and institute
State flowing space connection.The nozzle tip 15 being formed in these two groups of flowing spaces 32a and 32b be disposed parallel to described another
Bar edge.
Installing one or more solution feed line 200, a solution feed line 200 is connected to one or more nozzle
Most advanced and sophisticated 15.
Specifically, if two nozzle tips 15 are connected to a solution feed line 200, then its structure becomes more
Simply so that it can easily manufacture.
Meanwhile, as illustrated in figure 9, in the liquid applying apparatus 2000 with the nozzle head according to the present invention, middle
Accumulator tank 500 is connected to vacuum cleaned liquid and applies pipeline 300, and vacuum pump 550 and accumulator tank 520 are connected respectively to centre
Accumulator tank 500.
Therefore, when operated vacuum pumps 550 makes vacuum be applied to vacuum/cleaning liquid applying pipeline 300, from nozzle tip
The liquid of end 15 discharge is introduced in intermediate storage groove 500.
Meanwhile, cleaning liquid supply pump 600 and cleaning liquid accumulator tank 510 are all connected to intermediate storage groove 500 simultaneously.
Therefore, if operation cleaning liquid supply pump 600, then the cleaning liquid in cleaning liquid accumulator tank 510 is via very
Sky/cleaning liquid applies pipeline 300 through the flowing space 32 with washer jet tip 15.
Accumulator tank 520 is for collecting the assembly applying liquid and the like matter being contained in intermediate storage groove 500, and
And when the applying liquid condition collected is good, can be recycled.
The clean unit 2560 being individually branched off from vacuum pump 550 is connected to intermediate storage groove 500.
The liquid in conduit path between intermediate storage groove 500 and vacuum pump 550 be cleaned unit 2560 collect and
It is contained in intermediate storage groove 500.
Clean unit 1320 is connected to vacuum/cleaning liquid and applies pipeline 300 and intermediate storage groove 500, and flow tube is online
Cleaning liquid can be contained in cleaning liquid accumulator tank 510, and can recycle.
Valve 1 to 7 is arranged on one and is connected to intermediate storage groove 500, cleaning liquid accumulator tank 510, accumulator tank 520, vacuum
In the path of pump 550, clean unit 1320 and clean unit 2560, and described path can open according to operator scheme and
Close.
Hereinafter, the example that use the aforesaid liquid supply arrangement with nozzle head apply liquid be will be described with reference to fig. 9.
In the following description, an example will be described, and wherein use liquid supply apparatus from the beginning to the end in a section
Perform applying, and after a spacer segment, in another section, again perform applying.
(1) cleaning model
As illustrated by table 1, before using nozzle head for liquid, perform the operation of washer jet.
[table 1]
In order to realize this operation, all valves (valve 1 to 7) remain turned-off, and then valve 1,3 and 2 is opened successively.
By operation cleaning liquid supply pump 600, apply pipeline 300 by vacuum/cleaning liquid and cleaning liquid is supplied
To nozzle tip 15.
Therefore, nozzle tip 15 is cleaned the cleanest.
In this step, supply holding by the liquid of nozzle bore 20 to be blocked.
(2) purification pattern
As illustrated by table 2, by close at the valve 2 opened and valve 7 open while operate clean unit 1320,
All cleaning liquids remaining in conduit path are released cleaning liquid accumulator tank 510.
Therefore, maintenance conduit path does not remain the clean state of cleaning liquid.
[table 2]
(3) vacuum suction mode 1
As illustrated by table 3, the valve 7 and 3 having already turned on cuts out, and clean unit 1320 is closed.
Meanwhile, by opening valve 4 and operated vacuum pumps 550.
Therefore, apply pipeline 300 to vacuum/cleaning liquid and apply vacuum, and the liquid discharged by nozzle tip 15
It is contained in intermediate storage groove 500.
[table 3]
(4) suction stop mode 1/ applies pattern (starting coating)
As illustrated by table 4, after the valve 1 opened cuts out and valve 5 is opened, operate clean unit 2560.
The liquid in conduit path between intermediate storage groove 500 and vacuum pump 550 is cleaned unit 2560 and pushes away neatly
Go out to intermediate storage groove 500.
Valve 2,3,6 and 7 continues to remain turned-off.
When the vacuum state that vacuum/cleaning liquid applies pipeline 300 is broken, liquid continues supply by nozzle tip 15
To panel.
The step for be maintained to perform apply section on applying terminate till.
[table 4]
(5)/suction mode 2 (applying stopping/intermediate storage) it is vacuum formed
As illustrated by table 5, valve 5 cuts out and the operation of clean unit 2560 stops, and valve 1 is opened.
Valve 2,3,6 and 7 continues to remain turned-off.
Therefore, vacuum is applied to vacuum/cleaning liquid and applies pipeline 300, and passes through the liquid that nozzle tip 15 is discharged
It is contained in intermediate storage groove 500.
Pattern 4 and 5 can be used optionally to control to be coated with (applying).
It is to say, when drain, can control to stop suction to carry out applying and vacuum draw, in order to towards inciting somebody to action
The region being applied in is to nozzle tip 15 feedback material.
[table 5]
(6) take-back model
As illustrated by table 6, valve 1 and 4 cuts out and valve 5 and 6 is opened, and operates clean unit 2560.
Valve 2,3 and 7 remains in that cut out.
Therefore, the liquid being contained in intermediate storage groove 500 flows to accumulator tank 520.
[table 6]
Via step 1 to 6, complete liquid through nozzle tip 15 with the process being applied on panel.
(7) vacuum suction mode 3
As illustrated by table 7, valve 5 and 6 cuts out, and valve 4 and 1 is opened, and valve 2,3 and 7 cuts out.
In this state, predetermined space moving nozzle tip 15 can be used.
[table 7]
(8) suction stop mode 2/ applies pattern (starting coating)
When by predetermined space to nozzle tip 15 feedback material, by nozzle tip 15 sustainable supply liquid to panel, because of
The vacuum state applying pipeline 300 for vacuum/cleaning solution is broken, as illustrated by table 8.
Meanwhile, the liquid being contained in intermediate storage groove 500 moves to accumulator tank 520 and by operation clean unit 2
And reclaimed.
[table 8]
According to the present invention, as long as being vacuum formed/aspirating such shirtsleeve operation by opening and closing, it is not necessary to change and pass through
The flow velocity of the liquid of nozzle tip 15 injection, it is possible to determine applying.
If actually using CCD camera shooting by the profile of the liquid of the nozzle injection according to the present invention, as
Illustrated in fig. 10, then liquid never occurs, and if be vacuum formed owing to being vacuum formed and aspirating (seeing Figure 10 A)
Closing with suction, liquid will persistently penetrate (seeing Figure 10 B).
It is to say, injection liquid accumulation to panel this shortcoming without.
The attribute being vacuum formed and aspirating is used to be easier to coat strip pattern.
It is to say, as illustrated by Figure 11 A and 11B, if predetermined a period of time being vacuum formed and aspirates with predetermined
Flow velocity is closed, and changes to the switch periods being vacuum formed simultaneously and aspirating, then can form highly uniform width and thickness
Pattern, and if not performing to be vacuum formed and aspirate, liquid would not touch panel, thus form the most patterned section.
Meanwhile, as illustrated in Figure 12, if installing multiple nozzle and application vacuum draw and suction release rightly,
Just can apply multiple rectangular patterns with predetermined area.
Meanwhile, as illustrated by Figure 13 A, the multiinjector tip 15 with multiple nozzle tip can be formed, and at this
In the case of Zhong, nozzle backboard 400 necessarily has suitable configuration.
Figure 13 B explanation is for the various configurations of the nozzle backboard 400 at multiinjector tip 15.
As illustrated by Figure 13 A, the nozzle body of the shape with plate comprises 18 nozzle tips 15, Qi Zhongjiu altogether
The individual center arrangement being respectively relative to nozzle body, and comprise two and be vacuum formed hole 90, it is used for forming vacuum.
It is respectively formed at for being vacuum formed or supply left and right vacuum/cleaning liquid applying pipeline 300 of cleaning liquid
On on the left of nozzle backboard 400 and right side, and form six solution feed line 200 to be each responsible for three nozzle tips 15.
Although having been described with embodiments of the invention so far, however, it is understood that the invention is not restricted to this, but base
The scope being equivalent to embodiments of the invention in basis falls within the scope of the present invention.Those skilled in the art is without departing from this
Various amendment can be carried out in the case of the scope of invention.
Claims (27)
1. a nozzle head, comprising:
One nozzle plate；
One nozzle tip, it is from the lower surface of described nozzle plate towards lower process, and a nozzle bore is upwardly and downwardly through institute
State nozzle tip；
One avoids dimple, and it is formed on the periphery of described nozzle tip, and from the lower surface of described nozzle plate towards institute
State the upper surface depression of nozzle plate；And
One introduces dimple, and it is formed on the described upper surface of described nozzle plate, so that for the pipeline for liquid
It is connected to described introducing dimple.
2. a nozzle head, comprising:
One nozzle plate；
One nozzle tip, it is from the lower surface of described nozzle plate towards lower process, and a nozzle bore is upwardly and downwardly through institute
State nozzle tip；
One avoids dimple, and it is formed on the periphery of described nozzle tip, and from the lower surface of described nozzle plate towards institute
State the upper surface depression of nozzle plate；
One is vacuum formed hole, and it is arranged to separate with described nozzle tip, and through described nozzle plate upper surface and under
Surface；
One moves dimple, and it caves on the described lower surface of described nozzle plate, and is vacuum formed hole with described described in making
Avoid dimple connection；And
One sheet glass, it is attached to the described lower surface of described nozzle plate, and the one of wherein said glass is in the face of described spray
The part band of sharp-tongued end is porose.
Nozzle head the most according to claim 2, wherein a flowing space is formed at the bottom of described mobile dimple with described
Between the upper surface of glass, wherein liquid flows through the described flowing space or vacuum puts on the described flowing space.
Nozzle head the most according to claim 2, wherein a solution feed line and one vacuum/cleaning liquid apply pipeline even
Receive the described upper surface of described nozzle plate, wherein said solution feed line and a nozzle bore to connect, and described vacuum/clear
Wash liq applies pipeline and connects with the described hole that is vacuum formed.
Nozzle head the most according to claim 4, wherein said solution feed line and described vacuum/cleaning liquid apply pipe
Line is connected to a nozzle backboard, and described nozzle backboard is attached to the described upper surface of described nozzle plate.
Nozzle head the most according to claim 4, wherein diameter is more than the one of the diameter of described nozzle tip circular dimple shape
Becoming around the described nozzle tip of described nozzle plate, one is divided into the guide groove circle along described nozzle tip of some
Week and be formed between described circular dimple and described nozzle tip, and a flowing space is formed at described circular dimple with described
It is vacuum formed between hole.
Nozzle head the most according to claim 2, two of which or more nozzle tip and one or more be vacuum formed
Hole is formed in described nozzle plate.
Nozzle head the most according to claim 7, wherein said nozzle plate has rectangular shape, the described flowing space along
Two neighboring edges of described nozzle plate extend, described in be vacuum formed that hole is formed in described two edges one
The end of the described flowing space, and two or more nozzle tip connected with the described flowing space along another edge
End can be parallel to this another edge and be arranged to a line.
Nozzle head the most according to claim 8, wherein a connection space be formed at described nozzle tip with along described separately
Article one, between the described flowing space at edge.
Nozzle head the most according to claim 9, the wherein described flowing space of in described two edges
Cross-sectional area is more than the cross-sectional area of the described flowing space along another edge described, and along another edge described
The cross-sectional area of the described flowing space is more than the cross-sectional area of described connection space.
11. nozzle heads according to claim 8, wherein the guide bar for being directed at described nozzle tip be formed at along
Between the described flowing space and another edge described at another edge described.
12. nozzle heads according to claim 9, are formed with two groups of flowing spaces, and described nozzle tip, described very
Empty formation hole, described connection space connect with the described flowing space, and are formed at the described nozzle in described two groups of flowing spaces
Tip is disposed parallel to another edge described.
13. nozzle heads according to claim 6, are wherein provided with one or more solution feed line, and a solution
Supply pipeline is connected to one or more nozzle tip.
14. nozzle heads according to claim 2, wherein pass through during an operation being vacuum formed described in be vacuum formed hole
Fetch described liquid, so that the applying of described liquid stops, and apply described liquid when being vacuum formed described in release.
15. nozzle heads according to claim 14, wherein one are vacuum formed the time and one and are vacuum formed and are subject to release time
Control to apply various shape.
16. 1 kinds of liquid supply apparatus, comprising:
One according to the nozzle head according to any one of claim 2 to 15,
Wherein an intermediate storage groove be connected to described in be vacuum formed hole, and vacuum pump and accumulator tank are connected respectively to storage in the middle of described
Deposit groove.
17. liquid applying apparatus according to claim 16, wherein a cleaning liquid supply pump and a cleaning liquid store
Groove is all connected to described intermediate storage groove simultaneously.
18. liquid applying apparatus according to claim 16, wherein one first clean unit be connected to described in be vacuum formed
Hole and described intermediate storage groove.
19. liquid applying apparatus according to claim 16, wherein one individually from the second purification of described vacuum pump branch
Unit is connected to described intermediate storage groove.
20. 1 kinds of methods manufacturing nozzle head, described method includes:
(1) wherein will be formed the upper surface of the nozzle plate of a nozzle bore by etching one and form an introducing dimple；
(2) on the lower surface of described nozzle plate, a protecting film is formed；
(3) to the described guarantor corresponding to the avoidance dimple having around a nozzle tip of a nozzle bore and described nozzle tip
One region of cuticula patterns；
(4) on the protecting film of patterning, photoresist is coated described, and to the described light corresponding to described nozzle bore
The part causing resist patterns；
(5) in described nozzle plate, a nozzle dimple is formed by primary etch；
(6) from described nozzle plate, described photoresist is removed；And
(7) nozzle bore and the avoidance dimple around described nozzle tip are formed by two grades of etchings；And
(8) described protecting film is removed.
21. methods according to claim 20, it farther includes: a sheet glass, after step (8), is engaged by (9)
The lower surface of described nozzle plate to the surrounding of described avoidance dimple.
22. methods according to claim 20, it farther includes: after step (8), at the table of described nozzle tip
Hydrophobic coating is formed on the bottom surface of face and described avoidance dimple.
23. methods according to claim 21, it farther includes: after step (9), at the table of described nozzle tip
Hydrophobic coating is formed on the surface of face, the bottom of described avoidance dimple and described glass.
24. according to the method according to any one of claim 20 to 23, wherein in step (4), corresponding to described nozzle bore
The diameter of the described part through patterning of described photoresist more than described protecting film corresponding to described nozzle bore
The described diameter of part through patterning.
25. according to the method according to any one of claim 20 to 23, and wherein the bottom from described nozzle dimple is drawn to described
The height of the top board entering dimple is identical with the degree of depth of described avoidance dimple.
26. according to the method according to any one of claim 20 to 23, wherein said primary etch and described two grades of etchings are
Anisotropic etching.
27. according to the method according to any one of claim 20 to 23, and wherein said protecting film is by TEOS (silicic acid tetrem
Ester) formed.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0180605 | 2014-12-15 | ||
| KR1020140180605A KR101649340B1 (en) | 2014-12-15 | 2014-12-15 | Method for manufacturing nozzle head based on mems and the nozzle head |
| KR10-2015-0012835 | 2015-01-27 | ||
| KR1020150012835A KR101639774B1 (en) | 2015-01-27 | 2015-01-27 | Method for manufacturing nozzle head based on mems and the nozzle head |
| PCT/KR2015/007980 WO2016098984A1 (en) | 2014-12-15 | 2015-07-30 | Nozzle head, manufacturing method for nozzle head and liquid supply apparatus comprising nozzle head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106170876A true CN106170876A (en) | 2016-11-30 |
| CN106170876B CN106170876B (en) | 2018-02-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580000944.1A Active CN106170876B (en) | 2014-12-15 | 2015-07-30 | Nozzle head, manufacture the method for the nozzle head and the liquid supply apparatus with the nozzle head |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN106170876B (en) |
| TW (1) | TWI613094B (en) |
| WO (1) | WO2016098984A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110426916A (en) * | 2019-08-05 | 2019-11-08 | 常州瑞择微电子科技有限公司 | A kind of device and method of optical mask plate protective film offset printing removal |
| CN110534467A (en) * | 2018-05-24 | 2019-12-03 | 台湾积体电路制造股份有限公司 | Keep the conveyer system and method for wafer cleaner |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018054429A (en) * | 2016-09-28 | 2018-04-05 | 株式会社Ｓｃｒｅｅｎホールディングス | Detection method and detection device |
| WO2018125821A1 (en) * | 2016-12-30 | 2018-07-05 | Applied Materials, Inc. | Spray bar design for uniform liquid flow distribution on a substrate |
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| JP2009113351A (en) * | 2007-11-07 | 2009-05-28 | Seiko Epson Corp | Nozzle substrate made of silicon, liquid droplet discharge head with nozzle substrate made of silicon, liquid droplet discharge apparatus equipped with liquid droplet discharge head, and method for manufacturing nozzle substrate made of silicon |
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| KR20140055193A (en) * | 2012-10-30 | 2014-05-09 | 주식회사 선익시스템 | Nozzle shield to minimize the thermal deformation |
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| JP5023488B2 (en) * | 2005-03-09 | 2012-09-12 | セイコーエプソン株式会社 | Device mounting structure and device mounting method, droplet discharge head, drive unit, and semiconductor device |
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2015
- 2015-07-30 CN CN201580000944.1A patent/CN106170876B/en active Active
- 2015-07-30 WO PCT/KR2015/007980 patent/WO2016098984A1/en active Application Filing
- 2015-09-08 TW TW104129633A patent/TWI613094B/en active
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| JP2000297761A (en) * | 1999-04-14 | 2000-10-24 | Hitachi Ltd | Micro-pump and chemical analyzer |
| KR20070024153A (en) * | 2005-08-26 | 2007-03-02 | 주식회사 디지아이 | Nozzle element of head using semiconductor process and manufacturing method thereof |
| JP2009113351A (en) * | 2007-11-07 | 2009-05-28 | Seiko Epson Corp | Nozzle substrate made of silicon, liquid droplet discharge head with nozzle substrate made of silicon, liquid droplet discharge apparatus equipped with liquid droplet discharge head, and method for manufacturing nozzle substrate made of silicon |
| US20120120153A1 (en) * | 2010-11-17 | 2012-05-17 | Samsung Electronics Co., Ltd. | Nozzle Plate And Method Of Manufacturing The Same |
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| CN110534467A (en) * | 2018-05-24 | 2019-12-03 | 台湾积体电路制造股份有限公司 | Keep the conveyer system and method for wafer cleaner |
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| CN110534467B (en) * | 2018-05-24 | 2022-01-25 | 台湾积体电路制造股份有限公司 | Conveying system and method for keeping wafer clean |
| CN110426916A (en) * | 2019-08-05 | 2019-11-08 | 常州瑞择微电子科技有限公司 | A kind of device and method of optical mask plate protective film offset printing removal |
| CN110426916B (en) * | 2019-08-05 | 2023-07-14 | 常州瑞择微电子科技有限公司 | Device and method for offset printing removal of photomask protective film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106170876B (en) | 2018-02-06 |
| TWI613094B (en) | 2018-02-01 |
| TW201620722A (en) | 2016-06-16 |
| WO2016098984A1 (en) | 2016-06-23 |
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