CN106166863A - High temperature resistant compound mould release membrance - Google Patents
High temperature resistant compound mould release membrance Download PDFInfo
- Publication number
- CN106166863A CN106166863A CN201610656004.4A CN201610656004A CN106166863A CN 106166863 A CN106166863 A CN 106166863A CN 201610656004 A CN201610656004 A CN 201610656004A CN 106166863 A CN106166863 A CN 106166863A
- Authority
- CN
- China
- Prior art keywords
- layer
- high temperature
- temperature resistant
- mould release
- release membrance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
Landscapes
- Laminated Bodies (AREA)
Abstract
The open a kind of high temperature resistant compound mould release membrance of the present invention, including: release layer, described release film layer is that two kinds of thermoplastic resin materials are realized by coextrusion process；Adhesive layer, described adhesive layer uniformly coats by adhesive and is formed with described release film layer one surface；Fire resistant resin thin layer, described fire resistant resin thin layer is attached at described adhesive layer.The high temperature resistant compound mould release membrance of three-layer type that the present invention provides, structure compacts and is easily peeled, and on the basis of ensureing not affect glue surface characteristic, off-type force is little；Fire resistant resin thin layer selects the material containing fluorine element, under 200 DEG C of hot conditionss, remain to keep not decompose, chemical reaction, will not be with release layer and adhesive layer generation chemical reaction, antiseized isolation effect is excellent, Temperature Size is stable, release layer uses elastomer silicone adhesive and controls its thickness, makes release layer not remain.
Description
Technical field
The present invention relates to field of membrane material.It is more particularly related to a kind of high temperature resistant compound mould release membrance.
Background technology
Along with Development of Human Civilization and the progress of science and technology, increasing electronic product is used for each neck of society
Territory, and external electronics industry is to the fast development of the strategic shift of foreign country and home communications with electronic industry so that quasiconductor
Industry and epoxy copperplate industry are in gold developing period, also will drive developing rapidly of its subsidiary industrial chain simultaneously.?
When manufacturing printed circuit board (PCB), ceramic electronic components, thermoset resin article, decorative panel etc., mould release membrance makes again mold release film often exist
Operation is added between metallic plate, or uses between resin, to avoid the bonding between metallic plate or between resin, and this
A little techniques are required for completing under certain hot conditions.
Mould release membrance on ordinary meaning refers to the film for following purposes: be coated with various jointing material, coating on this film
Deng and be allowed to solidify, thus this film formed film, then by this coating film peel off and can use.All the time, for electricity
Mould release membrance during sub-production is the fluororesin film of Te Folong etc. and in biaxial stretch-formed polyethylene terephthalate
(PET) film etc. of silicon based material it is coated with on surface.Wherein, use the film of fluororesin owing to having relatively low surface as top layer
Can, therefore there is relatively low cohesive, release property is the most excellent.And the release resin of fluorine have the highest thermostability, indeformable and
Agent of low hygroscopicity, is extremely suitable for being shaped by High Temperature High Pressure and manufactures film or laminar laminates, but expensive.PET or
The product of other base materials of person coating silicone oil is then easily generated the residual of silicone oil, causes the use in later stage unstable, percent defective height occur.
The communication that China is domestic at present is just in fast development, quasiconductor and epoxy copperplate industry with electronic industry
Gold developing period, the demand of high temperature resistant composite mould release membrance is increased day by day, meanwhile, the skill of domestic production fluororesin mould release membrance
Art is the most overripened, mostly relies on external import and expensive starting materials, there is the problem that fluororesin mould release membrance cost is high, makes fluorine
Resin mould release membrance can not be generalized popularization in the manufacture process of electronic product, therefore mould release membrance the research of reduction cost technology and
Production domesticization large-scale production is extremely urgent.
Summary of the invention
For above-mentioned weak point, it is an object of the invention to provide and a kind of there is excellent release stability, release layer
Do not remain, can the most high temperature resistant, Temperature Size be stable and the high temperature resistant compound mould release membrance of low cost.
Technical scheme is as follows:
A kind of high temperature resistant compound mould release membrance, including:
Release layer, described release film layer is that two kinds of thermoplastic resin materials are realized by coextrusion process；
Adhesive layer, described adhesive layer uniformly coats by adhesive and is formed with described release film layer one surface；
Fire resistant resin thin layer, described fire resistant resin thin layer is attached at described adhesive layer.
Preferably, described thermoplastic resin material be comprise the polyester material of following formula unit, Merlon, polypropylene,
One in polrvinyl chloride, high density polyethylene (HDPE), Low Density Polyethylene,
Wherein T is bivalence matrix, selected from C5-7Alicyclic group, C6-12Aromatic group and combinations thereof, D is divalent group, choosing
From C6-12Alicyclic group, C2-12Aliphatic group and combinations thereof.
Preferably, described T is selected from cyclohexylidene, terephthalylidene, the combination of m-phenylenedimethylim-delivery date；D is selected from 1,
4-cyclohexanedimethyleterephthalate, methylene, propylene, trimethylene, tetramethylene and a combination thereof.
Preferably, the thickness of described adhesive layer is 0.05～1.0 μm.
Preferably, described adhesive be solid content be the elastomer silicone adhesive of 5wt%～10wt%.
Preferably, described elastomer silicone is selected from dimethyl siloxane, octamethylcy-clotetrasiloxane, vinyl terminal
Organosilicon polymer, vinylacetate vinyl alcohol polymer in one or more.
Preferably, described fire resistant resin layer is fluorine resin.
Preferably, described fluorine resin is for selected from free tetrafluoroethylene-perfluoro (alkyl vinyl ether) copolymer, tetrafluoro
Ethylene-hexafluoropropylene copolymer and ethylene-tetrafluoroethylene copolymer composition group at least one.
Preferably, described fluorine resin is ethylene-tetrafluoroethylene copolymer.
Preferably, in described composition ethylene-tetrafluoroethylene copolymer unit, the content of tetrafluoroethylene units is 50% to rub
More than Er.
The present invention at least includes following beneficial effect: the high temperature resistant compound mould release membrance of three-layer type that the present invention provides, structure is tight
Cause is easily peeled, and on the basis of ensureing not affect glue surface characteristic, off-type force is little；Fire resistant resin thin layer is selected containing fluorine element
Material, under 200 DEG C of hot conditionss, remains to keep not decompose, chemical reaction, will not occur with release layer and adhesive layer
Chemical reaction, antiseized isolation effect is excellent, Temperature Size is stable, and release layer uses elastomer silicone adhesive and controls its thickness
Degree, makes release layer not remain.Release layer uses the thermoplastic resin of two kinds of different materials to be prepared by the technique of co-extrusion, has
Support performance and protective value.
Detailed description of the invention
The present invention is described in further detail below, with make those skilled in the art with reference to description word can evidence
To implement.
A kind of high temperature resistant compound mould release membrance of the present invention, by release layer, coat with on one surface of release layer is upper gluing
The high-temperature resin thin layer of oxidant layer and adhesion and adhesive layer is constituted；Wherein, release layer is by two kinds of thermoplastic resin materials
Realized by mutual aid technique；Adhesive layer is formed by for the elastomer silicone adhesive coated that solid content is 5%～10%；High
Temperature resin film material is selected from free tetrafluoroethylene-perfluoro (alkyl vinyl ether) copolymer, hexafluoropropylene (HFP)/tetrafluoroethylene (TFE) copolymerization
At least one of thing and ethylene-tetrafluoroethylene copolymer composition.
The release layer of the present invention uses polyester material, Merlon, polypropylene, polrvinyl chloride, high density polyethylene (HDPE), low close
The thin film that any bi-material in degree polythene material is made, these thin film can have well absorption with organosilicon, it is to avoid
Produce impact to from shape power, cost can also be reduced simultaneously.The preferred polyester material of the combination of material and Merlon in two.It is suitable for this
The polyester slice of invention be intrinsic viscosity be the condensation polymer of poly terephthalic acid and the ethylene glycol of 0.6～0.7dl/g.Merlon
The preferred bisphenol-a polycarbonate of material.Needed polyester slice and Merlon are dried process before carrying out biaxial tension
With pre-crystallized, improve the softening point of polymer, it is to avoid its resin particle during being dried and melt extruding is inter-adhesive, knot
Block, prevents the polymer containing ester group from hydrolytic degradation occurring during melt extruding and produces bubble.Generally, tie in advance
Brilliant and baking temperature at about 160～180 DEG C, crystallization time at 10～20 minutes, drying time 4～6 hours.
The performance having had both inorganic material and organic material that organosilicon is unique, has a high-low temperature resistant, resistance to oxidation stability,
Weatherability, the excellent specific property such as corrosion-resistant.The present invention selects dimethyl siloxane, octamethylcy-clotetrasiloxane, vinyl ends to have
Organosilicon polymer, vinylacetate vinyl alcohol polymer in one or several.Organism elastomer precursor gum of the present invention
The solids content of stick controls in the range of 5%～10%, because can cause the thinnest off-type force of coating when solid content is less than 5%
Do not reach design load, can cause when solid content is higher than 10% that coating surface levelability is bad, apparent property is deteriorated.Organosilicon bullet
Gonosome adhesive just useful coating line-connection type coating process, the THICKNESS CONTROL of adhesive layer is in 0.05～1.0 μm.High-temperature resin
Film layer material optimal ethylene-TFE copolymer, wherein the content of tetrafluoroethylene units is more than 50% mole, its demoulding
Performance is good.High-temperature resin thin film can use extrusion by melting, inflation method, T embrane method.From the standpoint of film thickness and precision are high,
Preferably T modulus method.
Embodiment 1
Take silicone elastomer emulsions DC7935 (can be commercial) 18 parts, cross-linking agent DC7975 (can be commercial) 2 parts, go from
110 parts of sub-water；Above-mentioned material utilizes high-shear emulsion machine dispersion all, obtains the elastomer silicone that solid content is 5% gluing
Agent.
Release layer uses PET and Merlon to use coextrusion process film extrusion.
High-temperature resin thin layer uses ethylene-tetrafluoroethylene copolymer material, and (molar content of tetrafluoroethylene monomer is
51%) prepared by T modulus method.
Release layer and high-temperature resin film layer are gluing compound by elastomer silicone adhesive.The thickness of adhesive layer is
0.05μm。
Embodiment 2
Take silicone elastomer emulsions DC7935 (can be commercial) 27 parts, cross-linking agent DC7975 (can be commercial) 2 parts, go from
110 parts of sub-water；Above-mentioned material utilizes high-shear emulsion machine dispersion all, obtains the elastomer silicone adhesive that solid content is 8%.
Release layer uses PEN and Merlon to use coextrusion process film extrusion.
High-temperature resin thin layer uses ethylene-tetrafluoroethylene copolymer material, and (molar content of tetrafluoroethylene monomer is
55%) prepared by T modulus method.
Release layer and high-temperature resin film layer are gluing compound by elastomer silicone adhesive.The thickness of adhesive layer is
0.8μm。
Embodiment 3
Take silicone elastomer emulsions DC7935 (can be commercial) 38 parts, cross-linking agent DC7975 (can be commercial) 3 parts, go from
110 parts of sub-water；Above-mentioned material utilizes high-shear emulsion machine dispersion all, obtains the elastomer silicone that solid content is 10% gluing
Agent.
Release layer uses PET and polyethylene to use coextrusion process film extrusion.
High-temperature resin thin layer uses ethylene-tetrafluoroethylene copolymer (molar content of tetrafluoroethylene monomer is 60%) material
Expect to be prepared by T modulus method.
Release layer and high-temperature resin film layer are gluing compound by elastomer silicone adhesive.The thickness of adhesive layer is 1 μ
m。
Although embodiment of the present invention are disclosed as above, but it is not restricted in description and embodiment listed
Using, it can be applied to various applicable the field of the invention completely, for those skilled in the art, and can be easy
Realize other amendment, therefore under the general concept limited without departing substantially from claim and equivalency range, the present invention is not
It is limited to specific details.
Claims (10)
1. a high temperature resistant compound mould release membrance, it is characterised in that including:
Release layer, described release film layer is that two kinds of thermoplastic resin materials are realized by coextrusion process；
Adhesive layer, described adhesive layer uniformly coats by adhesive and is formed with described release film layer one surface；
Fire resistant resin layer, described fire resistant resin laminating invests described adhesive layer.
High temperature resistant compound mould release membrance the most as claimed in claim 1, it is characterised in that under described thermoplastic resin material is for comprising
One in the polyester material of formula unit, Merlon, polypropylene, polrvinyl chloride, high density polyethylene (HDPE), Low Density Polyethylene,
Wherein T is bivalence matrix, selected from C5-7Alicyclic group, C6-12Aromatic group and combinations thereof, D is divalent group, is selected from
C6-12Alicyclic group, C2-12Aliphatic group and combinations thereof.
High temperature resistant compound mould release membrance the most as claimed in claim 2, it is characterised in that described T is selected from cyclohexylidene, to benzene two Asia
Methyl, the combination of m-phenylenedimethylim-delivery date；D selected from Isosorbide-5-Nitrae-cyclohexanedimethyleterephthalate, methylene, propylene, 1,3-Asia third
Base, tetramethylene and a combination thereof.
High temperature resistant compound mould release membrance the most as claimed in claim 1, it is characterised in that the thickness of described adhesive layer be 0.05～
1.0μm。
High temperature resistant compound mould release membrance the most as claimed in claim 1, it is characterised in that described adhesive be solid content be 5wt%
～the elastomer silicone adhesive of 10wt%.
High temperature resistant compound mould release membrance the most as claimed in claim 5, it is characterised in that described elastomer silicone is selected from dimethyl
Siloxanes, octamethylcy-clotetrasiloxane, vinyl terminal organosilicon polymer, vinylacetate vinyl alcohol polymer in
One or more.
High temperature resistant compound mould release membrance the most as claimed in claim 1, it is characterised in that described fire resistant resin layer is fluorine resin
Layer.
High temperature resistant compound mould release membrance the most as claimed in claim 7, it is characterised in that described fluorine resin is for selected from free tetrafluoro
Ethylene-perfluor (alkyl vinyl ether) copolymer, tetrafluoraoethylene-hexafluoropropylene copolymer and ethylene-tetrafluoroethylene copolymer
Composition group at least one.
High temperature resistant compound mould release membrance the most as claimed in claim 8, it is characterised in that described fluorine resin is ethylene-tetrafluoro second
Alkene copolymer.
High temperature resistant compound mould release membrance the most as claimed in claim 9, it is characterised in that described composition ethylene-tetrafluoroethylene copolymerization
In thing unit, the content of tetrafluoroethylene units is more than 50% mole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610656004.4A CN106166863A (en) | 2016-08-11 | 2016-08-11 | High temperature resistant compound mould release membrance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610656004.4A CN106166863A (en) | 2016-08-11 | 2016-08-11 | High temperature resistant compound mould release membrance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106166863A true CN106166863A (en) | 2016-11-30 |
Family
ID=58066270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610656004.4A Pending CN106166863A (en) | 2016-08-11 | 2016-08-11 | High temperature resistant compound mould release membrance |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107602815A (en) * | 2017-09-04 | 2018-01-19 | 瑞安市鸿日塑胶有限公司 | Tpu film |
| WO2019128802A1 (en) * | 2017-12-27 | 2019-07-04 | 东丽先端材料研究开发（中国）有限公司 | Thin film material for thermosetting resin molding and use thereof |
| CN111002667A (en) * | 2019-12-19 | 2020-04-14 | 宁波长阳科技股份有限公司 | Release film and preparation method thereof |
| CN111454477A (en) * | 2020-04-20 | 2020-07-28 | 李瑞林 | High-temperature-resistant APET (amorphous polyethylene terephthalate) antistatic material and manufacturing method thereof |
| CN113388138A (en) * | 2021-06-24 | 2021-09-14 | 扬州万润光电科技有限公司 | High-temperature stable release film and preparation method thereof |
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| JP2002370315A (en) * | 2001-06-14 | 2002-12-24 | Sony Chem Corp | Peel film and adhesive film using the same |
| CN101506961A (en) * | 2006-08-18 | 2009-08-12 | 旭硝子株式会社 | Mold release film for the resin encapsulation of semiconductors |
| CN101679728A (en) * | 2007-04-06 | 2010-03-24 | 沙伯基础创新塑料知识产权有限公司 | Polyester compositions, method of manufacture, and uses thereof |
| CN102076766A (en) * | 2008-05-07 | 2011-05-25 | 沙伯基础创新塑料知识产权有限公司 | Polymer compositions, method of manufacture, and articles formed therefrom |
| CN104936776A (en) * | 2012-12-12 | 2015-09-23 | 美国圣戈班性能塑料公司 | Multilayer film having pressure sensitive adhesive layer |
| CN105163938A (en) * | 2013-04-30 | 2015-12-16 | 住友电木株式会社 | Release film and method for using release film |
-
2016
- 2016-08-11 CN CN201610656004.4A patent/CN106166863A/en active Pending
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| JP2002370315A (en) * | 2001-06-14 | 2002-12-24 | Sony Chem Corp | Peel film and adhesive film using the same |
| CN101506961A (en) * | 2006-08-18 | 2009-08-12 | 旭硝子株式会社 | Mold release film for the resin encapsulation of semiconductors |
| CN101679728A (en) * | 2007-04-06 | 2010-03-24 | 沙伯基础创新塑料知识产权有限公司 | Polyester compositions, method of manufacture, and uses thereof |
| CN102076766A (en) * | 2008-05-07 | 2011-05-25 | 沙伯基础创新塑料知识产权有限公司 | Polymer compositions, method of manufacture, and articles formed therefrom |
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| CN105163938A (en) * | 2013-04-30 | 2015-12-16 | 住友电木株式会社 | Release film and method for using release film |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107602815A (en) * | 2017-09-04 | 2018-01-19 | 瑞安市鸿日塑胶有限公司 | Tpu film |
| WO2019128802A1 (en) * | 2017-12-27 | 2019-07-04 | 东丽先端材料研究开发（中国）有限公司 | Thin film material for thermosetting resin molding and use thereof |
| CN111002667A (en) * | 2019-12-19 | 2020-04-14 | 宁波长阳科技股份有限公司 | Release film and preparation method thereof |
| CN111002667B (en) * | 2019-12-19 | 2022-03-08 | 宁波长阳科技股份有限公司 | Release film and preparation method thereof |
| CN111454477A (en) * | 2020-04-20 | 2020-07-28 | 李瑞林 | High-temperature-resistant APET (amorphous polyethylene terephthalate) antistatic material and manufacturing method thereof |
| CN113388138A (en) * | 2021-06-24 | 2021-09-14 | 扬州万润光电科技有限公司 | High-temperature stable release film and preparation method thereof |
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