CN106161886B - Circuit board and method for improving flatness of circuit board - Google Patents
Circuit board and method for improving flatness of circuit board Download PDFInfo
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- CN106161886B CN106161886B CN201510162811.6A CN201510162811A CN106161886B CN 106161886 B CN106161886 B CN 106161886B CN 201510162811 A CN201510162811 A CN 201510162811A CN 106161886 B CN106161886 B CN 106161886B
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Abstract
The invention provides a circuit board for a camera module and a corresponding camera module, and also provides a method for improving the flatness of the circuit board of the camera module and a method for improving the imaging quality of the camera module. Wherein this circuit board includes: the circuit layer is used for routing; and the substrate is used for grounding and heat dissipation, the substrate comprises a plurality of independent substrate layers, and the deformation of the circuit board is smaller than that of the traditional circuit board when the circuit board is heated through the separated substrate.
Description
Technical Field
The invention relates to a circuit board and a method for improving the flatness of the circuit board, in particular to a circuit board for a mobile phone camera module.
Background
The current mobile phone camera module generally comprises three main elements: microscope base, sensitization chip and circuit board. The photosensitive chip is glued to the circuit board and electrically connected with the circuit board. The lens base comprises a lens and a base for supporting the lens, the base is connected with the circuit board in an adhesive mode, the lens is located above the photosensitive chip, and therefore light rays passing through the lens can enter the photosensitive chip. In an ideal state, the optical axis of the lens should be perpendicular to the photosensitive chip, and in practice, due to various errors, the optical axis of the lens can be inclined relative to the photosensitive chip, so that the imaging quality of the camera module is affected. The flatness of the circuit board is an important reason for influencing the verticality of the lens and the photosensitive chip, and when the circuit board is uneven, the lens and the photosensitive chip which are installed on the circuit board cannot be aligned.
At present, a circuit board of a high-end mobile phone camera module usually adopts a hard board or a soft and hard joint board, the flatness of the circuit boards can only be controlled to be about 30 micrometers, and the circuit boards can be seriously deformed after being heated, so that the circuit boards are not flat, and the production yield of the camera module is influenced. Taking a printed circuit board as an example, the bottom layer of the current circuit board is usually a layer of solid copper, and other layers of the circuit board are used for routing wires and are not solid, so that the structure is asymmetric, and the expansion ratio of each layer is different, so that the circuit board is deformed irregularly when being heated.
In addition, along with the improvement of the pixel of the module of making a video recording and the camera lens light ring, the sensitivity of whole module of making a video recording to the roughness of circuit board is also higher and higher, and traditional circuit board has can't satisfy the demand of high definition module of making a video recording.
Disclosure of Invention
An object of the present invention is to provide a circuit board for a camera module, which has better flatness and less deformation when heated than the conventional circuit board.
Another objective of the present invention is to provide a circuit board for a camera module, which has a better flatness, and is beneficial to improving the adhesion of other components to the circuit board, and avoiding the generation of gaps or openings when other components are attached to the circuit board due to the unevenness of the circuit board.
Another object of the present invention is to provide a circuit board for a camera module, which has a simple structure and can be processed into a circuit board with better flatness by a simple process.
Another object of the present invention is to provide a camera module, in which a circuit board of the camera module has good flatness and dimensional stability, and has a small deformation amount when heated, thereby being beneficial to ensuring the perpendicularity between an optical axis of a lens of the camera module and a photosensitive chip.
Another objective of the present invention is to provide a method for improving the flatness of a circuit board, which can greatly improve the flatness of a conventional circuit board and reduce the deformation of the circuit board when heated.
Another objective of the present invention is to provide a method for improving the imaging quality of a camera module, which is beneficial to improving the verticality between the optical axis of the lens of the camera module and the photosensitive chip.
In order to achieve the above object, the present invention provides a circuit board for a camera module, wherein the circuit board comprises:
the circuit layer is used for routing; and
the circuit layer is arranged on the substrate, and the substrate comprises a plurality of independent substrate layers.
Preferably, each of the substrate layers is completely separated from each other with a predetermined interval between the adjacent substrate layers.
Preferably, the dimensions of each of the substrate layers are the same or different.
Preferably, at least one connecting portion extends from any one of the substrate layers to at least one other adjacent substrate layer, and the connecting portion connects a part of the two adjacent substrate layers.
Preferably, a connecting portion extends from any one of the substrate layers to each of the other substrate layers adjacent to the substrate layer, and each connecting portion extends from a side edge of the substrate layer to a side edge of the adjacent substrate layer, so that each substrate layer is connected in a net shape.
Preferably, any one of the substrate layers extends to a connecting part from the other substrate layer adjacent to the substrate layer, so that the substrate layers are directly or indirectly connected with each other, and the substrate layers have the same or different sizes.
Preferably, each of the base layers is made of a metal material. More preferably, each of the base layers is made of a copper material.
The invention also provides a camera module, which comprises:
the circuit board comprises at least one circuit layer and a substrate, wherein the circuit layer is used for wiring, the substrate is used for grounding and heat dissipation, the circuit layer is arranged on the substrate, and the substrate comprises a plurality of independent substrate layers;
the photosensitive chip is arranged on the circuit board; and
the lens base comprises a lens and a base for mounting the lens, and the base is arranged on the circuit board so that the lens and the photosensitive chip are arranged in an optical alignment manner.
The invention also provides a method for improving the flatness of the circuit board of the camera module, which comprises the following steps: a substrate of a circuit board is formed into a plurality of independent substrate layers. Preferably, the substrate of the wiring board forms a plurality of completely separate substrate layers. Alternatively, the substrate of the wiring board forms a plurality of substrate layers that are partially connected together.
The invention also provides a method for improving the imaging quality of the camera module, which comprises the following steps:
forming a plurality of independent substrate layers on a substrate of a circuit board of the camera module;
arranging the substrate layers in the same plane to form a mounting plane on the upper surface of each substrate layer;
flatly arranging the circuit layer of the circuit board on the mounting plane, so that the circuit board forms a flat upper surface; and
level and smooth the setting the sensitization chip and the microscope base of module of making a video recording in the upper surface of circuit board makes the optical axis of a camera lens of microscope base perpendicular to sensitization chip.
Preferably, the substrate is formed into the substrate layer separated by one or more isolation trenches formed in the substrate.
Preferably, the isolation groove penetrates the substrate completely, so that the substrate layers are in a completely separated state.
Preferably, the isolation groove is formed at a local position of the substrate and connects adjacent substrate layers together.
Drawings
Fig. 1 is a cross-sectional view of a preferred embodiment of a camera module according to the present invention.
Fig. 2 is a cross-sectional view of a preferred embodiment of a wiring board according to the present invention.
Fig. 3 is an exploded view of a preferred embodiment of a wiring board according to the present invention.
Fig. 4 is a schematic view of a preferred embodiment of a substrate according to the present invention.
Fig. 5 is a schematic view of a variant of the above-described preferred embodiment of the substrate according to the invention.
Fig. 6A to 6C are experimental diagrams for performing thermal simulation, where fig. 6A shows the deformation of the conventional circuit board when heated, fig. 6B and 6C show the deformation of the separated circuit board of the present invention when heated, and fig. 6B and 6C are simulation diagrams of the separated circuit board at different angles.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
Fig. 1 is a schematic view of a circuit board 3 of the present invention mounted on a camera module. The camera module further comprises a lens base 1 and a photosensitive chip 2, wherein the lens base 1 and the photosensitive chip 2 are arranged on the circuit board 3, so that the whole camera module is formed. Sensitization chip 2 electric link in circuit board 3, when light incides on sensitization chip 2, sensitization chip 2 converts light signal into electrical signal transmission and gives circuit board 3. Preferably, the photosensitive chip 2 is attached to the circuit board 3.
The lens holder 1 includes a lens 11 and a base 12. The lens 11 is mounted on the base 12, and the base 12 is disposed on the circuit board 3, so that the lens 11 is opposite to the photosensitive chip 2, and light entering the lens 11 can be incident on the photosensitive chip 2.
It should be noted that, in an ideal state, the optical axis of the lens 11 should be perpendicular to the photosensitive chip 2, and when the optical axis of the lens 11 is not perpendicular to the photosensitive chip 2, the imaging effect of the camera module is affected. In order to ensure that the optical axis of the lens 11 is perpendicular to the photosensitive chip 2, the circuit board 3 should be as flat as possible, and the circuit board 3 should have good dimensional stability, and the deformation amount should be as small as possible when the external temperature changes.
As shown in fig. 2, the circuit board 3 includes at least one circuit layer 31 and a substrate 32, each circuit layer 31 is disposed on the substrate 32, each circuit layer 31 is used for routing, and the substrate 32 is electrically coupled to the circuit layer 31, so that a circuit formed by the circuit layers 31 is grounded through the substrate 32 and provides a heat dissipation function.
The substrate 32 has a mounting plane 320, and each of the circuit boards 31 is flatly disposed on the mounting plane 320 of the substrate 32, so that a flat plane is formed on the surface of the circuit board 3, which is beneficial to keeping the optical axes of the photosensitive chip 2 and the lens 11 mounted on the circuit board 3 perpendicular, and is also beneficial to tightly attaching the photosensitive chip 2 and the base 12 to the circuit board 3. If circuit board 3 unevenness, have the warpage, and photosensitive chip 2 with the bottom surface of base 12 is level and smooth, this moment photosensitive chip 2 with base 12 can not completely with circuit board 3 laminating, consequently when gluing, the part can produce gap or opening, thereby leads to photosensitive chip 2 with base 12 easily follows drop on the circuit board 3.
The substrate 32 includes a plurality of individual substrate layers 321, where the substrate layers 321 are individual structures including: the base layers 321 are completely separated, i.e., the base layers 321 are not connected to each other, and the base layers 321 are partially separated, i.e., a part of each base layer 321 is connected and a part of each base layer 321 is separated.
The upper surfaces of the substrate layers 321 are in the same plane, thereby forming the mounting plane 320. Each of the wiring layers 31 is provided on the mounting plane 320 formed by each of the base layers 321.
The mutual separation of stratum basale 321 is favorable to the dispersion the power that basement 32 received avoids stress concentration's phenomenon to can reduce basement 32 deformation volume when being heated and taking place the deformation, also improved the roughness and the dimensional stability of basement 32, thereby improve the roughness and the dimensional stability of circuit board 3. When any one of the substrate layers 321 is deformed by a force, the deformation is transmitted to the edge of the substrate layer 321 to stop, and the other substrate layers 321 independent from the edge are not affected. And traditional integral type stratum basale is a whole, as long as when certain part atress of stratum basale takes place deformation, whole stratum basale all can receive the influence and take place deformation to greatly increased the degree of deformation.
Preferably, the substrate 32 is made of metal, such as copper, and since metal has a good heat dissipation capability, the substrate 32 also has a heat dissipation function for dissipating heat generated by the circuit layer 31.
Fig. 3 shows a first preferred embodiment of the substrate 32 of the wiring board 3 of the invention. The substrate layers 321 of the substrate 32 are completely separated, and a certain interval is provided between two adjacent substrate layers 321, so that each substrate layer 321 does not affect the other substrate layers 321 when being deformed.
It should be noted that the spacing between the substrate layers 321 is not too large, and if the spacing between the substrate layers 321 is too large, the stability and the heat dissipation capability of the substrate 32 are affected.
Preferably, the substrate layers 321 are the same size, which is beneficial for increasing the uniformity of the substrate 32.
The circuit board 3 includes three circuit layers 31, namely a first circuit layer 311, a second circuit layer 312 and a third circuit layer 313, and the circuit layers 31 are sequentially stacked on the mounting plane 320 of the substrate 32. Each of the circuit layers 31 is used for routing, and therefore each of the circuit layers 31 is of a hollow structure, that is, a space is formed between each part of the circuit layer 31, which is beneficial to dispersing stress and reducing stress concentration, so that each of the circuit layers 31 has better flatness and dimensional stability.
Because each circuit layer 31 and the substrate 32 form a dispersed structure, the difference of the expansion ratio and the contraction ratio among the layers is reduced, so that the overall deformation of the circuit board 3 when being heated is reduced, and the warping is avoided.
The number of the substrate layers 321 is not limited to 9 shown in the figure, and may be more than 9 or less than 9, and is actually determined according to the processing requirement.
As shown in fig. 4, a second preferred embodiment of the substrate 32 of the present invention. Each of the base layers 321A of the base 32A is partially separated. Any one of the substrate layers 321A extends out of at least one connecting portion 322A towards each of the other substrate layers 321A adjacent to the substrate layer, so that the substrate layers 321A are connected in a net shape, thereby facilitating the rapid determination of the relative position between the substrate layers 321A during processing. The width of the connecting portion 322A should be minimized to minimize the mutual influence between the adjacent base layers 321A.
In another aspect, the base 32 of the present invention is formed with isolation grooves 323A at one or more local locations, such that the isolation grooves 323A divide the base 32 into a plurality of independent gripping bases 321A. The isolation groove 323A may have various shapes, as shown in the drawing, a bar shape, a cross shape, etc.
Preferably, the base layers 321 have the same size, each base layer 321 is a regular quadrilateral, and each connecting portion 322A extends from a midpoint of a side of each base layer 321 to a midpoint of a side of an adjacent base layer 321, so that each base layer 321 is connected in a mesh shape. It will be understood by those skilled in the art that the shapes are merely exemplary and not intended to limit the present invention, the substrate layer 321 may be other polygonal shapes such as triangle, rectangle, pentagon, etc., or may be circular, or other irregular shapes, and the sizes of the substrate layer 321 may be different.
The substrate 32A may be manufactured by retaining portions of the substrate layer 321A and the connecting portion 322A on a complete metal sheet, and separating the other portions, so as to ensure that each of the substrate layer 321A and the connecting portion 322A are located on the same plane, that is, the mounting plane 320 is formed.
As shown in fig. 5, is a variation of the second preferred embodiment of the substrate 32 of the present invention. Each of the base layers 321B of the base 32B is partially separated. Any one of the substrate layers 321B extends to at least one other adjacent substrate layer to form a connecting portion 322B, so that the substrate layers 321B are directly or indirectly connected to each other.
As shown in fig. 5, the base layers 321B are different in size. The substrate 32B includes 7 pieces of the substrate layers 321B, wherein the first substrate layer 3211B, the second substrate layer 3212B, and the third substrate layer 3213B are adjacent to each other and have different shapes, wherein the first substrate layer 3211B is connected to the second substrate layer 3212B by a connection 322B, the second substrate layer 3212B is connected to the third substrate layer 3213B by a connection 322B, and the first substrate layer 3211B is indirectly connected to the third substrate layer 3213B by the second substrate layer 3212B.
The manufacturing method of the substrate 32B may be to leave the substrate layer 321B and the connecting portion 322B on a complete metal plate, and separate the other portions, so as to ensure that each of the substrate layer 321B and the connecting portion 322B are in the same plane, that is, the mounting plane 320 is formed. From a processing point of view, the embodiment shown in fig. 5 is simpler in processing process than the embodiment shown in fig. 4.
The invention utilizes thermal simulation software to simulate the deformation condition of the circuit board adopting the integrated substrate scheme and the circuit board adopting the separated substrate when being heated. For simplicity, the circuit board using the one-piece substrate scheme will be referred to as a conventional circuit board, and the circuit board using the separated substrate will be referred to as a separated circuit board.
In order to ensure the comparability of experimental data, the size, the number of layers and the like of the traditional circuit board and the separated circuit board are the same during the experiment, and the difference is that the substrate of the traditional circuit board is an integral substrate layer, and the substrate of the separated circuit board is a plurality of independent substrate layers. Because the deformation degree of the circuit board may be influenced by the number of the substrate layers of the separated circuit board, the deformation amount of the circuit board comprising the substrate layers with different numbers and different sizes is compared in the experiment, and the deformation amount of different separated circuit boards is within 2 micrometers in a determined thermal environment according to simulation data, while the deformation amount of a traditional circuit board is 30 micrometers. According to the actual measurement data, the deformation quantity of different separated circuit boards is within 10 micrometers in a determined thermal environment, while the deformation quantity of a traditional circuit board is more than 30 micrometers. From both the simulation data and the actual measurement data, the separated circuit board has better dimensional stability and flatness than the traditional circuit board.
Fig. 6A shows a heat simulation diagram of a conventional wiring board, and fig. 6B and 6C show heat simulation diagrams of a separated wiring board. The figure shows the deformation after one hundred times of magnification, and it is obvious from the figure that the deformation of the traditional circuit board is far more than that of the separated circuit board under the same thermal environment.
Therefore, the circuit board 3 adopting the substrate 32 of the invention has better flatness and dimensional stability, and is beneficial to improving the yield and the imaging quality of the camera module.
The invention also provides a method for improving the flatness of the circuit board, which comprises the following steps: a substrate of a circuit board is formed into a plurality of independent substrate layers.
It is worth mentioning that the above-mentioned plurality of independent substrate layers includes the case where each of the substrate layers is completely separated and a part of each of the substrate layers is separated and a part of the substrate layers is connected.
In one embodiment, the steps are specifically: the substrate of the wiring board forms a plurality of completely independent substrate layers.
In another embodiment, the steps are specifically: the substrate of the circuit board forms a plurality of substrate layers that are partially connected together.
The invention also provides a method for improving the imaging quality of the camera module, which comprises the following steps:
a. forming a plurality of independent substrate layers on a substrate of a circuit board of the camera module;
b. arranging the substrate layers in the same plane, so that the upper surfaces of the substrate layers form a mounting plane;
c. flatly arranging the circuit layer of the circuit board on the mounting plane, so that the circuit board forms a flat upper surface;
d. level and smooth the setting the sensitization chip and the microscope base of module of making a video recording in the upper surface of circuit board makes the optical axis of a camera lens of microscope base perpendicular to sensitization chip.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (14)
1. The utility model provides a circuit board for making a video recording module which characterized in that, the circuit board includes:
the circuit layer is used for routing; and
the circuit layer is arranged on the substrate, the substrate comprises a plurality of independent substrate layers, at least one connecting part extends from any one substrate layer to at least one other substrate layer adjacent to the substrate layer, and the connecting part connects parts of two adjacent substrate layers.
2. The wiring board of claim 1, wherein each of the substrate layers is completely separated with a predetermined spacing between adjacent ones of the substrate layers.
3. The wiring board of claim 2, wherein the substrate layers are the same or different sizes.
4. The wiring board of claim 1, wherein a connecting portion extends from any one of the substrate layers to each of the other substrate layers adjacent thereto, each connecting portion extending from a side edge of the substrate layer to a side edge of the adjacent substrate layer, respectively, such that each substrate layer is connected in a mesh shape.
5. The wiring board of claim 3, wherein a connecting portion extends from any one of the substrate layers to each of the other substrate layers adjacent thereto, each connecting portion extending from a side edge of the substrate layer to a side edge of the adjacent substrate layer, respectively, such that each substrate layer is connected in a mesh shape.
6. The wiring board of claim 1, wherein any one of the substrate layers extends to a neighboring other substrate layer to form a connecting portion, so that the substrate layers are directly or indirectly connected to each other, and the substrate layers have the same or different sizes.
7. The wiring board defined in any one of claims 1-6, wherein each of the substrate layers is a metal.
8. The wiring board defined in claim 7, wherein each of the base layers is made of a copper material.
9. The utility model provides a module of making a video recording, its characterized in that, the module of making a video recording includes:
the circuit board comprises at least one circuit layer and a substrate, wherein the circuit layer is used for wiring, the substrate is used for grounding and heat dissipation, the circuit layer is arranged on the substrate, and the substrate comprises a plurality of independent substrate layers;
the photosensitive chip is arranged on the circuit board; and
the lens base comprises a lens and a base for mounting the lens, the base is arranged on the circuit board so that the lens and the photosensitive chip are arranged in an optical alignment manner, and at least one connecting part extends from any one of the substrate layers to at least one of the other substrate layers adjacent to the substrate layer, so that the substrate layers are partially connected.
10. The camera module of claim 9, wherein the substrate layers are completely separated from each other, adjacent substrate layers have a predetermined spacing therebetween, and the substrate layers are the same or different in size.
11. A method for improving the flatness of a circuit board of a camera module is characterized by comprising the following steps: forming a substrate of a circuit board into a plurality of separate substrate layers, wherein the substrate of the circuit board forms a plurality of substrate layers that are partially joined together.
12. The method of claim 11, wherein the substrate of the wiring board forms a plurality of completely separate substrate layers.
13. A method for improving the imaging quality of a camera module is characterized by comprising the following steps:
a. forming a plurality of independent substrate layers on a substrate of a circuit board of the camera module;
b. arranging the substrate layers in the same plane to form a mounting plane on the upper surface of each substrate layer;
c. flatly arranging the circuit layer of the circuit board on the mounting plane, so that the circuit board forms a flat upper surface; and
d. flatly arranging a photosensitive chip and a lens holder of the camera module on the upper surface of the circuit board, so that the optical axis of a lens of the lens holder is perpendicular to the photosensitive chip, wherein in the step a, one or more isolation grooves formed in the substrate are used for enabling the substrate to form the substrate layers separated by the isolation grooves, the isolation grooves are formed in the local positions of the substrate, and the adjacent substrate layers are connected together.
14. The method as claimed in claim 13, wherein in the step a, the isolation trench penetrates completely through the substrate, so that the plurality of substrate layers are in a completely separated state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510162811.6A CN106161886B (en) | 2015-04-08 | 2015-04-08 | Circuit board and method for improving flatness of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510162811.6A CN106161886B (en) | 2015-04-08 | 2015-04-08 | Circuit board and method for improving flatness of circuit board |
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| Publication Number | Publication Date |
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| CN106161886A CN106161886A (en) | 2016-11-23 |
| CN106161886B true CN106161886B (en) | 2022-04-29 |
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| CN113014772A (en) * | 2021-03-01 | 2021-06-22 | 维沃移动通信有限公司 | Imaging device, electronic apparatus, imaging member, and method of manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102088017A (en) * | 2010-03-15 | 2011-06-08 | 苏州科医世凯半导体技术有限责任公司 | LED SMD (surface mount type)packaging module |
| CN203840422U (en) * | 2014-03-25 | 2014-09-17 | 宁波舜宇光电信息有限公司 | Camera module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101711007B1 (en) * | 2010-04-29 | 2017-03-02 | 삼성전자주식회사 | Image sensor module having image sensor package |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102088017A (en) * | 2010-03-15 | 2011-06-08 | 苏州科医世凯半导体技术有限责任公司 | LED SMD (surface mount type)packaging module |
| CN203840422U (en) * | 2014-03-25 | 2014-09-17 | 宁波舜宇光电信息有限公司 | Camera module |
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