CN106159061A - 一种倒装晶片集成封装装置及工艺 - Google Patents

一种倒装晶片集成封装装置及工艺 Download PDF

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Publication number
CN106159061A
CN106159061A CN201610631215.2A CN201610631215A CN106159061A CN 106159061 A CN106159061 A CN 106159061A CN 201610631215 A CN201610631215 A CN 201610631215A CN 106159061 A CN106159061 A CN 106159061A
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metallic plate
viscose
wafer
lower metallic
plate
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Inventor
方涛
钱诚
王明明
樊学军
张国旗
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Changzhou Wujin Semiconductor Lighting Application Technology Institute
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Changzhou Wujin Semiconductor Lighting Application Technology Institute
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明公开了一种倒装晶片集成封装装置及工艺，包括上金属板、下金属板，上金属板上设有玻璃支承板，玻璃支承板上设有紫外线照射胶带，晶片贴在所述紫外线照射胶带上；下金属板上设有两块隔板，荧光胶块置于两块隔板之间，下金属板上还铺设有PET膜，PET膜铺设在下金属板和隔板表面，将荧光胶块与下金属板之间、荧光胶块与隔板之间都隔离开。本发明的优点：本集成封装可以实现高密度的晶片排列，客户可以自由设计电路结构，从而在有限的面积内提供更高的光通量。高密度的光通输出，满足特定场合光输出要求，材料使用更省，成本更低，可以在6*6mm内提供25‑75W的输出。

Description

一种倒装晶片集成封装装置及工艺
技术领域
本发明涉及封装相关技术领域，具体的涉及是一种倒装晶片集成封装装置及工艺。
背景技术
目前市面上流通的集成封装，规格最小的为13*13mm，最大能提供9W输出。现有技术方案的无法在较小发光面积内（6*6mm）提供大光通量（＞6000lm），不能满足一些场合照明需要，如诱鱼灯，室外投影等。
发明内容
本发明的目的是为了弥补现有技术的不足，提供了一种倒装晶片集成封装装置及工艺，以满足特定场合光输出要求。
为了达到本发明的目的，技术方案如下：
一种倒装晶片集成封装装置，其特征在于，包括上金属板、下金属板，上金属板上设有玻璃支承板，玻璃支承板上设有紫外线照射胶带，晶片贴在所述紫外线照射胶带上；下金属板上设有两块隔板，荧光胶块置于两块隔板之间，下金属板上还铺设有PET膜，PET膜铺设在下金属板和隔板表面，将荧光胶块与下金属板之间、荧光胶块与隔板之间都隔离开。
一种倒装晶片集成封装工艺，其特征在于，包括步骤：
（1）、在紫外线照射胶带上铺设晶片，晶片按照阵列排布；将荧光胶块置于下金属板的两块隔板之间；
（2）、将铺设有晶片的上金属板倒置，使晶片插入到荧光胶块内；
（3）、一次固化：温度100℃，时间2小时；
（4）、将固化有晶片的荧光胶块取出，在晶片上预制锡球，再切割成小块。
本发明具有的有益效果：
本集成封装可以实现高密度的晶片排列，客户可以自由设计电路结构，从而在有限的面积内提供更高的光通量。高密度的光通输出，满足特定场合光输出要求，材料使用更省，成本更低，可以在6*6mm内提供25-75W的输出。
附图说明
图1是本发明倒装晶片集成封装装置的结构示意图；
图2是晶片封装后的结果示意图；
图3是本发明的工艺流程图。
具体实施方式
下面结合实施例对本发明作进一步描述，但本发明的保护范围不仅仅局限于实施例。
结合图1所示，一种倒装晶片集成封装装置，包括上金属板4、下金属板5，上金属板4上设有玻璃支承板1，玻璃支承板1上设有紫外线照射胶带2，晶片3贴在所述紫外线照射胶带2上。下金属板5上设有两块隔板8，荧光胶块7置于两块隔板之间，下金属板5上还铺设有PET膜6，PET膜铺设在下金属板和隔板表面，将荧光胶块7与下金属板5之间、荧光胶块7与隔板8之间都隔离开。
结合图2和图3所示，一种倒装晶片集成封装工艺，其特征在于，包括步骤：
（1）、在紫外线照射胶带上铺设晶片，晶片按照阵列排布；将荧光胶块置于下金属板的两块隔板之间；
（2）、将铺设有晶片的上金属板倒置，使晶片插入到荧光胶块内；
（3）、一次固化：温度100℃，时间2小时；
（4）、将固化有晶片的荧光胶块取出，在晶片上预制锡球9，再切割成小块。
最后应说明的是：以上实施例仅用以说明本发明而并非限制本发明所描述的技术方案，因此，尽管本说明书参照上述的各个实施例对本发明已进行了详细的说明，但是，本领域的普通技术人员应当理解，仍然可以对本发明进行修改或等同替换，而一切不脱离本发明的精神和范围的技术方案及其改进，其均应涵盖在本发明的权利要求范围中。

Claims (2)

1.一种倒装晶片集成封装装置，其特征在于，包括上金属板（4）、下金属板（5），上金属板上设有玻璃支承板（1），玻璃支承板上设有紫外线照射胶带（2），晶片（3）贴在所述紫外线照射胶带上；下金属板上设有两块隔板（8），荧光胶块（7）置于两块隔板之间，下金属板上还铺设有PET膜（6），PET膜铺设在下金属板和隔板表面，将荧光胶块与下金属板之间、荧光胶块与隔板之间都隔离开。
2.一种倒装晶片集成封装工艺，其特征在于，包括步骤：
（1）、在紫外线照射胶带上铺设晶片，晶片按照阵列排布；将荧光胶块置于下金属板的两块隔板之间；
（2）、将铺设有晶片的上金属板倒置，使晶片插入到荧光胶块内；
（3）、一次固化：温度100℃，时间2小时；
（4）、将固化有晶片的荧光胶块取出，在晶片上预制锡球，再切割成小块。
CN201610631215.2A 2016-08-03 2016-08-03 一种倒装晶片集成封装装置及工艺 Pending CN106159061A (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110074003A1 (en) * 2009-09-30 2011-03-31 National Semiconductor Corporation Foil based semiconductor package
CN203434130U (zh) * 2013-07-23 2014-02-12 深圳市创唯星自动化设备有限公司 封装设备
CN103943764A (zh) * 2014-04-18 2014-07-23 立达信绿色照明股份有限公司 模压一体化封装led光源的成型模具及成型方法
CN105047786A (zh) * 2015-05-29 2015-11-11 广州市鸿利光电股份有限公司 芯片级封装led的封装方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110074003A1 (en) * 2009-09-30 2011-03-31 National Semiconductor Corporation Foil based semiconductor package
CN203434130U (zh) * 2013-07-23 2014-02-12 深圳市创唯星自动化设备有限公司 封装设备
CN103943764A (zh) * 2014-04-18 2014-07-23 立达信绿色照明股份有限公司 模压一体化封装led光源的成型模具及成型方法
CN105047786A (zh) * 2015-05-29 2015-11-11 广州市鸿利光电股份有限公司 芯片级封装led的封装方法

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Application publication date: 20161123