CN106159026A - Portable electronic device and light sensing package thereof - Google Patents
Portable electronic device and light sensing package thereof Download PDFInfo
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- CN106159026A CN106159026A CN201510188987.9A CN201510188987A CN106159026A CN 106159026 A CN106159026 A CN 106159026A CN 201510188987 A CN201510188987 A CN 201510188987A CN 106159026 A CN106159026 A CN 106159026A
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 50
- 230000000903 blocking effect Effects 0.000 claims abstract description 23
- 230000005540 biological transmission Effects 0.000 claims description 51
- 239000010408 film Substances 0.000 claims description 24
- 239000010409 thin film Substances 0.000 claims description 7
- 238000009738 saturating Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 5
- 230000004888 barrier function Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 86
- 239000011521 glass Substances 0.000 description 35
- 239000000463 material Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 235000003339 Nyssa sylvatica Nutrition 0.000 description 2
- 244000018764 Nyssa sylvatica Species 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by at least one potential or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
Abstract
The invention relates to a portable electronic device and a light sensing package. The portable electronic device comprises a shell, a cover body and a light sensing packaging body. The cover body is arranged on the shell body. The cover body is provided with a first light-transmitting area and a second light-transmitting area. The light sensing packaging body is arranged in the shell. The optical sensing package includes a first chip, a second chip and a blocking portion. The first chip provides a light source. The second wafer is provided with a first sensing area and a second sensing area. The first sensing region provides an ambient light sensing signal, and the second sensing region provides a proximity sensing signal. The second sensing region is located between the first wafer and the first sensing region. The barrier portion is disposed between the first wafer and the second wafer. The first sensing region is located below the first light-transmitting region. The first wafer and the second sensing region are located under the second light-transmitting region.
Description
Technical field
The present invention is relevant with light sensing, especially with regard to a kind of visual field that can increase sensing environment light
(Field Of View, FOV) angle and the portable electronic devices of visible ray penetrance and light sensing thereof encapsulate
Body.
Background technology
In recent years, along with the progress of light sensing technology, gradually develop the various light with difference in functionality
Sensor, such as sensing environment light device (Ambient Light Sensor, ALS) and proximity sensor
(Proximity Sensor, PS) etc., and it has been widely used in notebook computer, panel computer and intelligence
The portable electronic devices such as energy type mobile phone.
But, as it is shown in figure 1, mostly use double saturating due to the most common light sensing packaging body 1
The design of unthreaded hole (including light emission loophole and light sensing loophole), causes being positioned at light sensing loophole
Under ambient light and proximity sensor wafer 10 face the visual field (FOV) angle too small of light sensing
Problem.Once light sensing packaging body 1 be applied to portable electronic devices, ambient light and proximity sense
Survey the brightness flop of ambient light that device wafer 10 sensed and differ markedly from that human eye is actual to be experienced
The brightness flop of ambient light.
Furthermore, if as in figure 2 it is shown, light sensing packaging body 2 is also additionally provided with one layer of black gum cover 24,
Then can cause being positioned at the ambient light under light sensing loophole and proximity sensor wafer 20 receives light
Field-of-view angle become less than Fig. 1.Additionally, due to ambient light and proximity sensor wafer 20 enter
Also need during row proximity sensing to receive infrared light, thus be positioned at ambient light and proximity sensor wafer 20 it
On light sensing loophole also need to be provided with infrared light and penetrate film, cause ambient light and proximity sensor brilliant
Visible ray brightness that sheet 20 is sensed can be penetrated film by infrared light to be affected and is significantly decayed.
Summary of the invention
In view of this, the present invention provides a kind of field-of-view angle that can increase sensing environment light and visible ray
The portable electronic devices of penetrance and light sensing packaging body thereof, with asking of solving that prior art addressed
Topic.
One preferred embodiment of the present invention is a kind of light sensing packaging body.In this embodiment, light
Sensing packaging body is arranged in housing.Housing has the first transmission region and the second transmission region.Light sensation
Survey packaging body and include the first wafer, the second wafer and the first blocking part.First wafer provides a light source.
Second wafer has the first sensing area and the second sensing area.First sensing area provides a sensing environment light letter
Number, the second sensing area provides a proximity sensing signal.Second sensing area is positioned at the first wafer and the first sense
Survey between district.First blocking part is arranged between the first wafer and the second wafer.First sensing area is positioned at
Under first transmission region, the first wafer and the second sensing area are positioned under the second transmission region.
In one embodiment of this invention, the second transmission region is a similar round shape, and its diameter is less than
2mm。
In one embodiment of this invention, there is the first distance between the first sensing area and the second sensing area
And second have second distance between sensing area and the first wafer, the first distance is more than second distance.
In one embodiment of this invention, have between the side of the second sensing area to the side of the first wafer
Having the 3rd distance, the 3rd distance is less than 2mm.
In one embodiment of this invention, the second transmission region is provided with the first film, to filter other
The light of non-infrared light wavelength.
In one embodiment of this invention, the first transmission region is provided with the second thin film, to promote environment
Passing through of light.
In one embodiment of this invention, light sensing packaging body also includes the second blocking part.Second intercepts
Portion is arranged on the second wafer and between the first sensing area and the second sensing area.
Another preferred embodiment of the present invention is a kind of portable electronic devices.In this embodiment
In, portable electronic devices includes housing, lid and light sensing packaging body.Lid is arranged on housing.
Lid has the first transmission region and the second transmission region.Light sensing packaging body is arranged in housing.Light
Sensing packaging body includes the first wafer, the second wafer and blocking part.First wafer provides a light source.The
Two wafers have the first sensing area and the second sensing area.First sensing area provides a sensing environment light letter
Number, the second sensing area provides a proximity sensing signal.Second sensing area is positioned at the first wafer and the first sense
Survey between district.Blocking part is arranged between the first wafer and the second wafer.First sensing area is positioned at first
Under transmission region, the first wafer and the second sensing area are positioned under the second transmission region.
In one embodiment of this invention, portable electronic devices as above, wherein, above-mentioned
Two transmission regions are a similar round shape, and its diameter is less than 2mm.
In one embodiment of this invention, portable electronic devices as above, wherein, above-mentioned
There is one first distance and above-mentioned second sensing area with above-mentioned between one sensing area and above-mentioned second sensing area
Having a second distance between first wafer, above-mentioned first distance is more than above-mentioned second distance.
In one embodiment of this invention, portable electronic devices as above, wherein, above-mentioned
The side of two sensing areas has one the 3rd distance, above-mentioned 3rd distance between the side of above-mentioned first wafer
Less than 2mm.
In one embodiment of this invention, portable electronic devices as above, wherein, above-mentioned
Two transmission regions are provided with a first film, to filter the light of other non-infrared light wavelength.
In one embodiment of this invention, portable electronic devices as above, wherein, above-mentioned
One transmission region is provided with one second thin film, to promote passing through of ambient light.
In one embodiment of this invention, portable electronic devices as above, also include the second resistance
Every portion, be arranged on above-mentioned second wafer and be positioned at above-mentioned first sensing area and above-mentioned second sensing area it
Between.
Compared to prior art, portable electronic devices and light sensing packaging body thereof according to the present invention are
By the sensing environment light device being arranged on same light sensing wafer and proximity sensor separated from one another
Segment distance, thus increases the independent loophole corresponding only to sensing environment light device, to increase its angle of visibility
Spend, and this independent loophole be not on Watch glass set infrared light and penetrate under film,
Therefore film will not be penetrated by infrared light and be affected, can effectively promote visible ray penetrance so that ambient light
The environmental light brightness change that sensor is sensed can more meet the actual environment bright experienced of human eye
Degree change.
Can be described in detail by invention below about the advantages and spirit of the present invention and appended accompanying drawing obtains
Further understand.
Accompanying drawing explanation
Fig. 1 and Fig. 2 respectively prior art has the signal of the light sensing packaging body of different structure
Figure.
Fig. 3 and Fig. 4 is respectively the section of the light sensing packaging body of the specific embodiment according to the present invention
Figure and top view.
Fig. 5 and Fig. 6 is respectively and the light sensing packaging body in Fig. 3 is arranged at portable electronic devices
Top view below Watch glass and profile.
Fig. 7 and Fig. 8 is respectively cuing open of the light sensing packaging body of another specific embodiment according to the present invention
Face figure and top view.
Fig. 9 and Figure 10 is respectively and the light sensing packaging body in Fig. 7 is arranged at portable electronic devices
Watch glass below top view and profile.
Primary clustering symbol description
1～3,7: light sensing packaging body
10,20: ambient light and proximity sensor wafer
11,21: substrate
12,22: infrared light-emitting diode (IR-LED) wafer
13,23: blocking part
24: black gum cover
L: light
30,70: the second wafer
31,71: substrate
32,72: the first wafer
33: blocking part
73: the first blocking parts
75: the second blocking parts
34,74: encapsulating material
S1: the first sensing area
S2: the second sensing area
L1: the first light
L2: the second light
L1 ＇: proximity light sensing
CL1: the first transmission region
CL2: the second transmission region
G: Watch glass
F1: the first film
F2: the second thin film
D1, D1 ＇: the first distance between sensing area and the second sensing area
D2, D2 ＇: the second distance between sensing area and the first wafer
K: straight line
Detailed description of the invention
Now with detailed reference to the one exemplary embodiment of the present invention, and illustrate described exemplary in the accompanying drawings
The example of embodiment.It addition, used in drawings and the embodiments the element of same or like label
/ component is used to represent same or like part.
A preferred embodiment according to the present invention is a kind of light sensing packaging body.In this embodiment
In, this light sensing packaging body can include sensing environment light device (ALS) and proximity sensor (PS), can answer
For portable electronic devices such as notebook computer, panel computer and intelligent mobile phones, but not as
Limit.
In order to be effectively improved that the photosensitive field-of-view angle of sensing environment light device is too small and visible ray brightness significantly
The problem of decay, the light sensing packaging body in this embodiment has a following features:
(1) the sensing environment light device that will be located on same light sensing wafer is separately positioned with proximity sensor,
And no longer integrate, thus, the independent loophole corresponding only to sensing environment light device i.e. will not be subject to again
The infrared light plated to the Watch glass of portable electronic devices penetrates the impact of film, therefore can effectively keep away
Exempt from the facts generation that visible ray brightness significantly decays.
(2) the photosensitive aperture of environment OPTICAL SENSORS, thus, the photosensitive angle of visibility of sensing environment light device are strengthened
Degree becomes big the most therewith, therefore the brightness flop situation that the eyes that can more press close to user are experienced.
Refer to Fig. 3 and Fig. 4, Fig. 3 and Fig. 4 and be respectively the specific embodiment according to the present invention
The profile of light sensing packaging body and top view.It should be noted that, from Fig. 3 and Fig. 4: this is real
Execute the light sensing packaging body 3 in example and there is the encapsulating structure of double loophole, but be not limited.
As it is shown on figure 3, light sensing packaging body 3 includes substrate the 31, first wafer the 32, second wafer
30, blocking part 33 and encapsulating material 34.First wafer 32 is infrared light-emitting diode (IR-LED)
Wafer, in order to send Infrared L1；Second wafer 30 is for having sensing environment light function and proximity concurrently
The light sensing wafer of sensing function, the second wafer 30 has the first sensing area S1 of setting separated from one another
And the second sensing area S2, and the second sensing area S2 be positioned at the first wafer 32 and the first sensing area S1 it
Between, wherein the light of the first wafer 32 output can reflex to the second sense via an object (such as: face)
Survey the energy of light source after district S2, the second sensing area S2 receive its reflection, and the first sensing area S1 can
Receive ambient light.Thus, the first sensing area S1 is in order to receive luminous ray L2 and to provide an ambient light
Sensing signal and the second sensing area S2 are in order to receive Infrared L1 ＇ and to provide a proximity sensing letter
Number；Substrate 31 is in order to carry first wafer the 32, second wafer 30, blocking part 33 and encapsulating material
34, the kind of its constituent material there is no specific restriction；Blocking part 33 is to be made up of light-proof material；
Encapsulating material 34 can be light transmissive material, such as resin, but is not limited.
In this embodiment, the first wafer 32 and the second wafer 30 may be contained within substrate 31 and that
This separates；Blocking part 33 is also arranged on substrate 31 and is positioned at the first wafer 32 and the second wafer 30
Between；Encapsulating material 34 is formed on substrate the 31, first wafer 32 and the second wafer 30, with bag
Cover the first wafer 32 and the second wafer 30.
It should be noted that, it is assumed that the first sensing area S1 on the second wafer 30 and the second sensing area S2
Between distance be D1 and between the second sensing area S2 and the first wafer 32 on the second wafer 30
Distance is D2, then D1 can be more than D2.This represents reception Infrared L1 ＇ on the second wafer 30
The second sensing area S2 closer can send the first wafer 32 of Infrared L1, and the second sense
Survey district S2 and can receive the first sensing area S1 of luminous ray L2 on the second wafer 30.In
In one embodiment, D1 can be more than the twice of D2 or twice, but is not limited.
As shown in Figure 4, light sensing packaging body 3 has the encapsulating structure of double loophole, the second wafer 30
On the first sensing area S1 and the second sensing area S2 lays respectively at below the bigger loophole in left side and that
This is separately positioned；First wafer 32 is then positioned at below the loophole that right side is less；First wafer 32
The center of center, the center of the first sensing area S1 and the second sensing area S2 all can be positioned at same straight line K
On；Distance D1 between first sensing area S1 and the second sensing area S2 is more than the second sensing area S2
And distance D2 between the first wafer 32；The left side of the second sensing area S2 to the right side of the first wafer 32
Distance between side is less than 2mm, preferably 1.2～1.5mm, but is not limited.
In an embodiment, portable electronic devices also includes housing and lid, and lid is arranged at
On housing.Above-mentioned light sensing packaging body is arranged in housing and is positioned under lid.It practice, can
The housing of portable electronic apparatus can be common metal or plastic casing, there is no specific restriction.
It should be noted that, the lid of portable electronic devices can be a Watch glass, and surface glass
Glass at least has two transmission regions and a viewing area, and viewing area is light-permeable, but not with this
It is limited.Other neighboring areas as Watch glass are lighttight mostly, even if there being part printing opacity,
Its light transmittance also can be less than 30%.
Then, refer to Fig. 5 and Fig. 6, Fig. 5 and Fig. 6 be respectively the light sensing encapsulation in Fig. 3
Body is arranged at the top view under the Watch glass of portable electronic devices and profile.Such as Fig. 5 and figure
Shown in 6, Watch glass G has the first transmission region CL1 and the second transmission region CL2.Second is brilliant
First sensing area S1 of sheet 30 is positioned under the first transmission region CL1 of Watch glass G, that is
The first transmission region CL1 upright projection of Watch glass G is in the first sensing area of the second wafer 30
S1；Second sensing area S2 and first wafer 32 of the second wafer 30 are positioned at the second of Watch glass G
Under transmission region CL2, that is the second transmission region CL2 upright projection of Watch glass G is in
Second sensing area S2 of two wafers 30 and the first wafer 32.
It should be noted that, the shape of the first transmission region CL1 of Watch glass G is at least wanted to contain
First sensing area S1 of the second wafer 30 below.In an embodiment, the of Watch glass G
The shape of one transmission region CL1 can be a similar round shape, such as circular, oval, close to rectangular
The oblong etc. of shape.As for the Watch glass G in Fig. 6 except the first transmission region CL1 and
Hatched example areas outside two transmission region CL2 is light tight region, even if having part printing opacity, its printing opacity
Rate also can be less than 30%.
It practice, the first transmission region CL1 of Watch glass G can be provided with the first film F1, example
As visible ray penetrates film, to promote passing through of ambient light.In an embodiment, the first film F1 sets
It is placed in the lower surface of the first transmission region CL1 of Watch glass G, but is not limited.Certainly,
The first transmission region CL1 of Watch glass G also can be not provided with thin film, there is no specific restriction.
Shape as the second transmission region CL2 of Watch glass G is at least wanted contain below
Second sensing area S2 of the second wafer 30 and the first wafer 32.In an embodiment, Watch glass G
The shape of the second transmission region CL2 can be a similar round shape, such as circular, oval, close to long
Square oblong etc., and its diameter is less than 2mm, but be not limited.
It practice, the second transmission region CL2 of Watch glass G can be provided with the second film F 2, example
As infrared light penetrates film, to filter the light of other non-infrared light wavelength.In an embodiment, second is thin
Film F2 is arranged at the lower surface of the second transmission region CL2 of Watch glass G, but is not limited.
It should be noted that, owing to being provided with infrared light, to penetrate the second transmission region CL2 of film the most vertical
It is projected on the first sensing area S1 of the second wafer 30 receiving visible ray so that the first sensing area S1
It is less affected by the second transmission region CL2 set infrared light when receiving visible ray and penetrates film
Impact, therefore can effectively promote the penetrance of visible ray.
Additionally, due to launch the first wafer 32 of Infrared L1 with reception Infrared L1 ＇'s
Second sensing area S2 be disposed adjacent to each other and be respectively positioned on Watch glass G the second transmission region CL2 it
Under, that is the first wafer 32 and the second sensing area S2 carrying out proximity sensing function is positioned at Watch glass
Under the same little loophole (the second transmission region CL2) of G.When user operates portable electronic
During device, from the little printing opacity that can only somewhat see Watch glass G in appearance of portable electronic devices
Hole (the second transmission region CL2), and more difficult the first transmission region CL1 seeing Watch glass G.
For example, it is assumed that be arranged at the visible ray on the first transmission region CL1 of Watch glass G
Penetrating film to the penetrance of optical wavelength 550nm is 50%, is arranged at second printing opacity of Watch glass G
It is 20% and to optical wavelength that infrared light on the CL2 of region penetrates film to the penetrance of optical wavelength 550nm
The penetrance of 940nm is 85%.
When visible ray L2 is disposed through on the first transmission region CL1 of Watch glass G visible
When light penetrates film and is incident upon the first sensing area S1 of the second wafer 30, the first sensing area S1 can sense
To light luminance be about visible ray L2 brightness 50%, and can obtain bigger than prior art
Field-of-view angle and higher visible ray penetrance.
Infrared L1 sent when the first wafer 32 is disposed through Watch glass through object reflection
Infrared light on the second transmission region CL2 of G penetrates film and penetrates and be reflected as Infrared L1 ＇
Through infrared light penetrate the second sensing area S2 that film is incident upon the second wafer 30 time, the second sensing area S2
The light ray energy that can sense is about the 72.25% of the energy of Infrared L1.
Then, refer to Fig. 7 and Fig. 8, Fig. 7 and Fig. 8 and be respectively according to another of the present invention concrete
The profile of the light sensing packaging body of embodiment and top view.It should be noted that, can by Fig. 7 and Fig. 8
Know: the light sensing packaging body 3 being different from previous embodiment has the encapsulating structure of double loophole, this
Light sensing packaging body 7 in embodiment has the encapsulating structure of three loopholes, but is not limited.
As it is shown in fig. 7, light sensing packaging body 7 includes substrate the 71, first wafer the 72, second wafer
70, the first blocking part the 73, second blocking part 75 and encapsulating material 74.Light sensing in this embodiment
Packaging body 7 is with light sensing packaging body 3 difference in previous embodiment: light sensing packaging body
7 also include the second blocking part 75, and the second blocking part 75 is arranged on the second wafer 70 and is positioned at
Between first sensing area S1 and the second sensing area S2.
As shown in Figure 8, light sensing packaging body 7 has the encapsulating structure of three loopholes, the second wafer 70
On the first sensing area S1 and the second sensing area S2 setting separated from one another, the first sensing area S1 is positioned at
Below the bigger loophole in left side and the second sensing area S2 is positioned at below center-right less loophole；
First wafer 72 is then positioned at below the loophole that right side is less；First sensing area S1 and the second sensing area
Distance D1 ＇ between S2 is more than the distance D2 ＇ between the second sensing area S2 and the first wafer 32；
Distance between the left side of the second sensing area S2 to the right side of the first wafer 72 is less than 2mm, preferably
It is 1.2～1.5mm, but is not limited.
It is respectively as Fig. 9 and Figure 10 and the light sensing packaging body in Fig. 7 is arranged at portable electronic
Top view under the Watch glass of device and profile.Due in the technology shown in Fig. 9 and Figure 10
Holding similar with previous embodiment, difference is only that light sensing packaging body 7 also includes being positioned at the first sensing area
The second blocking part 75 between S1 and the second sensing area S2, therefore refer to speaking on somebody's behalf mutually of previous embodiment
Bright, repeat the most separately in this.
Compared to prior art, portable electronic devices and light sensing packaging body thereof according to the present invention are
By the sensing environment light device being arranged on same light sensing wafer and proximity sensor separated from one another
Segment distance, thus increases the independent loophole corresponding only to sensing environment light device, to increase its angle of visibility
Spend, and this independent loophole be not on Watch glass set infrared light and penetrate under film,
Therefore film will not be penetrated by infrared light and be affected, can effectively promote visible ray penetrance so that ambient light
The environmental light brightness change that sensor is sensed can more meet the actual environment bright experienced of human eye
Degree change.
By the above detailed description of preferred embodiments, it is intended to more clearly describe the spy of the present invention
Levy and spirit, and not come to scope of the invention in addition with above-mentioned disclosed preferred embodiment
Limit.On the contrary, its objective is to wish to contain various change and tool equality is arranged in the present invention
In the category of the claim to be applied for.
Claims (14)
1. a light sensing packaging body, is arranged in a housing, it is characterised in that above-mentioned housing has
Having one first transmission region and one second transmission region, above-mentioned light sensing packaging body includes:
One first wafer a, it is provided that light source；
One second wafer, has one first sensing area and one second sensing area, the most above-mentioned first sense
Surveying district provides a sensing environment light signal, above-mentioned second sensing area to provide a proximity sensing signal, and
Above-mentioned second sensing area is between above-mentioned first wafer and above-mentioned first sensing area；And
One first blocking part, is arranged between above-mentioned first wafer and above-mentioned second wafer,
Wherein, above-mentioned first sensing area is positioned under above-mentioned first transmission region, above-mentioned first wafer
It is positioned under above-mentioned second transmission region with above-mentioned second sensing area.
2. light sensing packaging body as claimed in claim 1, it is characterised in that above-mentioned second printing opacity
Region is a similar round shape, and its diameter is less than 2mm.
3. light sensing packaging body as claimed in claim 1, it is characterised in that above-mentioned first sensing
There is between district and above-mentioned second sensing area one first distance and above-mentioned second sensing area and above-mentioned first
Having a second distance between wafer, above-mentioned first distance is more than above-mentioned second distance.
4. light sensing packaging body as claimed in claim 1, it is characterised in that above-mentioned second sensing
The side in district has one the 3rd distance between the side of above-mentioned first wafer, and the above-mentioned 3rd apart from little
In 2mm.
5. light sensing packaging body as claimed in claim 1, it is characterised in that above-mentioned second printing opacity
Region is provided with a first film, to filter the light of other non-infrared light wavelength.
6. light sensing packaging body as claimed in claim 1, it is characterised in that above-mentioned first printing opacity
Region is provided with one second thin film, to promote passing through of ambient light.
7. light sensing packaging body as claimed in claim 1, it is characterised in that above-mentioned light sensing seals
Dress body also includes:
One second blocking part, is arranged on above-mentioned second wafer and is positioned at above-mentioned first sensing area with upper
State between the second sensing area.
8. a portable electronic devices, it is characterised in that above-mentioned portable electronic devices includes:
One housing；
One lid, is arranged on above-mentioned housing, and above-mentioned lid has one first transmission region and
Second transmission region；And
One light sensing packaging body, is arranged in above-mentioned housing, and above-mentioned light sensing packaging body includes:
One first wafer a, it is provided that light source；
One second wafer, has one first sensing area and one second sensing area, and the most above-mentioned first
Sensing area provides a sensing environment light signal, above-mentioned second sensing area to provide a proximity sensing signal,
And above-mentioned second sensing area is between above-mentioned first wafer and above-mentioned first sensing area；And
One first blocking part, is arranged between above-mentioned first wafer and above-mentioned second wafer,
Wherein, above-mentioned first sensing area is positioned under above-mentioned first transmission region, above-mentioned first wafer
It is positioned under above-mentioned second transmission region with above-mentioned second sensing area.
9. portable electronic devices as claimed in claim 8, it is characterised in that above-mentioned second saturating
Light region is a similar round shape, and its diameter is less than 2mm.
10. portable electronic devices as claimed in claim 8, it is characterised in that above-mentioned first sense
Survey and there is between district and above-mentioned second sensing area one first distance and above-mentioned second sensing area and above-mentioned the
Having a second distance between one wafer, above-mentioned first distance is more than above-mentioned second distance.
11. portable electronic devices as claimed in claim 8, it is characterised in that above-mentioned second sense
The side surveying district has one the 3rd distance, above-mentioned 3rd distance between the side of above-mentioned first wafer
Less than 2mm.
12. portable electronic devices as claimed in claim 8, it is characterised in that above-mentioned second saturating
Light region is provided with a first film, to filter the light of other non-infrared light wavelength.
13. portable electronic devices as claimed in claim 8, it is characterised in that above-mentioned first saturating
Light region is provided with one second thin film, to promote passing through of ambient light.
14. such as claim 8 portable electronic devices stated, it is characterised in that above-mentioned portable
Electronic installation also includes:
One second blocking part, is arranged on above-mentioned second wafer and is positioned at above-mentioned first sensing area with upper
State between the second sensing area.
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| TW104109019 | 2015-03-20 | ||
| TW104109019A TW201635089A (en) | 2015-03-20 | 2015-03-20 | Portable electronic apparatus and optical sensing packaging object thereof |
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| CN106159026A true CN106159026A (en) | 2016-11-23 |
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| CN201510188987.9A Pending CN106159026A (en) | 2015-03-20 | 2015-04-21 | Portable electronic device and light sensing package thereof |
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| Country | Link |
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| CN (1) | CN106159026A (en) |
| TW (1) | TW201635089A (en) |
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| WO2018157334A1 (en) * | 2017-03-01 | 2018-09-07 | 上海箩箕技术有限公司 | Fingerprint imaging module and electrical device |
| CN108600537A (en) * | 2018-04-23 | 2018-09-28 | Oppo广东移动通信有限公司 | Proximity sensor, human body shadowing method, electronic device and readable storage medium storing program for executing |
| CN109494201A (en) * | 2017-09-11 | 2019-03-19 | 原相科技股份有限公司 | Optical sensing package module and its manufacturing method |
| CN110456367A (en) * | 2018-05-07 | 2019-11-15 | 光宝新加坡有限公司 | Proximity induction module with double transmitters |
| CN110542445A (en) * | 2018-05-29 | 2019-12-06 | 义明科技股份有限公司 | Optical sensing module |
| TWI698623B (en) * | 2018-10-15 | 2020-07-11 | 億光電子工業股份有限公司 | Proximity sensing device and display device |
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| TWI663415B (en) * | 2018-05-07 | 2019-06-21 | 新加坡商光寶科技新加坡私人有限公司 | Proximity sensor module with two detectors |
| CN110456365B (en) * | 2018-05-07 | 2023-05-16 | 光宝新加坡有限公司 | Proximity sensing module with double sensors |
| TWI676124B (en) * | 2018-05-29 | 2019-11-01 | 義明科技股份有限公司 | Optical sensing module |
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| WO2018157334A1 (en) * | 2017-03-01 | 2018-09-07 | 上海箩箕技术有限公司 | Fingerprint imaging module and electrical device |
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| CN108600537A (en) * | 2018-04-23 | 2018-09-28 | Oppo广东移动通信有限公司 | Proximity sensor, human body shadowing method, electronic device and readable storage medium storing program for executing |
| CN110456367A (en) * | 2018-05-07 | 2019-11-15 | 光宝新加坡有限公司 | Proximity induction module with double transmitters |
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| Publication number | Publication date |
|---|---|
| TW201635089A (en) | 2016-10-01 |
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