TWI663415B - Proximity sensor module with two detectors - Google Patents

Proximity sensor module with two detectors Download PDF

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TWI663415B
TWI663415B TW107115441A TW107115441A TWI663415B TW I663415 B TWI663415 B TW I663415B TW 107115441 A TW107115441 A TW 107115441A TW 107115441 A TW107115441 A TW 107115441A TW I663415 B TWI663415 B TW I663415B
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sensor
light
reflected
circuit substrate
light emitter
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TW107115441A
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TW201947255A (en
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聖義 蔡
力士 狄
廣力 宋
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新加坡商光寶科技新加坡私人有限公司
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Abstract

本發明公開一種具有雙感測器的近接感應模組,其包括一封裝殼體、一電路基板、一光發射器以及一感測組件。封裝殼體包括一第一封裝結構、一第二封裝結構、一分隔結構、由第一封裝結構與分隔結構所定義出的一第一容置空間以及由第二封裝結構與分隔結構所定義出的一第二容置空間。光發射器位於第一容置空間內且設置於電路基板上。感測組件包括一第一感測器以及一第二感測器,第一感測器與第二感測器位於第二容置空間內,且第一感測器比第二感測器遠離光發射器。藉此,第一感測器接收自光發射器所發出且經一近距離待測物所反射的一第一反射光線,第二感測器接收自光發射器所發出且經一遠距離待測物所反射的一第二反射光線。 The invention discloses a proximity sensing module with dual sensors, which includes a package housing, a circuit substrate, a light emitter and a sensing component. The package housing includes a first package structure, a second package structure, a partition structure, a first receiving space defined by the first package structure and the partition structure, and a package space defined by the second package structure and the partition structure. A second accommodation space. The light emitter is located in the first accommodation space and is disposed on the circuit substrate. The sensing component includes a first sensor and a second sensor. The first sensor and the second sensor are located in the second accommodating space, and the first sensor is farther away than the second sensor. Light emitter. Thereby, the first sensor receives a first reflected light emitted from the optical transmitter and reflected by a short-distance object to be measured, and the second sensor receives the first emitted light from the optical transmitter and passes a long-distance object. A second reflected light reflected by the object.

Description

具有雙感測器的近接感應模組 Proximity sensing module with dual sensors

本發明涉及一種近接感應模組,特別是涉及一種具有雙感測器的近接感應模組。 The invention relates to a proximity sensing module, in particular to a proximity sensing module with dual sensors.

現有的行動裝置多在顯示屏幕內設有近接感應器,以偵測使用者的臉、耳或頭髮,並在偵測到近距離物品時使顯示屏幕暫時關閉,一方面達到省電的功效,一方面也防止通話時使用者的臉、耳誤觸螢幕,影響到進行中的通話。 Most existing mobile devices have a proximity sensor in the display screen to detect the user's face, ears, or hair, and to temporarily close the display screen when a short-range object is detected, on the one hand, to save power, On the one hand, it also prevents the user's face and ears from touching the screen by mistake, which affects the ongoing call.

市場上對於行動裝置的近接感應器存在開孔小或外觀無開孔的需求,然而,若要達成開孔小或無開孔,近接感應器能夠從顯示面板內側向外傳輸出去的遠紅外線訊號將大幅降低,且訊號遭顯示面板內側面反射而造成的串擾現象也將提升。 On the market, the proximity sensor of mobile devices requires small openings or no openings. However, to achieve small or no openings, the proximity sensor can transmit far-infrared signals from the inside of the display panel. It will be greatly reduced, and the crosstalk phenomenon caused by the reflection of the signal from the inner side of the display panel will also increase.

此外,現有的行動裝置多使用具有表面塗層的玻璃面板作為顯示屏幕,其可按需求塗佈不同的顏色塗層以及功能塗層,然而,具有塗層的玻璃面板較一般不具塗層的玻璃面板或是不透光的面板具有更高的透光率以及反射率,因此造成更強烈的串擾效應,而串擾效應使近接感應器測得的信噪比降低,因此無法有效感應近接物體。 In addition, the existing mobile devices mostly use a glass panel with a surface coating as a display screen, which can be coated with different color coatings and functional coatings as required. However, a glass panel with a coating is more common than a glass without a coating. Panels or opaque panels have higher light transmittance and reflectivity, resulting in a stronger crosstalk effect. The crosstalk effect reduces the signal-to-noise ratio measured by the proximity sensor, so it cannot effectively sense the proximity object.

鑒於上述原因,如何通過結構設計的改良,而在遠紅外線傳輸效率低且串擾現象強的環境下,使近接感測器仍能夠感測到近距離待測物,已成為該項事業所欲解決的重要課題之一。 In view of the above reasons, how to improve the structural design and make the proximity sensor still be able to detect the short-distance DUT under the environment of low far-infrared transmission efficiency and strong crosstalk has become the goal of this project. One of the important topics.

本發明所要解決的技術問題在於,針對現有技術的不足提供一種具有雙感測器的近接感測器,其雙感測器的其中之一接收近距離待測物所反射的光線,而另一感測器接收遠距離待測物所反射的光線,以使具有雙感測器的近接感測器在高串擾效應的環境下仍能夠感測近距離物品。 The technical problem to be solved by the present invention is to provide a proximity sensor with dual sensors in response to the shortcomings of the prior art. One of the dual sensors receives the light reflected by the object to be measured at a short distance, and the other The sensor receives the light reflected from the object to be measured at a long distance, so that the proximity sensor with dual sensors can still detect the object at a short distance in an environment with a high crosstalk effect.

為了解決上述的技術問題,本發明所採用的其中一技術方案是,提供一種具有雙感測器的近接感應模組,其包括一封裝殼體、一電路基板、一光發射器以及一感測組件。所述封裝殼體包括一第一封裝結構、一第二封裝結構、一分隔結構、由所述第一封裝結構與所述分隔結構相互配合所定義出的一第一容置空間以及由所述第二封裝結構與所述分隔結構相互配合所定義出的一第二容置空間。所述電路基板承載所述第一封裝結構與所述第二封裝結構。一光發射器,所述光發射器位於所述第一容置空間內且設置於所述電路基板上。一感測組件,所述感測組件包括一第一感測器以及一第二感測器,所述第一感測器與所述第二感測器位於所述第二容置空間內且設置於所述電路基板上,且所述第一感測器比所述第二感測器遠離所述光發射器。所述第一感測器用以接收自所述光發射器所發出且經一近距離待測物所反射的一第一反射光線,所述第二感測器用以接收自所述光發射器所發出且經一遠距離待測物所反射的一第二反射光線。 In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a proximity sensor module with dual sensors, which includes a package housing, a circuit substrate, a light emitter, and a sensor. Components. The package housing includes a first package structure, a second package structure, a partition structure, a first accommodating space defined by the first package structure and the partition structure cooperating with each other, and the first housing space A second accommodating space defined by the second packaging structure and the partition structure cooperating with each other. The circuit substrate carries the first package structure and the second package structure. A light emitter located in the first accommodation space and disposed on the circuit substrate. A sensing component, the sensing component includes a first sensor and a second sensor, the first sensor and the second sensor are located in the second accommodation space and It is disposed on the circuit substrate, and the first sensor is farther from the light emitter than the second sensor. The first sensor is configured to receive a first reflected light emitted from the light transmitter and reflected by a short distance object to be measured, and the second sensor is configured to receive a first reflected light from the light transmitter. A second reflected light emitted from and reflected by a long-distance object to be measured.

為了解決上述的技術問題,本發明所採用的另外一技術方案是,提供一種具有雙感測器的近接感應模組,其包括一封裝殼體、一電路基板、一光發射器、一感測組件以及一光隔離件。所述封裝殼體包括一第一封裝結構、一第二封裝結構、一第一分隔結構、一第二分隔結構、由所述第一封裝結構與所述第一分隔結構相互配合所定義出的一第一容置空間、由所述第一分隔結構與所述第二分隔結構共同形成一第二容置空間以及由所述第二分隔結構與所述第二封裝結構相互配合所定義出的一第三容置空間。所述電 路基板承載所述第一封裝結構與所述第二封裝結構。所述光發射器位於所述第一容置空間內且設置於所述電路基板上。一感測組件,所述感測組件包括一第一感測器以及一第二感測器,所述第一感測器位於所述第二容置空間內且設置於所述電路基板上,所述第二感測器位於所述第三容置空間且設置於所述電路基板上,所述第一感測器比所述第二感測器接近於所述光發射器。一光隔離件,其中,所述光隔離件設置於所述第二分離結構上,用以限制所述第二感測器的感測視角。所述第一感測器用以接收自所述光發射器所發出且經一近距離待測物所反射的一第一反射光線,所述第二感測器用以接收自所述光發射器所發出且經一遠距離待測物所反射的一第二反射光線。 In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a proximity sensor module with dual sensors, which includes a package housing, a circuit substrate, a light emitter, and a sensor. Component and an optical isolator. The package housing includes a first package structure, a second package structure, a first partition structure, a second partition structure, and a structure defined by the first package structure and the first partition structure cooperating with each other. A first accommodating space, a second accommodating space formed by the first partition structure and the second partition structure together, and defined by the cooperation of the second partition structure and the second packaging structure A third accommodation space.所述 电 The electric The circuit substrate carries the first package structure and the second package structure. The light emitter is located in the first accommodation space and is disposed on the circuit substrate. A sensing component, the sensing component includes a first sensor and a second sensor, the first sensor is located in the second accommodation space and is disposed on the circuit substrate; The second sensor is located in the third accommodating space and disposed on the circuit substrate. The first sensor is closer to the light emitter than the second sensor. An optical isolator, wherein the optical isolator is disposed on the second separation structure, and is used to limit a sensing angle of the second sensor. The first sensor is configured to receive a first reflected light emitted from the light transmitter and reflected by a short-distance test object, and the second sensor is configured to receive a first reflected light from A second reflected light emitted from and reflected by a long-distance object to be measured.

本發明的其中一有益效果在於,本發明所提供的具有雙感測器的近接感應模組,其能通過“所述光發射器位於所述第一容置空間內且設置於所述電路基板上”以及“所述第一感測器與所述第二感測器位於所述第二容置空間內且設置於所述電路基板上,且所述第一感測器比所述第二感測器遠離所述光發射器”的技術方案,以使所述第一感測器接收自所述光發射器所發出且經一近距離待測物所反射的一第一反射光線,且使所述第二感測器接收自所述光發射器所發出且經一遠距離待測物所反射的一第二反射光線。 One of the beneficial effects of the present invention is that the proximity sensing module with dual sensors provided by the present invention can pass "the light emitter is located in the first accommodation space and disposed on the circuit substrate. Up "and" the first sensor and the second sensor are located in the second accommodating space and disposed on the circuit substrate, and the first sensor is less than the second sensor "Sensor is far away from the light transmitter", so that the first sensor receives a first reflected light emitted from the light transmitter and reflected by a short distance object to be measured, and The second sensor is configured to receive a second reflected light emitted from the light transmitter and reflected by a long-distance object to be measured.

為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,然而所提供的附圖僅用於提供參考與說明,並非用來對本發明加以限制。 In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

P‧‧‧行動裝置 P‧‧‧mobile device

M‧‧‧面板 M‧‧‧ Panel

Z‧‧‧近接感應模組 Z‧‧‧ Proximity Sensor Module

1‧‧‧封裝殼體 1‧‧‧ Encapsulated Housing

11‧‧‧第一封裝結構 11‧‧‧first package structure

12‧‧‧第二封裝結構 12‧‧‧Second package structure

13‧‧‧分隔結構 13‧‧‧ partition structure

131‧‧‧第一分隔結構 131‧‧‧ first partition structure

132‧‧‧第二分隔結構 132‧‧‧Second partition structure

R1‧‧‧第一容置空間 R1‧‧‧First accommodation space

R2‧‧‧第二容置空間 R2‧‧‧Second accommodation space

R3‧‧‧第三容置空間 R3‧‧‧Third accommodation space

2‧‧‧電路基板 2‧‧‧circuit board

3‧‧‧光發射器 3‧‧‧ light emitter

4‧‧‧感光組件 4‧‧‧ Photosensitive components

41‧‧‧第一感測器 41‧‧‧first sensor

θ1、θ2、θ3‧‧‧第一感測器的感測視角 θ1, θ2, θ3‧‧‧ the sensing angle of the first sensor

42‧‧‧第二感測器 42‧‧‧Second sensor

φ1、φ2、φ3‧‧‧第二感測器的感測視角 φ1, φ2, φ3‧‧‧ sensing angle of the second sensor

d1、d2、d3‧‧‧距離 d1, d2, d3‧‧‧ distance

5‧‧‧光隔離件 5‧‧‧ Optical Isolator

6‧‧‧第一透鏡 6‧‧‧first lens

7‧‧‧第二透鏡 7‧‧‧Second lens

L1‧‧‧第一反射光線 L1‧‧‧ the first reflected light

L2‧‧‧第二反射光線 L2‧‧‧Second reflected light

圖1為使用本發明第一實施例的具有雙感測器的近接感應模組的行動裝置的剖面示意圖;圖2為使用本發明第二實施例的具有雙感測器的近接感應模組的行動裝置的剖面示意圖; 圖3為使用本發明第三實施例的具有雙感測器的近接感應模組的行動裝置的剖面示意圖;以及圖4為本發明第三實施例的具有雙感測器的近接感應模組運作時的信噪比示意圖。 1 is a schematic cross-sectional view of a mobile device using a proximity sensor module with dual sensors in a first embodiment of the present invention; FIG. 2 is a schematic view of a mobile device using a proximity sensor module with dual sensors in a second embodiment of the present invention Schematic cross-section of a mobile device; 3 is a schematic cross-sectional view of a mobile device using a proximity sensor module with dual sensors according to a third embodiment of the present invention; and FIG. 4 is an operation of the proximity sensor module with dual sensors according to a third embodiment of the present invention Signal-to-noise ratio at time.

以下是通過特定的具體實施例來說明本發明所公開有關“具有雙感測器的近接感應模組”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的精神下進行各種修飾與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。 The following is a description of the implementation of the “proximity sensing module with dual sensors” disclosed by the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention may be implemented or applied through other different specific embodiments, and various details in this specification may also be based on different viewpoints and applications, and various modifications and changes may be made without departing from the spirit of the present invention. In addition, the drawings of the present invention are merely a schematic illustration, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

[第一實施例] [First embodiment]

請參閱圖1,圖1顯示使用本發明第一實施例的具有雙感測器的近接感應模組Z的行動裝置P1的剖面示意圖,其中,近接感應模組Z設置於行動裝置P1的面板M內側,且近接感應模組Z包括:一封裝殼體1、一電路基板2、一光發射器3以及一感測組件4。在本實施例中,使用本發明的近接感應模組Z的行動裝置P的面板M為一具有表面塗層的玻璃面板,然而本發明不限於此。 Please refer to FIG. 1. FIG. 1 is a schematic cross-sectional view of a mobile device P1 using a proximity sensor module Z with dual sensors according to a first embodiment of the present invention. The proximity sensor module Z is disposed on a panel M of the mobile device P1 The inside and the proximity sensing module Z include: a package housing 1, a circuit substrate 2, a light emitter 3, and a sensing component 4. In this embodiment, the panel M of the mobile device P using the proximity sensing module Z of the present invention is a glass panel with a surface coating, but the present invention is not limited thereto.

進一步而言,封裝殼體1包括一第一封裝結構11、一第二封裝結構12、一分隔結構13、由第一封裝結構11與分隔結構13相互配合所定義出的一第一容置空間R1以及由第二封裝結構12與分隔結構13相互配合所定義出的一第二容置空間R2。電路基板2承載第一封裝結構11與第二封裝結構12。光發射器3位於第一容置空間R1內且設置於電路基板2上。 Further, the package housing 1 includes a first package structure 11, a second package structure 12, a partition structure 13, and a first accommodating space defined by the first package structure 11 and the partition structure 13 cooperating with each other. R1 and a second accommodating space R2 defined by the mutual cooperation of the second packaging structure 12 and the partition structure 13. The circuit substrate 2 carries a first package structure 11 and a second package structure 12. The light emitter 3 is located in the first accommodation space R1 and is disposed on the circuit substrate 2.

如圖1所示,感測組件4包括一第一感測器41以及一第二感測器42,第一感測器41與第二感測器42位於第二容置空間R2內且設置於電路基板2上。且第一感測器41比第二感測器42遠離光發射器3,其中,第一感測器41用以接收自光發射器3所發出且經一近距離待測物所反射的一第一反射光線L1,第二感測器42用以接收自光發射器3所發出且經一遠距離待測物所反射的一第二反射光線L2。 As shown in FIG. 1, the sensing component 4 includes a first sensor 41 and a second sensor 42. The first sensor 41 and the second sensor 42 are located in the second accommodation space R2 and are disposed. On the circuit board 2. The first sensor 41 is farther from the light transmitter 3 than the second sensor 42, wherein the first sensor 41 is used to receive a light emitted from the light transmitter 3 and reflected by a short distance object to be measured. The first reflected light L1 and the second sensor 42 are used for receiving a second reflected light L2 emitted from the light emitter 3 and reflected by a long-distance object to be measured.

明確而言,由於第二感測器42鄰近於分隔結構13,來自分隔結構13一側的光線被分隔結構13阻擋而無法被第二感測器42接收,因此第二感測器42的感測視角φ1鄰近分隔結構13的一側被限縮,換句話說,第二感測器42由於分隔結構13的隔離,較無法接收來自光發射器3且被面板M反射的光線。而第一感測器41的視角僅被其鄰近的第二封裝結構12所限制,因此其感測視角θ1能涵蓋到來自光發射器3一側的光線。 Specifically, since the second sensor 42 is adjacent to the partition structure 13, light from one side of the partition structure 13 is blocked by the partition structure 13 and cannot be received by the second sensor 42. The side of the measurement angle φ1 adjacent to the separation structure 13 is restricted. In other words, due to the isolation of the separation structure 13, the second sensor 42 is less able to receive light from the light transmitter 3 and reflected by the panel M. The viewing angle of the first sensor 41 is limited only by the adjacent second packaging structure 12. Therefore, the sensing angle θ1 of the first sensor 41 can cover light from the light emitter 3 side.

藉由上述結構,第一感測器41主要接收的光線大部分為來自光發射器3所發出且經一近距離待測物所反射的第一反射光線L1,且第二感測器42主要接收的光線大部分為來自光發射器3所發出且經一遠距離待測物所反射的第二反射光線L2。 With the above structure, most of the light mainly received by the first sensor 41 is the first reflected light L1 emitted from the light emitter 3 and reflected by a short-distance object to be measured, and the second sensor 42 is mainly Most of the received light is the second reflected light L2 emitted from the light transmitter 3 and reflected by a long distance object to be measured.

詳細而言,如圖1所示,本發明的近接感應模組Z還進一步包括一光隔離件5,光隔離件5設置於分隔結構13上,用以限制第二感測器42的感測視角φ1。如圖所示,光隔離件5延長了分隔結構13的高度,因此進一步限制了第二感測器42的感測視角φ1。然而,本發明不限於此,在其他實施例中,可僅以分隔結構13來限制第二感測器42的感測視角φ1。 In detail, as shown in FIG. 1, the proximity sensing module Z of the present invention further includes an optical isolator 5. The optical isolator 5 is disposed on the separation structure 13 to limit the sensing of the second sensor 42. Angle of view φ1. As shown in the figure, the optical isolator 5 extends the height of the separation structure 13, thereby further limiting the sensing angle φ1 of the second sensor 42. However, the present invention is not limited to this. In other embodiments, the sensing angle φ1 of the second sensor 42 may be limited only by the separation structure 13.

更進一步而言,當面板M與近接感應模組Z間隔較小,可不需設置光隔離件5即可限制第二感測器42的感測視角φ1,而當面板M與近接感應模組Z間隔較大,設置光隔離件5除了可限制第二感測器42接收來被面板M反射的串擾光線,還可防止從面板M 與近接感應模組Z之間漏出的光線以及從此處竄入的外部光線,藉此可進一步降低串擾現象。此外,光隔離件5為由一不透光材料製成,且較佳地為一具伸縮性的材料。 Furthermore, when the distance between the panel M and the proximity sensor module Z is small, it is possible to limit the sensing angle φ1 of the second sensor 42 without providing the optical isolator 5. The interval is large, and the provision of the optical isolator 5 can not only restrict the crosstalk light received by the second sensor 42 from being reflected by the panel M, but also prevent it from being transmitted from the panel M. The light leaked from the proximity sensor module Z and the external light entering from it can further reduce the crosstalk phenomenon. In addition, the light isolator 5 is made of an opaque material, and is preferably a stretchable material.

如圖1所示,本發明的近接感應模組Z還進一步包括一第一透鏡6。如圖所示,第一透鏡6位於第一容置空間R1內且設置於電路基板2上,且第一透鏡6覆蓋光發射器3。藉由第一透鏡6的設置,可更佳地控制光發射器3的光線方向。在其他實施例中,也可是藉由其他方式來控制光發射器3所發出的光線的方向。 As shown in FIG. 1, the proximity sensing module Z of the present invention further includes a first lens 6. As shown in the figure, the first lens 6 is located in the first accommodation space R1 and is disposed on the circuit substrate 2, and the first lens 6 covers the light emitter 3. With the arrangement of the first lens 6, the light direction of the light emitter 3 can be better controlled. In other embodiments, the direction of the light emitted by the light emitter 3 may be controlled by other methods.

明確而言,本發明的近接感應模組Z的光發射器3為一紅外線發光二極體。然而,本發明不限於此。在其他實施例中,光發射器3也可為其他用於近接感應的光源。 Specifically, the light emitter 3 of the proximity sensing module Z of the present invention is an infrared light emitting diode. However, the present invention is not limited to this. In other embodiments, the light emitter 3 may also be another light source for proximity sensing.

本發明的近接感應模組Z藉由配置兩個感測器,即第一感測器41與第二感測器42,且第二感測器42設置為接近光發射器3而第一感測器41設置為遠離光發射器3,並利用位在光發射器3與第二感測器42之間的分隔結構13使第二感測器42接收到的串擾光線大幅減小。藉由上述結構,本發明的近接感應模組Z可使第一感測器41用於接收大部分來自光發射器3且被面板M反射的光線(及串擾光線)以及被近距離待測物反射的光線,而第二感測器42用於接收大部分來自光發射器3且被遠距離待測物反射的光線。 The proximity sensor module Z of the present invention is configured with two sensors, namely a first sensor 41 and a second sensor 42, and the second sensor 42 is disposed close to the light emitter 3 and the first sensor The detector 41 is disposed far away from the light transmitter 3, and the separation structure 13 located between the light transmitter 3 and the second sensor 42 is used to greatly reduce the crosstalk light received by the second sensor 42. With the above structure, the proximity sensing module Z of the present invention enables the first sensor 41 to receive most of the light (and crosstalk light) from the light transmitter 3 and reflected by the panel M and the object to be measured at a short distance. The reflected light, and the second sensor 42 is used to receive most of the light from the light transmitter 3 and reflected by the object to be measured at a long distance.

[第二實施例] [Second embodiment]

請參閱圖2所示,本發明的第二實施例與第一實施例大致相同,其具有的相同元件具有相同的元件標號,且功能大致相同,在此不再加以贅述。第二實施例與第一實施例的差別在於,第二實施例的具有雙感測器的近接感應模組Z還進一步包括一光路徑修正元件。如圖2所示,在本實施例中,光路徑修正元件為一第二透鏡7,其覆蓋第一感測器41與第二感測器42,其中,第一感 測器41與第二感測器42分別位於第二透鏡7的主軸的兩側。 Please refer to FIG. 2, the second embodiment of the present invention is substantially the same as the first embodiment, and the same components have the same component numbers and the same functions, which are not described herein again. The difference between the second embodiment and the first embodiment is that the proximity sensing module Z with dual sensors in the second embodiment further includes an optical path correction element. As shown in FIG. 2, in this embodiment, the light path correction element is a second lens 7, which covers the first sensor 41 and the second sensor 42, wherein the first sensor The sensor 41 and the second sensor 42 are respectively located on both sides of the main axis of the second lens 7.

進一步而言,如圖2所示,第一感測器41的感測視角θ2可通過第二透鏡7的調整以朝向接近光發射器3的方向偏移,且第二感測器42的感測視角φ2通過第二透鏡7的調整以朝向遠離光發射器3的方向偏移。 Further, as shown in FIG. 2, the sensing angle θ2 of the first sensor 41 can be adjusted by the second lens 7 to shift in a direction close to the light emitter 3, and the sensing of the second sensor 42 The measurement angle φ2 is shifted away from the light emitter 3 by the adjustment of the second lens 7.

藉由上述結構,本發明可使具有雙感測器的近接感應模組Z的第一感測器41增加接收來自光發射器3且被面板M以及近距離待測物反射的光線,而第二感測器42則減少接收來自光發射器3且被面板M以及近距離待測物反射的光線,可使具有雙感測器的近接感應模組Z可達到更佳的近接感應效果。 With the above structure, the present invention can increase the first sensor 41 of the proximity sensor module Z with dual sensors to receive light from the light transmitter 3 and reflected by the panel M and the object to be measured at a short distance. The two sensors 42 reduce the light received from the light transmitter 3 and are reflected by the panel M and the object to be measured at a short distance, so that the proximity sensor module Z with dual sensors can achieve a better proximity effect.

需要說明的說,本發明不限於上述光路徑修正元件的實現方式,在其他實施例中,光路徑修正元件也可以是透鏡以外的元件或結構。 It should be noted that the present invention is not limited to the implementation of the light path correction element described above. In other embodiments, the light path correction element may be an element or a structure other than a lens.

[第三實施例] [Third embodiment]

請參閱圖3,本發明的第三實施例與第一以及第二實施例大致相同,相同之處於此不在贅述。本發明的第三實施例與第一以及第二實施例的其中一不同點在於,第三實施例的具有雙感測器的近接感應模組Z的封裝殼體1包括一第一封裝結構11、一第二封裝結構12、一第一分隔結構131、一第二分隔結構132、由第一封裝結構11與第一分隔結構131相互配合所定義出的一第一容置空間R1、由第一分隔結構131與第二分隔結構132共同形成一第二容置空間R2以及由第二分隔結構14與第二封裝結構12相互配合所定義出的一第三容置空間R3。 Referring to FIG. 3, the third embodiment of the present invention is substantially the same as the first and second embodiments, and the same is not described here. One difference between the third embodiment of the present invention and the first and second embodiments is that the package housing 1 of the proximity sensor module Z with dual sensors of the third embodiment includes a first package structure 11 A second packaging structure 12, a first separating structure 131, a second separating structure 132, a first accommodating space R1 defined by the first packaging structure 11 and the first separating structure 131 cooperating with each other, A partition structure 131 and a second partition structure 132 together form a second accommodating space R2 and a third accommodating space R3 defined by the mutual cooperation of the second partition structure 14 and the second packaging structure 12.

進一步地,本發明的第三實施例與第一以及第二實施例的另外一不同點在於,第一實施例以及第二實施例中,第一感測器41比第二感測器42遠離光發射器3,而在本實施例中,第一感測器41比第二感測器接近光發射器3。詳細而言,第一感測器41位於 第二容置空間R2內且設置於電路基板2上,且第二感測器42位於第三容置空間R3內且設置於電路基板2上。更進一步地,在本實施例中,光隔離件5設置於第二分隔結構132上,用以限制第二感測器的感測視角φ3。 Further, the third embodiment of the present invention is different from the first and second embodiments in that, in the first and second embodiments, the first sensor 41 is farther away than the second sensor 42 The light transmitter 3, and in this embodiment, the first sensor 41 is closer to the light transmitter 3 than the second sensor. In detail, the first sensor 41 is located The second accommodation space R2 is disposed on the circuit substrate 2, and the second sensor 42 is located in the third accommodation space R3 and disposed on the circuit substrate 2. Furthermore, in this embodiment, the optical isolator 5 is disposed on the second separation structure 132 to limit the sensing angle φ3 of the second sensor.

在本實施例中,第一感測器41與第一實施例的第一感測器41一樣,是用以接收自光發射器3所發出且經一近距離待測物所反射的第一反射光線L1,且第二感測器42與第一實施例的第二感測器42同樣是用以接收自光發射器3所發出且經一遠距離待測物所反射的第二反射光線L2。 In this embodiment, the first sensor 41 is the same as the first sensor 41 of the first embodiment, and is used for receiving the first emitted from the light transmitter 3 and reflected by a short distance object to be measured. The reflected light L1, and the second sensor 42 is the same as the second sensor 42 of the first embodiment for receiving the second reflected light emitted from the light transmitter 3 and reflected by a long distance object to be measured L2.

更詳細而言,在本實施例中,由於第二感測器42比第一以及第二實施例中的第二感測器42更遠離光發射器3,再加上光隔離件5阻擋了發出自光發射器3且被面板M反射的光線,因此第二感測器42接收到光發射器3發出且經面板M反射的光線(串擾光線)的機率比第一以及第二實施例的第二感測器42更小。另一方面,由於本實施例的第一感測器比第一以及第二實施例中的第一感測器41更接近光發射器3,因此能接收到更多的來自光發射器3且被面板M以及近距離待測物反射的光線。 In more detail, in this embodiment, since the second sensor 42 is farther from the light emitter 3 than the second sensor 42 in the first and second embodiments, it is blocked by the optical isolator 5 The light emitted from the light transmitter 3 and reflected by the panel M, so the second sensor 42 has a higher probability of receiving the light (crosstalk light) emitted by the light transmitter 3 and reflected by the panel M than in the first and second embodiments. The second sensor 42 is smaller. On the other hand, since the first sensor in this embodiment is closer to the light transmitter 3 than the first sensor 41 in the first and second embodiments, it can receive more from the light transmitter 3 and The light reflected by the panel M and the object to be measured at a short distance.

因此,本實施例藉由上述結構,使第一感測器41接收自光發射器3所發出且經近距離待測物所反射的第一反射光線L1以及使第二感測器42接收自光發射器3所發出且經遠距離待測物所反射的第二反射光線L1,使本發明的近接感應模組Z可具有更佳的近接感應能力。 Therefore, in this embodiment, with the above structure, the first sensor 41 receives the first reflected light L1 emitted from the light transmitter 3 and is reflected by the object to be measured at a short distance, and the second sensor 42 is received from The second reflected light L1 emitted by the light transmitter 3 and reflected by the object to be measured at a long distance enables the proximity sensing module Z of the present invention to have better proximity sensing capabilities.

請參閱圖4,其顯示本發明第三實施例的具有雙感測器的近接感應模組Z運作時的信噪比示意圖。如圖所示,在鄰近面板M距離最近時,第一感測器41較第二感測器42有更高的信噪比,而隨著感測距離增加,第一感測器41接收的訊號減弱而第二感測器42接收的訊號增強,故第二感測器42較第一感測器41有更高的信噪比。 Please refer to FIG. 4, which shows a schematic diagram of a signal-to-noise ratio of a proximity sensor module Z with dual sensors according to a third embodiment of the present invention during operation. As shown in the figure, when the distance between the adjacent panel M is the shortest, the first sensor 41 has a higher signal-to-noise ratio than the second sensor 42, and as the sensing distance increases, the first sensor 41 receives The signal is weakened and the signal received by the second sensor 42 is enhanced. Therefore, the second sensor 42 has a higher signal-to-noise ratio than the first sensor 41.

進一步地,請配合參考圖4,第一感測器41以及第二感測器42可分別具有一接近閾值以及一遠離閾值,舉例而言,當第一感測器41以及第二感測器42的接近閾值分別為4dB,且遠離閾值分別為3dB,而一待測物由遠至近接近面板M,則待測物將在與面板M距離分別為d1以及d2時觸發第一感測器41以及第二感測器42的接近閾值,而行動裝置P可根據第一感測器41及第二感測器42被觸發接近閾值而判斷有物體相當接近面板M,進而使面板M休眠。而當待測物持續接近面板M,至與面板M距離為d3時,第二感測器42的遠離閾值被觸發,但由於第一感測器41此時的信噪比高於3dB,第一感測器41的遠離閾值不會被觸發,因此行動裝置P不會僅因為第二感測器42的遠離閾值被觸發就判斷物品已遠離面板M而重新啟動螢幕。 Further, with reference to FIG. 4, the first sensor 41 and the second sensor 42 may have a near threshold and a far threshold respectively. For example, when the first sensor 41 and the second sensor The approach thresholds of 42 are 4dB, and the distance thresholds are 3dB. When an object to be measured approaches panel M from far to near, the object to be tested will trigger the first sensor 41 when the distance from panel M is d1 and d2. And the approaching threshold of the second sensor 42, and the mobile device P can determine that an object is relatively close to the panel M according to the first sensor 41 and the second sensor 42 being triggered to approach the threshold, and then the panel M sleeps. When the object under test continues to approach the panel M until the distance from the panel M is d3, the distance threshold of the second sensor 42 is triggered. However, since the signal-to-noise ratio of the first sensor 41 at this time is higher than 3 dB, the A distance threshold of the sensor 41 will not be triggered, so the mobile device P will not determine that the item has moved away from the panel M and restart the screen just because the distance threshold of the second sensor 42 is triggered.

因此,本發明的近接感應模組Z可提升近接感應的感應範圍,降低誤判機率,且提高對於低反射率的物質(例如:頭髮)的感應能力。 Therefore, the proximity sensing module Z of the present invention can increase the sensing range of proximity sensing, reduce the probability of misjudgment, and improve the sensing capability for substances with low reflectivity (for example, hair).

[實施例的有益效果] [Advantageous Effects of the Embodiment]

本發明的其中一有益效果在於,本發明所提供的具有雙感測器的近接感應模組Z,其能通過“光發射器3位於第一容置空間R1內且設置於電路基板2上”以及“第一感測器41與第二感測器42位於第二容置空間R2內且設置於電路基板2上,且第一感測器41比第二感測器42遠離光發射器3”的技術方案,以使第一感測器41接收自光發射器3所發出且經一近距離待測物所反射的一第一反射光線L1,第二感測器42接收自光發射器3所發出且經一遠距離待測物所反射的一第二反射光線L2。 One of the beneficial effects of the present invention is that the proximity sensor module Z with dual sensors provided by the present invention can pass “the light transmitter 3 is located in the first accommodation space R1 and disposed on the circuit substrate 2”. And "the first sensor 41 and the second sensor 42 are located in the second accommodating space R2 and disposed on the circuit substrate 2, and the first sensor 41 is farther from the light emitter 3 than the second sensor 42 ", So that the first sensor 41 receives a first reflected light L1 from the light emitter 3 and is reflected by a short-distance object to be measured, and the second sensor 42 receives from the light emitter A second reflected light L2 emitted by 3 and reflected by a long-distance test object.

以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及附圖內容所做的等效技術變化,均包含於本發明的申請專利範圍內。 The content disclosed above is only the preferred and feasible embodiment of the present invention, and therefore does not limit the scope of patent application of the present invention. Therefore, any equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. Within the scope of the patent.

Claims (6)

一種具有雙感測器的近接感應模組,其包括:一封裝殼體,所述封裝殼體包括一第一封裝結構、一第二封裝結構、一分隔結構、由所述第一封裝結構與所述分隔結構相互配合所定義出的一第一容置空間以及由所述第二封裝結構與所述分隔結構相互配合所定義出的一第二容置空間;一電路基板,所述電路基板承載所述第一封裝結構與所述第二封裝結構;一光發射器,所述光發射器位於所述第一容置空間內且設置於所述電路基板上;以及一感測組件,所述感測組件包括一第一感測器以及一第二感測器,所述第一感測器與所述第二感測器位於所述第二容置空間內且設置於所述電路基板上,且所述第一感測器比所述第二感測器遠離所述光發射器,其中,所述第一感測器用以接收自所述光發射器所發出且經一近距離待測物所反射的一第一反射光線,所述第二感測器用以接收自所述光發射器所發出且經一遠距離待測物所反射的一第二反射光線。A proximity sensing module with dual sensors includes a package housing, the package housing including a first package structure, a second package structure, a partition structure, and the first package structure and A first accommodating space defined by the partition structure cooperating with each other and a second accommodating space defined by the second packaging structure and the partition structure cooperating with each other; a circuit substrate, the circuit substrate Carrying the first package structure and the second package structure; a light emitter, the light emitter is located in the first accommodation space and disposed on the circuit substrate; and a sensing component, The sensing component includes a first sensor and a second sensor, and the first sensor and the second sensor are located in the second accommodation space and disposed on the circuit substrate. Above, and the first sensor is farther from the light transmitter than the second sensor, wherein the first sensor is configured to receive the light emitted from the light transmitter and wait for a short distance. A first reflected light reflected by the object, and the second From the detector for receiving emitted light emitted by a second and by a distance reflecting light reflected analyte. 如請求項1所述的具有雙感測器的近接感應模組,還進一步包括一第一透鏡,所述第一透鏡位於所述第一容置空間內且設置於所述電路基板上,所述第一透鏡覆蓋所述光發射器。The proximity sensing module with dual sensors according to claim 1, further comprising a first lens, the first lens is located in the first accommodation space and is disposed on the circuit substrate, so The first lens covers the light emitter. 如請求項1所述的具有雙感測器的近接感應模組,還進一步包括一光隔離件,所述光隔離件設置於所述分隔結構上,用以限制所述第二感測器的感測視角。The proximity sensing module with dual sensors according to claim 1, further comprising an optical isolator, the optical isolator is disposed on the separation structure, and is used to restrict the second sensor. Sensing perspective. 如請求項1所述的具有雙感測器的近接感應模組,其中,所述光發射器為一紅外線發光二極體。The proximity sensing module with dual sensors according to claim 1, wherein the light emitter is an infrared light emitting diode. 如請求項1所述的具有雙感測器的近接感應模組,還進一步包括一光路徑修正元件,所述光路徑修正元件位於所述第二容置空間內,其中,所述第一感測器的感測視角通過所述光路徑修正元件的調整以朝向接近所述光發射器的方向偏移,且所述第二感測器的感測視角通過所述光路徑修正元件的調整以朝向遠離所述光發射器的方向偏移。The proximity sensing module with dual sensors according to claim 1, further comprising a light path correction element, the light path correction element is located in the second accommodation space, wherein the first sensor The sensing angle of the sensor is adjusted by the light path correction element to be shifted toward a direction close to the light emitter, and the sensing angle of the second sensor is adjusted by the light path correction element to Offset in a direction away from the light emitter. 如請求項5所述的具有雙感測器的近接感應模組,其中,所述光路徑修正元件為一第二透鏡,所述第二透鏡覆蓋所述第一感測器與所述第二感測器,其中,所述第一感測器與所述第二感測器分別位於所述第二透鏡的主軸的兩側。The proximity sensing module with dual sensors according to claim 5, wherein the light path correction element is a second lens, and the second lens covers the first sensor and the second sensor. The sensor, wherein the first sensor and the second sensor are respectively located on two sides of a main axis of the second lens.
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