CN106158918A - Flexible display and preparation method thereof - Google Patents
Flexible display and preparation method thereof Download PDFInfo
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- CN106158918A CN106158918A CN201610871672.9A CN201610871672A CN106158918A CN 106158918 A CN106158918 A CN 106158918A CN 201610871672 A CN201610871672 A CN 201610871672A CN 106158918 A CN106158918 A CN 106158918A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
- G02F1/167—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The present invention provides a kind of flexible display and preparation method thereof, including: sequentially forming channel layer, gate insulation layer, the first electrode layer and dielectric layer the most from the bottom to top, dielectric layer is coated with the first electrode layer and superposes with gate insulation layer laminating；Forming the first hole running through this dielectric layer and gate insulation layer in dielectric layer and gate insulation layer, this first hole terminates at channel layer upper surface；The organic filler that can absorb stress that at least can coat this first hole surface completely it is formed with at the first hole；Remove part organic filler and form the second hole, formed between this second hole and first hole and there is the organic matter layer absorbing stress；The second electrode lay is deposited in the second hole.Above-mentioned flexible display and preparation method thereof can the stress energy that produces in bending process of buffer electrode layer and insulating barrier, improve display effect.
Description
Technical field
The present invention relates to display technology field, especially relate to a kind of flexible display and preparation method thereof.
Background technology
Flexible display has plurality of advantages, such as impact resistance, and shock resistance is strong, lightweight, volume is little, carries more square
The feature such as just.
Flexible display currently mainly is broadly divided into three kinds: Electronic Paper (or flexible electrophoresis showed), organic of flexibility
Optical diode (Organic Light Emitting Diode, OLED) and flexible liquid crystal etc..
The feature of flexible screen body maximum is exactly that bendable can be rolled over.During screen body bending, it is easiest to cause damage of losing efficacy
It it is the contact interface between metal and inoranic membrane.Due to differing greatly of fatigue properties, when bending, inoranic membrane is easily generated and splits
Stricture of vagina, metal level is easily by inorganic layer stress rupture.
For above-mentioned technical problem, in prior art, use and cushion be directly set between metal level and insulating barrier,
Absorb with the stress energy that this realizes BENDING PROCESS.But, the method and structure forming this cushion also fails to solve bending very well
The process impact on metal electrode.
Summary of the invention
The purpose of the present invention includes providing a kind of flexible display and preparation method thereof, exists solving existing flexible display
During bending, damage metal electrode and the problem that reduces display effect.
The embodiment of the present invention provides the preparation method of a kind of flexible display, and this preparation method includes:
Sequentially form channel layer, gate insulation layer, the first electrode layer and dielectric layer, dielectric layer the most from the bottom to top
It is coated with the first electrode layer and superposes with gate insulation layer laminating；
Forming the first hole running through this dielectric layer and gate insulation layer in dielectric layer and gate insulation layer, this first hole terminates at
Channel layer upper surface；
The organic filling that can absorb stress that at least can coat this first hole surface completely it is formed with at the first hole
Thing；
Remove part organic filler and form the second hole, formed between this second hole and first hole and there is having of absorption stress
Machine nitride layer；
The second electrode lay is deposited in the second hole.
Further, when forming organic filler, the first hole is covered with.
Further, described organic filler is formed by coating method or printing processing technique.
Further, described second longitudinal section, hole is trapezoidal, rectangle or triangle.
Further, masking process is used to form described second hole in organic filler.
The embodiment of the present invention also provides for a kind of flexible display, including:
Flexible base board；
Channel layer, gate insulation layer, the first electrode layer and the dielectric layer arranged the most from bottom to top, wherein, is situated between
Matter layer is coated with the first electrode layer and superposes with gate insulation layer laminating；
First hole, through dielectric layer and gate insulation layer and terminate at channel layer upper surface；
Organic matter layer, is adhered to the surface in the first hole, it is possible to absorb stress；And
The second electrode lay, is deposited on the second hole.
Further, organic matter layer is removed a part by the organic filler that at least can be entirely coated on the first hole surface
After obtain, this organic filler fills up the first hole.
Further, described organic filler by coating method or prints processing technique formation.
Further, described second longitudinal section, hole is trapezoidal, rectangle or triangle.
Further, described second hole uses masking process to be formed in organic filler.
Flexible display and preparation method thereof that the present invention provides, dielectric layer and gate insulation layer arrange run through should both also
Terminate at the first hole of channel layer upper surface, organic matter layer is set in the first hole, then in organic matter layer, forms the second hole,
Second hole deposition the second electrode lay.Pass through the program, it is possible to avoid damaging metal electrode bending flexible display when, carry
High exhibit stabilization.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of description, and in order to allow the above and other objects, features and advantages of the present invention can
Become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, describe in detail as follows.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the preparation method of a kind of flexible display of the embodiment of the present invention.
The structural representation of a kind of flexible display that Fig. 2 is provided by the embodiment of the present invention.
Fig. 3 is the partial enlarged drawing of A in Fig. 2.
The structural representation offered behind the first hole of a kind of flexible display that Fig. 4 is provided by the embodiment of the present invention.
Structural representation after the filling organic filler of a kind of flexible display that Fig. 5 is provided by the embodiment of the present invention
Figure.
The structural representation offered behind the second hole of a kind of flexible display that Fig. 6 is provided by the embodiment of the present invention.
Detailed description of the invention
By further illustrating the technological means and effect that the present invention taked by reaching predetermined goal of the invention, below in conjunction with
Accompanying drawing and preferred embodiment, to a kind of flexible display proposed according to the present invention and preparation method thereof and specific embodiment party thereof
Formula, method, step, structure, feature and effect, after describing in detail such as.
For the present invention aforementioned and other technology contents, feature and effect, in following cooperation with reference to graphic preferable real
Execute in the detailed description of example and can clearly present.By the explanation of detailed description of the invention, when can be predetermined for reaching to the present invention
Technological means that purpose is taked and effect are able to more deeply and concrete understanding, however institute's accompanying drawings be only to provide with reference to
Purposes of discussion, is not used for being any limitation as the present invention.
Refer to the schematic flow sheet of the preparation method that Fig. 1 to Fig. 3, Fig. 1 are a kind of flexible display；Fig. 2 is the present invention
The structural representation of a kind of flexible display that embodiment is provided；Fig. 3 is the partial enlarged drawing of A in Fig. 2.As in figure 2 it is shown, should
Flexible display includes flexible base board 11, this flexible base board 11 is the most sequentially arranged channel layer 12, gate insulation layer 13,
First electrode layer 14 and dielectric layer 15, wherein, dielectric layer 15 is coated with the first electrode layer 14 fitting with gate insulation layer 13 and superposes；?
The laminated construction that this channel layer 12, gate insulation layer the 13, first electrode layer 14 and dielectric layer 15 are formed is formed with the first hole 16, tool
Body, this first hole 16 is through dielectric layer 15 and gate insulation layer 13 and terminates at channel layer 12 upper surface；In the present embodiment, at this
Having organic matter layer 17 on first hole 16, this organic matter layer 17 is adhered to the surface in the first hole 16, it is possible to absorbing stress, this has
Machine nitride layer 17 obtains after being removed a part by the organic filler 18 that at least can be entirely coated on the first surface, hole 16；Organic substance
Layer 17 constitutes the second hole 19, deposits the second electrode lay 20 in this second hole 19.In detail, above-mentioned flexible display by with
Lower method obtains, as shown in Figure 1.Particularly as follows: sequentially form the most from the bottom to top channel layer, gate insulation layer, first
Electrode layer and dielectric layer, dielectric layer is coated with the first electrode layer and superposes with gate insulation layer laminating；In dielectric layer and gate insulation layer
Forming the first hole running through this dielectric layer and gate insulation layer, this first hole terminates at channel layer upper surface；Formed at the first hole
There is the organic filler that can absorb stress that at least can coat this first hole surface completely；Remove part organic filler shape
Become the second hole, formed between this second hole and first hole and there is the organic matter layer absorbing stress；The second electrode is deposited in the second hole
Layer.
Perform step: sequentially form channel layer, gate insulation layer, the first electrode layer and medium the most from the bottom to top
Layer, dielectric layer is coated with the first electrode layer and superposes with gate insulation layer laminating.
This channel layer 12 is semiconductor structure layer, is the channel layer in thin film transistor (TFT) (TFT), and this channel layer 12 determines
Service behaviour in thin film transistor (TFT) (TFT), it should have that low-power consumption, response be fast and the function such as technique is simple.In this reality
Executing in example, this channel layer 12 can be a-Si, p-Si, oxide semiconductor or other form semiconductor layers, it is therefore intended that protects
The service behaviour of card thin film transistor (TFT), does not repeats at the present embodiment.Specifically being formed when, when selecting a-Si quasiconductor
During material, chemical gaseous phase depositing process is used to prepare；When selecting p-Si semi-conducting material to prepare these channel layer 12 when, then adopt
Prepare by quasi-molecule laser annealing technique；When using oxide semiconductor to prepare this channel layer 12, then use PVD physical vapor
Depositing operation.Owing to above-mentioned process is the universal technique that current semiconductor structure produces, do not repeat, but this area
Those of ordinary skill should be to understand, and be attainable.
Gate insulation layer 13 is the insulating barrier of thin film transistor (TFT) (TFT), uses at least double-layer structure in the present embodiment, can adopt
Prepare with materials such as SiOx, TEOS, SiNx, SiNO, specifically producing when, PECVD, plasma-reinforced chemical gas can be used
Mutually prepared by deposition or other techniques.Preparing these gate insulation layer 13 when, described channel layer 12 is wrapped up in by this gate insulation layer 13
Attached, and partly fit with flexible base board 11.
First electrode layer 14, as conductive electrode, can use Mo metal to be prepared by PVD physical gas-phase deposition, should
Layer is arranged on described gate insulation layer 13.
Dielectric layer 15, as the insulating barrier between electrode layer and device, its structure uses at least double-layer structure, can use
Prepared by the materials such as SiOX, SiNx, SiNO, specifically producing when, can use PECVD, plasma reinforced chemical vapour deposition
Or other techniques.These techniques are commonly used in the art, do not repeat.
Performing step: formed in dielectric layer and gate insulation layer and run through the first hole of this dielectric layer and gate insulation layer, this is the years old
One hole terminates at channel layer upper surface.
It is damaged in using BENDING PROCESS to solve electrode layer, therefore, the present embodiment have employed organic matter layer
17 realize buffering to adsorb stress energy.Refer to opening of a kind of flexible display that Fig. 4, Fig. 4 provided by the embodiment of the present invention
If the structural representation behind the first hole.As shown in Figure 4, being provided with the first hole 16, dielectric layer 15 and grid have been run through in this first hole 16
Insulating barrier 13, i.e. extends to the lower surface of gate insulation layer 13 by the upper surface of dielectric layer 15, and terminates and channel layer 12
Upper surface.Forming this first hole 16 when, the method for dry etching is used to obtain, naturally it is also possible to be obtained by wet etching
Arrive.The when of dry etching, physical chemistry can be used to etch, anti-to physical action and the chemistry of substrate by active ion
Answer dual function to etch, there is anisotropy and the good advantage of selectivity.This method is the universal method of integrated circuit fabrication process,
Those skilled in the art should realize, and does not repeats.The first hole 16 obtained is according to the demand of the second electrode lay 20
Select different etching size and shape.In the present embodiment, the longitudinal section in this first hole 16 is trapezoidal shape.Equally, in order to full
The demand that foot is different, this first hole 16 can be that other disclosure satisfy that the arbitrary shape that the second electrode lay 20 uses, for example, square
Shape or triangle etc..
Perform step: be formed at the first hole at least can coat this first hole surface completely can absorb stress
Organic filler.Refer to the filling organic filler of a kind of flexible display that Fig. 5, Fig. 5 are provided by the embodiment of the present invention
After structural representation.As it is shown in figure 5, owing to the first hole 16 is for housing the second electrode lay 20 that material is metal, in order to
Ensure to reduce the damage to this second electrode lay 20 when bending, after having obtained the first hole 16, formed in this first hole 16 and be used for
Absorb the cushion of stress energy.Specifically, in this first hole 16, organic filler is filled by coating method or printing type
18, such as in exposure manufacture process, the film-forming process of photoresist uses coating process, such as ink character OLED material, can beat with ink-jet
India side formula realizes.Specifically, this organic filler 18 at least wants to coat the surface in this first hole 16, and has certain thickness
Degree, the thickness of such as thinnest part should be more than 1 micron.In order to improve the convenience of preparation, organic filler 18 be covered with this first
Hole 16.Wherein organic filler 18 can be acrylic resin or photosensitive material or transparent resin material.During filling,
Organic filler 18 is to be formed in the first hole 16 by the form of solution, needs the regular hour stable, so, need to adopt
Dry by the mode heated up.It addition, this organic filler 18 uses resin material.
Perform step: remove part organic filler and form the second hole, formed between this second hole and first hole and there is suction
Receive the organic matter layer of stress.Refer to a kind of flexible display that Fig. 6, Fig. 6 provided by the embodiment of the present invention offers second
Structural representation behind hole.As shown in Figure 6, after organic filler 18 is stable, remove part organic filler 18, then the
The surface in one hole 16 is formed has the organic matter layer 17 absorbing stress energy, and this organic matter layer 17 is to have completely enclosed this first hole 16
Inner surface, this organic matter layer 17 has uniform thickness, and thickness is preferably between 2-4 micron.Specifically in formation, this has
The when of machine nitride layer 17, masking process is used to obtain.This organic matter layer 17 forms the second hole 19.
Perform step: deposit the second electrode lay in the second hole.After the formation completing organic matter layer 17, on the second hole 19
Deposition the second electrode lay 20.The second electrode lay 20 can use the materials such as Mo, Al to prepare, by PVD physical gas-phase deposition
Obtain.The material of this second electrode lay 20 can be identical with the first electrode layer 14, it is also possible to different.Deposition the second electrode lay
When 20, the second hole 19 being filled up and closed this second hole 19, then this second electrode lay 20 can also be partially covered on dielectric layer
The upper surface of 15.Meanwhile, when this second electrode lay 20 is partially covered on the upper surface of dielectric layer 15, be combined with dielectric layer 15
Part is also provided with organic matter layer, the strain produced during being buffered in bending with this.In embodiments of the present invention, this second hole 19
Longitudinal section is trapezoidal shape, rectangle or triangle etc..
After defining the second electrode lay 20, masking process is used to complete the graphical of the second electrode lay 20.Purpose is
Realize metal electrode and metal routing function.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, any be familiar with this specialty
Technical staff, in the range of without departing from technical solution of the present invention, when available above-mentioned disclosed technology contents is made a little
Change or modification etc., all any amendment, equivalent or improvement etc. made within the spirit and principles in the present invention, all should wrap
Within being contained in protection scope of the present invention.
Claims (10)
1. the preparation method of a flexible display, it is characterised in that this preparation method includes:
Sequentially forming channel layer, gate insulation layer, the first electrode layer and dielectric layer the most from the bottom to top, dielectric layer is coated with
First electrode layer also superposes with gate insulation layer laminating；
Forming the first hole running through this dielectric layer and gate insulation layer in dielectric layer and gate insulation layer, this first hole terminates at raceway groove
Layer upper surface；
The organic filler that can absorb stress that at least can coat this first hole surface completely it is formed with at the first hole；
Remove part organic filler and form the second hole, formed between this second hole and first hole and there is the Organic substance absorbing stress
Layer；
The second electrode lay is deposited in the second hole.
2. the preparation method of flexible display as claimed in claim 1, it is characterised in that: when forming organic filler, by the
One hole is covered with.
3. the preparation method of flexible display as claimed in claim 1, it is characterised in that: added by coating method or printing
Work technique forms described organic filler.
4. the preparation method of flexible display as claimed in claim 1, it is characterised in that: described second longitudinal section, hole is ladder
Shape, rectangle or triangle.
5. the preparation method of flexible display as claimed in claim 1, it is characterised in that: use masking process in organic filling
Thing is formed described second hole.
6. a flexible display, it is characterised in that including:
Flexible base board；
Channel layer, gate insulation layer, the first electrode layer and the dielectric layer arranged the most from bottom to top, wherein, dielectric layer
It is coated with the first electrode layer and superposes with gate insulation layer laminating；
First hole, through dielectric layer and gate insulation layer and terminate at channel layer upper surface；
Organic matter layer, is adhered to the surface in the first hole, it is possible to absorb stress；And
The second electrode lay, is deposited on the second hole.
7. flexible display as claimed in claim 6, it is characterised in that: described organic matter layer is by being at least entirely coated on
The organic filler of the first hole surface obtains after removing a part, and described organic filler fills up the first hole.
8. flexible display as claimed in claim 7, it is characterised in that: described organic filler is by coating method or beats
Print processing technique is formed.
9. flexible display as claimed in claim 6, it is characterised in that: described second longitudinal section, hole is trapezoidal, rectangle or three
Dihedral.
10. flexible display as claimed in claim 6, it is characterised in that: described second hole uses masking process to fill out organic
Fill in thing and formed.
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| CN107359177B (en) * | 2017-06-28 | 2020-03-31 | 武汉华星光电半导体显示技术有限公司 | Manufacturing method of flexible back plate, liquid crystal display panel and OLED display panel |
| CN109523914A (en) * | 2017-09-19 | 2019-03-26 | 深圳天珑无线科技有限公司 | A kind of protective device of flexible screen, display panel and electronic device |
| CN109523914B (en) * | 2017-09-19 | 2021-10-15 | 深圳天珑无线科技有限公司 | Protection device, display panel and electron device of flexible screen |
| CN109860143A (en) * | 2019-02-27 | 2019-06-07 | 京东方科技集团股份有限公司 | Array substrate, display device and preparation method, splicing display device |
| US11121068B2 (en) | 2019-02-27 | 2021-09-14 | Boe Technology Group Co., Ltd. | Array substrate, display device, method for manufacturing them, and spliced display device |
| CN109860143B (en) * | 2019-02-27 | 2022-01-14 | 京东方科技集团股份有限公司 | Array substrate, display device, preparation method and splicing display device |
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