CN106158547A - Chip fuse - Google Patents
Chip fuse Download PDFInfo
- Publication number
- CN106158547A CN106158547A CN201610736866.8A CN201610736866A CN106158547A CN 106158547 A CN106158547 A CN 106158547A CN 201610736866 A CN201610736866 A CN 201610736866A CN 106158547 A CN106158547 A CN 106158547A
- Authority
- CN
- China
- Prior art keywords
- fuse
- connecting portion
- melt
- cross
- fuse part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/08—Fusible members characterised by the shape or form of the fusible member
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- Fuses (AREA)
Abstract
The invention discloses a kind of chip fuse, a kind of chip fuse being made up of thick film print technology, the base material including melt, being coated with described melt and the connection end being arranged at described melt two ends, described melt includes fuse part and is positioned at described fuse part two ends and connects the connecting portion of described connection end, and the cross-sectional area of described connecting portion is more than the cross-sectional area of described fuse part.The chip fuse that the present invention provides; increase the cross-sectional area of connecting portion; utilize connecting portion and connect the contact area that end is bigger; improve connecting portion and connect the connection reliability of end; bigger rush of current can be withstood without fusing easily, now, connecting portion and connect the junction of end and will not restrict the performance of chip fuse; the fuse part relying on melt realizes circuit protection, thus is substantially improved the fusing performance of chip fuse.
Description
Technical field
The present invention relates to a kind of fuse, particularly relate to the chip fuse of a kind of small volume.
Background technology
Fuse generally includes melt, the base material of cladding melt and insulation tube two ends the termination electrically connected with melt.Outward
Portion's circuit electrical connection two ends is to make current flow through melt, and when the electric current flowing through melt exceedes setting, melt itself produces
Heat make melt fuse, disconnecting circuit, thus play the effect of protection of short circuit and overcurrent, is to apply most common circuit
One of protection device.
Currently, the miniature patch fuse on market mostly uses thick film print technology to manufacture, this kind of technique
Production miniature patch fuse production efficiency is higher and production cost is relatively low, but the product produced is at time current curve
On, show highly unstable characteristic, give and bring the biggest inefficacy in application.
Accordingly, it is desirable to provide it is a kind of by improving in structure, so that the fuse of its stable performance simultaneously again will not shadow
Ring production efficiency and the use cost of fuse.
Summary of the invention
It is an object of the invention to provide a kind of by improving in structure, so that the fuse of its stable performance is the most not
Production efficiency and the use cost of fuse can be affected.
To achieve these goals, the invention discloses a kind of chip fuse, a kind of be made up of thick film print technology
Chip fuse, the base material including melt, being coated with described melt and be arranged at the connection end at described melt two ends, described melt bag
Including fuse part and be positioned at described fuse part two ends and connect the connecting portion of described connection end, the cross-sectional area of described connecting portion is more than
The cross-sectional area of described fuse part.
Finding according to experiment, the striking point of the fuse of about 80% occurs in the two ends of melt and the connection of connection end
Place, thinks, during essentially consisting in thick film screen printing production fuse, is positioned at the connecting portion at melt two ends and connects end
Between connect and rely on the conduction printing solutions that brings of thick film print technology to realize, in the range of lesser width, conduction printing
Solution is likely to deficiency and causes connecting portion and the connection connected between end less reliable, thus causes the time electricity of chip fuse
Flow curve is not sufficiently stable, and is not sufficiently stable when electric current especially or circuit start, the electric current that suddenly increases flow through connecting portion and connect end
During place, local heating makes more weak connecting portion fuse, and does not meets actually used demand.
Compared with prior art, the chip fuse that the present invention provides, increase the cross-sectional area of connecting portion, utilize connecting portion
The contact area bigger with connecting end, improves connecting portion and connects the connection reliability of end, it is possible to withstanding bigger electric current
Impact is without fusing easily, and now, the junction of connecting portion and connection end will not restrict the performance of chip fuse, depends on
Fuse part by melt realizes circuit protection, thus is substantially improved the fusing performance of chip fuse.
It is also preferred that the left described connecting portion is identical with the thickness of described fuse part, and the cross-sectional width of described connecting portion is more than institute
State the cross-sectional width of fuse part.
Specifically, the cross-sectional width of described connecting portion is 1.1～1.6 with the ratio of the cross-sectional width of described fuse part.
It is also preferred that the left the ratio of the cross-sectional area of described connecting portion and the cross-sectional area of described fuse part is 1.1～1.6.
Specifically, described fuse part is in bending in plane residing for described melt, and connecting portion described in two is respectively in connection
In the linearity of described fuse part end, and the junction of described connecting portion and described fuse part is bending.
Further, the described fuse part in bending includes two fusing arms being parallel to each other, described in two fuse arm it
Between gap be 50 μm～1mm；Gap between two fusing arms is the least, when melt is energized, and the heat that melt sends
More concentrate, so that during melt energising excess, it is possible to fuse more rapidly.
It is also preferred that the left the thickness of described connection end is more than the thickness of described melt.
Accompanying drawing explanation
Fig. 1 is the structural representation of the chip fuse before improving.
Fig. 2 is the structural representation of chip fuse of the present invention.
Fig. 3 is the sectional view in A-A direction in Fig. 2.
Detailed description of the invention
By describing the technology contents of the present invention, structural feature in detail, being realized purpose and effect, below in conjunction with embodiment
And coordinate accompanying drawing to be explained in detail.
The existing chip fuse being made up of thick film print technology as shown in Figure 1, including melt 100, cladding melt
The base material (not shown) of 100 and the connection end 200 being arranged at melt 100 two ends.Wherein, melt 100 by thick film print technology,
Being formed in printing on substrates conduction printing solutions, therefore, the integral thickness of the melt 100 that thick film screen printing goes out keeps consistent, its
Thickness is mainly limited, about between 12 μm～25 μm by the performance of conduction printing solutions.In conjunction with Fig. 3, the thickness of melt 100
Compare the thin upper many of thickness of two connection ends 200.
Performance test according to using feedback and chip fuse shows, the existing paster being made up of thick film print technology
Fuse presents highly unstable phenomenon on time current curve, and the chip fuse portion of about 5% disclosure satisfy that
Electrical requirements, gives and brings the biggest inefficacy in application, had a strong impact on the safety and reliability of product.Research finds, existing
The chip fuse being made up of thick film print technology having, the striking point of about 80% occurs in the two ends of melt 100 and connection
The junction of end 200, thinks, during essentially consisting in thick film screen printing production fuse, is positioned at melt 100 two ends
The conduction printing solutions that connecting portion 120 and the connection connected between end 200 rely on thick film print technology to bring realizes, and printing is to base
Electric printing solutions for the moment the most uncured on material is it may happen that flowing, in the range of lesser width, and conduction printing solutions a little
Microfluidic i.e. can cause connecting portion 120 and the conduction printing solutions connected between end 200 is not enough, it is less reliable to connect, thus leads
The time current curve causing chip fuse is not sufficiently stable, and is not sufficiently stable when electric current especially or circuit start, the electricity that suddenly increases
When stream flows through connecting portion 120 and connects at end 200, the local temperature slightly caused beyond rated current has increased slightly, and also may
Cause more weak connecting portion 120 to fuse, do not meet actually used demand.
To this, the improvement of the present invention is: the situation that the thickness of the melt 100 made at thick film print technology is constant
Under, it is used for melt 100 being connected to connecting and is configured to wider at the two ends of end 200, utilize melt 100 and to connect end 200 wider
Connection area so that connection between the two is the most solid and reliable, even if partially electronically conductive printing solutions flows, still has
The melt 100 that the conduction printing solutions of major part molds keeps the state of connection with connecting end 200 so that melt 100 He
The junction connecting end 200 will not become the weak link of restriction chip fuse performance, thus improves the steady of chip fuse
Qualitative.
Concrete, as shown in Figures 2 and 3, a kind of chip fuse being made up of thick film print technology disclosed by the invention,
Including melt 100, the base material (not shown) of cladding melt 100 and the connection end 200 being arranged at melt 100 two ends, melt 100
Including fuse part 110 be positioned at fuse part 110 two ends and connect the connecting portion 120 of end 200, the cross-sectional area of connecting portion 120 is big
Cross-sectional area in fuse part 110.
The chip fuse that the present invention provides, increases the cross-sectional area of connecting portion 120, utilizes connecting portion 120 and connects end
200 bigger contacts area, improve connecting portion 120 and connect the connection reliability of end 200, it is possible to withstanding bigger electric current
Impact is without fusing easily, and now, the junction of connecting portion 120 and connection end 200 will not restrict chip fuse
Performance, relies on the fuse part 110 of melt 100 to realize circuit protection, thus is substantially improved the fusing performance of chip fuse.
Further, as it is shown on figure 3, as it was previously stated, connection end 200 thickness being arranged at melt 100 two ends is thicker；Utilize
Thick film print technology molds melt 100 in printing on substrates, and melt 100 thickness is limited by the performance of conduction printing solutions,
The integral thickness of melt 100 keeps consistent, about between 12 μm～25 μm.Therefore, keep at existing melt 100 integral thickness
Consistent and on the premise of will not changing easily, the cross-sectional area of connecting portion 120 alleged by the present invention is more than the horizontal stroke of fuse part 110
Sectional area, is: the thickness of connecting portion 120 and fuse part 110 is equal, the cross-sectional width of connecting portion 120 is more than fuse part 110
Cross-sectional width.
It is also preferred that the left the ratio of the cross-sectional area of connecting portion 120 and the cross-sectional area of fuse part 110 is 1.1～1.6, melt 100
On the premise of integral thickness keeps consistent and will not change easily, it is, the cross-sectional width of connecting portion 120 and fuse part
The ratio of the cross-sectional width of 110 is 1.1～1.6.Under the conditions of this ratio, connecting portion 120 and the connection blowout current of end 200, phase
The relatively blowout current of fuse part 110, the blowout current of both roughly equal or connecting portions 120 and connection end 200 is slightly larger than comparing
The blowout current of fuse part 110, thus keep the stable performance of chip fuse.Concrete, the present invention provide improved after
Chip fuse, our experiments show that, striking point does not occur in connecting portion 120 and the junction that connects end 200, and paster melts
The electrical qualification rate of disconnected device reaches 99.9%.
Concrete, fuse part 110 is in bending in plane residing for melt 100, and two connecting portions 120 are respectively in being connected to melt
The linearity of disconnected portion 110 end, and the junction of connecting portion 120 and fuse part 110 is bending.Fuse part in bending
110 purposes are to extend the length of fuse part 110, so that under the conditions of same resistance, the cross-sectional width chi of fuse part 110
Very little be able to relatively big, by wider size so that the structure of fuse part 110 is relatively stable, improve chip fuse of the present invention
Stability.
Further, the fuse part 110 in bending includes two fusing arms 111 being parallel to each other, two fusing arms 111 it
Between gap be 50 μm～1mm；Gap between two fusing arms 111 is the least, when melt 100 is energized, and melt 100
The heat gone out more is concentrated, so that melt 100 is energized during excess, it is possible to fuse more rapidly, thus promote further
Fusing performance.
Compared with prior art, the chip fuse that the present invention provides, increase the cross-sectional area of connecting portion 120, the company of utilization
Meet portion 120 and connect the contact area that end 200 is bigger, improve connecting portion 120 and connect the connection reliability of end 200, it is possible to warp
Afford to be subject to bigger rush of current without fusing easily, now, connecting portion 120 and connect the junction of end 200 will not
The performance of restriction chip fuse, relies on the fuse part 110 of melt 100 to realize circuit protection, thus is substantially improved paster fusing
The fusing performance of device.Our experiments show that, the chip fuse that the present invention provides, striking point does not occur at connecting portion 120 and connects
Connect the junction of end 200, and the electrical qualification rate of chip fuse reaches 99.9%.
The above disclosed the preferred embodiments of the present invention that are only, can not limit the right of the present invention with this certainly
Scope, the equivalent variations therefore made according to scope of the present invention patent, still belong to the scope that the present invention is contained.
Claims (7)
1. the chip fuse being made up of thick film print technology, the base material including melt, being coated with described melt and being arranged at
The connection end at described melt two ends, it is characterised in that described melt includes fuse part and is positioned at described fuse part two ends and connects
The connecting portion of described connection end, the cross-sectional area of described connecting portion is more than the cross-sectional area of described fuse part.
2. chip fuse as claimed in claim 1, it is characterised in that the thickness phase of described connecting portion and described fuse part
With, and the cross-sectional width of described connecting portion is more than the cross-sectional width of described fuse part.
3. chip fuse as claimed in claim 2, it is characterised in that the cross-sectional width of described connecting portion and described fuse part
The ratio of cross-sectional width be 1.1～1.6.
4. chip fuse as claimed in claim 1, it is characterised in that the cross-sectional area of described connecting portion and described fuse part
The ratio of cross-sectional area be 1.1～1.6.
5. the chip fuse as described in any one of claim 1-4, it is characterised in that described fuse part is in residing for described melt
In bending in plane, connecting portion described in two respectively in being connected to the linearity of described fuse part end, and described connecting portion and
The junction of described fuse part is bending.
6. chip fuse as claimed in claim 5, it is characterised in that the described fuse part in bending includes two mutually
Parallel fusing arm, the gap fused between arm described in two is 50 μm～1mm.
7. the chip fuse as described in any one of claim 1-4, it is characterised in that the thickness of described connection end is more than described
The thickness of melt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610736866.8A CN106158547A (en) | 2016-08-26 | 2016-08-26 | Chip fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610736866.8A CN106158547A (en) | 2016-08-26 | 2016-08-26 | Chip fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106158547A true CN106158547A (en) | 2016-11-23 |
Family
ID=57343142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610736866.8A Pending CN106158547A (en) | 2016-08-26 | 2016-08-26 | Chip fuse |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106158547A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111508796A (en) * | 2020-04-23 | 2020-08-07 | 南京萨特科技发展有限公司 | Controllable fuse, fuse assembly and control method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4651119A (en) * | 1985-06-28 | 1987-03-17 | Gould Inc. | Electric fuse heat dam element having stiffening ribs |
| US20070159291A1 (en) * | 2003-05-26 | 2007-07-12 | Abb Sp.Zo. O. | High-voltage thick-film high rupturing capacity substrate fuse |
| CN204303736U (en) * | 2014-11-14 | 2015-04-29 | 陕西同力电气有限公司 | A kind of fuse |
| CN104616940A (en) * | 2015-02-14 | 2015-05-13 | 南京萨特科技发展有限公司 | Chip type protection element and a manufacturing method thereof |
| CN206059325U (en) * | 2016-08-26 | 2017-03-29 | 东莞市博钺电子有限公司 | Chip fuse |
-
2016
- 2016-08-26 CN CN201610736866.8A patent/CN106158547A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4651119A (en) * | 1985-06-28 | 1987-03-17 | Gould Inc. | Electric fuse heat dam element having stiffening ribs |
| US20070159291A1 (en) * | 2003-05-26 | 2007-07-12 | Abb Sp.Zo. O. | High-voltage thick-film high rupturing capacity substrate fuse |
| CN204303736U (en) * | 2014-11-14 | 2015-04-29 | 陕西同力电气有限公司 | A kind of fuse |
| CN104616940A (en) * | 2015-02-14 | 2015-05-13 | 南京萨特科技发展有限公司 | Chip type protection element and a manufacturing method thereof |
| CN206059325U (en) * | 2016-08-26 | 2017-03-29 | 东莞市博钺电子有限公司 | Chip fuse |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111508796A (en) * | 2020-04-23 | 2020-08-07 | 南京萨特科技发展有限公司 | Controllable fuse, fuse assembly and control method |
| CN111508796B (en) * | 2020-04-23 | 2022-07-22 | 南京萨特科技发展有限公司 | Controllable fuse, fuse assembly and control method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161123 |