CN106155248A - A kind of heat abstractor of CPU automatic clamping and placing module - Google Patents
A kind of heat abstractor of CPU automatic clamping and placing module Download PDFInfo
- Publication number
- CN106155248A CN106155248A CN201610796923.1A CN201610796923A CN106155248A CN 106155248 A CN106155248 A CN 106155248A CN 201610796923 A CN201610796923 A CN 201610796923A CN 106155248 A CN106155248 A CN 106155248A
- Authority
- CN
- China
- Prior art keywords
- cpu
- automatic clamping
- placing module
- heat abstractor
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims abstract description 8
- 230000000694 effects Effects 0.000 abstract description 10
- 150000001875 compounds Chemical class 0.000 abstract description 4
- 239000002360 explosive Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses the heat abstractor of a kind of CPU automatic clamping and placing module, including the radiating subassembly with CPU upper surface, described radiating subassembly is respectively provided on two sides with a radiator fan, enclosed radiation passage it is formed with between radiator fan described in two, the present invention inhales one by two fans one and blows work compound and can improve air velocity in enclosed radiation passage, and the one of two radiator fans blows a suction, negative pressure is formed in making heat dissipation channel, air is by being just pressed onto negative pressure, air themperature can be made to reduce, improve radiating effect, there is volume little, the advantage of good heat dissipation effect.
Description
[technical field]
The present invention relates to CPU heat abstractor, the heat abstractor of a kind of CPU automatic clamping and placing module.
[background technology]
Along with the upgrading of computer CPU, the operational performance of CPU is increasingly stronger, function the most from strength to strength, consequently also
Some problems occur, one of them is that the heat that CPU produces gets more and more, and CPU heat dissipation equipment is proposed by this more to be increased
Requirement.Existing server, work station the radiator volume of CPU bigger, radiating efficiency is low, is automatically surveying mainboard
Need during examination to be automatically installed on mainboard CPU, owing to the volume of CPU heat abstractor has had a strong impact on more greatly other equipment
The installation of (such as: memory bar), and radiator fan only one of which, radiating effect is bad.
The present invention is i.e. to propose for the deficiencies in the prior art.
[summary of the invention]
The technical problem to be solved in the present invention is to provide the heat abstractor of a kind of CPU automatic clamping and placing module, including with on CPU
The radiating subassembly of surface contact, described radiating subassembly is respectively provided on two sides with a radiator fan, between the radiator fan described in two
Being formed with enclosed radiation passage, the present invention inhales one by two fans one and blows work compound and can improve enclosed radiation passage
Interior air velocity, and the one of two radiator fans blows a suction, forms negative pressure in making heat dissipation channel, air by being just pressed onto negative pressure,
Air themperature can be made to reduce, improve radiating effect, have that volume is little, the advantage of good heat dissipation effect.
For solving above-mentioned technical problem, the present invention includes and the radiating subassembly of CPU upper surface, described radiating subassembly
It is respectively provided on two sides with a radiator fan, between the radiator fan described in two, is formed with enclosed radiation passage.
The heat abstractor of a kind of CPU automatic clamping and placing module as above, described radiating subassembly comprises and CPU upper surface
The CPU of contact fixes seat and is connected to CPU and fixes the radiating fin of seat upper surface.
The heat abstractor of a kind of CPU automatic clamping and placing module as above, described enclosed radiation passage comprises multiple
It is arranged on CPU fix seat and the thermal vias arranged along enclosed radiation channel direction and be arranged on radiating fin and along envelope
The heat radiation gap that enclosed heat dissipation channel direction is arranged.
The heat abstractor of a kind of CPU automatic clamping and placing module as above, the spread geometry of described thermal vias is with scattered
The inlet shape of Hot-air fan is consistent.
The heat abstractor of a kind of CPU automatic clamping and placing module as above, it is characterised in that above described radiating fin
Connecting and have level to practice fishplate bar, described radiating fin is respectively provided on two sides with vertical connecting plate, described horizontal connecting plate, two vertical
Connecting plate and radiating fin bottom surface constitute enclosed radiation passage.
The heat abstractor of a kind of CPU automatic clamping and placing module as above, described thermal vias is bellmouth.
Compared with prior art, the heat abstractor of a kind of CPU automatic clamping and placing module of the present invention has the advantage that
1, be respectively provided on two sides with a radiator fan at radiating subassembly, by two radiator fans one inhale one blow work compound can
With air velocity in raising enclosed radiation passage；And two radiator fans one blow a suction, in making heat dissipation channel, form negative pressure,
Air, by being just pressed onto negative pressure, can make air themperature reduce, and improves radiating effect.
2, fixing at CPU and arrange multiple thermal vias on seat, and through hole is easily worked, processing cost is low.
3, through hole is set to the bellmouth that big one end, one end is little, when air flows to small end from big end, sky can be increased
Gas flow velocity in hole also can form negative pressure, strengthens radiating effect.
[accompanying drawing explanation]
Below in conjunction with the accompanying drawings the detailed description of the invention of the present invention is described in further detail, wherein:
Fig. 1 is the design sketch that the present invention is arranged on CPU automatic clamping and placing module；
Fig. 2 is the explosive view that the present invention is arranged on CPU automatic clamping and placing module；
Fig. 3 is the structural representation of the present invention；
Fig. 4 is heat abstractor explosive view of the present invention.
[detailed description of the invention]
Below in conjunction with the accompanying drawings embodiments of the present invention are elaborated.
As shown in Figures 1 to 4, the present embodiment includes the radiating subassembly 4 with CPU801 upper surface, radiating subassembly 4 liang
Side is respectively equipped with a radiator fan 43, is formed with enclosed radiation passage 44 between two radiator fans 43, by two fans one
Work compound is blown in suction one can improve air velocity in enclosed radiation passage 44, improves radiating effect.
Radiating subassembly 4 comprises the CPU with CPU801 upper surface to be fixed seat 41 and is connected to CPU and fixes seat 41 upper surface
Radiating fin 42, enclosed radiation passage 44 comprises multiple CPU of being arranged on and fixes seat 41 and along enclosed radiation passage 44 side
To between the thermal vias 411 arranged and the heat radiation being arranged on radiating fin 42 and arranging along enclosed radiation passage 44 direction
Gap 421, thermal vias 411 can strengthen CPU and fix the radiating effect of seat 41, and through hole is easily worked, and processing cost is low,
CPU fixes seat 41 and uses red copper to make.
In addition, being connected above level at radiating fin 42 and practice fishplate bar 45, radiating fin 42 is respectively provided on two sides with perpendicular
Enclosed radiation is constituted to connecting plate 46, the described vertical connecting plate 46 of horizontal connecting plate 45, two and radiating fin 42 bottom surface
Passage 44.
In order to improve radiating efficiency, the spread geometry of thermal vias 411 is consistent with the inlet shape of radiator fan 43.
Thermal vias 411 is bellmouth, when air-flow flows to small end from the big end of thermal vias 411, thermal vias 411
The flow velocity of small end is fast, can strengthen radiating effect.
Claims (6)
1. the heat abstractor of a CPU automatic clamping and placing module, it is characterised in that include the heat radiation with CPU (801) upper surface
Assembly (4), described radiating subassembly (4) is respectively provided on two sides with a radiator fan (43), between the radiator fan (43) described in two
It is formed with enclosed radiation passage (44).
The heat abstractor of a kind of CPU automatic clamping and placing module the most according to claim 1, it is characterised in that described heat radiation group
Part (4) comprises to be fixed seat (41) with the CPU of CPU (801) upper surface and is connected to CPU and fixes the heat radiation of seat (41) upper surface
Fin (42).
The heat abstractor of a kind of CPU automatic clamping and placing module the most according to claim 2, it is characterised in that described is closed
Heat dissipation channel (44) comprise multiple CPU of being arranged on fix seat (41) and along enclosed radiation passage (44) direction arrange heat radiation lead to
Hole (411) and the heat radiation gap (421) being arranged on radiating fin (42) and arranging along enclosed radiation passage (44) direction.
The heat abstractor of a kind of CPU automatic clamping and placing module the most according to claim 3, it is characterised in that described heat radiation is led to
The spread geometry in hole (411) is consistent with the inlet shape of radiator fan (43).
The heat abstractor of a kind of CPU automatic clamping and placing module the most according to claim 2, it is characterised in that described radiating fin
Sheet (42) is connected above level and practices fishplate bar (45), and described radiating fin (42) is respectively provided on two sides with vertical connecting plate (46),
Described horizontal connecting plate (45), two vertical connecting plates (46) and radiating fin (42) bottom surface constitute enclosed radiation passage
(44)。
6. according to the heat abstractor of a kind of CPU automatic clamping and placing module described in claim 3 or 4, it is characterised in that described dissipates
Heat through-hole (411) is bellmouth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610796923.1A CN106155248A (en) | 2016-08-31 | 2016-08-31 | A kind of heat abstractor of CPU automatic clamping and placing module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610796923.1A CN106155248A (en) | 2016-08-31 | 2016-08-31 | A kind of heat abstractor of CPU automatic clamping and placing module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106155248A true CN106155248A (en) | 2016-11-23 |
Family
ID=57345527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610796923.1A Pending CN106155248A (en) | 2016-08-31 | 2016-08-31 | A kind of heat abstractor of CPU automatic clamping and placing module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106155248A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113918399A (en) * | 2021-12-06 | 2022-01-11 | 深圳市微特精密科技股份有限公司 | Computer mainboard firmware function test device |
| CN114446332A (en) * | 2022-01-12 | 2022-05-06 | 朱国良 | Engineering cost data management storage module heat dissipation case |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020189789A1 (en) * | 2001-06-18 | 2002-12-19 | Global Win Technology Co., Ltd | CPU cooling arrangement |
| US20050087329A1 (en) * | 2003-10-03 | 2005-04-28 | Jie Zhang | Heat dissipation module with a pair of fans |
| US20050189088A1 (en) * | 2004-02-26 | 2005-09-01 | Wang Chin W. | Circulation structure of heat dissipation device |
| CN2758849Y (en) * | 2004-12-02 | 2006-02-15 | 奇宏电子(深圳)有限公司 | Side blowing type CPU radiator |
| CN203397347U (en) * | 2013-05-17 | 2014-01-15 | 中山市拓电电子科技有限公司 | CPU automatic taking and placing device with pressure sensor of computer detecting machine |
| CN203786647U (en) * | 2014-04-28 | 2014-08-20 | 吉首大学 | Radiating structure of computer case |
| CN206193658U (en) * | 2016-08-31 | 2017-05-24 | 中山市拓电电子科技有限公司 | Heat radiator for module is put to automatic getting of CPU |
-
2016
- 2016-08-31 CN CN201610796923.1A patent/CN106155248A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020189789A1 (en) * | 2001-06-18 | 2002-12-19 | Global Win Technology Co., Ltd | CPU cooling arrangement |
| US20050087329A1 (en) * | 2003-10-03 | 2005-04-28 | Jie Zhang | Heat dissipation module with a pair of fans |
| US20050189088A1 (en) * | 2004-02-26 | 2005-09-01 | Wang Chin W. | Circulation structure of heat dissipation device |
| CN2758849Y (en) * | 2004-12-02 | 2006-02-15 | 奇宏电子(深圳)有限公司 | Side blowing type CPU radiator |
| CN203397347U (en) * | 2013-05-17 | 2014-01-15 | 中山市拓电电子科技有限公司 | CPU automatic taking and placing device with pressure sensor of computer detecting machine |
| CN203786647U (en) * | 2014-04-28 | 2014-08-20 | 吉首大学 | Radiating structure of computer case |
| CN206193658U (en) * | 2016-08-31 | 2017-05-24 | 中山市拓电电子科技有限公司 | Heat radiator for module is put to automatic getting of CPU |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113918399A (en) * | 2021-12-06 | 2022-01-11 | 深圳市微特精密科技股份有限公司 | Computer mainboard firmware function test device |
| CN113918399B (en) * | 2021-12-06 | 2022-03-08 | 深圳市微特精密科技股份有限公司 | Computer mainboard firmware function test device |
| CN114446332A (en) * | 2022-01-12 | 2022-05-06 | 朱国良 | Engineering cost data management storage module heat dissipation case |
| CN114446332B (en) * | 2022-01-12 | 2023-09-08 | 内蒙古瑾达项目管理有限公司 | Engineering cost data management storage module radiating box |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161123 |