CN106155183B - Dynamic pressure module and its manufacturing method - Google Patents
Dynamic pressure module and its manufacturing method Download PDFInfo
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- CN106155183B CN106155183B CN201510143512.8A CN201510143512A CN106155183B CN 106155183 B CN106155183 B CN 106155183B CN 201510143512 A CN201510143512 A CN 201510143512A CN 106155183 B CN106155183 B CN 106155183B
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Abstract
The present invention provides a kind of dynamic pressure module and its manufacturing method, and dynamic pressure module includes a fluid slot at least two channels；At least two elastic devices being respectively arranged at least two channels and at least two sliding stop blocks；One cover board for being set to above fluid slot and being open with one；One is set to the heat-conducting fluid in fluid slot；And a heat conducting module, at least part pass through the opening of cover board and are set in fluid slot.Wherein there is heat conducting module a binding face to be bonded with electronic component, heat conducting module on vertical binding face direction when moving, an active force is imposed to heat-conducting fluid, and the grade elastic devices impose a reaction force to heat conducting module by the sliding stop block of the grade and heat-conducting fluid, and heat conducting module is maintained an equilbrium position on the direction of vertical binding face.Through the invention, it can avoid electronic component to be damaged because of the vibration after force when assembled or assembling, and simplify the technique for needing to design different heat conducting modules for different electronic components.
Description
Technical field
The present invention relates to a kind of dynamic pressure module and its manufacturing methods, especially with regard to applied to computer installation
A kind of dynamic pressure module and its manufacturing method.
Background technique
In computer installation, to operate computer installation maintenance at moderate temperatures, usually using with thermally conductive mould
The heat-transfer device of block, by the way that heat conducting module is fitted closely the electronic component for generating a large amount of thermal energy in one, by thermal energy by electronics
Element is rapidly transferred to heat-transfer device.
To fit closely the heat conducting module on heat-transfer device in electronic component, a kind of traditional way is in heat conducting module
And the gap of electronic component is placed in a thermally conductive sheet (Thermal Pad), wherein thermally conductive sheet is bonded in heat conducting module with electronic component
When generate a deflection so that thermally conductive sheet simultaneously fitted closely with heat conducting module and electronic component.However, such thermally conductive sheet
(Thermal Pad) usually has higher thermal resistance value, and in the case where reducing thermally conductive sheet thickness as far as possible, heat-transfer device can not be fitted
Answer the height of different electronic components, therefore conventional method must be for different thermally conductive of electronic component design of various different heights
Device, higher cost.In addition, such thermally conductive sheet does not have buffer capacity, it be easy to cause electronics first when by external force or vibration
Part is impaired.
The heat conducting module of another traditional approach, with reference to conductive structure shown in FIG. 1 (TaiWan, China utility model patent
M451797), wherein disclosing a heat-conducting block 3, when the pyrotoxin of circuit board (diagram does not disclose) is bonded with heat-conducting block, make thermally conductive
Block, to a convergence part 21 of heat conducting pipe 2 and flexibly positioned 4 application strength, and passes through the fixed heat-conducting block of Spring screws to bottom offset
And heat conducting pipe, so that heat-conducting block 3 is fitted closely the pyrotoxin of side and the heat conducting pipe 2 of side simultaneously, completing one has low-heat
The conductive structure of resistance.However, there are following items disadvantages for the heat conducting module of such traditional approach: the deformation of heat pipe may make
At heat pipe failure；Heat pipe and Spring screws higher cost；The pyrotoxin for being not easy to adapt to different height assembles；It is not easy to remain thermally conductive
Module and pyrotoxin fit closely；And conductive structure does not have resiliency, and such as chip is be easy to cause under vibration environment
Pyrotoxin it is impaired.
Therefore the heat conducting module of existing heat-transfer device, in practical application, it is clear that with the presence of its inconvenient and missing, and
It can be wait be improved.
Summary of the invention
The problem of in view of above-mentioned conventional thermal conductive module, problem to be addressed is how avoid heat-transfer device and electronics for present invention institute
Because external force is impaired when element assembles, and keep heat-transfer device to be formed with electronic component simultaneously and fit closely, in addition, the thermally conductive mould
Block can also adjust height and position, to adapt to the pyrotoxin of different height, increase the convenience of assembling, and as the slow of an external force
Punching avoids electronic component impaired because of external force.
Based on the purpose of the present invention, a dynamic pressure module is provided, wherein including: a fluid slot, at least two elasticity dresses
It sets, at least two slide stop blocks, a cover board, a heat-conducting fluid and a heat conducting module.The fluid slot has one side wall and at least two
A channel, at least two channel are respectively provided with an engagement side wall.At least two elastic device be respectively arranged at this at least two
The engagement side wall of at least two channel is bonded in a channel and with an affixed side, preferably, at least two elasticity
Device is made of spring.At least two sliding stop block is set at least two channel, and be respectively engaged to this at least two
Side of a elastic device relative to the affixed side, wherein the fluid slot is divided at least two elasticity by at least two sliding stop block
Device space and a heat-conducting fluid space.The cover board is set to above the fluid slot and has an opening.Heat-conducting fluid setting
In the heat-conducting fluid space, preferably, the heat-conducting fluid is that material by thermal coefficient range at 3~6W/m DEG C is constituted.
The heat conducting module includes that a setting face and a binding face, the setting face are set in the fluid slot by the opening of the cover board,
And contacted with the heat-conducting fluid, which is set to side of the cover board relative to the fluid slot, with an electronic component shape
At fitting closely.For the heat conducting module when moving on the vertical binding face direction, which imposes a work towards the heat-conducting fluid
Firmly, and the grade elastic devices slide stop block and the heat-conducting fluid by the grade and impose a reaction force to the setting face, and should
Setting face maintains an equilbrium position on the direction of the vertical binding face.
Based on the purpose of the present invention, a dynamic pressure module making method is provided, it includes: firstly, providing a heat-conducting plate
And a fluid slot is made on the heat-conducting plate, which has one side wall and at least two channels, at least two channel point
It Ju You not an engagement side wall.Secondly, at least two elastic devices are respectively correspondingly arranged at least two channel, this is extremely
Few two elastic devices are respectively provided with the engagement side wall that an affixed side is bonded at least two channel, preferably, this is at least
Two elastic devices are made of spring.Also secondly, at least two sliding stop blocks are arranged at least two channel, engage respectively
To the side of at least two elastic devices relative to the affixed side, wherein at least two sliding stop block by the fluid slot be divided into
Few two elastic device spaces and a heat-conducting fluid space.Again secondly, a cover board is arranged above the fluid slot, which has
One opening.Thirdly, a heat-conducting fluid is set in the heat-conducting fluid space.And a heat conducting module, the heat conducting module packet are set
Containing one setting face and a binding face, the setting face be set in the fluid slot by the opening of the cover board, and with the thermally conductive stream
Body contact, the binding face are set to side of the cover board relative to the fluid slot, to fit closely with electronic component formation.Its
In, for the heat conducting module when moving on the vertical binding face direction, which imposes an active force towards the heat-conducting fluid, and should
Equal elastic devices impose a reaction force to the setting face by the sliding stop block of the grade and the heat-conducting fluid, and the setting face is being hung down
An equilbrium position is maintained on the direction of the straight binding face, the binding face is formed with the electronic component and fits closely.
The beneficial effects of the present invention are dynamic pressure module and its manufacturing method through the embodiment of the present invention can be kept away
Exempt from electronic component to be damaged because of the vibration after force when assembled or assembling, and simplifies and need to design for different electronic components
The technique of different heat conducting modules.
Detailed description of the invention
Fig. 1 is a kind of conductive structure of the prior art；
Fig. 2 is the dynamic pressure decomposition module figure of first embodiment of the invention；
Fig. 3 is the dynamic pressure module perspective view of first embodiment of the invention；
Fig. 4 is the dynamic pressure module sectional view of first embodiment of the invention；
Fig. 5 is the fluid slot perspective view of second embodiment of the invention；
Fig. 6 is the dynamic pressure module perspective view of second embodiment of the invention；
Fig. 7 is the flow chart of dynamic pressure module making method of the present invention；
Fig. 8 is the perspective view that production method S01 step of the present invention completes fluid slot setting；
Fig. 9 is the perspective view that production method S02 step of the present invention completes sliding stop block setting；
Figure 10 is the perspective view that production method S03 step of the present invention completes elastic device setting；
Figure 11 is the perspective view that production method S04 step of the present invention completes cover board setting.
Appended drawing reference
2 heat pipes
21 convergence parts
3 heat-conducting blocks
4 flexibly positioned
1000,2000 dynamic pressure modules
1100,2100 fluid slots
1110,2110 side walls
1120,2120 channels
1130 elastic device spaces
1140 heat-conducting fluid spaces
1121,2121 engagement side walls
1200 elastic devices
1210 affixed sides
1300 sliding stop blocks
1400,2400 cover boards
1410 openings
1500,2500 heat conducting modules
1510,2510 binding faces
1520 setting faces
1600,2600 heat-conducting plates
Specific embodiment
It is hereafter specific embodiment according to the present invention and describes it referring to schema.
Firstly, illustrating the first specific embodiment of the invention.Referring to Fig. 2, being dynamic pressure mould in present embodiment
The exploded view of block 1000 depicts a fluid slot 1100, two sliding stop block 1300, two elastic devices 1200, a cover boards
1400 and a heat conducting module 1500.Wherein, fluid slot 1100 is arranged on heat-conducting plate 1600, and has side wall 1110, each other
Engagement side wall 1121 in two opposite channels 1120 and channel 1120.Elastic device 1200 is separately positioned on channel 1120
In, and the affixed side 1210 of elastic device 1200 is respectively engaged to the engagement side wall 1121 of channel 1120, wherein present embodiment
It is to use spring as elastic device.It is preferred that elastic device of the invention can also be other flexible material institutes
It is made, such as uses elastic device made of rubber material.Sliding stop block 1300 is bonded to elastic device 1200 relative to affixed side
1210 other end, and being set in channel 1120, by fluid slot 1100 be divided to for two elastic device spaces 1130 and one it is thermally conductive
Fluid space 1140.Cover board 1400 is arranged on fluid slot 1100, and has an opening 1410.Heat conducting module 1500 has each other
Opposite binding face 1510 and setting face 1520, is provided with face 1520 and is arranged by the opening 1410 of cover board 1400 in fluid slot
In 1100, binding face 1510 is arranged outside fluid slot 1100, to fit closely with electronic component formation.
Referring to Fig. 3, be the perspective view of dynamic pressure module 1000 in present embodiment, the dynamic after depicting combination
The binding face 1510 of the cover board 1400 of modular pressure 1000, heat conducting module 1500 and heat conducting module 1500.Wherein, when dynamic is pressed
When power module 1000 is to provide one preferable thermally conductive pathways of electronic component, the binding face 1510 of heat conducting module 1500 can be with electricity
Subcomponent formation fits closely, and makes the thermal energy of electronic component via the conduction of binding face 1510 to heat conducting module 1500.
Referring to Fig. 4, being the sectional view in the direction AA along Fig. 3 of dynamic pressure module 1000 in present embodiment, describe
Heat conducting module 1500 is set to the position in fluid slot out.Wherein, the heat-conducting fluid between sliding stop block 1300 and heat conducting module 1500
Space 1140 is provided with a suitable heat-conducting fluid, when heat conducting module 1500 is arranged, the setting face 1520 of heat conducting module 1500
It is set in heat-conducting fluid space 1140 by cover board 1400, and contacted with heat-conducting fluid.It is preferred that heat-conducting fluid is by leading
Made by the material of 3~6W/m DEG C of hot coefficient.More preferably it is, when binding face 1510 is fitted closely with electronic component formation, if
It sets face 1520 to be bonded with the bottom surface of fluid slot, to form preferable thermally conductive pathways between the bottom surface in setting face 1520 and fluid slot.
Wherein, heat conducting module of the invention can not only be formed with electronic component and be fitted closely, to provide electronic component one
Preferable thermally conductive pathways also can be avoided and impose excessive power to electronic component, cause electronic component impaired.Please continue to refer to figure
4, when dynamic pressure module 1000 is for when providing one thermally conductive pathways of electronic component, the binding face 1510 of heat conducting module 1500 first with
One electronic component forms contact, at this point, 1500 stress of heat conducting module is moved into fluid slot 1100, and in vertical binding face 1510
Direction on, an active force is imposed to heat-conducting fluid, then, heat-conducting fluid flows to surrounding and formed and squeezed to sliding stop block 1300
Pressure, sliding stop block 1300 causes the compression of elastic device 1200 after being squeezed, at this point, the elastic device 1200 for generating deformation passes through
Sliding stop block 1300 imposes elastic force to heat-conducting fluid, by elastic force heat-conducting fluid thus on the direction of vertical binding face, to leading
Thermal modules 1500 impose a reaction force, on the direction of vertical binding face, work that heat conducting module 1500 applies heat-conducting fluid
Firmly reach flat by the reaction force that sliding stop block 1300 and heat-conducting fluid apply heat conducting module 1500 with elastic device 1200
When weighing apparatus, heat conducting module 1500 is just maintained on an equilbrium position.Therefore, dynamic pressure module 1000 of the invention makes to lead in force
When thermal modules 1500 fit closely an electronic component, it is able to avoid external force from causing electronic component impaired via the above process.Again
Person, the electronic component for completing assembling with dynamic pressure module 1000 are also less easily damaged when being vibrated.In addition, by upper
Mechanism is stated, dynamic pressure module 1000 of the invention more can form close patch with the electronic component with different height or thickness
It closes, simplifies the technique for needing to design different heat conducting modules for different electronic components.
It is preferred that in actual test, the dynamic pressure module 1000 of present embodiment compared to the prior art in make
It uses thermally conductive sheet (Thermal Pad) as the mode of heat conducting module and the interface of electronic component, there is more preferably heat-conducting effect.In detail
Thin test condition and result please refer to following table one, and in this test, embodiment one is the dynamic of first embodiment of the invention
Modular pressure 1000, and tested using the Intel i7-4700EQ processor operated under 47 watts of power, comparative example one is
Use thermally conductive sheet as the interface of heat conducting module and electronic component in the prior art, and using operating under 17 watts of power
Intel i7-4700EQ processor is tested, and wherein embodiment one and the environment temperature of comparative example one are all 65 DEG C.Test knot
Fruit shows that the temperature difference of processor and environment temperature is 15.6 DEG C in the test of embodiment one, and in the test of comparative example one
In be 22.6 DEG C, it can be seen that, dynamic pressure module of the invention has more preferably thermally conductive compared to the heat-transfer device of traditional approach
Effect, make processor and environment temperature maintains lower temperature difference.
The thermal conductivity test result of table one, dynamic pressure module
Then, illustrate the second specific embodiment of the invention.Referring to Fig. 5, being to illustrate dynamically to press in present embodiment
The exploded view of power module 2000 depicts a fluid slot 2100, and the fluid slot 2100 is arranged on a heat-conducting plate 2600, and
With 2110, four channels 2120 of side wall, and it is one group relative to each other that channel 2120, which is arranged around fluid slot 2,100 two, often
The engagement side wall 2121 of one channel 2120 is respectively engaged to the affixed side of an elastic device, and each elastic device is relative to affixed side
Side be bonded to a sliding stop block, and fluid slot is divided into four elastic device spaces and a heat-conducting fluid space by sliding stop block.Lid
Plate is set to above fluid slot, and has an opening.Heat conducting module has setting face and binding face, and the face of being provided with passes through cover board
Opening be arranged in fluid slot, binding face be arranged outside fluid slot, to an electronic component formation fit closely.
Referring to Fig. 6, being the perspective view for illustrating dynamic pressure module 2000 in present embodiment, after depicting combination
The cover board 2400 of dynamic pressure module 2000, heat conducting module 2500, heat-conducting plate 2600 and heat conducting module 2500 binding face
2510.Wherein, when dynamic pressure module 2000 is to provide one preferable thermally conductive pathways of electronic component, heat conducting module 2500
Binding face 2510 can be formed with electronic component and be fitted closely, and conduct the thermal energy of electronic component to thermally conductive via binding face 2510
Module 2500.
It is noted that dynamic pressure module of the invention is not limited to certain amount of channel.Dynamic in the present invention
Modular pressure is characterized in that, elastic device in multiple channels is arranged and passes through multiple works that sliding stop block applies heat-conducting fluid
Firmly, balance can be reached in a plane parallel with heat conducting module binding face, so that heat conducting module is squeezed by heat-conducting fluid
When, heat conducting module will not move on the direction for be parallel to binding face, and only by heat-conducting fluid via be arranged towards thermally conductive mould
Thrust of the block along a vertical binding face direction.Therefore, optionally, dynamic pressure module of the invention can be with multiple ditches
Road, and the grade channels form a rotational symmetry relationship in a plane of the binding face of parallel heat conducting module, and accommodate one respectively
Elastic device and a sliding stop block are wherein.
Then, illustrate a kind of production method of dynamic pressure module in the present invention.It is present invention production dynamic refering to Fig. 7
The flow chart of modular pressure.Below with reference to the dynamic pressure module 1000 of the first specific embodiment of the invention, illustrate the present invention
A kind of embodiment of middle dynamic pressure module making method.
In S01 step, a heat-conducting plate 1600 is first provided, and makes a fluid slot 1100 on heat-conducting plate 1600.It please join
Examine Fig. 8, be in present embodiment S01 step make heat-conducting plate 1600 on fluid slot 1100, with one side wall 1110 with
And it is respectively provided with two channels 1120 of engagement side wall 1121.It is preferred that fluid slot 1100 of the invention can be with it is thermally conductive
The integrated molding of plate 1600 is made.
In S02 step, two sliding stop blocks 1300 are provided and are respectively arranged in two channels 1120.Referring to FIG. 9, being to retouch
Draw the cunning stop block 1300 that S03 step is completed in present embodiment.Wherein, fluid slot is divided into elastic device sky by sliding stop block 1300
Between 1130 and heat-conducting fluid space 1140.
In S03 step, two elastic devices 1200 are provided and are respectively arranged in two channels 1120.Referring to FIG. 10,
Depicting the elastic device 1200 that S03 step is completed in present embodiment is spring.Wherein, the affixed side of elastic device 1200
1210 are respectively engaged to the engagement side wall 1121 of channel 1120.Optionally, elastic device 1200 of the invention can also be other
Made by flexible material, such as use elastic device made of rubber material.
In S04 step, the cover board 1400 with opening 1410 is provided.Figure 11 is please referred to, is to depict this embodiment party
The cover board 1400 that S03 step is completed in formula is arranged above fluid slot 1100.
In S05 step, a heat-conducting fluid is provided, is set in heat-conducting fluid space 1140.It is preferred that thermally conductive stream
Body is as made by 3~6W/m DEG C of thermal coefficient of material.
In S06 step, a heat conducting module 1500 is provided.Fig. 3 and Fig. 4 is please referred to, is to depict S06 in present embodiment
The dynamic pressure module 1000 that step is completed.Wherein, Fig. 4 is the side AA along Fig. 3 of dynamic pressure module 1000 in present embodiment
To sectional view, when heat conducting module 1500 is set in fluid slot 1100, the setting face 1520 of heat conducting module 1500 passes through lid
The opening 1410 of plate 1400 is contacted with heat-conducting fluid, and the binding face 1510 of heat conducting module 1500 is set to outside fluid slot 1100,
To be fitted closely with electronic component formation.Optionally, the present invention can further provide for a thermally conductive sheet, be set to the fitting
On face 1510, to fill up the gap of binding face 1510 Yu electronic component.It is preferred that when binding face 1510 is formed with electronic component
When fitting closely, setting face 1520 is bonded with the bottom surface of fluid slot 1100, so that shape between setting face 1520 and the bottom surface of fluid slot
At preferable thermally conductive pathways.
Via dynamic pressure module made of method of the invention, it is able to be bonded an electronic component in heat conducting module 1500
When, by movable property of the heat conducting module 1500 in fluid slot 1100, a buffer function is provided, avoids electronic component because of group
The vibration after force or assembling when dress and be damaged, and simplify the work for needing to design different heat conducting modules for different electronic components
Skill.
After the preferred embodiment that the present invention will be described in detail, being familiar with this skilled worker can be apparent from, and not taken off
Various change can be carried out under range and spirit from claims of the present invention and is changed, and the present invention is also not only restricted to specification
The embodiment of middle illustrated embodiment.
Claims (11)
1. a kind of dynamic pressure module, which is characterized in that the dynamic pressure module includes:
One fluid slot, has one side wall and at least two channels, and at least two channel is respectively provided with an engagement side wall；
At least two elastic devices, be respectively arranged at least two channel and have an affixed side, described at least two
The affixed side of elastic device is respectively engaged to the engagement side wall of at least two channel；
At least two sliding stop blocks, are set at least two channel, and be respectively engaged at least two elastic device
Relative to the side of the affixed side, wherein the fluid slot is divided at least two elastic devices by described at least two sliding stop blocks
Space and a heat-conducting fluid space；
One cover board is set to above the fluid slot and has an opening；
One heat-conducting fluid is set in the heat-conducting fluid space；And
One heat conducting module includes:
One setting face, is set in the fluid slot, and contact with the heat-conducting fluid by the opening of the cover board；With
And
One binding face, relative to the setting face, the binding face is set to side of the cover board relative to the fluid slot,
To be fitted closely with electronic component formation,
Wherein, the heat conducting module when moving on the vertical binding face direction, apply towards the heat-conducting fluid by the setting
With an active force, and at least two elastic device is set by described at least two sliding stop blocks and the heat-conducting fluid to described
The face of setting imposes a reaction force, and the setting face is maintained an equilbrium position on the direction of the vertical binding face.
2. dynamic pressure module according to claim 1, which is characterized in that the heat-conducting fluid is existed by thermal coefficient range
3~6W/m DEG C of material is constituted.
3. dynamic pressure module according to claim 1, which is characterized in that at least two elastic device is spring.
4. dynamic pressure module according to claim 1, which is characterized in that the dynamic pressure module includes one thermally conductive
Piece is set to the binding face of the heat conducting module, to fill up the gap of the binding face Yu the electronic component.
5. dynamic pressure module according to claim 1, which is characterized in that the heat conducting module and the electronic component shape
When at fitting closely, the bottom surface of the setting face and the fluid slot, which is formed, to be fitted closely.
6. a kind of dynamic pressure module manufacturing methods, which is characterized in that the dynamic pressure module manufacturing methods include:
One heat-conducting plate is provided；
Making a fluid slot on the heat-conducting plate, the fluid slot has one side wall and at least two channels, and described at least two
A channel is respectively provided with an engagement side wall；
At least two elastic devices are set, are respectively correspondingly set at least two channel, at least two elasticity
Device is respectively provided with the engagement side wall that an affixed side is bonded at least two channel；
The sliding stop block of setting at least two, it is opposite to be respectively engaged at least two elastic device at least two channel
In the side of the affixed side, wherein the fluid slot is divided at least two elastic device spaces by described at least two sliding stop blocks
An and heat-conducting fluid space；
One cover board is set above the fluid slot, and the cover board has an opening；
A heat-conducting fluid is set in the heat-conducting fluid space；And
One heat conducting module is set, and the heat conducting module is set to the stream by the opening of the cover board comprising a setting face
It in body slot, and is contacted with the heat-conducting fluid, the heat conducting module further includes a binding face and is set to the cover board relative to institute
The side of fluid slot is stated, to be fitted closely with electronic component formation,
Wherein, the heat conducting module when moving on the vertical binding face direction, apply towards the heat-conducting fluid by the setting
With an active force, and at least two elastic device is set by described at least two sliding stop blocks and the heat-conducting fluid to described
The face of setting imposes a reaction force, and the setting face is maintained an equilbrium position on the direction of the vertical binding face.
7. dynamic pressure module manufacturing methods according to claim 6, which is characterized in that the fluid slot with it is described thermally conductive
Plate is integrally formed completion.
8. dynamic pressure module manufacturing methods according to claim 6, which is characterized in that the heat-conducting fluid is by thermally conductive system
Number ranges are made by 3~6W/m DEG C of the material.
9. dynamic pressure module manufacturing methods according to claim 6, which is characterized in that at least two elastic device
It is made of with spring.
10. dynamic pressure module manufacturing methods according to claim 6, which is characterized in that the dynamic pressure module
Manufacturing method further include: further one thermally conductive sheet of setting is on the binding face of the heat conducting module, to fill up the patch
The gap in conjunction face and the electronic component.
11. dynamic pressure module manufacturing methods according to claim 6, which is characterized in that the binding face and the electricity
When subcomponent formation fits closely, the setting face is bonded with the bottom surface of the fluid slot.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510143512.8A CN106155183B (en) | 2015-03-30 | 2015-03-30 | Dynamic pressure module and its manufacturing method |
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| CN201510143512.8A CN106155183B (en) | 2015-03-30 | 2015-03-30 | Dynamic pressure module and its manufacturing method |
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| CN106155183B true CN106155183B (en) | 2019-07-19 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW280088B (en) * | 1994-04-11 | 1996-07-01 | Minnesota Mining & Mfg | |
| CN2480986Y (en) * | 2001-05-29 | 2002-03-06 | 台达电子工业股份有限公司 | Chip heat conduction and sink module |
| CN2552065Y (en) * | 2002-04-06 | 2003-05-21 | 富士康(昆山)电脑接插件有限公司 | Radiator fixer |
| CN102065666A (en) * | 2009-11-12 | 2011-05-18 | 富准精密工业(深圳)有限公司 | Heat dissipating device |
| CN102131371A (en) * | 2010-11-11 | 2011-07-20 | 华为技术有限公司 | Heat-conducting device and electronic device using same |
| TWI347826B (en) * | 2008-01-24 | 2011-08-21 | Raydium Semiconductor Corp | Cooling module and electronic device using the same |
| CN203982299U (en) * | 2014-07-14 | 2014-12-03 | 深圳市兴森快捷电路科技股份有限公司 | A kind of radiator structure, radiating module and cooling cabinet |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5082970B2 (en) * | 2008-03-25 | 2012-11-28 | 富士通株式会社 | Circuit board equipment |
-
2015
- 2015-03-30 CN CN201510143512.8A patent/CN106155183B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW280088B (en) * | 1994-04-11 | 1996-07-01 | Minnesota Mining & Mfg | |
| CN2480986Y (en) * | 2001-05-29 | 2002-03-06 | 台达电子工业股份有限公司 | Chip heat conduction and sink module |
| CN2552065Y (en) * | 2002-04-06 | 2003-05-21 | 富士康(昆山)电脑接插件有限公司 | Radiator fixer |
| TWI347826B (en) * | 2008-01-24 | 2011-08-21 | Raydium Semiconductor Corp | Cooling module and electronic device using the same |
| CN102065666A (en) * | 2009-11-12 | 2011-05-18 | 富准精密工业(深圳)有限公司 | Heat dissipating device |
| CN102131371A (en) * | 2010-11-11 | 2011-07-20 | 华为技术有限公司 | Heat-conducting device and electronic device using same |
| CN203982299U (en) * | 2014-07-14 | 2014-12-03 | 深圳市兴森快捷电路科技股份有限公司 | A kind of radiator structure, radiating module and cooling cabinet |
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| Publication number | Publication date |
|---|---|
| CN106155183A (en) | 2016-11-23 |
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