CN106153988A - Contact conducting structure, contact conducting device and plate are to board test device - Google Patents
Contact conducting structure, contact conducting device and plate are to board test device Download PDFInfo
- Publication number
- CN106153988A CN106153988A CN201610480194.9A CN201610480194A CN106153988A CN 106153988 A CN106153988 A CN 106153988A CN 201610480194 A CN201610480194 A CN 201610480194A CN 106153988 A CN106153988 A CN 106153988A
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- Prior art keywords
- contact conducting
- conductor
- electric
- plate
- installed part
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The present invention open one contact conducting structure, contact conducting device and plate are to board test device, wherein, described contact conducting structure includes multiple onunit, each onunit includes two electric-conductors and installed part, described electric-conductor has the first end turned on the printed circuit board (PCB) of board test device with described plate and the second end with circuit board under test conducting, and described in the two of each described onunit, the second end of electric-conductor is set in distance；Described installed part has the die cavity fixedly mounting described electric-conductor, and multiple described installed part stackings are fixed, so that multiple onunit forms feed-through assembly.Technical solution of the present invention is by using contact conducting structure so that carries out dismounting according to the practical situation of PIN number and centre-to-centre spacing and adjusts, and then reduces production cost, improves service life and test accuracy rate.
Description
Technical field
The present invention relates to circuit board testing technical field, particularly to one contact conducting structure, contact conducting device and
Plate is to board test device.
Background technology
It is typically all to use probe that the most current plate connects (Board To Board Connector) test device to plate
Structure carries out contact conducting, concrete, arranges in installation frame according to PIN number and centre-to-centre spacing, then will insert in this installation frame
Entering probe structure, this probe structure typically uses POGO PIN probe, installation frame is fixed on after allowing base and gland is formed
Quick clip between, be generally wholely set and can not be split.But, use CNC to add according to fixing PIN number and centre-to-centre spacing
Work corresponding hole site, its long processing time, particularly below 0.35mm high-precision product precision not can fully ensure that, and processes report
Useless rate is high, there is cost of manufacture high, and precision exists certain error, leads as contact conducting additionally, due to using POGO PIN probe
Body so that the problems such as whole product use cost is high, the life-span is low, test accuracy rate is low exist.
Summary of the invention
The main object of the present invention is to provide a kind of contact conducting structure, it is intended to make basis by this contact conducting structure
The practical situation of PIN number and centre-to-centre spacing carries out dismounting and adjusts, and then reduces production cost, improves service life with test accurately
Rate.
For achieving the above object, the contact conducting structure that the present invention proposes, it is applied to plate and board test device, described contact are led
Logical structure includes that multiple onunit, each onunit include two electric-conductors and installed part,
Described electric-conductor has the first end and and circuit under test turned on the printed circuit board (PCB) of board test device with described plate
Second end of plate conducting, the second end of electric-conductor described in the two of each described onunit is set in distance；
Described installed part has the die cavity fixedly mounting described electric-conductor, and multiple described installed part stackings are fixed, so that many
Individual onunit forms feed-through assembly.
Alternatively, described installed part is formed in one setting.
Alternatively, described installed part includes the first installing plate and the second installing plate, described first installing plate and described second
Installing plate is equipped with described die cavity, and electric-conductor described in two is respectively arranged in corresponding die cavity, described first installing plate and
Described second installing plate connects by connecting plate is fixing.
Alternatively, described contact conducting structure also includes fixedly mounting structure, and described fixed installation structure includes at least two
Clamping plate and at least one connecting rod, Boards wall described in two is installed on the two ends of described feed-through assembly, and each described installed part is all provided with
Having installing hole, described connecting rod passes described installing hole, and the two ends of described connecting rod are individually fixed in clamping plate described in two.
Alternatively, described electric-conductor has the linkage section between described first end and described second end, described connection
Section has multiple bending.
Alternatively, the second end of each described electric-conductor is respectively provided with two conductive base pins, and conductive base pin described in two is that interval sets
Put.
Alternatively, the wedge shaped setting of free end of described conductive base pin, described in the two of the second end of each described electric-conductor
Arrange in enlarging shape between conductive base pin.
The present invention also proposes a kind of contact conducting device, is applied to plate and board test device, contact conducting device are included contact
Conducting structure；
Described contact conducting structure includes that multiple onunit, each onunit include two electric-conductors and installed part,
Described electric-conductor has the first end and and circuit under test turned on the printed circuit board (PCB) of board test device with described plate
Second end of plate conducting, the second end of electric-conductor described in the two of each described onunit is set in distance；
Described installed part has the die cavity fixedly mounting described electric-conductor, and multiple described installed part stackings are fixed, so that many
Individual onunit forms feed-through assembly.
Alternatively, described contact conducting device also includes fixing seat, and described fixing seat is provided with storage tank, and described contact turns on
Structure is placed in described storage tank；
Being provided with pressing plate on described fixing seat, the surface deviating from described fixing seat of described pressing plate is arranged with test trough, institute
The diapire stating test trough offers the through hole that the second end for described electric-conductor passes, and described circuit board under test is placed in described survey
Experimental tank, and with described electric-conductor second end conducting.
Alternatively, being provided with positioning bar in described storage tank, described positioning bar houses along the notch of described storage tank to described
The diapire of groove is extended；
The side of described installed part is provided with groove, and described positioning bar is held in described groove.
Alternatively, described fixing seat includes that base station and upper cover, described storage tank are located at described base station, described on be covered with
The via of described test trough coupling, described base station and described upper cover are fixing to be connected, described pressing plate be located at described base station and described on
Between lid,
The plate face towards described fixing seat of described pressing plate is provided with locating dowel, and described base station offers accommodating described locating dowel
Hole, location；Described base station is further opened with blind hole, is provided with spring in described blind hole, and one end of described spring is supported with described pressing plate
Connecing, the other end abuts with the diapire of described blind hole.
The present invention also proposes a kind of plate to board test device, and including described contact conducting device, contact conducting device includes
Contact conducting structure；
Described contact conducting structure includes that multiple onunit, each onunit include two electric-conductors and installed part,
Described electric-conductor has the first end and and circuit under test turned on the printed circuit board (PCB) of board test device with described plate
Second end of plate conducting, the second end of electric-conductor described in the two of each described onunit is set in distance；
Described installed part has the die cavity fixedly mounting described electric-conductor, and multiple described installed part stackings are fixed, so that many
Individual onunit forms feed-through assembly.
Alternatively, plate board test device is included base and and gland, described base is convexly equipped with two installation portions, described in two pacify
Dress portion is located at the both sides of described base relatively, and the dual-side of described gland is rotationally connected with installation portion described in two, with in described pressure
One end of lid and described base forms crimping space；
Described floor installation has printed circuit board (PCB), and one end being positioned at described crimping space of described printed circuit board (PCB) is provided with survey
Trying contact, the other end is provided with adaptor connector；
Described contact conducting device is fixed on described printed circuit board (PCB), and is positioned at described crimping space, described electric-conductor
First end turns on described test contact point.
Alternatively, being additionally provided with stage clip between described gland and described installation portion, described stage clip is away from described contact conducting dress
Install.
Technical solution of the present invention is by using contact conducting structure so that enter according to the practical situation of PIN number and centre-to-centre spacing
Row dismounting adjusts, and then reduces production cost, improves service life and test accuracy rate.
Concrete, by forming die cavity in installed part, electric-conductor being arranged in die cavity, the first end of electric-conductor passes die cavity
And with plate, the printed circuit board (PCB) of board test device is turned on, the second end of electric-conductor is led through die cavity and circuit board under test
Logical.According to the spacing distance between the second end of center distance regulation to be measured two electric-conductor of circuit board under test, and then it can be made to fit
Join centre-to-centre spacing to be measured.The quantity of onunit can be set according to the PIN number of circuit board under test, such as, when needs PIN number is 10
Time, 10 onunits are set, carry out stacking and assemble.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to
Other accompanying drawing is obtained according to the structure shown in these accompanying drawings.
Fig. 1 is the plate of the present invention decomposition texture schematic diagram to board test device one embodiment；
Fig. 2 is the structural representation to board test device test circuit board under test of the plate in Fig. 1；
Fig. 3 is the decomposition texture schematic diagram of contact conducting structure one embodiment in Fig. 1；
Fig. 4 is the structural representation of an embodiment of electric-conductor in Fig. 3；
Fig. 5 is the structural representation of the second embodiment of the contact conducting structure in Fig. 1；
Fig. 6 is the combinative structure schematic diagram of the contact conducting device in Fig. 5；
Fig. 7 is the part-structure decomposition texture schematic diagram of the contact conducting device in Fig. 5；
Fig. 8 is the decomposition texture schematic diagram of an embodiment of the contact conducting device in Fig. 1；
Fig. 9 is the combinative structure schematic diagram of the contact conducting device in Fig. 8.
Drawing reference numeral illustrates:
| Label | Title | Label | Title |
| 100 | Plate is to board test device | 201a | Blind hole |
| 10 | Contact conducting structure | 202 | Upper cover |
| 11 | Onunit | 202a | Via |
| 12 | Electric-conductor | 211 | Storage tank |
| 121 | First end | 211a | Positioning bar |
| 122 | Second end | 212 | Hole, location |
| 122a | Conductive base pin | 213 | Spring |
| 123 | Linkage section | 22 | Pressing plate |
| 13 | Installed part | 221 | Test trough |
| 13a | Groove | 222 | Locating dowel |
| 130 | Die cavity | 30 | Base |
| 131 | First installing plate | 31 | Installation portion |
| 132 | Second installing plate | 40 | Gland |
| 14 | Fixed installation structure | 50 | Printed circuit board (PCB) |
| 141 | Clamping plate | 51 | Adaptor connector |
| 142 | Connecting rod | 60 | Stage clip |
| 143 | Connecting plate | 200 | Circuit board under test |
| 20 | Contact conducting device | 201 | Base station |
| 21 | Fixing seat |
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further referring to the drawings.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Base
Embodiment in the present invention, those of ordinary skill in the art obtained under not making creative work premise all its
His embodiment, broadly falls into the scope of protection of the invention.
It is to be appreciated that directional instruction in the embodiment of the present invention (such as up, down, left, right, before and after ...) is only used
In explaining relative position relation between each parts, motion conditions etc. under a certain particular pose (as shown in drawings), if should
When particular pose changes, then directionality instruction changes the most therewith.
It addition, the description relating to " first ", " second " etc. in the present invention is only used for describing purpose, and it is not intended that refer to
Show or imply its relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", "
Two " feature can express or implicitly include at least one this feature.It addition, the technical scheme between each embodiment can
To be combined with each other, but must be based on those of ordinary skill in the art are capable of, when the combination of technical scheme occurs
Conflicting will be understood that the combination of this technical scheme does not exists, the most not at the protection model of application claims when maybe cannot realize
Within enclosing.
The present invention proposes a kind of contact conducting structure 10.
Referring to figs. 1 through 3, in embodiments of the present invention, this contact conducting structure 10, it is applied to plate to board test device 100, institute
State contact conducting structure 10 and include that multiple onunit 11, each onunit 11 include two electric-conductors 12 and installed part 13,
Described electric-conductor 12 have the first end 121 printed circuit board (PCB) 50 of board test device 100 turned on described plate and
With the second end 122 of circuit board under test 200 conducting, the second end 122 of electric-conductor 12 described in the two of each described onunit 11
It is set in distance；
Described installed part 13 has the die cavity 130 fixedly mounting described electric-conductor 12, and the stacking of multiple described installed part 13 is solid
It is fixed, so that multiple onunit 11 forms feed-through assembly (sign).
Technical solution of the present invention is by using contact conducting structure 10 so that according to PIN number and the practical situation of centre-to-centre spacing
Carry out dismounting to adjust, and then reduce production cost, improve service life and test accuracy rate.
Concrete, form die cavity 130 by installed part 13, electric-conductor 12 is arranged in die cavity 130, the of electric-conductor 12
The printed circuit board (PCB) 50 of board test device 100 is turned on plate by one end 121 through die cavity 130, and the second end 122 of electric-conductor 12 is worn
Cross die cavity 130 and and turn between circuit board under test 200.Can conduct electricity according to the center distance regulation to be measured two of circuit board under test 200
Spacing distance between second end 122 of part 12, and then make its adaptive centre-to-centre spacing to be measured.Can be according to the PIN of circuit board under test 200
Number arranges the quantity of onunit 11, such as, when needs PIN number is 10, arranges 10 onunits 11, carries out stacking assembling
?.
With reference to Fig. 3 to Fig. 4, in embodiments of the invention one: described installed part 13 is formed in one setting.That is, adopt
With one piece of installing plate, inside arranges two independent die cavities 130 and carries out installing two electric-conductors 12, is thusly-formed an onunit
11, then multiple onunits 11 are carried out stacking, forms feed-through assembly.Namely turned on by the installing plate stratification of a group
Assembly.
Further combined with reference to Fig. 5 to Fig. 7, in embodiments of the invention two: described installed part 13 includes the first installation
Plate 131 and the second installing plate 132, described first installing plate 131 and described second installing plate 132 be equipped with described die cavity 130, and two
Described electric-conductor 12 is respectively arranged in corresponding die cavity 130, described first installing plate 131 and described second installing plate
132 connect by connecting plate 143 is fixing.
That is, arrange the first installing plate 131 and the second installing plate 132, at the first installing plate 131 and the second installing plate 132
Inside it is respectively provided with die cavity 130, in each die cavity 130, is all equiped with electric-conductor 12.Then by multiple first installing plate 131 stacking shapes
Becoming first group, band is by multiple second installing plate 132 stackings second group, and two groups are collectively forming feed-through assembly.
It is understood that above-mentioned two embodiments all can realize adjusting PIN number and centre-to-centre spacing, certainly, bag of the present invention
Containing but be not limited to this, it is also possible to be arranged to other forms and such as arrange three groups or four groups and carry out stacking, form feed-through assembly, all at this
In the protection domain of invention.Meanwhile, with reference to the embodiment one of the contact conducting structure 10 that Fig. 3 to Fig. 4 is formed, and Fig. 5 to Fig. 7
Contact conducting structure 10 embodiment two formed, can be all that single product uses.
With reference to Fig. 3 and Fig. 5, described contact conducting structure 10 also includes fixedly mounting structure 14, described fixed installation structure
14 include at least two clamping plate 141 and at least one connecting rods 142, and described in two, clamping plate 141 are fixedly installed in the two of described feed-through assembly
End, each described installed part 13 is equipped with installing hole (sign), and described connecting rod 142 is through described installing hole, described connection
The two ends of bar 142 are individually fixed in clamping plate 141 described in two.
That is, form grasping part by two clamping plate 141, installed part 13 is clamped in grasping part.Pass through connecting rod
Each installed part 13 is gone here and there together by 142, so, can install installed part 13 simply and easily.
Certainly, for embodiment one, can be installed, for embodiment two, by four clamping plate by two clamping plate 141
141 install, and the quantity of connecting rod 142 may be configured as one or more.
With reference to Fig. 4, in the present embodiment, described electric-conductor 12 has and is positioned at described first end 121 and described second end 122
Between linkage section 123, described linkage section 123 has multiple bending.
So, this linkage section 123 arranges multiple bending, and the electric-conductor 12 that can make has elasticity, the of crimping electric-conductor 12
One end 121 and the second end 122, electric-conductor 12 can produce deformation, and then make with circuit board under test 200 and printed circuit board (PCB) 50 it
Between turn on more stable.
Further, the second end 122 of each described electric-conductor 12 is respectively provided with two conductive base pin 122a, and described in two, conduction is inserted
Foot 122a is set in distance.
Arranging two conductive base pin 122a, when can prevent the wherein conductive base pin 122a from occurring damaging, whole device is forced
It is replaced, extends the service life of electric-conductor 12.
Further, the wedge shaped setting of free end of described conductive base pin 122a, the second end of each described electric-conductor 12
Arrange in enlarging shape between conductive base pin 122a described in the two of 122.So, the stress between the two conductive base pin 122a that can make is more
For uniformly, reduce the spoilage of electric-conductor 12.
The present invention also proposes a kind of contact conducting device 20, is applied to plate to board test device 100, incorporated by reference to Fig. 1, Fig. 2, ginseng
According to Fig. 8 and Fig. 9, contact conducting device 20 includes contacting conducting structure 10 and fixing seat 21；This contact conducting structure 10 concrete
Structure is with reference to above-described embodiment, owing to this contact conducting device 20 have employed whole technical schemes of above-mentioned all embodiments, because of
All beneficial effects that this technical scheme at least with above-described embodiment is brought, this is no longer going to repeat them.This contact is led
Exchange device 20 also can use as single product, and it is dismountable parts.
Wherein, described fixing seat 21 is provided with storage tank 211, and described contact conducting structure 10 is placed in described storage tank 211
In；
Being provided with pressing plate 22 on described fixing seat 21, the surface deviating from described fixing seat 21 of described pressing plate 22 is arranged with survey
Experimental tank 221, the diapire of described test trough 221 offers the through hole that the second end 122 for described electric-conductor 12 passes, described to be measured
Circuit board 200 is placed in described test trough 221, and turns on the second end 122 of described electric-conductor 12.
When test, being placed in test trough 221 by circuit board under test 200, circuit board under test 200 is by electric-conductor 12
With plate, the printed circuit board (PCB) 50 of board test device 100 is turned on, so, can conveniently circuit board under test 200 be tested.
With reference to Fig. 8, being provided with positioning bar 211a in described storage tank 211, described positioning bar 211a is along described storage tank 211
Notch is extended to the diapire of described storage tank 211, and the side of described installed part 13 is provided with groove 13a, described positioning bar
211a inserts described groove 13a.
When assembling, multiple installed parts 13 are installed and are easily formed dimensional tolerance, and the quantity of installed part 13 is the most, and tolerance is also got over
Greatly.Therefore, arranging positioning bar 211a in storage tank 211, the quantity of this positioning bar 211a can be one, it is also possible to for many
Individual, set according to practical situation.So, dimensional tolerance can be reduced, improve assembly precision.
With reference to Fig. 1, Fig. 2, Fig. 8 and Fig. 9, described fixing seat includes that base station 201 and upper cover 202, described storage tank 211 are located at
Described base station 201, described upper cover 202 is provided with the via 202a mated with described test trough, described base station 201 and described upper cover
202 fix connection, and described pressing plate is located between described base station 201 and described upper cover 202,
The plate face towards described base station 201 of described pressing plate 22 is provided with locating dowel 222, and described base station 201 offers accommodating
The hole, location 212 of described locating dowel 222；Described base station 201 is further opened with blind hole 201a, is provided with spring in described blind hole 201a
213, one end of described spring 213 abuts with described pressing plate 22, and the other end abuts with the diapire of described blind hole 201a.
So, when tested, circuit board under test 200 is pressed in test trough 221, at spring 213 through via 202a
In compressive state so that the second end 122 of circuit board under test 200 and electric-conductor 12 is in close contact and turning circuit, and then make to survey
The precision of examination increases.
The present invention also proposes a kind of plate to board test device 100, with reference to Fig. 1, Fig. 2, Fig. 8 and Fig. 9, leads including described contact
Exchange device 20, base 30 and gland 40, the concrete structure of this contact conducting device 20 is with reference to above-described embodiment, due to this plate
Board test device 100 be have employed whole technical schemes of above-mentioned all embodiments, the most at least there is the technology of above-described embodiment
All beneficial effects that scheme is brought, this is no longer going to repeat them.
Wherein, described base 30 is convexly equipped with two installation portions 31, and installation portion 31 described in two is located at the two of described base 30 relatively
Side, the dual-side of described gland 40 is rotationally connected with installation portion 31 described in two, with in described gland 40 and the one of described base 30
End forms crimping space；
Described base 30 is provided with printed circuit board (PCB) 50, one end being positioned at described crimping space of described printed circuit board (PCB) 50
Being provided with test contact point, the other end is provided with adaptor connector 51；
Described contact conducting device 20 is fixed on described printed circuit board (PCB) 50, and is positioned at described crimping space, described conduction
First end 121 of part 12 turns on described test contact point.
Wherein, being additionally provided with stage clip 60 between described gland 40 and described installation portion 31, described stage clip 60 is away from described contact
Conducting device 20 is arranged.Arrange spring 213 make between gland 40 with circuit board under test 200 contact the tightst.
When test, depressing gland 40, the space that crimps between gland 40 with base 30 increases, by circuit board under test 200
Being placed in the test trough 221 in crimping space, then unclamp gland 40, circuit board under test 200 is pressed by gland 40 with electric-conductor 12
Tightly so that whole plate is in the conduction state to board test device 100, adaptor connector 51 connects with external test facility, will test
Signal passes to test instrunment, completes test.
The foregoing is only the preferred embodiments of the present invention, not thereby limit the scope of the claims of the present invention, every at this
Under the inventive concept of invention, utilize the equivalent structure transformation that description of the invention and accompanying drawing content are made, or directly/indirectly use
The technical field relevant at other is included in the scope of patent protection of the present invention.
Claims (14)
1. a contact conducting structure, is applied to plate to board test device, it is characterised in that described contact conducting structure includes multiple
Onunit, each onunit includes two electric-conductors and installed part,
Described electric-conductor has the first end turned on the printed circuit board (PCB) of board test device with described plate and leads with circuit board under test
The second logical end, the second end of electric-conductor described in the two of each described onunit is set in distance；
Described installed part has the die cavity fixedly mounting described electric-conductor, and multiple described installed part stackings are fixed, and lead so that multiple
Logical unit forms feed-through assembly.
Contact conducting structure the most as claimed in claim 1, it is characterised in that described installed part is formed in one setting.
Contact conducting structure the most as claimed in claim 1, it is characterised in that described installed part includes the first installing plate and second
Installing plate, described first installing plate and described second installing plate be equipped with described die cavity, electric-conductor described in two be respectively arranged at
In the die cavity of its correspondence, described first installing plate and described second installing plate connect by connecting plate is fixing.
Contact conducting structure the most as claimed in claim 1, it is characterised in that described contact conducting structure also includes fixed installation
Structure, described fixed installation structure includes at least two clamping plate and at least one connecting rod, Boards wall described in two be installed on described in lead
The two ends of logical assembly, each described installed part is equipped with installing hole, and described connecting rod passes described installing hole, described connecting rod
Two ends are individually fixed in clamping plate described in two.
5. the contact conducting structure as described in arbitrary in Claims 1-4, it is characterised in that described electric-conductor has and is positioned at institute
Stating the linkage section between the first end and described second end, described linkage section has multiple bending.
Contact conducting structure the most as claimed in claim 5, it is characterised in that the second end of each described electric-conductor is respectively provided with two
Conductive base pin, described in two, conductive base pin is set in distance.
Contact conducting structure the most as claimed in claim 6, it is characterised in that the free end of described conductive base pin is wedge shaped to be set
Put, arrange in enlarging shape between conductive base pin described in the two of the second end of each described electric-conductor.
8. a contact conducting device, it is characterised in that include that the contact as described in claim 1 to 7 arbitrary is led
Logical structure.
Contact conducting device the most as claimed in claim 8, it is characterised in that including fixing seat, described fixing seat is provided with accommodating
Groove, described contact conducting structure is placed in described storage tank；
Being provided with pressing plate on described fixing seat, the surface deviating from described fixing seat of described pressing plate is arranged with test trough, described survey
The diapire of experimental tank offers the through hole that the second end for described electric-conductor passes, and described circuit board under test is placed in described test
Groove, and with described electric-conductor second end conducting.
Contact conducting device the most as claimed in claim 8, it is characterised in that in described storage tank, be provided with positioning bar, described fixed
Position muscle is extended to the diapire of described storage tank along the notch of described storage tank；
The side of described installed part is provided with groove, and described positioning bar is held in described groove.
11. contact conducting device as claimed in claim 8, it is characterised in that described fixing seat includes base station and upper cover, described
Storage tank is located at described base station, described on be covered with the via mated with described test trough, described base station is fixed with described upper cover
Connecting, described pressing plate is located between described base station and described upper cover,
The plate face towards described fixing seat of described pressing plate is provided with locating dowel, and described base station offers determining of accommodating described locating dowel
Hole, position；Described base station is further opened with blind hole, is provided with spring in described blind hole, and one end of described spring abuts with described pressing plate, separately
One end abuts with the diapire of described blind hole.
12. 1 kinds of plates are to board test device, it is characterised in that include the contact conducting dress as described in arbitrary in claim 8 to 11
Put.
13. plates as claimed in claim 12 are to board test device, it is characterised in that described plate board test device is also included base and
Gland；
Described base is convexly equipped with two installation portions, and installation portion described in two is located at the both sides of described base, the both sides of described gland relatively
While be rotationally connected with installation portion described in two, to form crimping space in one end of described gland and described base；
Described floor installation has printed circuit board (PCB), and one end being positioned at described crimping space of described printed circuit board (PCB) is provided with test and connects
Contact, the other end is provided with adaptor connector；
Described contact conducting device is fixed on described printed circuit board (PCB), and is positioned at described crimping space, the first of described electric-conductor
End turns on described test contact point.
14. plates as claimed in claim 13 are to board test device, it is characterised in that also set between described gland and described installation portion
Having stage clip, described stage clip is arranged away from described contact conducting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610480194.9A CN106153988A (en) | 2016-06-24 | 2016-06-24 | Contact conducting structure, contact conducting device and plate are to board test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610480194.9A CN106153988A (en) | 2016-06-24 | 2016-06-24 | Contact conducting structure, contact conducting device and plate are to board test device |
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| Publication Number | Publication Date |
|---|---|
| CN106153988A true CN106153988A (en) | 2016-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610480194.9A Pending CN106153988A (en) | 2016-06-24 | 2016-06-24 | Contact conducting structure, contact conducting device and plate are to board test device |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI633310B (en) * | 2018-02-22 | 2018-08-21 | 致茂電子股份有限公司 | Clamping-type probe assembly |
| CN108614185A (en) * | 2018-05-28 | 2018-10-02 | 格力电器（郑州）有限公司 | A kind of anti-inserted test device of needle stand and ICT tester and its application method |
| CN109061238A (en) * | 2018-08-10 | 2018-12-21 | 武汉精测电子集团股份有限公司 | A kind of clamshell vertically crimps POGO conducting device |
| CN109346860A (en) * | 2018-09-27 | 2019-02-15 | 东莞市荣享电子科技有限公司 | A kind of BTB bonder terminal and BTB connector |
| CN116338364A (en) * | 2023-05-26 | 2023-06-27 | 河北北芯半导体科技有限公司 | Stacked package device testing device and testing method |
| CN117452117A (en) * | 2023-11-21 | 2024-01-26 | 荣耀终端有限公司 | Test device |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI633310B (en) * | 2018-02-22 | 2018-08-21 | 致茂電子股份有限公司 | Clamping-type probe assembly |
| CN108614185A (en) * | 2018-05-28 | 2018-10-02 | 格力电器（郑州）有限公司 | A kind of anti-inserted test device of needle stand and ICT tester and its application method |
| CN108614185B (en) * | 2018-05-28 | 2024-04-09 | 格力电器（郑州）有限公司 | Needle seat reverse plug testing device, ICT tester and use method thereof |
| CN109061238A (en) * | 2018-08-10 | 2018-12-21 | 武汉精测电子集团股份有限公司 | A kind of clamshell vertically crimps POGO conducting device |
| CN109061238B (en) * | 2018-08-10 | 2023-10-10 | 武汉精测电子集团股份有限公司 | Flip type vertical compression joint POGO conduction device |
| CN109346860A (en) * | 2018-09-27 | 2019-02-15 | 东莞市荣享电子科技有限公司 | A kind of BTB bonder terminal and BTB connector |
| CN109346860B (en) * | 2018-09-27 | 2020-07-07 | 东莞市荣享电子科技有限公司 | BTB connector terminal and BTB connector |
| CN116338364A (en) * | 2023-05-26 | 2023-06-27 | 河北北芯半导体科技有限公司 | Stacked package device testing device and testing method |
| CN117452117A (en) * | 2023-11-21 | 2024-01-26 | 荣耀终端有限公司 | Test device |
| CN117452117B (en) * | 2023-11-21 | 2024-04-19 | 荣耀终端有限公司 | Test device |
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