CN106147702B - Wave-absorbing composite material and preparation method thereof - Google Patents
Wave-absorbing composite material and preparation method thereof Download PDFInfo
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- CN106147702B CN106147702B CN201510159118.3A CN201510159118A CN106147702B CN 106147702 B CN106147702 B CN 106147702B CN 201510159118 A CN201510159118 A CN 201510159118A CN 106147702 B CN106147702 B CN 106147702B
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Abstract
The invention provides a wave-absorbing composite material and a manufacturing method thereof. The wave-absorbing composite material provided by the invention not only has good broadband wave-absorbing characteristic, but also can be suitable for environments with damp heat, high temperature and certain bearing requirements.
Description
Technical Field
The invention relates to a wave-absorbing material, in particular to a wave-absorbing composite material.
Background
The traditional single wave-absorbing coating has the limitations of limited wave-absorbing frequency band, low efficiency, large weight, poor temperature resistance and the like, at present, most of the wave-absorbing materials in the prior art are foam wave-absorbing materials prepared from open-cell polyurethane foam, and although the wave-absorbing materials have the characteristics of light weight, wide frequency band, good low-frequency performance and the like, the open-cell foam of the wave-absorbing materials has no hardness and can not be applied to any environment with bearing requirements.
In view of the above, there is an urgent need for a lightweight foam wave-absorbing material with broadband wave-absorbing characteristics, environmental load-bearing performance requirements and temperature performance requirements.
Disclosure of Invention
The invention provides a wave-absorbing composite material, aiming at the problems that the wave-absorbing material with broadband wave-absorbing property in the prior art cannot simultaneously have certain mechanical property and can be suitable for damp-heat and high-temperature environments.
According to one aspect of the invention, the wave-absorbing composite material comprises at least one layer of foam board and at least one layer of wave-absorbing electromagnetic film, wherein the foam board and the wave-absorbing electromagnetic film are alternately laid together, and the foam board is a closed-cell foam board.
In the above wave-absorbing composite material, preferably, the foam sheet comprises Polymethacrylimide (PMI) foam, Polyurethane (PU) foam, Polystyrene (PS) foam or polypropylene (PP) foam.
In the wave-absorbing composite material, the aperture of the closed-cell foam plate is preferably 10-50 microns.
In the wave-absorbing composite material, preferably, the wave-absorbing electromagnetic film comprises conductive fibers.
In the wave-absorbing composite material, the conductive fibers preferably comprise chopped carbon fibers or metal fibers.
In the wave-absorbing composite material, the length of the conductive fiber is preferably 0.1 mm-2 mm.
In the wave-absorbing composite material, the conductive fiber preferably accounts for 0.5-2% of the wave-absorbing electromagnetic film.
In the wave-absorbing composite material, preferably, an adhesive film is applied to the surface of the wave-absorbing electromagnetic film.
In the wave-absorbing composite material, the thickness of the adhesive film is preferably 0.1 mm.
In the wave-absorbing composite material, preferably, the adhesive film comprises a thermosetting adhesive film or a hot-melt adhesive film.
In the wave-absorbing composite material, preferably, the adhesive film comprises a polyamide adhesive film, a polyether sulfone resin adhesive film, a propylene oxide adhesive film or an acrylic adhesive film.
In the wave-absorbing composite material, preferably, the wave-absorbing electromagnetic film further comprises an epoxy resin adhesive film, a polyurethane adhesive film, a silica gel film or a chloroprene rubber adhesive film.
In the wave-absorbing composite material, preferably, the thickness of each layer of foam plate is 4 mm.
In the wave-absorbing composite material, preferably, the thickness of each wave-absorbing electromagnetic film is 0.1 mm.
According to another aspect of the invention, a method for manufacturing a wave-absorbing composite material is provided, which comprises the steps of preparing a wave-absorbing electromagnetic film; applying a glue film on the surface of the wave-absorbing electromagnetic film; alternately laying at least one layer of foam plate and at least one layer of wave-absorbing electromagnetic film together; and hot-press forming to obtain the wave-absorbing composite material, wherein the foam board is a closed-cell foam board.
In the manufacturing method of the wave-absorbing composite material, the foam plate comprises Polymethacrylimide (PMI) foam, Polyurethane (PU) foam, Polystyrene (PS) foam or polypropylene (PP) foam.
In the manufacturing method of the wave-absorbing composite material, the wave-absorbing electromagnetic film is prepared by the conductive fiber and the epoxy resin adhesive film by adopting a spraying method.
In the manufacturing method of the wave-absorbing composite material, the conductive fiber comprises short carbon fiber or metal fiber.
In the manufacturing method of the wave-absorbing composite material, the length of the conductive fiber is 0.1-2 mm.
In the manufacturing method of the wave-absorbing composite material, the conductive fiber accounts for 0.5-2% of the volume of the wave-absorbing electromagnetic film.
In the manufacturing method of the wave-absorbing composite material, the adhesive film is applied on the surface of the wave-absorbing electromagnetic film by adopting a layer-laying method, and the applied adhesive film is a semi-cured adhesive film.
In the manufacturing method of the wave-absorbing composite material, the thickness of the applied semi-cured adhesive film is 0.1 mm.
In the manufacturing method of the wave-absorbing composite material, the adhesive film comprises a thermosetting adhesive film or a hot-melt adhesive film.
In the manufacturing method of the wave-absorbing composite material, the adhesive film comprises a polyamide adhesive film, a polyether sulfone resin adhesive film, a propylene oxide adhesive film or an acrylic adhesive film.
In the manufacturing method of the wave-absorbing composite material, vacuum bag forming or autoclave forming is adopted to implement hot press forming.
In the manufacturing method of the wave-absorbing composite material, the thickness of each layer of foam plate is 4 mm.
In the manufacturing method of the wave-absorbing composite material, the thickness of each layer of the wave-absorbing electromagnetic film is 0.1 mm.
In the manufacturing method of the wave-absorbing composite material, the aperture of the closed-cell foam board is 10-50 microns.
The wave-absorbing composite material and the manufacturing method thereof provided by the invention are convenient to implement, and the obtained wave-absorbing composite material not only has good broadband wave-absorbing property, but also can be suitable for environments with damp heat, high temperature and certain bearing requirements.
Drawings
FIG. 1 is a schematic structural diagram of a wave-absorbing composite according to an embodiment of the invention;
FIG. 2 is a flow chart of a method of making a wave absorbing composite in accordance with an embodiment of the present invention;
Figure 3 is a result of the reflectivity measurement of the wave-absorbing composite material according to the embodiment 1 of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
Method for manufacturing wave-absorbing composite material
As shown in step S101 of fig. 2, the electromagnetic film 2 containing the wave-absorbing material is prepared (as shown in fig. 1). In step S101, the wave-absorbing electromagnetic film is prepared from conductive fibers and an epoxy resin adhesive film by a spraying method, wherein the conductive fibers account for 0.5-2% of the volume of the whole wave-absorbing electromagnetic film. The conductive fibres used are chopped carbon fibres or metal fibres having a length in the range of 0.1mm to 2mm, preferably 0.5 mm. The metal fiber can be made of conductive metal such as iron, copper, aluminum, nickel and the like. The conductive carbon fiber not only enables the wave-absorbing electromagnetic film to have wave-absorbing performance, but also contributes to the improvement of the mechanical performance of the whole wave-absorbing composite material. The adhesive film used in this step is not limited to the epoxy adhesive film, and may be a polyurethane adhesive film, a silicone adhesive film, or a neoprene adhesive film. In this step, the thickness of the prepared wave-absorbing electromagnetic film is preferably 0.1 mm.
As shown in step S103 of fig. 2, an adhesive film is applied at the surface of the wave-absorbing electromagnetic film. In step S103, a glue film is applied to the surface of the wave-absorbing electromagnetic film by a layer-by-layer method, and the applied glue film is a semi-cured glue film, so that in the subsequent step, after the glue film is laminated with the foam boards, the glue film is completely cured to bond each layer of the foam boards and the wave-absorbing electromagnetic film together. And the thickness of the semi-cured adhesive film applied in this step is preferably 0.1 mm. The adhesive film is a thermosetting adhesive film or a hot-melt adhesive film, such as a polyamide adhesive film, a propylene oxide adhesive film or an acrylic adhesive film.
As shown in step S105 of fig. 2, at least one foam board 1 (shown in fig. 1) and at least one wave-absorbing electromagnetic film 2 (shown in fig. 1) are alternately laid together. In step S105, the foam board is a closed-cell foam board, and the aperture of the closed-cell foam board is 10 to 50 micrometers, so that the foam board layer has good strength and can be used in an environment with certain bearing requirements. In this step S105, the closed-cell foam sheet used may be Polymethacrylimide (PMI) foam, Polyurethane (PU) foam, Polystyrene (PS) foam, or polypropylene (PP) foam. In a preferred embodiment of the invention, Polymethacrylimide (PMI) foams are used. The layer ratio of the foam plate to the wave-absorbing electromagnetic film is 1: 1. However, in other embodiments of the present invention, the ratio of the number of layers of the rigid foam board to the conductive resistor sheet is not limited to 1:1, and may also be n + 1: n (wherein, n is an integer more than or equal to 1) so as to enable the wave-absorbing composite material to achieve better wave-absorbing performance. Although only 4 layers of foam boards are shown in fig. 1, the number of layers can be designed according to the requirements of wave absorption performance in specific applications, so that the obtained wave absorbing composite material has good wave absorbing performance and appropriate thickness, for example, in a preferred embodiment, the number of layers of the used foam boards or wave absorbing electromagnetic films is 15. The thickness of the foam plate adopted is preferably 4mm, so that the final wave-absorbing composite material product has proper thickness and can maintain good mechanical properties.
And (5) performing hot-press forming to obtain the wave-absorbing composite material as shown in step S107 of figure 2. In the step, according to the type of the adhesive film selected in the step S107, the foam board and the wave-absorbing electromagnetic film are hot-pressed and molded by vacuum bag molding or autoclave molding at a temperature of 130 ℃ to 150 ℃, and the curing time is about 2 hours, so that the wave-absorbing composite material is prepared.
The manufacturing method provided by the invention is convenient to implement, and the obtained wave-absorbing composite material not only has good broadband wave-absorbing property, but also can be suitable for environments with damp heat, high temperature and certain bearing requirements.
Example 1
The wave-absorbing electromagnetic film 2 with the thickness of 0.1mm is prepared from carbon fibers and an epoxy resin adhesive film by adopting a spraying method, wherein the carbon fibers account for 1% of the volume of the wave-absorbing electromagnetic film, and the length of the carbon fibers is 0.5 mm; applying a semi-cured epoxy propane adhesive film with the thickness of 0.1mm on the surface of the wave-absorbing electromagnetic film by adopting a layer-spreading method; alternately laying 15 layers of closed-cell Polymethacrylimide (PMI) foam plates with the thickness of 4mm and 15 layers of wave-absorbing electromagnetic films with adhesive films applied to the surfaces of the layers, wherein the pore diameter of each closed-cell foam plate is 20-30 microns; and (3) carrying out hot-press molding on the closed-cell PMI foam plate and the wave-absorbing electromagnetic film by vacuum bag molding at the temperature of 130 ℃, wherein the curing time is 2 hours, so as to prepare the wave-absorbing composite material.
Example 2
Preparing a wave-absorbing electromagnetic film with the thickness of 0.1mm by using copper fibers and an epoxy resin adhesive film by adopting a spraying method, wherein the copper fibers account for 0.5 percent of the volume of the wave-absorbing electromagnetic film, and the length of the copper fibers is 0.5 mm; applying a semi-cured polyamide adhesive film with the thickness of 0.1mm on the surface of the wave-absorbing electromagnetic film by adopting a layer-laying method; alternately laying 10 layers of closed-cell Polyurethane (PU) foam boards with the thickness of 4mm and 10 layers of wave-absorbing electromagnetic films with adhesive films applied to the surfaces of the layers, wherein the pore diameter of each closed-cell foam board is 30-50 microns; and (3) hot-pressing the closed-cell PU foam board and the wave-absorbing electromagnetic film at 150 ℃ by autoclave molding, wherein the curing time is 2 hours, so as to prepare the wave-absorbing composite material.
Example 3
Preparing a wave-absorbing electromagnetic film with the thickness of 0.1mm by using copper fibers and an epoxy resin adhesive film by adopting a spraying method, wherein the copper fibers account for 0.5 percent of the volume of the wave-absorbing electromagnetic film, and the length of the copper fibers is 0.1 mm; applying a semi-cured epoxy propane adhesive film with the thickness of 0.1mm on the surface of the wave-absorbing electromagnetic film by adopting a layer-spreading method; alternately laying 12 layers of closed-cell Polyurethane (PU) foam boards with the thickness of 4mm and 12 layers of wave-absorbing electromagnetic films with adhesive films applied to the surfaces of the layers, wherein the pore diameter of each closed-cell foam board is 10-20 microns; and (3) carrying out hot-press molding on the PU foam plate with the closed pores and the wave-absorbing electromagnetic film by vacuum bag molding at the temperature of 130 ℃, wherein the curing time is 2 hours, and thus the wave-absorbing composite material is prepared.
Example 4
Preparing a wave-absorbing electromagnetic film with the thickness of 0.1mm by adopting a spraying method and using aluminum fibers and an epoxy resin adhesive film, wherein the aluminum fibers account for 2% of the volume of the wave-absorbing electromagnetic film, and the length of the aluminum fibers is 2 mm; applying a semi-cured epoxy propane adhesive film with the thickness of 0.1mm on the surface of the wave-absorbing electromagnetic film by adopting a layer-spreading method; alternately laying 1 layer of closed-cell Polystyrene (PS) foam boards and 1 layer of wave-absorbing electromagnetic film with adhesive films applied to the surfaces of the layers, wherein the pore diameter of the closed-cell foam boards is 20-30 microns; and (3) hot-pressing the closed-pore PS foam plate and the wave-absorbing electromagnetic film at 130 ℃ by vacuum bag forming for 2 hours to obtain the wave-absorbing composite material.
Example 5
Preparing a wave-absorbing electromagnetic film with the thickness of 0.1mm by adopting a spraying method and using aluminum fibers and an epoxy resin adhesive film, wherein the aluminum fibers account for 2% of the volume of the wave-absorbing electromagnetic film, and the length of the aluminum fibers is 1 mm; applying a semi-cured polyamide adhesive film with the thickness of 0.1mm on the surface of the wave-absorbing electromagnetic film by adopting a layer-laying method; alternately laying 15 layers of closed-cell Polystyrene (PS) foam boards with the thickness of 4mm and 15 layers of wave-absorbing electromagnetic films with adhesive films applied to the surfaces of the layers, wherein the pore diameter of each closed-cell foam board is 40-50 microns; and (3) carrying out hot-press molding on the closed-pore PS foam plate and the wave-absorbing electromagnetic film at 150 ℃ by vacuum bag molding, wherein the curing time is 2 hours, so as to prepare the wave-absorbing composite material.
Testing of wave absorption Properties
the wave-absorbing composite material obtained in the embodiment 1 is cut into samples with the size of 400mm × 400mm, the samples are placed between receiving and transmitting horn antennas, the reflectivity of the samples is measured in a wave-absorbing dark room by adopting an arch frame method, and the measured wave band is 1-18 GHz.
Figure 3 is a result of the reflectivity measurement of the wave-absorbing composite material according to the embodiment 1 of the invention. As shown in FIG. 3, the wave-absorbing composite material provided by the invention has good wave-absorbing performance from 3GHz to 15GHz, so that the wave-absorbing composite material provided by the invention has good mechanical performance, can be suitable for high-temperature and damp-heat environments, and also has good broadband wave-absorbing performance.
The wave-absorbing composite material provided by the invention comprises at least one layer of closed-cell foam board and at least one layer of wave-absorbing electromagnetic film containing conductive fibers, wherein the foam board and the wave-absorbing electromagnetic film are alternately paved together. The wave-absorbing composite material has good broadband wave-absorbing property, and can be applied to environments with damp heat, high temperature and certain bearing requirements.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (23)
1. A wave-absorbing composite, comprising:
At least one layer of foam board; and
At least one layer of wave-absorbing electromagnetic film,
The foam boards and the wave-absorbing electromagnetic films are alternately paved together, wherein the foam boards are closed-cell foam boards, the pore diameter of each closed-cell foam board is 10-50 microns,
The wave-absorbing electromagnetic film is prepared from conductive fibers and a first adhesive film, wherein the first adhesive film comprises an epoxy resin adhesive film, a polyurethane adhesive film, a silica gel film or a chloroprene rubber adhesive film.
2. The wave absorbing composite of claim 1 wherein the foam sheet comprises Polymethacrylimide (PMI) foam, Polyurethane (PU) foam, Polystyrene (PS) foam, or polypropylene (PP) foam.
3. The wave absorbing composite of claim 1, wherein the conductive fibers comprise chopped carbon fibers or metal fibers.
4. The wave-absorbing composite material according to claim 1, wherein the length of the conductive fiber is 0.1-2 mm.
5. The wave-absorbing composite material according to claim 1, wherein the conductive fibers account for 0.5-2% of the volume of the wave-absorbing electromagnetic film.
6. The wave-absorbing composite material according to claim 1, wherein a second glue film is applied at the surface of the wave-absorbing electromagnetic film.
7. The wave absorbing composite of claim 6, wherein the second adhesive film has a thickness of 0.1 mm.
8. A wave-absorbing composite according to claim 6 wherein the second adhesive film comprises a thermosetting adhesive film or a hot-melt adhesive film.
9. The wave-absorbing composite material according to claim 8, wherein the second adhesive film comprises a polyamide adhesive film, a polyether sulfone resin adhesive film, a propylene oxide adhesive film or an acrylic adhesive film.
10. A wave-absorbing composite according to claim 1 wherein each layer of said foam sheet has a thickness of 4 mm.
11. The wave-absorbing composite material according to claim 1, wherein the thickness of each layer of the wave-absorbing electromagnetic film is 0.1 mm.
12. A method for manufacturing a wave-absorbing composite material is characterized by comprising the following steps:
Preparing a wave-absorbing electromagnetic film;
Applying a second adhesive film on the surface of the wave-absorbing electromagnetic film;
Alternately laying at least one layer of foam plate and at least one layer of wave-absorbing electromagnetic film together; and
Hot-press forming to obtain the wave-absorbing composite material,
The wave-absorbing electromagnetic film is prepared from the conductive fibers and a first adhesive film by adopting a spraying method, wherein the foam board is a closed-cell foam board, the aperture of the closed-cell foam board is 10-50 microns, and the first adhesive film comprises an epoxy resin adhesive film, a polyurethane adhesive film, a silica gel film or a chloroprene rubber adhesive film.
13. The method of claim 12, wherein the foam sheet comprises Polymethacrylimide (PMI) foam, Polyurethane (PU) foam, Polystyrene (PS) foam, or polypropylene (PP) foam.
14. The method of claim 12, wherein the conductive fibers comprise chopped carbon fibers or metal fibers.
15. The method of claim 14, wherein the conductive fibers have a length of 0.1 to 2 mm.
16. The method of claim 12, wherein the conductive fibers comprise 0.5-2% by volume of the wave absorbing electromagnetic film.
17. The method according to claim 12, wherein applying a second glue film at the surface of the wave-absorbing electromagnetic film is performed using a layer-by-layer method, the second glue film applied being a semi-cured glue film.
18. The method according to claim 17, characterized in that the thickness of the applied semi-cured glue film is 0.1 mm.
19. The method of claim 12, wherein the second adhesive film comprises a thermosetting adhesive film or a hot melt adhesive film.
20. The method of claim 19, wherein the second adhesive film comprises a polyamide adhesive film, a polyethersulfone resin adhesive film, a propylene oxide adhesive film, or an acrylic adhesive film.
21. The method of claim 12, wherein the thermoforming is performed using vacuum bag forming or autoclave forming.
22. The method of claim 12, wherein each layer of the foam sheet has a thickness of 4 mm.
23. The method of claim 12, wherein each of the layers of the wave-absorbing electromagnetic film has a thickness of 0.1 mm.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107026329B (en) * | 2017-03-21 | 2021-06-04 | 四川九洲电器集团有限责任公司 | Luneberg lens antenna |
| CN108617160A (en) * | 2018-06-22 | 2018-10-02 | 四川大学 | A kind of absorbing material and preparation method thereof |
| CN111271527A (en) * | 2020-03-04 | 2020-06-12 | 广东宇顺新材料科技有限公司 | Carbon fiber-PMI composite pipeline and preparation method thereof |
| CN111319312A (en) * | 2020-03-04 | 2020-06-23 | 广东宇顺新材料科技有限公司 | Metal fiber-PMI composite pipeline and preparation method thereof |
| CN111516340B (en) * | 2020-07-03 | 2020-09-22 | 宁波曙翔新材料股份有限公司 | Invisible and anti-damage shielding material and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1929731A (en) * | 2006-08-30 | 2007-03-14 | 电子科技大学 | Broad band multilayer foam wave-suction material and method for making same |
| CN101552044A (en) * | 2009-04-17 | 2009-10-07 | 南京南大波平电子信息有限公司 | Electromagnetic wave absorbing material used for EMC electric wave darkroom and preparation method thereof |
| CN101700706A (en) * | 2009-11-18 | 2010-05-05 | 中南大学 | Lightweight and broadband wave absorbing material with foam sandwich structure and method for producing same |
| CN102529229A (en) * | 2010-12-21 | 2012-07-04 | 镇江育达复合材料有限公司 | Wave-absorbing polymethacrylimide (PMI) foam sandwich composite material and preparation method and use thereof |
-
2015
- 2015-04-03 CN CN201510159118.3A patent/CN106147702B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1929731A (en) * | 2006-08-30 | 2007-03-14 | 电子科技大学 | Broad band multilayer foam wave-suction material and method for making same |
| CN101552044A (en) * | 2009-04-17 | 2009-10-07 | 南京南大波平电子信息有限公司 | Electromagnetic wave absorbing material used for EMC electric wave darkroom and preparation method thereof |
| CN101700706A (en) * | 2009-11-18 | 2010-05-05 | 中南大学 | Lightweight and broadband wave absorbing material with foam sandwich structure and method for producing same |
| CN102529229A (en) * | 2010-12-21 | 2012-07-04 | 镇江育达复合材料有限公司 | Wave-absorbing polymethacrylimide (PMI) foam sandwich composite material and preparation method and use thereof |
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