CN106132095B - A kind of multi-level wiring board patch reinforcement has with smelting - Google Patents
A kind of multi-level wiring board patch reinforcement has with smelting Download PDFInfo
- Publication number
- CN106132095B CN106132095B CN201610743100.2A CN201610743100A CN106132095B CN 106132095 B CN106132095 B CN 106132095B CN 201610743100 A CN201610743100 A CN 201610743100A CN 106132095 B CN106132095 B CN 106132095B
- Authority
- CN
- China
- Prior art keywords
- positioning pin
- positioning
- wiring board
- outside
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000002787 reinforcement Effects 0.000 title claims abstract description 24
- 238000003723 Smelting Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 230000003014 reinforcing effect Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
Abstract
The invention discloses a kind of multi-level wiring board patch reinforcement smeltings to have, including cover board, wiring board and substrate, the first frame is equipped on the outside of the cover board, first frame both sides offer first positioning hole, the cover board is equipped with the first positioning pin, the second positioning pin is equipped on the outside of first positioning pin, third positioning pin is equipped on the outside of second positioning pin, the 4th positioning pin is equipped on the outside of the third positioning pin, the 5th positioning pin is equipped on the outside of 4th positioning pin, the second frame is equipped on the outside of the wiring board, the wiring board both sides offer second location hole, the substrate top is equipped with gasket, two side roof part of the substrate is equipped with positioning column.A kind of multi-level wiring board patch reinforcement smelting tool reasonable design, use is easy to operate, logical that positioning and operation, positioning pin is facilitated to be gap-matched, and adapts to different size of patch reinforcement, has very high practicability, is suitble to be widely popularized.
Description
Technical field
The present invention relates to a kind of wiring board patch, more particularly to a kind of multi-level wiring board patch reinforcement has with smelting.
Background technology
Wiring board is mainly made of pad, via, mounting hole, conducting wire, component, connector, filling, electrical boundary etc..
The stickup of the reinforcing chip of wiring board patch mostly uses greatly manual operations at present, once grips a reinforcing chip, uses artificial naked eyes
Contraposition, is affixed to the designated position on wiring board.Not only working efficiency is low for this kind of method of attaching, time-consuming, Anawgy accuracy
Also very poor.It is difficult not only gripping by hand when the reinforcing chip small volume for needing to paste, but also at all can not be accurate by naked eyes
Ground pastes designated position, and because of the different size size of wiring board, also limits the viscous of the reinforcing chip of wiring board patch
Patch, influences sticking Quality and precision.
Invention content
The main purpose of the present invention is to provide a kind of multi-level wiring board patch reinforcement smeltings to have, a kind of multi-level line
Road plate patch reinforcement has reasonable design with smelting, and use is easy to operate, can improve wiring board reinforcing paster efficiency and quality, is suitble to
It is widely popularized, can effectively solve the problems in background technology.
To achieve the above object, the technical solution that the present invention takes is：
A kind of multi-level wiring board patch reinforcement has with smelting, including cover board, wiring board and substrate, is equipped on the outside of the cover board
First frame, first frame both sides offer first positioning hole, and the cover board is equipped with the first positioning pin, and described first is fixed
Position pin outside is equipped with the second positioning pin, and third positioning pin is equipped on the outside of second positioning pin, is set on the outside of the third positioning pin
There is the 4th positioning pin, the 5th positioning pin is equipped on the outside of the 4th positioning pin, the second frame is equipped on the outside of the wiring board, it is described
Wiring board both sides offer second location hole, and the substrate top is equipped with gasket, and two side roof part of the substrate is equipped with positioning column.
Further, positioning bolt is offered in the substrate, the positioning column bottom is equipped with and positioning bolt phase interworking
The threaded hole of conjunction.
Further, first frame and the second border width size are identical, the first positioning hole and the second positioning
Hole size is identical, and corresponds.
Further, first positioning pin, the second positioning pin, third positioning pin, the 4th positioning pin and the 5th positioning pin
Respectively clearance fit.
Further, the positioning column quantity is 6, and where midpoint of 6 positioning columns on the length direction of substrate
Cross section be symmetrical arranged.
Compared with prior art, the present invention has the advantages that：A kind of multi-level wiring board patch reinforcement smelting
Has reasonable design, use is easy to operate, by fixing cover board, wiring board and substrate, positioning and operation, positioning pin is facilitated to use
Clearance fit adapts to different size of patch reinforcement, has very high practicability, greatly improves a kind of multi-level wiring board
What patch reinforcement smelting had uses functionality, ensures its using effect and utilization benefit, is suitble to be widely popularized.
Description of the drawings
Fig. 1 is a kind of covering plate structure schematic diagram of multi-level wiring board patch reinforcement smelting tool of the present invention；
Fig. 2 is a kind of main structure diagram of multi-level wiring board patch reinforcement smelting tool of the present invention；
Fig. 3 is a kind of wiring board schematic diagram of multi-level wiring board patch reinforcement smelting tool of the present invention.
In figure：1, cover board；2, the first frame；3, first positioning hole；4, the first positioning pin；5, the second positioning pin；6, third
Positioning pin；7, the 4th positioning pin；8, the 5th positioning pin；9, second location hole；10, wiring board；11, substrate；12, gasket；13, fixed
Position column；14, positioning bolt；15, the second frame.
Specific implementation mode
To make the technical means, the creative features, the aims and the efficiencies achieved by the present invention be easy to understand, with reference to
Specific implementation mode, the present invention is further explained.
As shown in Figs. 1-3, a kind of multi-level wiring board patch reinforcement has with smelting, including cover board 1, wiring board 10 and substrate
11, the outside of the cover board 1 is equipped with the first frame 2, and 2 both sides of the first frame offer first positioning hole 3, on the cover board 1
Equipped with the first positioning pin 4, the outside of first positioning pin 4 is equipped with the second positioning pin 5, and second positioning pin, 5 outside is equipped with the
Three positioning pins 6,6 outside of the third positioning pin are equipped with the 4th positioning pin 7, and 7 outside of the 4th positioning pin is equipped with the 5th positioning
Pin 8,10 outside of the wiring board are equipped with the second frame 15, and 10 both sides of the wiring board offer second location hole 9, the substrate
11 tops are equipped with gasket 12, and 11 liang of side roof parts of the substrate are equipped with positioning column 13.
Wherein, positioning bolt 14 is offered in the substrate 11,13 bottom of the positioning column is equipped with and 14 phase of positioning bolt
The threaded hole mutually coordinated.
Wherein, first frame 2 is identical with 15 width size of the second frame, and the first positioning hole 3 and second positions
9 size of hole is identical, and corresponds.
Wherein, first positioning pin 4, the second positioning pin 5, third positioning pin 6, the 4th positioning pin 7 and the 5th positioning pin 8
Respectively clearance fit.
Wherein, 13 quantity of the positioning column is 6, and midpoint institute of 6 positioning columns 13 on the length direction of substrate 11
Cross section be symmetrical arranged.
Have with smelting it should be noted that the present invention is a kind of multi-level wiring board patch reinforcement, when work, substrate 11 is set
In bottom, the second location hole 9 on wiring board 10 is placed across positioning column 13, then the first positioning hole 3 on cover board 1 is passed through
Positioning column 13 is placed on top, according to patch size on wiring board 10, selects different positioning pins, because of the first positioning pin 4, the
Two positioning pins 5, third positioning pin 6, the 4th positioning pin 7 and the 5th positioning pin 8 are respectively clearance fit, and convenient directly dismounting is more
It changes, is convenient for patch reinforcement and positioning, ensure a kind of utilization benefit of multi-level wiring board patch reinforcement smelting tool.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (5)
1. a kind of multi-level wiring board patch reinforcement has with smelting, including cover board (1), wiring board (10) and substrate (11), feature
It is：The first frame (2) is equipped on the outside of the cover board (1), the first frame (2) both sides offer first positioning hole (3), institute
It states cover board (1) and is equipped with the first positioning pin (4), be equipped with the second positioning pin (5) on the outside of first positioning pin (4), described second
It is equipped with third positioning pin (6) on the outside of positioning pin (5), is equipped with the 4th positioning pin (7) on the outside of the third positioning pin (6), described the
It is equipped with the 5th positioning pin (8) on the outside of four positioning pins (7), the second frame (15), the circuit are equipped on the outside of the wiring board (10)
Plate (10) both sides offer second location hole (9), and gasket (12), substrate (11) the both sides top are equipped at the top of the substrate (11)
Portion is equipped with positioning column (13).
2. a kind of multi-level wiring board patch reinforcement according to claim 1 has with smelting, it is characterised in that：The substrate
(11) positioning bolt (14) is offered in, positioning column (13) bottom is equipped with and positioning bolt (14) mutually matched screw thread
Hole.
3. a kind of multi-level wiring board patch reinforcement according to claim 1 has with smelting, it is characterised in that：First side
Frame (2) is identical with the second frame (15) width size, and the first positioning hole (3) is identical with second location hole (9) size, and one
One corresponds to.
4. a kind of multi-level wiring board patch reinforcement according to claim 1 has with smelting, it is characterised in that：Described first is fixed
Position pin (4), the second positioning pin (5), third positioning pin (6), the 4th positioning pin (7) and the 5th positioning pin (8) are respectively that gap is matched
It closes.
5. a kind of multi-level wiring board patch reinforcement according to claim 1 has with smelting, it is characterised in that：The positioning column
(13) quantity is 6, and the cross section where midpoint of 6 positioning columns (13) on the length direction of substrate (11) is symmetrically set
It sets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610743100.2A CN106132095B (en) | 2016-08-29 | 2016-08-29 | A kind of multi-level wiring board patch reinforcement has with smelting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610743100.2A CN106132095B (en) | 2016-08-29 | 2016-08-29 | A kind of multi-level wiring board patch reinforcement has with smelting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106132095A CN106132095A (en) | 2016-11-16 |
| CN106132095B true CN106132095B (en) | 2018-08-14 |
Family
ID=57273735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610743100.2A Active CN106132095B (en) | 2016-08-29 | 2016-08-29 | A kind of multi-level wiring board patch reinforcement has with smelting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106132095B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107481944B (en) * | 2017-07-14 | 2019-08-20 | 李军 | A kind of semiconductor devices hybrid package method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200953690Y (en) * | 2006-09-22 | 2007-09-26 | 比亚迪股份有限公司 | Reinforced pressure clamp device for flexible circuit board |
| CN204887727U (en) * | 2015-09-07 | 2015-12-16 | 瑞华高科技电子工业园(厦门)有限公司 | Flexible line way board laminating tool |
| CN205912353U (en) * | 2016-08-29 | 2017-01-25 | 苏州市惠利盛电子科技有限公司 | Multi -level circuit board paster smelting tool for reinforcement |
-
2016
- 2016-08-29 CN CN201610743100.2A patent/CN106132095B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200953690Y (en) * | 2006-09-22 | 2007-09-26 | 比亚迪股份有限公司 | Reinforced pressure clamp device for flexible circuit board |
| CN204887727U (en) * | 2015-09-07 | 2015-12-16 | 瑞华高科技电子工业园(厦门)有限公司 | Flexible line way board laminating tool |
| CN205912353U (en) * | 2016-08-29 | 2017-01-25 | 苏州市惠利盛电子科技有限公司 | Multi -level circuit board paster smelting tool for reinforcement |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106132095A (en) | 2016-11-16 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Metallurgical Tool for Multilayer PCB Patch Reinforcement Effective date of registration: 20221009 Granted publication date: 20180814 Pledgee: Bank of China Limited Suzhou Xiangcheng sub branch Pledgor: SUZHOU HUILISHENG ELECTRONICS TECHNOLOGY CO.,LTD. Registration number: Y2022980017664 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231019 Granted publication date: 20180814 Pledgee: Bank of China Limited Suzhou Xiangcheng sub branch Pledgor: SUZHOU HUILISHENG ELECTRONICS TECHNOLOGY CO.,LTD. Registration number: Y2022980017664 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Metallurgical Tool for Multilevel PCB Chip Reinforcement Effective date of registration: 20231026 Granted publication date: 20180814 Pledgee: Bank of China Limited Suzhou Xiangcheng sub branch Pledgor: SUZHOU HUILISHENG ELECTRONICS TECHNOLOGY CO.,LTD. Registration number: Y2023980062603 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |