CN106132090A - A kind of method of conductive pattern leveling in PCB - Google Patents
A kind of method of conductive pattern leveling in PCB Download PDFInfo
- Publication number
- CN106132090A CN106132090A CN201610512969.6A CN201610512969A CN106132090A CN 106132090 A CN106132090 A CN 106132090A CN 201610512969 A CN201610512969 A CN 201610512969A CN 106132090 A CN106132090 A CN 106132090A
- Authority
- CN
- China
- Prior art keywords
- pcb
- pcb substrate
- copper
- conductive pattern
- carries out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 21
- 239000000919 ceramic Substances 0.000 claims abstract description 13
- 239000002002 slurry Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 12
- 238000010586 diagram Methods 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000011889 copper foil Substances 0.000 claims description 9
- 238000005286 illumination Methods 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 5
- 241000143437 Aciculosporium take Species 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000012774 insulation material Substances 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 abstract description 11
- 238000003466 welding Methods 0.000 abstract description 3
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 2
- 208000003351 Melanosis Diseases 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
In a kind of PCB conductive pattern leveling method, method step is as follows: take copper-clad plate cut, internal layer dry film, be laminated, bore filling hole, fill slurry, boring, outer layer dry film, ceramic grinding, welding resistance.By filling hole and the setting filling slurry, it is provided that a smooth plane, reduce hole and pitch of holes, reduce the area of plate, the problem solving wire and wiring, improves wiring density, mount components on hole.Make conductive pattern flush with base material by ceramic grinding simultaneously, can ensure that the planarization of conductive pattern and base material, pcb board after being flattened by the method for the present invention is applied in displacement transducer, can ensure that the normal rotation of displacement transducer pointer 360 °, it is ensured that the normal use of displacement transducer.
Description
Technical field
The present invention relates to electronic information field, a kind of method of conductive pattern leveling in PCB.
Background technology
Along with the newcooperative medical system of electronic product, traditional printed board conductive pattern uses addition process technique on the base material of FR-4
Process, but for displacement transducer, traditional printed board cannot meet performance requirement, is only embedded by conductive pattern
In base material, flush just satisfiability energy requirement with base material.
The operation principle of present displacement transducer is by the rotation of 360 ° of pointer, and needing could be suitable at same plane pointer
Profit rotates, and traditional printed board conductive pattern is on the base material of FR-4, and not at same plane, therefore pointer cannot rotate smoothly.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of method of conductive pattern leveling in PCB.
The present invention solves that the technical scheme that above-mentioned technical problem uses is:
A kind of method of conductive pattern leveling in PCB, described method step is as follows:
A. take copper-clad plate, determine the size of copper-clad plate, cut, the copper-clad plate after being cut；
B. internal layer dry film: take light-sensitive surface, sprays on light-sensitive surface by required circuit diagram, is then dried copper-clad plate
Process, then the one side with circuit diagram is close in PCB substrate, after heating, is placed under illumination, be exposed processing, expose
PCB substrate being placed in etching solution after light, the pcb board after etching carries out moving back film and processes, and obtains the pcb board of band internal layer circuit figure；
PCB substrate after moving back film carries out melanism and brown processes；
C. lamination: according to the number of plies of required PCB, take two Copper Foils, the PCB substrate that obtains in step b of respective numbers and
Prepreg, two Copper Foils are individually positioned in outermost layer, stack the PCB substrate of respective numbers, prepreg between two Copper Foils successively,
Place a prepreg between two PCB substrate, the circuit board folded is put into vacuum hotpressing machine, carry out laminating operation；
D. the PCB substrate after being laminated in step c is bored and is filled hole, and then PCB substrate carries out heavy copper operation；Take absolutely
Edge material makes the filling slurry supporting with described filling hole, is filled in by filling slurry in the filling hole of PCB substrate, uses half certainly
Dynamic filling perforation machine is filled with operation to described filling hole；Determine the ratio of thickness of slab and aperture, determine the hole of boring according to aperture ratio
Footpath, carries out drilling operation by the PCB after lamination in step c, then carries out electroless copper plating copper thick with plating operation；
E. outer layer dry film: take light-sensitive surface, sprays on light-sensitive surface by required circuit diagram, is then dried copper-clad plate
Process, then the one side with circuit diagram is close in PCB substrate, after heating, is placed under illumination, be exposed processing, expose
PCB substrate being placed in etching solution after light, the pcb board after etching carries out moving back film and processes, and obtains the pcb board of band outer circuit figure；
F. the pcb board obtained in step e is put into and ceramic grinding trigger carries out ceramic grinding, make conductive pattern put down with base material
OK.
G. the pcb board obtained in step f is carried out welding resistance operation and silk-screen operates, obtain complete pcb board.
Further, the uniformity of described ceramic grinding trigger needs to control at-5um～5um；The number of times ground is at most 5
Secondary, use micrometer or thickness of slab measuring instrument to measure thickness of slab uniformity after grinding every time；Do section to finished product after completing to measure
Base material and the flatness≤20um of conductive pattern.
The invention have the benefit that
By filling hole and the setting filling slurry, it is provided that a smooth plane, reduce hole and pitch of holes, reduce
The area of plate, the problem solving wire and wiring, improves wiring density, mount components on hole.Pass through ceramic grinding simultaneously
Conductive pattern is made to flush with base material, it is ensured that conductive pattern and the planarization of base material, after being flattened by the method for the present invention
Pcb board is applied in displacement transducer, it is ensured that the normal rotation of displacement transducer pointer 360 °, it is ensured that displacement transducer
Normal use.Intensifier circuit and the degree of integration of base material, more firm simultaneously, is not susceptible to circuit under various environmental conditions and asks
Topic.
Detailed description of the invention
Below in conjunction with detailed description of the invention, the present invention is further elaborated.
A kind of method of conductive pattern leveling in PCB, described method step is as follows:
A. take copper-clad plate, determine the size of copper-clad plate, cut, the copper-clad plate after being cut；
B. internal layer dry film: take light-sensitive surface, sprays on light-sensitive surface by required circuit diagram, is then dried copper-clad plate
Process, then the one side with circuit diagram is close in PCB substrate, after heating, is placed under illumination, be exposed processing, expose
PCB substrate being placed in etching solution after light, the pcb board after etching carries out moving back film and processes, and obtains the pcb board of band internal layer circuit figure；
PCB substrate after moving back film carries out melanism and brown processes；
C. lamination: according to the number of plies of required PCB, take two Copper Foils, the PCB substrate that obtains in step b of respective numbers and
Prepreg, two Copper Foils are individually positioned in outermost layer, stack the PCB substrate of respective numbers, prepreg between two Copper Foils successively,
Place a prepreg between two PCB substrate, the circuit board folded is put into vacuum hotpressing machine, carry out laminating operation；
D. the PCB substrate after being laminated in step c is bored and is filled hole, and then PCB substrate carries out heavy copper operation；Take absolutely
Edge material makes the filling slurry supporting with described filling hole, is filled in by filling slurry in the filling hole of PCB substrate, uses half certainly
Dynamic filling perforation machine is filled with operation to described filling hole；Determine the ratio of thickness of slab and aperture, determine the hole of boring according to aperture ratio
Footpath, carries out drilling operation by the PCB after lamination in step c, then carries out electroless copper plating copper thick with plating operation；
E. outer layer dry film: take light-sensitive surface, sprays on light-sensitive surface by required circuit diagram, is then dried copper-clad plate
Process, then the one side with circuit diagram is close in PCB substrate, after heating, is placed under illumination, be exposed processing, expose
PCB substrate being placed in etching solution after light, the pcb board after etching carries out moving back film and processes, and obtains the pcb board of band outer circuit figure；
F. the pcb board obtained in step e is put into and ceramic grinding trigger carries out ceramic grinding, make conductive pattern put down with base material
OK.
G. the pcb board obtained in step f is carried out welding resistance operation and silk-screen operates, obtain complete pcb board.
The uniformity of ceramic grinding trigger needs to control at-5um～5um；The number of times ground is at most 5 times, after grinding every time
Micrometer or thickness of slab measuring instrument is used to measure thickness of slab uniformity；Do section to finished product after completing and measure base material and conductive pattern
Flatness≤20um.
By filling hole and the setting filling slurry, it is provided that a smooth plane, reduce hole and pitch of holes, reduce
The area of plate, the problem solving wire and wiring, improves wiring density, mount components on hole.Pass through ceramic grinding simultaneously
Conductive pattern is made to flush with base material, it is ensured that conductive pattern and the planarization of base material, after being flattened by the method for the present invention
Pcb board is applied in displacement transducer, it is ensured that the normal rotation of displacement transducer pointer 360 °, it is ensured that displacement transducer
Normal use.Intensifier circuit and the degree of integration of base material, more firm simultaneously, is not susceptible to circuit under various environmental conditions and asks
Topic.
Claims (2)
1. the method for conductive pattern leveling in a PCB, it is characterised in that: described method step is as follows:
A. take copper-clad plate, determine the size of copper-clad plate, cut, the copper-clad plate after being cut；
B. internal layer dry film: take light-sensitive surface, is coated in PCB substrate uniformly by light-sensitive surface, then by the film with circuit diagram
It is close in PCB substrate, is placed under illumination, be exposed processing, after exposure, PCB substrate be placed in etching solution, after etching
Pcb board carries out moving back film and processes, and obtains the pcb board of band internal layer circuit figure；PCB substrate after moving back film carries out brown process；
C. lamination: according to the number of plies of required PCB, take two Copper Foils, the PCB substrate obtained in step b of respective numbers and half is admittedly
Changing sheet, two Copper Foils are individually positioned in outermost layer, stack the PCB substrate of respective numbers, prepreg between two Copper Foils successively, and two
Place a prepreg between PCB substrate, the circuit board folded is put into vacuum hotpressing machine, carry out laminating operation；
D. the PCB substrate after being laminated in step c is bored and is filled hole, and then PCB substrate carries out heavy copper operation；Take insulation material
Material makes the filling slurry supporting with described filling hole, is filled in by filling slurry in the filling hole of PCB substrate, uses semi-automatic filling out
Hole machine is filled with operation to described filling hole；Determine the ratio of thickness of slab and aperture, determine the aperture of boring according to aperture ratio, will
In step c, the PCB after lamination carries out drilling operation, then carries out electroless copper plating copper thick with plating operation；
E. outer layer dry film: take light-sensitive surface, sprays on light-sensitive surface by required circuit diagram, then copper-clad plate is dried place
Reason, is then close to the one side with circuit diagram in PCB substrate, after heating, is placed under illumination, is exposed processing, exposure
After PCB substrate is placed in etching solution, the pcb board after etching carries out moving back film and processes, and obtains the pcb board of band outer circuit figure；
F. the pcb board obtained in step e is put into and ceramic grinding trigger carries out ceramic grinding, make conductive pattern parallel with base material.
The method of conductive pattern leveling in PCB the most according to claim 1, it is characterised in that: described ceramic grinding trigger
Uniformity needs to control at-5um～5um；The number of times ground is at most 5 times, uses micrometer or thickness of slab to measure after grinding every time
Thickness of slab uniformity measured by instrument；Do section to finished product after completing and measure the flatness≤20um of base material and conductive pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610512969.6A CN106132090B (en) | 2016-06-30 | 2016-06-30 | A kind of method of conductive pattern leveling in PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610512969.6A CN106132090B (en) | 2016-06-30 | 2016-06-30 | A kind of method of conductive pattern leveling in PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106132090A true CN106132090A (en) | 2016-11-16 |
| CN106132090B CN106132090B (en) | 2019-03-22 |
Family
ID=57468988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610512969.6A Active CN106132090B (en) | 2016-06-30 | 2016-06-30 | A kind of method of conductive pattern leveling in PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106132090B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111328205A (en) * | 2020-03-18 | 2020-06-23 | 四川英创力电子科技股份有限公司 | Processing technology of planar thick copper PCB |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002344142A (en) * | 2001-05-15 | 2002-11-29 | Ibiden Co Ltd | Method of manufacturing multilayer printed wring board |
| JP2004087656A (en) * | 2002-08-26 | 2004-03-18 | Victor Co Of Japan Ltd | Method for manufacturing printed wiring board |
| CN101716744A (en) * | 2009-11-12 | 2010-06-02 | 梅州博敏电子有限公司 | Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board |
| CN101772269A (en) * | 2009-12-23 | 2010-07-07 | 深南电路有限公司 | PCB (Printed Circuit Board) processing method |
| CN102244987A (en) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | Method for resin plugging of holes of back plate with high thickness-to-diameter ratio |
| CN103781291A (en) * | 2014-02-25 | 2014-05-07 | 昆山苏杭电路板有限公司 | Process for plugging holes in printed board by using resin |
| CN105430939A (en) * | 2015-10-30 | 2016-03-23 | 江苏博敏电子有限公司 | Printed circuit board buried hole resin plugging method |
-
2016
- 2016-06-30 CN CN201610512969.6A patent/CN106132090B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002344142A (en) * | 2001-05-15 | 2002-11-29 | Ibiden Co Ltd | Method of manufacturing multilayer printed wring board |
| JP2004087656A (en) * | 2002-08-26 | 2004-03-18 | Victor Co Of Japan Ltd | Method for manufacturing printed wiring board |
| CN101716744A (en) * | 2009-11-12 | 2010-06-02 | 梅州博敏电子有限公司 | Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board |
| CN101772269A (en) * | 2009-12-23 | 2010-07-07 | 深南电路有限公司 | PCB (Printed Circuit Board) processing method |
| CN102244987A (en) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | Method for resin plugging of holes of back plate with high thickness-to-diameter ratio |
| CN103781291A (en) * | 2014-02-25 | 2014-05-07 | 昆山苏杭电路板有限公司 | Process for plugging holes in printed board by using resin |
| CN105430939A (en) * | 2015-10-30 | 2016-03-23 | 江苏博敏电子有限公司 | Printed circuit board buried hole resin plugging method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111328205A (en) * | 2020-03-18 | 2020-06-23 | 四川英创力电子科技股份有限公司 | Processing technology of planar thick copper PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106132090B (en) | 2019-03-22 |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A method of conducting pattern leveling in PCB Effective date of registration: 20210525 Granted publication date: 20190322 Pledgee: Guangde sub branch of Postal Savings Bank of China Ltd. Pledgor: GUANGDE BAODA PRECISION PCB Co.,Ltd. Registration number: Y2021980003931 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220527 Granted publication date: 20190322 Pledgee: Guangde sub branch of Postal Savings Bank of China Ltd. Pledgor: GUANGDE BAODA PRECISION PCB Co.,Ltd. Registration number: Y2021980003931 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A method of leveling conductive pattern in PCB Effective date of registration: 20220527 Granted publication date: 20190322 Pledgee: Guangde sub branch of Postal Savings Bank of China Ltd. Pledgor: GUANGDE BAODA PRECISION PCB Co.,Ltd. Registration number: Y2022990000287 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230718 Granted publication date: 20190322 Pledgee: Guangde sub branch of Postal Savings Bank of China Ltd. Pledgor: GUANGDE BAODA PRECISION PCB Co.,Ltd. Registration number: Y2022990000287 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Method for Leveling Conductive Patterns in PCB Effective date of registration: 20230725 Granted publication date: 20190322 Pledgee: Anhui Guangde Rural Commercial Bank Co.,Ltd. Pledgor: GUANGDE BAODA PRECISION PCB Co.,Ltd. Registration number: Y2023980049445 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |