CN106123846B - The device and method that aggregate settles in a kind of test fill paste - Google Patents
The device and method that aggregate settles in a kind of test fill paste Download PDFInfo
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- CN106123846B CN106123846B CN201610427418.XA CN201610427418A CN106123846B CN 106123846 B CN106123846 B CN 106123846B CN 201610427418 A CN201610427418 A CN 201610427418A CN 106123846 B CN106123846 B CN 106123846B
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- test
- microcontroller
- fill paste
- aggregate
- organic glass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C5/00—Measuring height; Measuring distances transverse to line of sight; Levelling between separated points; Surveyors' levels
Abstract
The device and method that aggregate settles in fill paste is tested the invention discloses a kind of.Apparatus of the present invention include organic glass guide channel, resistivity measurement device；Copper plate electrode is equipped with the insulation card slot of organic glass groove, pass through conducting wire connection electrode converter, electrode converter is connected with H bridges launching circuit and amplifier, H bridge launching circuit emission current signals, H bridge launching circuit external impressed current sensors, the current pulse signal of transmitting is converted to the voltage signal easily measured by current sensor, then is input to after Signal-regulated kinase in microcontroller, and voltage signal to be measured is amplified in the input range of microcontroller by amplifier；Microcontroller controls H bridge launching circuits by light-coupled isolation driving device, receives the data of microcontroller by PC computers and is handled.The present invention tests the sedimentation of aggregate in fill paste using the method for resistivity, and test method is simple and practicable, and test result is accurately reliable；Short the time required to test, testing efficiency is high.
Description
Technical field
The device and method that aggregate settles in fill paste is tested the present invention relates to a kind of, belongs to coal mining filling technique
Field.
Background technology
China's coal-mine " under three " pressure coal is huge, and " under three " pressure coal recovery ratio, and effective guarantee can be improved by implementing filling mining
The safety in production of mine, while mining area solid waste is disposed, reduce and take up an area and mitigate subsidence, reduce village migration, protect
Shield and improvement mining area ecological environment, are conducive to development of resources and Coordination Development Between Eco-environment.China's railways and water-bodies method form
Various, wherein paste body filling is preferable to control ground shift and deformation effect, thus is generally used.
Paste body filling process system is simple, realizes that high-efficiency and continuous conveys by pipeline, therefore paste filling material must is fulfilled for
The primary condition of pumpability requirements.For adding the lotion of aggregate it should be further noted that ensureing not isolate under high pump pressure effect, no
Bleeding, do not settle.The isolation of aggregate necessarily causes to settle in paste filling material, and the sedimentation of aggregate is easy to cause pipeline jam accident
Occur, plugging not only influences being normally carried out for packing job, but also can pollute subsurface environment.The sedimentation of aggregate can also influence to fill
The intensity of body, weakens the effect of control overlying rock and surface movement and deformation.Therefore, for the lotion prepared, test is passed through
Whether wherein aggregate is settled to judge that the height of fill paste quality is particularly important.
The content of the invention
The present invention is intended to provide a kind of test the device and method that aggregate settles in fill paste, solve in fill paste
The measure problem of aggregate sedimentation.
The device that aggregate settles in fill paste is tested the present invention provides a kind of, including organic glass guide channel, resistivity are surveyed
Trial assembly is put；
The organic glass groove is rectangular parallelepiped structure, if being uniformly provided with respectively in the vertical centerline in four vertical faces
Dry insulation card slot, insulation card slot are used to connect resistivity measurement device；
The resistivity measurement device include copper plate electrode, multicore cable, electrode converter, H bridges launching circuit, optocoupler every
From driving device, current sensor, signal conditioning circuit, amplifier, microcontroller, PC computers, power supply, copper plate electrode is welded on
In the insulation card slot of organic glass groove, the conducting wire being connected with copper plate electrode passes through the circular aperture connection electrode on organic glass groove
Converter, by coordination electrode converter can test respectively fill paste test piece upper part, middle part, lower part resistivity, electrode
Converter is connected with H bridges launching circuit and amplifier, H bridge launching circuit emission current signals, and H bridge launching circuits external impressed current passes
The current pulse signal of transmitting is converted to the voltage signal easily measured by sensor, current sensor, then after Signal-regulated kinase
It is input in microcontroller, voltage signal to be measured is amplified in the input range of microcontroller by amplifier；Microcontroller by optocoupler every
H bridge launching circuits are controlled from driving device, microcontroller is connected with PC computers, and the number of microcontroller is received by PC computers
According to and handled.
In above device, three insulation card slots are respectively equipped with each vertical plane of organic glass groove inner wall, along organic
Three circular apertures, and edge insulator groove center and circle are had at the upper, middle and lower of the center line of four vertical planes of glass guide channel
Small hole center overlaps.
In above device, four bridge arms of the H bridges launching circuit by four gate level turn-off thyristor VT1, VT2,
VT3, VT4 are formed, the high voltage direct current that input current is provided by power supply, and when VT1, VT3 on diagonal are open-minded, VT2, VT4 are closed
When disconnected, output current is just；When VT2, VT4 are open-minded, and VT1, VT3 are turned off, output current is negative, controls four gate electrode capable of switching off
The shut-off of thyristor can be obtained by the square-wave pulse transmitting signal of required alternate positive and negative.
The light-coupled isolation driving device uses the linear optical coupling TLP521-4 of four-way.
The signal conditioning circuit moves to the zero point of the output signal of current sensor in microcontroller in ADC ranges
Point.
The model of the microcontroller is MSP430F149.
Hardhead sponge is equipped between the copper plate electrode and card slot, the hardhead sponge is boss shape, and passes through CuSO4Solution soaks
Bubble, has good electric conductivity, when test specimen is placed in organic glass groove, it is ensured that copper plate electrode and test specimen are in test
Come into full contact with.
The present invention provides it is a kind of test fill paste in aggregate settle method, by fill paste test piece upper part, in
Portion, the difference condition of lower resistance rate judge whether fill paste aggregate in process of setting settles, it is specifically pressed
Row step carries out：
（1）Copper plate electrode is welded in the card slot of organic glass groove, the conducting wire being connected with copper plate electrode is out of card slot
Circular aperture picks out, and by CuSO4The hardhead sponge that solution soaked is stuck between copper plate electrode and card slot；
（2）Connect resistivity measurement device；
（3）The fill paste test specimen prepared is placed in organic glass groove；
（4）Power on, start PC computers, the top, middle part, the resistance of lower part of fill paste test specimen are compared in observation
Rate, so as to judge whether aggregate settles.
The principle of the present invention：Just solidification after fill paste due to the moisture in pore structure it is more, fill paste
The influence factor of resistivity is mainly pore solution and circulation passage, and circulation passage includes the intercommunicating pore and aggregate in pore structure
The interfacial transition zone loose structure of surrounding, aggregate content is more, and the specific surface area of interfacial transition zone is bigger, and pore solution is easier
It is lower in fill paste internal transmission, resistivity value.If in the lotion newly mixed and stirred, aggregate does not occur the i.e. aggregate of sedimentation and is filling
Fill out in lotion and be uniformly distributed, the resistivity value that the fill paste after solidification is surveyed at upper and lower position should be consistent, if aggregate
Settle, the resistivity value that lower part measures is significantly lower than the resistivity value that top measures, and passes through fill paste after solidification
The measurement of diverse location resistivity value, judges whether fill paste settles.
Beneficial effects of the present invention：
（1）The present invention tests the sedimentation of aggregate in fill paste using the method for resistivity, and test method is simple and practicable,
Test result is accurately reliable；
（2）Easy to operate, device need to only pick and place test specimen, software operation can complete the survey of multigroup test specimen after installation is complete
Examination；
（3）Short the time required to test, testing efficiency is high, and a people can individually test multi-group data；
（4）According to resistivity measurement as a result, can quickly judge whether aggregate settles, and to the raw material type of fill paste and
Content is adjusted, and this method and device are suitable for the test of laboratory and industry spot to fill paste performance.
Brief description of the drawings
Fig. 1 is the general structure schematic diagram of test device of the present invention；
Fig. 2 arranges schematic diagram for organic glass groove inner wall side；
Fig. 3 is the circuit diagram of H bridge launching circuits；
In figure：1 is organic glass groove, and 2 be circular aperture, and 3 be insulation card slot, and 4 be hardhead sponge, and 5 be copper plate electrode, and 6 are
Multicore cable, 7 be electrode converter, and 8 be H bridge launching circuits, and 9 be light-coupled isolation driving device, and 10 be current sensor, and 11 are
Signal conditioning circuit, 12 be amplifier, and 13 be microcontroller, and 14 be PC computers, and 15 be power supply.
Embodiment
The present invention is further illustrated below by embodiment, but is not limited to following embodiments.
Embodiment：
As shown in Figure 1 and 2, it is a kind of to test the device that aggregate sinks in fill paste, including organic glass guide channel 1, circular aperture
2nd, insulate card slot 3, hardhead sponge 4, resistivity measurement device；Organic glass groove 1 all around four sides vertically in
Three circular apertures 2 are had on heart line, three insulation are respectively welded in each face of 1 inner wall of organic glass groove on vertically
Card slot 3；Resistivity measurement device includes copper plate electrode 5, multicore cable 6, electrode converter 7, H bridges launching circuit 8, light-coupled isolation
Driving device 9, current sensor 10, signal conditioning circuit 11, amplifier 12, microcontroller 13, PC computers 14, power supply 15, copper
Plate electrode 5 is welded in the insulation card slot 3 of organic glass groove 1, and the conducting wire being connected with copper plate electrode 5 is passed through on organic glass groove
Circular aperture 2 is connected on electrode converter 7, and electrode converter 7 is connected with H bridges launching circuit 8 and amplifier 12, the transmitting of H bridges
8 emission current signal of circuit, 8 external impressed current sensor 10 of H bridges launching circuit, current sensor 10 believe the current impulse of transmitting
Number the voltage signal easily measured is converted to, then is input to after Signal-regulated kinase in microcontroller 13, amplifier 12 is by electricity to be measured
Pressure signal is amplified in the input range of microcontroller 13, and microcontroller 13 controls H bridges to be transmitted back to by light-coupled isolation driving device 9
Road 8, microcontroller 13 connect PC computers 14, and PC computers 14 are used for receiving the data of microcontroller and are handled.
Further illustrate the method tested using above device, include the following steps：
1st, 1 specification of organic glass groove is；Long 140mm wide 140mm high 110mm, organic glass thickness is 10mm, in organic glass
All around four sides are highly being to have three a diameter of 3mm circular apertures 2 at 20mm, 60mm, 100mm to glass groove 1；
Three insulation card slots 3 are respectively welded in each face of 1 inner wall of organic glass groove on vertically, insulation 3 specification of card slot is：Long 40mm
Wide 10mm high 20mm, the height of the center in the vertical direction for the card slot 3 that insulate is 20mm, 60mm, 100mm；
2nd, copper plate electrode is welded in the card slot of organic glass groove, the conducting wire being connected with copper plate electrode connects from circular aperture
Go out, and by CuSO4The hardhead sponge that solution soaked is stuck between copper plate electrode and card slot；
3rd, resistivity measurement device is connected；
4th, just the long 100mm wide 100mm high 100mm fill paste test specimens that demould will be solidified to be put into organic glass groove；
5th, power on, start PC computers, fill paste test piece upper part, middle part, lower resistance rate are compared in observation, determine
Whether aggregate settles；（Specifically, by electrode converter, the electrode of copper plate electrode position corresponding with its opposite is beaten
Open, while power and receive resistivity data, after data stabilization to be tested, record result.）
6th, computer and power supply are closed after the completion of testing, takes out fill paste test specimen.
Claims (8)
1. a kind of test the device that aggregate settles in fill paste, it is characterised in that：Filled including organic glass guide channel, resistivity measurement
Put；
The organic glass groove is rectangular parallelepiped structure, several are uniformly provided with respectively in the vertical centerline in four vertical faces
Insulate card slot, and insulation card slot is used to connect resistivity measurement device；
The resistivity measurement device includes copper plate electrode, multicore cable, electrode converter, H bridges launching circuit, light-coupled isolation drive
Dynamic device, current sensor, signal conditioning circuit, amplifier, microcontroller, PC computers, power supply, copper plate electrode is welded on organic
In the insulation card slot of glass guide channel, the conducting wire being connected with copper plate electrode is changed through the circular aperture connection electrode on organic glass groove
Device, electrode converter are connected with H bridges launching circuit and amplifier, H bridge launching circuit emission current signals, outside H bridge launching circuits
Current sensor is connect, the current pulse signal of transmitting is converted to the voltage signal easily measured by current sensor, then through signal tune
It is input to after reason circuit in microcontroller, voltage signal to be measured is amplified in the input range of microcontroller by amplifier；Microcontroller leads to
Light-coupled isolation driving device is crossed to control H bridge launching circuits, microcontroller is connected with PC computers, and list is received by PC computers
The data of piece machine are simultaneously handled.
2. the device that aggregate settles in test fill paste according to claim 1, it is characterised in that：In organic glass groove
Be respectively equipped with each vertical plane of inner wall three insulation card slots, along four vertical planes of organic glass groove center line it is upper, in,
Lower place has three circular apertures, and edge insulator groove center is overlapped with circular aperture center.
3. the device that aggregate settles in test fill paste according to claim 1, it is characterised in that：The H bridges transmitting
Four bridge arms in circuit are made of four gate level turn-off thyristors VT1, VT2, VT3, VT4, and input current is provided by power supply
High voltage direct current, when VT1, VT3 on diagonal are open-minded, when VT2, VT4 are turned off, output current is just；When VT2, VT4 are open-minded,
When VT1, VT3 are turned off, output current be negative, control four gate level turn-off thyristors shut-off can be obtained by it is required positive and negative
Alternate square-wave pulse transmitting signal.
4. the device that aggregate settles in test fill paste according to claim 1, it is characterised in that：The light-coupled isolation
Driving device is the linear optical coupling TLP521-4 using four-way.
5. the device that aggregate settles in test fill paste according to claim 1, it is characterised in that：The signal condition
Circuit moves to the zero point of the output signal of current sensor at the midpoint of ADC ranges in microcontroller.
6. the device that aggregate settles in test fill paste according to claim 1, it is characterised in that：The microcontroller
Model is MSP430F149.
7. the device that aggregate settles in test fill paste according to claim 1, it is characterised in that：The copper plate electrode
Hardhead sponge is equipped between card slot, the hardhead sponge is boss shape, and passes through CuSO4Solution soaks, and has good electric conductivity,
When test specimen is placed in organic glass groove, ensure that copper plate electrode and test specimen come into full contact with.
8. a kind of test the method that aggregate settles in fill paste, filling cream is tested using claim 1 ~ 7 any one of them
The device that aggregate settles in body, it is characterised in that：By fill paste test piece upper part, middle part, lower resistance rate difference condition
To judge whether fill paste aggregate in process of setting settles, comprise the following steps：
（1）Copper plate electrode is welded in the card slot of organic glass groove, the conducting wire being connected with copper plate electrode passes through organic glass groove
Inner wall picks out, and by CuSO4The hardhead sponge that solution soaked is stuck between copper plate electrode and card slot；
（2）Connect resistivity measurement device；
（3）The fill paste test specimen prepared is placed in organic glass groove；
（4）Powering on, start PC computers, the top, middle part, lower resistance rate of fill paste test specimen are compared in observation, so that
Judge whether aggregate settles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610427418.XA CN106123846B (en) | 2016-06-16 | 2016-06-16 | The device and method that aggregate settles in a kind of test fill paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610427418.XA CN106123846B (en) | 2016-06-16 | 2016-06-16 | The device and method that aggregate settles in a kind of test fill paste |
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| Publication Number | Publication Date |
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| CN106123846A CN106123846A (en) | 2016-11-16 |
| CN106123846B true CN106123846B (en) | 2018-05-15 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106872320A (en) * | 2017-03-22 | 2017-06-20 | 太原理工大学 | The apparatus and method of aggregate sedimentation in a kind of test fill paste |
| CN106932319B (en) * | 2017-03-22 | 2019-11-12 | 太原理工大学 | The test device and method of aggregate sedimentation in a kind of fill paste |
| CN106940285A (en) * | 2017-03-22 | 2017-07-11 | 太原理工大学 | The device and method that aggregate is settled in a kind of test fill paste |
| CN109298025B (en) * | 2018-08-28 | 2021-03-05 | 太原理工大学 | Test device and method for monitoring segregation of paste filling slurry in pipeline |
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|---|---|---|---|---|
| CN102924010A (en) * | 2012-10-19 | 2013-02-13 | 太原理工大学 | Self-compaction filling paste body and preparation process thereof |
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| BE1018801A3 (en) * | 2009-06-26 | 2011-09-06 | M D C E Bvba | METHOD AND DEVICE FOR DETERMINING A RHEOLOGICAL BORDER TRANSITION |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102924010A (en) * | 2012-10-19 | 2013-02-13 | 太原理工大学 | Self-compaction filling paste body and preparation process thereof |
Non-Patent Citations (3)
| Title |
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| 基于80C552的高密度电阻率法测量系统设计;朱栋华等;《沈阳建筑工程学院学报（自然科学版）》;20030731;第19卷(第3期);第232-235页 * |
| 煤矿膏体充填材料不同条件下的电阻率特性及应用研究;戚庭野;《中国博士学位论文全文数据库 工程科技I辑》;20150915;第1-107页 * |
| 粉煤灰充填材料早龄期物理力学特性及其水化过程分析;杜明泽等;《岩石力学与工程学报》;20160430;第35卷(第4期);第826-836页 * |
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