CN106117973A - A kind of wiring board composition epoxy resin - Google Patents
A kind of wiring board composition epoxy resin Download PDFInfo
- Publication number
- CN106117973A CN106117973A CN201610463391.XA CN201610463391A CN106117973A CN 106117973 A CN106117973 A CN 106117973A CN 201610463391 A CN201610463391 A CN 201610463391A CN 106117973 A CN106117973 A CN 106117973A
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- epoxy resin
- bisphenol
- wiring board
- diethyltoluene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F289/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds not provided for in groups C08F251/00 - C08F287/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
nullThe invention discloses a kind of wiring board composition epoxy resin，Its raw material includes by weight: bisphenol A type epoxy resin 20 40 parts，Bisphenol f type epoxy resin 2 12 parts，Polyether Hexanediol diglycidyl ether 10 20 parts，Trimethylolpropane glycidyl ether 30 60 parts，Modified soybean adhesive 5 15 parts，4,4' methylene two (phenyl isocyanate) 5 15 parts，2，4 diaminourea 3，5 diethyltoluene 0.5 1.2 parts，Tetrahydrochysene phthalate anhydride 0.5 1.5 parts，2，6 diaminourea 3，5 diethyltoluene (heat-resist) 12 parts，Polyester 5 10 parts，Polyamine 5 15 parts，Polyacrylic acid 2 10 parts，Kaolin 5 15 parts，Bentonite 28 parts，Nano-titanium oxide 16 parts，Brucite 15 parts，Titanium oxide 4 10 parts，Ball-shaped silicon micro powder 38 parts.Viscosity of the present invention is low, is easily impregnated with, and mechanical property is good, Good Heat-resistance.
Description
Technical field
The present invention relates to composition epoxy resin technical field, particularly relate to a kind of wiring board composition epoxy resin.
Background technology
Along with electric at the fast development in the whole world, electronic and electrical equipment garbage and electric middle noxious substance
Harm to environment is increasingly severe, and in the face of the pressure of protection environment, wiring board material needs in the face of tighter in the course of processing
Severe reliability test, along with the development of electronic information technology, the short and small frivolous trend of electronic devices and components requires printed wiring board
Circuit finer, wiring density is higher, the thing followed then require board substrate have more excellent mechanical property and
Heat resistance.
Summary of the invention
The technical problem existed based on background technology, the present invention proposes a kind of wiring board composition epoxy resin, viscous
Spending low, be easily impregnated with, mechanical property is good, Good Heat-resistance.
A kind of wiring board composition epoxy resin that the present invention proposes, its raw material includes by weight: bisphenol type epoxy
Resin 20-40 part, bisphenol f type epoxy resin 2-12 part, polyether Hexanediol diglycidyl ether 10-20 part, trimethylolpropane contracts
Water glycerin ether 30-60 part, modified soybean adhesive 5-15 part, 4,4'-methylene two (phenyl isocyanate) 5-15 parts, 2,4-bis-
Amino-3,5-diethyltoluene 0.5-1.2 part, tetrahydrochysene phthalate anhydride 0.5-1.5 part, 2,6-diaminourea-3,5-diethyl first
Benzene (heat-resist) 1-2 part, polyester 5-10 part, polyamine 5-15 part, polyacrylic acid 2-10 part, Kaolin 5-15 part, bentonite 2-8
Part, nano-titanium oxide 1-6 part, brucite 1-5 part, titanium oxide 4-10 part, ball-shaped silicon micro powder 3-8 part.
Preferably, modified soybean adhesive uses following technique to prepare: by weight by 1-3 part anion emulsifier, 1-2
Part initiator potassium persulfate, 40-80 part deionized water mix homogeneously, add 10-20 part soybean protein, 1-2 part modified with reduction agent
Sodium sulfite, stirred under nitrogen atmosphere, add ammonia regulation system pH value and continue to stir to 9-9.6, addition 1-3 part styrene,
2-6 part butyl acrylate is stirred at room temperature uniformly, heats up and continues stirring, is cooled to room temperature, obtains modified soybean adhesive.
Preferably, 4,4'-methylene two (phenyl isocyanate), 2,4-diaminourea-3,5-diethyltoluene, tetrahydrochysene benzene two
Formic anhydride, 2,6-diaminourea-3, the weight ratio of 5-diethyltoluene is 8-12:0.6-1:0.8-1:1.2-1.5.
Preferably, polyester, polyamine, polyacrylic acid, Kaolin, bentonite, nano-titanium oxide, brucite, titanium oxide, spherical
The weight ratio of silicon powder is 6-8:8-11:3-6:9-12:3-5:2-4:2-4:6-8:5-7.
Preferably, bisphenol A type epoxy resin, bisphenol f type epoxy resin, the weight ratio of modified soybean adhesive are 30-35:
6-10:6-10.
Preferably, polyether Hexanediol diglycidyl ether, the weight ratio of trimethylolpropane glycidyl ether are 12-15:40-
50。
Preferably, bisphenol A type epoxy resin, the weight ratio of bisphenol f type epoxy resin are 30-35:6-10.
Preferably, described wiring board composition epoxy resin, its raw material includes by weight: bisphenol type epoxy tree
Fat 30-35 part, bisphenol f type epoxy resin 6-10 part, polyether Hexanediol diglycidyl ether 12-15 part, trimethylolpropane shrinks
Glycerin ether 40-50 part, modified soybean adhesive 6-10 part, 4,4'-methylene two (phenyl isocyanate) 8-12 parts, 2,4-diaminos
Base-3,5-diethyltoluene 0.6-1 part, tetrahydrochysene phthalate anhydride 0.8-1 part, 2,6-diaminourea-3,5-diethyltoluene 1.2-
1.5 parts, polyester 6-8 part, polyamine 8-11 part, polyacrylic acid 3-6 part, Kaolin 9-12 part, bentonite 3-5 part, nano-titanium oxide
2-4 part, brucite 2-4 part, titanium oxide 6-8 part, ball-shaped silicon micro powder 5-7 part.
Well, the circuit board good reliability manufactured with it, processability is with heat-resisting for viscosity of the present invention impregnation low, easy, reactivity
Excellent performance；Bisphenol A type epoxy resin, bisphenol f type epoxy resin coordinate the compatibility fabulous, through 2, and 4-diaminourea-3,5-bis-
Ethyltoluene, tetrahydrochysene phthalate anhydride, 2,6-diaminourea-3, after the collaborative solidification of 5-diethyltoluene, glass transition temperature is high,
Thermostability is fabulous, and after solidification, crosslink density is moderate, on the premise of ensureing that hardness meets demand, and good toughness, excellent in mechanical performance,
Goods have the thermostability and resistance to dip solderability of excellence, with polyether Hexanediol diglycidyl ether, trimethylolpropane glycidyl ether,
Modified soybean adhesive mating reaction, not only viscosity is low, and mixing uniformity is good, and effect of impregnation is good, can be effectively improved system tough
Property, and the dispersion that filler is wherein and effect of impregnation are the most excellent, can effectively reduce the thermal coefficient of expansion of system, improve system
Through hole reliability, thermostability of the present invention, humidity resistance are good, good-toughness, and working (machining) efficiency is high；In modified soybean adhesive, by
Higher in soybean protein viscosity, through sodium sulfite treatment, disulfide bonds, strand produces a large amount of active group, with benzene
Ethylene, butyl acrylate anion emulsifier, potassium peroxydisulfate effect under, occur polyreaction and with generating portion be grafted
Polymer, goods are ensureing to bond under moderate premise, with bisphenol A type epoxy resin, bisphenol f type epoxy resin mixing uniformity pole
Good, toughness further enhances, and is easily impregnated with, and heat stability is fabulous, low cost, and environmental pollution is little.
Detailed description of the invention
Below, by specific embodiment, technical scheme is described in detail.
Embodiment 1
A kind of wiring board composition epoxy resin, its raw material includes by weight: bisphenol A type epoxy resin 40 parts, double
Phenol F type epoxy resin 2 parts, polyether Hexanediol diglycidyl ether 20 parts, trimethylolpropane glycidyl ether 30 parts, modified soybean
Adhesive 15 parts, 4,4'-methylene two (phenyl isocyanate) 5 parts, 2,4-diaminourea-3,5-diethyltoluene 1.2 parts, tetrahydrochysene
Phthalate anhydride 0.5 part, 2,6-diaminourea-3,5-diethyltoluene (heat-resist) 2 parts, polyester 5 parts, polyamine 15 parts, poly-third
Olefin(e) acid 2 parts, Kaolin 15 parts, bentonite 2 parts, nano-titanium oxide 6 parts, brucite 1 part, titanium oxide 10 parts, ball-shaped silicon micro powder 3
Part.
Embodiment 2
A kind of wiring board composition epoxy resin, its raw material includes by weight: bisphenol A type epoxy resin 20 parts, double
Phenol F type epoxy resin 12 parts, polyether Hexanediol diglycidyl ether 10 parts, trimethylolpropane glycidyl ether 60 parts is modified big
Bean adhesive 5 parts, 4,4'-methylene two (phenyl isocyanate) 15 parts, 2,4-diaminourea-3,5-diethyltoluene 0.5 part, four
Hydrogen phthalate acid anhydride 1.5 parts, 2,6-diaminourea-3,5-diethyltoluene (heat-resist) 1 part, polyester 10 parts, polyamine 5 parts, poly-
10 parts of acrylic acid, Kaolin 5 parts, bentonite 8 parts, nano-titanium oxide 1 part, brucite 5 parts, titanium oxide 4 parts, ball-shaped silicon micro powder 8
Part.
Embodiment 3
A kind of wiring board composition epoxy resin, its raw material includes by weight: bisphenol A type epoxy resin 35 parts, double
Phenol F type epoxy resin 6 parts, polyether Hexanediol diglycidyl ether 15 parts, trimethylolpropane glycidyl ether 40 parts, modified soybean
Adhesive 10 parts, 4,4'-methylene two (phenyl isocyanate) 8 parts, 2,4-diaminourea-3,5-diethyltoluene 1 part, tetrahydrochysene benzene
Dicarboxylic acid anhydride 0.8 part, 2,6-diaminourea-3,5-diethyltoluene 1.5 parts, polyester 6 parts, polyamine 11 parts, polyacrylic acid 3 parts is high
12 parts of ridge soil, bentonite 3 parts, nano-titanium oxide 4 parts, brucite 2 parts, titanium oxide 8 parts, ball-shaped silicon micro powder 5 parts.
Modified soybean adhesive uses following technique to prepare: by weight by 3 parts of anion emulsifiers, 1 part of initiator mistake
Potassium sulfate, 80 parts of deionized water mix homogeneously, add 10 portions of soybean proteins, 2 parts of modified with reduction agent sodium sulfite, under nitrogen protection
Stirring 10min, adds ammonia regulation system pH value and continues stirring 20min to 9.6, add 3 parts of styrene, 2 parts of butyl acrylate
Stirring room temperature stirs, and rises high-temperature and continues stirring 20min to 70 DEG C, is cooled to room temperature, obtains modified soybean adhesive.
Embodiment 4
A kind of wiring board composition epoxy resin, its raw material includes by weight: bisphenol A type epoxy resin 30 parts, double
Phenol F type epoxy resin 10 parts, polyether Hexanediol diglycidyl ether 12 parts, trimethylolpropane glycidyl ether 50 parts is modified big
Bean adhesive 6 parts, 4,4'-methylene two (phenyl isocyanate) 12 parts, 2,4-diaminourea-3,5-diethyltoluene 0.6 part, four
Hydrogen phthalate acid anhydride 1 part, 2,6-diaminourea-3,5-diethyltoluene 1.2 parts, polyester 8 parts, polyamine 8 parts, polyacrylic acid 6 parts is high
9 parts of ridge soil, bentonite 5 parts, nano-titanium oxide 2 parts, brucite 4 parts, titanium oxide 6 parts, ball-shaped silicon micro powder 7 parts.
Modified soybean adhesive uses following technique to prepare: by weight by 1 part of anion emulsifier, 2 parts of initiator mistakes
Potassium sulfate, 40 parts of deionized water mix homogeneously, add 20 portions of soybean proteins, 1 part of modified with reduction agent sodium sulfite, under nitrogen protection
Stirring 20min, adds ammonia regulation system pH value and continues stirring 40min to 9, add 1 part of styrene, 6 parts of butyl acrylate stir
Mix and be stirred at room temperature uniformly, rise high-temperature and continue stirring 40min to 60 DEG C, be cooled to room temperature, obtain modified soybean adhesive.
Embodiment 5
A kind of wiring board composition epoxy resin, its raw material includes by weight: bisphenol A type epoxy resin 33 parts, double
Phenol F type epoxy resin 8 parts, polyether Hexanediol diglycidyl ether 13 parts, trimethylolpropane glycidyl ether 46 parts, modified soybean
Adhesive 8 parts, 4,4'-methylene two (phenyl isocyanate) 10 parts, 2,4-diaminourea-3,5-diethyltoluene 0.8 part, tetrahydrochysene
Phthalate anhydride 0.92 part, 2,6-diaminourea-3,5-diethyltoluene 1.4 parts, polyester 7 parts, polyamine 10 parts, polyacrylic acid 5 parts,
Kaolin 10 parts, bentonite 4 parts, nano-titanium oxide 3 parts, brucite 3 parts, titanium oxide 7 parts, ball-shaped silicon micro powder 6 parts.
Modified soybean adhesive uses following technique to prepare: by weight by 2.2 parts of anion emulsifiers, 1.8 parts of initiations
Agent potassium peroxydisulfate, 60 parts of deionized water mix homogeneously, add 16 portions of soybean proteins, 1.5 parts of modified with reduction agent sodium sulfite, nitrogen
Stir 16min under protection, add ammonia regulation system pH value and continue stirring 32min to 9.2, add 2 parts of styrene, 4 parts of propylene
Acid butyl ester stirring room temperature stirs, and rises high-temperature and continues stirring 32min to 65 DEG C, is cooled to room temperature, obtains modified soybean glue
Glutinous agent.
The above, the only present invention preferably detailed description of the invention, but protection scope of the present invention is not limited thereto,
Any those familiar with the art in the technical scope that the invention discloses, according to technical scheme and
Inventive concept equivalent or change in addition, all should contain within protection scope of the present invention.
Claims (7)
1. a wiring board composition epoxy resin, it is characterised in that its raw material includes by weight: bisphenol type epoxy tree
Fat 20-40 part, bisphenol f type epoxy resin 2-12 part, polyether Hexanediol diglycidyl ether 10-20 part, trimethylolpropane shrinks
Glycerin ether 30-60 part, modified soybean adhesive 5-15 part, 4,4'-methylene two (phenyl isocyanate) 5-15 parts, 2,4-diaminos
Base-3,5-diethyltoluene 0.5-1.2 part, tetrahydrochysene phthalate anhydride 0.5-1.5 part, 2,6-diaminourea-3,5-diethyltoluene
(heat-resist) 1-2 part, polyester 5-10 part, polyamine 5-15 part, polyacrylic acid 2-10 part, Kaolin 5-15 part, bentonite 2-8
Part, nano-titanium oxide 1-6 part, brucite 1-5 part, titanium oxide 4-10 part, ball-shaped silicon micro powder 3-8 part.
Wiring board composition epoxy resin the most according to claim 1, it is characterised in that 4,4'-methylene two (phenyl
Isocyanates), 2,4-diaminourea-3,5-diethyltoluene, tetrahydrochysene phthalate anhydride, 2,6-diaminourea-3,5-diethyltoluene
Weight ratio be 8-12:0.6-1:0.8-1:1.2-1.5.
3. according to the wiring board composition epoxy resin described in any one of claim 1-2, it is characterised in that polyester, polyamine,
Polyacrylic acid, Kaolin, bentonite, nano-titanium oxide, brucite, titanium oxide, the weight ratio of ball-shaped silicon micro powder are 6-8:8-11:
3-6:9-12:3-5:2-4:2-4:6-8:5-7.
4. according to the wiring board composition epoxy resin described in any one of claim 1-3, it is characterised in that bisphenol A-type ring
Epoxy resins, bisphenol f type epoxy resin, the weight ratio of modified soybean adhesive are 30-35:6-10:6-10.
5. according to the wiring board composition epoxy resin described in any one of claim 1-4, it is characterised in that polyether glycol two
Glycidyl ether, the weight ratio of trimethylolpropane glycidyl ether are 12-15:40-50.
6. according to the wiring board composition epoxy resin described in any one of claim 1-5, it is characterised in that bisphenol A-type ring
Epoxy resins, the weight ratio of bisphenol f type epoxy resin are 30-35:6-10.
7. according to the wiring board composition epoxy resin described in any one of claim 1-6, it is characterised in that its raw material is by weight
Amount part includes: bisphenol A type epoxy resin 30-35 part, bisphenol f type epoxy resin 6-10 part, polyether Hexanediol diglycidyl ether 12-
15 parts, trimethylolpropane glycidyl ether 40-50 part, modified soybean adhesive 6-10 part, (phenyl is different for 4,4'-methylene two
Cyanate) 8-12 part, 2,4-diaminourea-3,5-diethyltoluene 0.6-1 part, tetrahydrochysene phthalate anhydride 0.8-1 part, 2,6-diaminos
Base-3,5-diethyltoluene 1.2-1.5 part, polyester 6-8 part, polyamine 8-11 part, polyacrylic acid 3-6 part, Kaolin 9-12 part is swollen
Profit soil 3-5 part, nano-titanium oxide 2-4 part, brucite 2-4 part, titanium oxide 6-8 part, ball-shaped silicon micro powder 5-7 part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610463391.XA CN106117973A (en) | 2016-06-23 | 2016-06-23 | A kind of wiring board composition epoxy resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610463391.XA CN106117973A (en) | 2016-06-23 | 2016-06-23 | A kind of wiring board composition epoxy resin |
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| Publication Number | Publication Date |
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| CN106117973A true CN106117973A (en) | 2016-11-16 |
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| CN201610463391.XA Pending CN106117973A (en) | 2016-06-23 | 2016-06-23 | A kind of wiring board composition epoxy resin |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101124258A (en) * | 2005-02-21 | 2008-02-13 | 昭和电工株式会社 | Thermosetting composition for solder resist and cured product thereof |
| CN101851388A (en) * | 2009-03-31 | 2010-10-06 | 日立化成工业株式会社 | Electronic component-use liquid resin composition and electronic part apparatus |
| CN101910238A (en) * | 2008-01-08 | 2010-12-08 | 陶氏环球技术公司 | Be used for the high Tg epoxy systems that matrix material is used |
| CN104610909A (en) * | 2015-02-26 | 2015-05-13 | 许丽萍 | Aldehyde-free vegetable protein-based wood adhesive as well as preparation and application methods thereof |
-
2016
- 2016-06-23 CN CN201610463391.XA patent/CN106117973A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101124258A (en) * | 2005-02-21 | 2008-02-13 | 昭和电工株式会社 | Thermosetting composition for solder resist and cured product thereof |
| CN101910238A (en) * | 2008-01-08 | 2010-12-08 | 陶氏环球技术公司 | Be used for the high Tg epoxy systems that matrix material is used |
| CN101851388A (en) * | 2009-03-31 | 2010-10-06 | 日立化成工业株式会社 | Electronic component-use liquid resin composition and electronic part apparatus |
| CN104610909A (en) * | 2015-02-26 | 2015-05-13 | 许丽萍 | Aldehyde-free vegetable protein-based wood adhesive as well as preparation and application methods thereof |
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Application publication date: 20161116 |
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