CN106098680A - A kind of glory LED lamp bead and preparation method thereof - Google Patents
A kind of glory LED lamp bead and preparation method thereof Download PDFInfo
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- CN106098680A CN106098680A CN201610722902.5A CN201610722902A CN106098680A CN 106098680 A CN106098680 A CN 106098680A CN 201610722902 A CN201610722902 A CN 201610722902A CN 106098680 A CN106098680 A CN 106098680A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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Abstract
The invention provides a kind of glory LED lamp bead and preparation method thereof.This glory LED lamp bead includes four primary colors wafers and substrate, wherein, described four primary colors wafers are respectively red wafer, green wafer, the first blue dies and warm white wafer, described warm white wafer is fitted by fluorescence diaphragm and the second blue dies and is formed, described fluorescence diaphragm is attached to the top layer of described second blue dies, described four primary colors wafers are that matrix pattern is arranged on the substrate, and described red wafer, warm white wafer, the first blue dies and green wafer are arranged counterclockwise；The colour temperature of described warm white wafer is 2700K 3000K, shows index >=80.The present invention also provides for the preparation method of above-mentioned glory LED lamp bead.The glory LED lamp bead that the present invention provides can send the most warm-toned colorful light, and it also has the reference color temperature more broader than traditional glory LED lamp bead and display index simultaneously.
Description
Technical field
The invention belongs to semiconductor applications, relate to a kind of LED illumination technology, particularly relate to a kind of glory LED lamp bead and
Preparation method.
Background technology
LED is a kind of quasiconductor that can convert electrical energy into luminous energy, and LED light source is with its life-span length, light efficiency height, shock resistance
Can well the most not cracky, the radiationless advantage that conventional light source cannot compare therewith with low-power consumption etc. and be widely used in illumination and lead
Territory.
For general lighting, white light LEDs is likely to become replacement white heat with its advantage such as energy-saving and environmental protection and long-life
Lamp, tengsten lamp, the maximum potential green illumination light source of fluorescent lamp.But development and the variation of the modern life along with LED technology
And the increase of city lighting engineering, LED illumination is no longer only required to illuminate, more stresses the quality of illumination, to glory by people
Demand also get more and more.The important parameter directly affecting glory quality is: the color rendering index of light source and colour temperature.Optimal light
Source is nature light, and it has extraordinary color rendering properties and multiple different colour temperature.But, how to be obtained in that as natural light
The artificial light sources of quality of lighting, the most in the last hundred years dream of the mankind.So far, mankind's electric light source from electric filament lamp to energy-conservation
Lamp, then LED till now, have only electric filament lamp in terms of development properties can access expansion light (electric filament lamp whole colour developing refer to
Number R1-R15 is more than 95).Regrettably the colour temperature that electric filament lamp is the most fixing, consume energy poor efficiency, will be eliminated.In recent years,
How people are obtained in that New LED artificial light sources as natural light in research: can either be in wide scope
(2700-6500K) adjustable color, can keep again the color rendering index (R1-R15 is more than 90) of superelevation within the range.
At present, the reddest bluish-green light source with cool white combination that market existing glory LED lamp bead uses, but this light
The color that source sends is colder, and reference color temperature is less, and the light of cool tone easily allows the eyes of people tired, the most described
Do not please eyes, so glory LED lamp bead need to be updated.
Summary of the invention
In view of the shortcoming of above-mentioned prior art, it is an object of the invention to provide a kind of glory LED lamp bead and preparation side thereof
Method.This glory LED lamp bead can send the most warm-toned colorful light, and it also has more broader than traditional glory LED lamp bead simultaneously
Reference color temperature and display index.
In order to reach aforesaid goal of the invention, the present invention provides a kind of glory LED lamp bead, it include four primary colors wafers and
Substrate, wherein, described four primary colors wafers are respectively red wafer, green wafer, the first blue dies and warm white wafer,
Described warm white wafer is fitted by fluorescence diaphragm and the second blue dies and is formed, and it is blue that described fluorescence diaphragm is attached to described second
The top layer of color wafer,
Described four primary colors wafers are that matrix pattern is arranged on the substrate, and described red wafer, warm white wafer, the first indigo plant
Color wafer and green wafer are arranged counterclockwise；Wherein,
The colour temperature of described warm white wafer is 2700K-3000K, shows index >=80.
In above-mentioned glory LED lamp bead, described red wafer and described first blue dies are that diagonal is arranged, described green
Color wafer and described warm white wafer are that diagonal is arranged.Described glory LED lamp bead is mixed colours by described warm white wafer.
In above-mentioned glory LED lamp bead, it is preferable that the thickness of described fluorescence diaphragm is 90 μm-200 μm.
In above-mentioned glory LED lamp bead, it is preferable that described fluorescence diaphragm is by UV film layer and fluorescent powder silica gel film stacking conjunction
Become；Described UV film layer is the bottom of described fluorescence diaphragm, with described second blue dies laminating.
In above-mentioned glory LED lamp bead, it is preferable that be provided with LED electrode position, described LED electrode on described fluorescence diaphragm
Position is a diameter of 90 μm-200 μm round LED electrode positions or is 90 μm-200 μm square LED electrode positions for the length of side.
In above-mentioned glory LED lamp bead, it is preferable that be provided with a positive pole pin on described substrate and four negative poles draw
Foot, described four negative pin include that red negative pin, green negative pin, the first blue negative pin and warm white bear pin,
Described positive pole pin positive electrical with described four primary colors wafers respectively is connected,
Described redness is born pin and is connected with the negative electricity of described red wafer, and described green bears bearing of pin and described green wafer
Pole electrically connects, and described first blue negative pin is connected with the negative electricity of described first blue dies, described warm white bear pin and
The negative electricity of described warm white wafer connects.
The glory LED lamp bead that the present invention provides, can utilize red bluish-green and warm white combination light source to send the most warm-toned many
Glory line, gives cosy sensation, solves red bluish-green and that cool white combined light source LED causes colored light colder
Problem；This glory LED lamp bead has the reference color temperature more broader than traditional glory LED lamp bead and display index simultaneously, can show
More colorful color.
The present invention also provides for the preparation method of above-mentioned glory LED lamp bead, and it comprises the following steps:
Step one: prepare fluorescence diaphragm；
Step 2: redness wafer, the second blue dies, the first blue dies and green wafer are fixed on base counterclockwise
On plate, obtain Prefabricated substrate material；
Step 3: described Prefabricated substrate material is carried out pad pasting sheet process, makes described fluorescence diaphragm and described second blue dies
Surface fit tightly, then at a temperature of 90 DEG C-200 DEG C toast 10min-300min, obtain LED-baseplate material；
Step 4: described LED-baseplate material is carried out bonding wire, pressing mold, cutting, light splitting braid and packing processes successively, obtains coloured silk
Light LED lamp bead.
In above-mentioned preparation method, it is preferable that what described pad pasting sheet processed concretely comprises the following steps: by described Prefabricated substrate material
Put in laminator, then use spot gluing equipment at the surface point glue of described second blue dies, pick up followed by laminator
Described fluorescence diaphragm is attached to the surface of described second blue dies.
In above-mentioned preparation method, described laminator and spot gluing equipment are machine commonly used in the art, use spot gluing equipment to exist
The glue of the surface point trace of described second blue dies, then allows laminator pick up described fluorescence diaphragm and is attached to described second indigo plant
The surface of color wafer, can make fluorescent film sheet and the second blue dies fit tightly, prevent light leak, reduces glue to warm white simultaneously
The impact of coloured light line.After the surface of described fluorescence diaphragm Yu described second blue dies fits tightly, 90 DEG C of-200 DEG C of temperature
Toast 10min-300min under degree, described second blue dies can be made to become warm white wafer, then with red wafer, the first indigo plant
Color wafer, green wafer combination form warm light light source.
In above-mentioned preparation method, it is preferable that described fluorescence diaphragm of preparing comprises the following steps:
(1) the UV film that thickness is 85 μm-200 μm is paved, be then introduced into photoresist the levelling of 10 μm-100 μm, subsequently 80
Toast 30min-300min at a temperature of DEG C-200 DEG C, obtain UV photoresist film；
(2) on described UV photoresist film, cover mask plate, and at 250nm-410nm exposed under UV light 0.1-30s, exist subsequently
Developer solution develops, is placed in 1min-300min in the corrosive liquid of 90 DEG C of-150 ° of C and removes photoresist, be then washed with deionized,
To being loaded with the UV photoresist film of a diameter of 90 μm-200 μm circular light photoresist posts or to be loaded with the length of side be 90 μm-200 μm square lights
The UV photoresist film of photoresist post；
(3) fluorescent material is mixed for 4:1 in mass ratio with silica gel liquid, is then introduced on the UV photoresist film of step (2) gained,
And levelling, solidification, it is subsequently placed at press mold in knifing machine, obtains the composite membrane of 90 μm-200 μm；
(4) described composite membrane is toasted at a temperature of 100 DEG C-200 DEG C 10min-300min, be subsequently placed in photoresist corrosive liquid
Described circular light photoresist post or square light photoresist post are removed, is formed and be loaded with a diameter of 90 μm-200 μm round LED electrode positions
Fluorescence diaphragm or be loaded with the fluorescence diaphragm that the length of side is 90 μm-200 μm square LED electrode positions.
In above-mentioned preparation method, described photoresist, developer solution, corrosive liquid and photoresist corrosive liquid can be that this area is normal
Rule reagent.In described step 2, use the corrosive liquid 1min-300min that removes photoresist at a temperature of 90 DEG C of-150 ° of C can make UV film table
The unexposed photoresist in face is removed clean, reduces the glue impact on warm white light.
In above-mentioned preparation method, it is preferable that described fluorescent material is by yellow fluorescent powder, red fluorescence powder and green emitting phosphor
It is mixed to form, is in terms of 100% by the mass ratio of described fluorescent material, described yellow fluorescent powder, red fluorescence powder and green emitting phosphor
Mass ratio is (0-99): (0-99): (0-99).
In above-mentioned preparation method, it is preferable that described UV film intensity before ultraviolet photoetching is 10 N/mm2-30N/
mm2, the intensity after ultraviolet photoetching is 0.01 N/mm2-0.1N/mm2.Described UV film is when LED-baseplate material carries out bonding wire
Can be the most damaged, so that positive pole pin and negative pin have good electrical contact with described warm white wafer.
Beneficial effects of the present invention:
The glory LED lamp bead that the present invention provides, can utilize red bluish-green and warm white combination light source to send the most warm-toned colorful light
Line, gives cosy sensation, solves red bluish-green colder the asking of colored light caused with cool white combined light source LED
Topic；This glory LED lamp bead has the reference color temperature more broader than traditional glory LED lamp bead and display index simultaneously, can show more
Colorful color.And the glory LED lamp bead preparation method that the present invention provides, technique is simple, is suitable to large-scale production.
Accompanying drawing explanation
Fig. 1 is the warm white chip architecture schematic diagram of the glory LED lamp bead that embodiment 1 provides；
Fig. 2 is the arrangement schematic diagram of four primary colors wafers of the glory LED lamp bead that embodiment 1 provides.
Symbol description:
1 warm white wafer, 2 second blue dies, 3 fluorescence diaphragms, 4 LED electrode positions.
Detailed description of the invention
In order to the technical characteristic of the present invention, purpose and beneficial effect are more clearly understood from, the existing skill to the present invention
Art scheme carries out described further below, but it is not intended that can the restriction of practical range to the present invention.
Embodiment 1
Present embodiments providing a kind of glory LED lamp bead, it includes four primary colors wafers and substrate, wherein, four primary colors wafers
It is respectively red wafer, green wafer, the first blue dies and warm white wafer 1,
As it is shown in figure 1, warm white wafer 1 combined by fluorescence diaphragm 3, second blue dies 2 of 100 μm and LED electrode position 4 and
Becoming, fluorescence diaphragm 3 is attached to the top layer of the second blue dies 2, and fluorescence diaphragm 3 is by UV film layer and fluorescent powder silica gel film stacking conjunction
Becoming, UV film layer is the bottom of fluorescence diaphragm 3, fits tightly with the second blue dies 2；2 LED electricity it are provided with on fluorescence diaphragm 3
Position, pole 4, this LED electrode position be the length of side be the square LED electrode position of 100 μm；
Four primary colors wafers are that matrix pattern is arranged on substrate, as in figure 2 it is shown, red wafer, warm white wafer 1, first are blue
Wafer and green wafer are arranged counterclockwise, and red wafer and the first blue dies are that diagonal is arranged, green wafer and
Warm white wafer 1 is arranged in diagonal；
Being provided with a positive pole pin and four negative pin on substrate, four negative pin include that red negative pin, green are negative
Pin, the first blue negative pin and warm white bear pin,
Positive pole pin positive electrical with four primary colors wafers respectively is connected,
Red negative pin is connected with the negative electricity of red wafer, and green negative pin is connected with the negative electricity of green wafer, and first is blue
Color is born the negative electricity of pin and the first blue dies and is connected, and warm white is born pin and is connected with the negative electricity of warm white wafer 1.
The glory LED lamp bead of the present embodiment, the colour temperature of its warm white wafer 1 is 2700K-3000K, shows index >=80,
This glory LED lamp bead is mixed colours by warm white wafer 1.
The glory LED lamp bead of the present embodiment is prepared by following steps:
(1) by thickness be 85 μm-200 μm, the length of side be that the square UV film of 200mm-400mm entirely adsorbs at workbench
On, it is then introduced into photoresist the levelling of 10 μm-100 μm, at a temperature of 80 DEG C-200 DEG C, toasts 30min-300min subsequently,
To UV photoresist film；
(2) on UV photoresist film, mask plate is covered, then at 250nm-410nm exposed under UV light 0.1-30s, subsequently aobvious
Shadow liquid develops, is placed in 10min in the corrosive liquid of 100 ° of C and removes photoresist, be then washed with deionized, obtain being loaded with the length of side and be
The UV photoresist film of 100 μm square light photoresist posts；
(3) mixing fluorescent material and silica gel liquid for 4:1 in mass ratio, it is then introduced into the UV photoresist film of step (2) gained
On, and levelling, solidification, it being subsequently placed at press mold in knifing machine, the thickness between two rollers of knifing machine is controlled by this knifing machine
System, uses microscope to test, finally gives the composite membrane of 100 μm after press mold；
(4) composite membrane is toasted at a temperature of 150 DEG C 30min, be subsequently placed in photoresist corrosive liquid and square light photoresist post is gone
Remove, obtain being loaded with the fluorescence diaphragm 3 that the length of side is 100 μm square LED electrode position 4；
(5) redness wafer, second blue dies the 2, first blue dies and green wafer are fixed on substrate counterclockwise
On, obtain Prefabricated substrate material；
(6) Prefabricated substrate material is put in the laminator of specialty, then use spot gluing equipment on the surface of the second blue dies 2
The glue of some trace, utilizes laminator to pick up fluorescence diaphragm 3 and is fitted tightly over the surface of the second blue dies 2, then at 150 DEG C
At a temperature of toast 30min, make the second blue dies 2 become warm white wafer 1 so that its with red wafer, first blue brilliant
Sheet, green wafer combination form warm light light source, obtain LED-baseplate material；
(7) LED-baseplate material is carried out successively bonding wire, pressing mold, cutting, light splitting braid and packing processes, obtain glory LED
Pearl；
Wherein, fluorescent material is mixed to form by yellow fluorescent powder, red fluorescence powder and green emitting phosphor, with the mass ratio of fluorescent material is
100% meter, the mass ratio of yellow fluorescent powder, red fluorescence powder and green emitting phosphor is 50:35:15；UV film is before ultraviolet photoetching
Intensity be 20N/mm2, the intensity after ultraviolet photoetching is 0.05 N/mm2；
The color of the glory LED lamp bead of the present embodiment can be adjusted by adjusting the ratio between fluorescent material.
From embodiment 1, the glory LED lamp bead that the present invention provides, red bluish-green and warm white combination light source can be utilized to send out
Go out the most warm-toned colorful light, give cosy sensation, solve red bluish-green cause with cool white combined light source LED
The problem that colored light is colder；This glory LED lamp bead has the reference color temperature more broader than traditional glory LED lamp bead and shows simultaneously
Show index, more colorful color can be shown.And the glory LED lamp bead preparation method that the present invention provides, technique is simple, is suitable to advise greatly
Mould produces.
Claims (10)
1. a glory LED lamp bead, it includes four primary colors wafers and substrate, it is characterised in that: described four primary colors wafers divide
Not Wei red wafer, green wafer, the first blue dies and warm white wafer,
Described warm white wafer is fitted by fluorescence diaphragm and the second blue dies and is formed, and it is blue that described fluorescence diaphragm is attached to described second
The top layer of color wafer,
Described four primary colors wafers are that matrix pattern is arranged on the substrate, and described red wafer, warm white wafer, the first indigo plant
Color wafer and green wafer are arranged counterclockwise；Wherein,
The colour temperature of described warm white wafer is 2700K-3000K, shows index >=80.
Glory LED lamp bead the most according to claim 1, it is characterised in that: the thickness of described fluorescence diaphragm is 90 μm-200 μ
m。
Glory LED lamp bead the most according to claim 1, it is characterised in that: described fluorescence diaphragm is by UV film layer and fluorescent material
Pellosil layer is formed by stacking；Described UV film layer is the bottom of described fluorescence diaphragm, with described second blue dies laminating.
Glory LED lamp bead the most according to claim 1, it is characterised in that: it is provided with LED electrode on described fluorescence diaphragm
Position, described LED electrode position is a diameter of 90 μm-200 μm round LED electrode positions or is 90 μm-200 square LED of μm for the length of side
Electrode position.
Glory LED lamp bead the most according to claim 1, it is characterised in that: it is provided with a positive pole pin on described substrate
With four negative pin, described four negative pin include red negative pin, green negative pin, the first blue negative pin and warm white
Color bears pin,
Described positive pole pin positive electrical with described four primary colors wafers respectively is connected,
Described redness is born pin and is connected with the negative electricity of described red wafer, and described green bears bearing of pin and described green wafer
Pole electrically connects, and described first blue negative pin is connected with the negative electricity of described first blue dies, described warm white bear pin and
The negative electricity of described warm white wafer connects.
6. the preparation method of the glory LED lamp bead described in any one of claim 1-5, it comprises the following steps:
Step one: prepare fluorescence diaphragm；
Step 2: redness wafer, the second blue dies, the first blue dies and green wafer are fixed on base counterclockwise
On plate, obtain Prefabricated substrate material；
Step 3: described Prefabricated substrate material is carried out pad pasting sheet process, makes described fluorescence diaphragm and described second blue dies
Surface fit tightly, then at a temperature of 90 DEG C-200 DEG C toast 10min-300min, obtain LED-baseplate material；
Step 4: described LED-baseplate material is carried out bonding wire, pressing mold, cutting, light splitting braid and packing processes successively, obtains coloured silk
Light LED lamp bead.
Preparation method the most according to claim 6, it is characterised in that: what described pad pasting sheet processed concretely comprises the following steps: by institute
Stating Prefabricated substrate material and put in laminator, then use spot gluing equipment is at the surface point glue of described second blue dies, subsequently
Utilize laminator to pick up described fluorescence diaphragm and be attached to the surface of described second blue dies.
Preparation method the most according to claim 6, it is characterised in that: described fluorescence diaphragm of preparing comprises the following steps:
(1) the UV film that thickness is 85 μm-200 μm is paved, be then introduced into photoresist the levelling of 10 μm-100 μm, subsequently 80
Toast 30min-300min at a temperature of DEG C-200 DEG C, obtain UV photoresist film；
(2) on described UV photoresist film, cover mask plate, and at 250nm-410nm exposed under UV light 0.1-30s, exist subsequently
Developer solution develops, is placed in 1min-300min in the corrosive liquid of 90 DEG C of-150 ° of C and removes photoresist, be then washed with deionized,
To being loaded with the UV photoresist film of a diameter of 90 μm-200 μm circular light photoresist posts or to be loaded with the length of side be 90 μm-200 μm square lights
The UV photoresist film of photoresist post；
(3) fluorescent material is mixed for 4:1 in mass ratio with silica gel liquid, is then introduced on the UV photoresist film of step (2) gained,
And levelling, solidification, it is subsequently placed at press mold in knifing machine, obtains the composite membrane of 90 μm-200 μm；
(4) described composite membrane is toasted at a temperature of 100 DEG C-200 DEG C 10min-300min, be subsequently placed in photoresist corrosive liquid
Described circular light photoresist post or square light photoresist post are removed, is formed and be loaded with a diameter of 90 μm-200 μm round LED electrode positions
Fluorescence diaphragm or be loaded with the fluorescence diaphragm that the length of side is 90 μm-200 μm square LED electrode positions.
Preparation method the most according to claim 8, it is characterised in that: described fluorescent material is by yellow fluorescent powder, red fluorescence
Powder and green emitting phosphor are mixed to form, and are in terms of 100% by the mass ratio of described fluorescent material, described yellow fluorescent powder, red fluorescence powder
It is (0-99) with the mass ratio of green emitting phosphor: (0-99): (0-99).
Preparation method the most according to claim 8, it is characterised in that: described UV film intensity before ultraviolet photoetching is
10 N/mm2-30N/mm2, the intensity after ultraviolet photoetching is 0.01 N/mm2-0.1N/mm2。
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| CN201610722902.5A CN106098680B (en) | 2016-08-25 | 2016-08-25 | A kind of glory LED lamp bead and preparation method thereof |
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| CN201610722902.5A CN106098680B (en) | 2016-08-25 | 2016-08-25 | A kind of glory LED lamp bead and preparation method thereof |
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| CN101894832A (en) * | 2009-05-21 | 2010-11-24 | 海立尔股份有限公司 | Light-emitting diode (LED) structure for generating white light |
| CN204375749U (en) * | 2014-12-30 | 2015-06-03 | 厦门煜明光电有限公司 | A kind of slimming RGBW four-in-one light emitting diode construction |
| CN105042363A (en) * | 2015-06-29 | 2015-11-11 | 广东科立盈光电技术有限公司 | Four-primary color LED (light emitting diode) light source |
| CN206532777U (en) * | 2016-08-25 | 2017-09-29 | 广东新锐流铭光电有限公司 | A kind of glory LED lamp bead |
-
2016
- 2016-08-25 CN CN201610722902.5A patent/CN106098680B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894832A (en) * | 2009-05-21 | 2010-11-24 | 海立尔股份有限公司 | Light-emitting diode (LED) structure for generating white light |
| CN204375749U (en) * | 2014-12-30 | 2015-06-03 | 厦门煜明光电有限公司 | A kind of slimming RGBW four-in-one light emitting diode construction |
| CN105042363A (en) * | 2015-06-29 | 2015-11-11 | 广东科立盈光电技术有限公司 | Four-primary color LED (light emitting diode) light source |
| CN206532777U (en) * | 2016-08-25 | 2017-09-29 | 广东新锐流铭光电有限公司 | A kind of glory LED lamp bead |
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