CN106094444B - A kind of dynamic gas for extreme ultra violet lithography is locked - Google Patents
A kind of dynamic gas for extreme ultra violet lithography is locked Download PDFInfo
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- CN106094444B CN106094444B CN201610391179.7A CN201610391179A CN106094444B CN 106094444 B CN106094444 B CN 106094444B CN 201610391179 A CN201610391179 A CN 201610391179A CN 106094444 B CN106094444 B CN 106094444B
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- 238000001900 extreme ultraviolet lithography Methods 0.000 title abstract description 20
- 230000007246 mechanism Effects 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 239000007789 gas Substances 0.000 description 101
- 230000003287 optical effect Effects 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000003344 environmental pollutant Substances 0.000 description 3
- 231100000719 pollutant Toxicity 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 239000002912 waste gas Substances 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 241000233855 Orchidaceae Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
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- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a kind of dynamic gas lock, especially suitable for extreme ultra violet lithography.The main body of dynamic gas lock is tubular, has two openends, and there is its axial medium position a dividing plate inner space is divided into two chambers.Outer gas channel connection two chambers are provided with dividing plate.There is interior air-flow passage in the dividing plate of outer gas channel side, clean gas is entered by aerating device, and two chambers are separately flowed into by inside and outside gas channel.The present invention can be effectively isolated ultra-clean vacuum environment and clean vacuum environment in extreme ultra violet lithography, suppress dusty gas molecule and spread from clean vacuum environment to ultra-clean vacuum environment.
Description
Technical field
The invention belongs to extreme ultra violet lithography technical field, and in particular to the dynamic gas for extreme ultra violet lithography is locked.
Background technology
Because the extreme ultraviolet irradiation of air and almost all of refractive optics material to 13.5nm wavelength has strong suction
Adduction, cause under extreme ultra violet lithography (Extreme Ultraviolet Lithography-EUVL) and normal air environment
Litho machine differ widely.The main feature of extreme ultra violet lithography is shown：Optical system is reflective optical system；Inner loop
Border is vacuum environment, except the EUV irradiation to 13.5nm has high transmittance, can also be discharged caused polluter rapidly.
The all parts system such as light source, optical system, mask platform and work stage of extreme ultra violet lithography is placed in vacuum environment.It is each
Component working environment is different, and different vacuum chambers have different vacuum requirements in extreme ultra violet lithography.
The vacuum environment of the lamp optical system of extreme ultra violet lithography, imaging optical system etc. is ultra-clean vacuum environment,
This vacuum environment can meet the ultra-clean use environment requirement of EUVL optical mirror slips under certain vacuum degree.It is true in the ultra-clean
In Altitude, except EUV to be ensured irradiation is approximate lossless by also to avoid pollutant depositing, really in optical system
The service life of optical system is protected, so needing the vacuum deflation rate of strict control ultra-clean vacuum environment internal material and being released
Put the partial pressure of gas component.There is document (Abneesh Srivastava, Stenio Pereira, Thomas Gaffney.Sub-
Atmospheric Gas Purification for EUVL Vacuum Environment Control.SPIE, 2012) refer to
Go out, ultra-clean vacuum environment requires hydrocarbon (CxHy) partial pressure be not more than 1 × 10-9Mbar, water partial pressure are not more than 1 × 10- 7Mbar, to ensure that the loss of reflectivity in optical system 7-10 is less than 1%.
The vacuum environment of the parts such as the silicon wafer stage of extreme ultra violet lithography is clean vacuum environment.Do not include in this vacuum environment
Optical element, only it need to meet clean vacuum requirement.In the clean vacuum environment, not comprising optical element, EUV irradiation light path is only
By seldom a part of region, it requires be not as so high as ultra-clean vacuum environment, can allow to produce certain impurity (such as silicon
Pollutant caused by photic anti-aging drug on the silicon chip of piece platform) but need to strictly control the diffusion of impurity.
The thang-kng aperture that certain pore size is provided with ultra-clean vacuum environment is connected with clean vacuum environment, and extreme ultraviolet irradiation is logical
This aperture is crossed, the silicon chip being opposite in clean vacuum environment is exposed.The photoresist of silicon chip surface irradiates in extreme ultraviolet
In the presence of photochemical reaction can occur, produce to optical element in ultra-clean vacuum environment be harmful to waste gas and pollution particle,
These waste gas and pollution particle must be discharged in time by vacuum pumping system.
To maintain ultra-clean vacuum environment, it is highly desirable to establish between ultra-clean vacuum environment and clean vacuum environment
Dynamic gas locks (Dynamic Gas Lock-DGL), so as to which require two kinds of differences is environmentally isolated.Meanwhile in order to more preferable
Ensure that extreme ultraviolet exposure beam quality is not influenceed by dynamic gas lock, it is necessary to which the cleaning gas tream in dynamic gas lock is as far as possible equal
It is even.
In EUVL, the clean gas molecule injected is locked by dynamic gas and ultra-clean to be flowed in clean vacuum environment is true
Approximately linear elastic collision occurs for the dusty gas molecule of Altitude, make dusty gas molecule pass back into clean vacuum environment so as to
Reach and suppress the effect that dusty gas molecule spreads to ultra-clean vacuum environment.The inhibition depends on participating in the cleaning of collision
Gas molecula number purpose how many (the clean gas flows of corresponding macroscopic view), how much (corresponding contamination gases of dusty gas molecule amount
Body deflation rate), size (the corresponding dirt of the size of clean gas molecular weight (corresponding clean gas species) and dusty gas molecular weight
Contaminate gaseous species).
The content of the invention
(1) technical problems to be solved
The technical problems to be solved by the invention be how to suppress extreme ultra violet lithography at work caused pollutant by
Clean vacuum environment spreads to ultra-clean vacuum environment, and ensures the shadow that extreme ultraviolet exposure beam quality is not locked by dynamic gas
Ring.
(2) technical scheme
In order to solve the above technical problems, the present invention proposes a kind of dynamic gas lock, for the part for connecting two spaces
Gas barrier, including main body, aerating device and sealing connection mechanism are carried out, wherein, the main body is tubular, has two openings
End, the direction of two openends of connection is axial direction, is lateral perpendicular to axially direction；The middle position of the main body axially
Put and the inner space of tubular is divided into two chambers with dividing plate, the dividing plate；Outer gas channel is provided with the dividing plate, it is connected
Described two chambers；Interior air-flow is provided with the dividing plate and in the side of the outer gas channel, lateral along the main body
Passage, the interior air-flow passage connect the aerating device；The aerating device circulates via the interior air-flow passage and outer gas
Road is passed through clean gas to body interior；The sealing connection mechanism is used to carry out two openends of the main body with needing
The part of gas barrier is tightly connected.
According to a particular embodiment of the invention, there is difference in the aperture of two openends of the outer gas channel, that is, divide
For slot end and wide mouth end, and slot end and wide mouth end are connected with clean vacuum chamber and ultra-clean vacuum chamber respectively.
According to a particular embodiment of the invention, the aerating device includes charging valve and pipeline, and the pipeline is run through
Connected in the dividing plate and with the interior air-flow passage.
According to a particular embodiment of the invention, the charging valve, pipeline and interior air-flow passage all have two respectively, respectively
It is symmetrically distributed in the both sides of the dividing plate.
According to a particular embodiment of the invention, at least one even flow plate, the cleaning gas are provided with the interior air-flow passage
Body flows into the outer gas channel by the even flow plate.
According to a particular embodiment of the invention, level Four even flow plate is provided with each interior air-flow passage, and closer to institute
The even flow plate small opening of stating aerating device is more sparse, aperture is bigger, closer to the small opening of the even flow plate of the outer gas channel it is closeer,
Aperture is smaller.
According to a particular embodiment of the invention, the aerating device includes pipeline, and the pipeline is run through in the dividing plate
And connected with the interior air-flow passage；Near the aerating device one-level even flow plate face pipeline and in pipeline it is straight
1~2 times of diameter region in footpath does not arrange small opening.
According to a particular embodiment of the invention, multistage even flow plate is provided with the interior air-flow passage, even flow plates at different levels have
Imitate small opening area sum approximately equal.
According to a particular embodiment of the invention, the interior air-flow passage is bell mouth shape, and its slot end is close to the outer gas
Circulation road.
According to a particular embodiment of the invention, the pipeline is multiple pipelines side by side, and the multiple pipeline connects jointly
To the interior air-flow passage.
(3) beneficial effect
Dynamic gas lock proposed by the present invention for extreme ultra violet lithography, which can be effectively isolated in extreme ultra violet lithography, to be surpassed
Clean vacuum environment and clean vacuum environment, suppress dusty gas molecule and expanded from clean vacuum environment to ultra-clean vacuum environment
Dissipate, and ensure that extreme ultraviolet exposure beam quality is not influenceed by dynamic gas lock.
Brief description of the drawings
Fig. 1 is the front view of one embodiment of the dynamic gas lock of the present invention；
Fig. 2 and Fig. 3 be respectively one embodiment of dynamic gas lock along two orthogonal faces in interior air-flow
Profile at passage 13；
Fig. 4 shows the sectional view of the main body of another embodiment of the dynamic gas lock of the present invention.
Embodiment
The part that dynamic gas proposed by the present invention locks for two spaces to be connected carries out gas barrier, and it is mainly by leading
Body, aerating device and sealing connection mechanism composition, aerating device can include charging valve and pipeline etc..Main body is tubular, tool
There are two openends, for axially, its axial medium position has a dividing plate, the dividing plate by cylinder for the directions of two openends of connection
The inner space of shape is divided into two chambers.Outer gas channel is provided with dividing plate, it connects described two chambers.Clean gas is by pipe
Road enters the main body of gas lock, then separately flows into simulation clean vacuum chamber and simulation ultra-clean vacuum chamber by outer gas channel
In room；Clean gas is typically not form the gas of pollution to the space in two parts to be connected.Gas lock main body
There is interior air-flow passage in dividing plate, clean gas is finally uniformly flowed into outer gas channel by multistage even flow plate respectively.Inflation
Device is passed through clean gas via interior air-flow passage and outer gas channel to body interior.Sealing connection mechanism is used for the master
Two openends of body and the part sealed connection for needing progress gas barrier.
For the object, technical solutions and advantages of the present invention are more clearly understood, below in conjunction with specific embodiment, and reference
Accompanying drawing, the present invention is described in further detail.
Fig. 1 is the front view of one embodiment of the dynamic gas lock of the present invention.As shown in figure 1, dynamic gas lock is
Symmetrical structure, it is made up of main body 1, charging valve 2, pipeline 3 and flange 4.Charging valve 2 and pipeline 3 are aerating device, flange
As sealing connection mechanism；
Cylindrical shape is presented in the main body 1 on the whole, and tubular has two openends, and the direction of two openends of connection is
The axial direction of tubular, it is lateral perpendicular to axially direction.Medium position on the axial direction of tubular, the main body 1 have
The inner space of tubular is divided into two chambers by one dividing plate 11, the dividing plate 11.And an outer gas channel 12 is provided with dividing plate 11,
It connects described two chambers.
Described dividing plate 11 has certain thickness, in the dividing plate 11 of the side of outer gas channel 12, along cylindrical body
It is lateral be provided with interior air-flow passage 13 (not showing in Fig. 1), the interior air-flow passage connects with pipeline 3, so as to the outer gas channel
12 are connected by interior air-flow road road 13 and pipeline 3 with charging valve 2, because dividing plate has certain thickness, therefore the pipe
The part in road 3 can be formed in dividing plate.As shown in figure 1, pipeline 3 can be extended out the side of dividing plate 11.
In this embodiment, charging valve 2 has two, and it is symmetrically distributed in the both sides of the dividing plate of main body, and leads to respectively
Cross the pipeline 3 for running through dividing plate 11, interior air-flow passage 13 connects with outer gas channel 12.
Two openends of the cylindrical body 1 are respectively by flange 4 with needing mutually isolated chamber to be connected.The method
Orchid can also be other sealed bindiny mechanisms.
The charging valve 2 in pipeline 3 and the outside gas channel 12 of interior air-flow passage 13 by injecting clean gas.Consider
The absorption coefficient irradiated to hydrogen, helium, argon gas, nitrogen to extreme ultraviolet is relatively small, the cleaning gas tream institute in dynamic gas lock
It is to dry without miscellaneous hydrogen, helium, argon gas, nitrogen or their two kinds/a variety of mixed gas with gas.
Difference be present in the aperture of two openends of the outer gas channel 12.In this embodiment, its flare shape,
Slot end and wide mouth end are connected with clean vacuum chamber and ultra-clean vacuum chamber respectively.Because in true EUV lithography machine ring
In border, the extreme ultraviolet light beam from imaging optical system (ultra-clean vacuum environment) to silicon wafer stage (clean vacuum environment) progressively becomes
It is small, so rectifying in the wide mouth end face ultra-clean vacuum chamber of the outer gas channel of bell mouth shape, its slot to clean vacuum
Chamber.
In embodiment as shown in Figure 1, gas lock main body 1 connects clean vacuum chamber and ultra-clean respectively by flange 4
Vacuum chamber, the now interior diameter of flange 4 sufficiently large (such as ten times of characteristic size for outer gas channel 12), clean vacuum
Chamber and ultra-clean vacuum chamber are sufficiently small (minimum dimension that can carry out flange assembly and disassembly) to the gas lock spacing of main body 1, this
Sample can reduce influence of the flange to space air flow method, so as to reduce the error that flange is brought.In other implementations,
1 liang of openend of main body that gas is locked can be directly connected to need to the two chambers of gas barrier, or gas is locked
The connection cavity wall of main body 1 and two chambers is integrated, although being not drawn into these situation figures, still falls within this patent protection model
Farmland.
The charging valve 2 of dynamic gas lock can be connected with exterior clean source of the gas, for locking internal injection cleaning gas to gas
Body simultaneously adjusts its injection flow (air-flow break-make is controlled under limiting case)；In order to obtain the flow of more high control precision, Ke Yi
Increase a gas mass flow controller (being not drawn into figure) between the charging valve and exterior clean source of the gas, for accurately controlling
Clean gas processed injects flow.Charging valve 2 locks interior air-flow passage 13, the outer gas channel 12 of main body 1 by pipeline 3 and gas
It is connected, clean gas is entered gas lock main body by pipeline, enter back into outer gas channel 12 and separately flow into clean vacuum chamber
In ultra-clean vacuum chamber.
Fig. 2 and Fig. 3 be respectively one embodiment of dynamic gas lock along two orthogonal faces in interior air-flow
Profile at passage 13.As shown in Figures 2 and 3, at least one even flow plate, clean gas warp can be provided with interior air-flow passage 13
Cross even flow plate and finally uniformly flow into outer gas channel 12.In this embodiment, two interior air-flow passages 13 are symmetrically distributed in outer
The both sides of gas channel 12, level Four even flow plate 14,15,16,17 is designed with each interior air-flow passage 13.
Even flow plate can be wire netting panel, be evenly arranged small opening thereon.The small opening quantity of even flow plate not at the same level and
Aperture can be different.Preferably, (being placed on can be effectively by cleaning gas in gas lock main body for effective small opening of even flow plates at different levels
Stream) area sum approximately equal, and closer to charging valve 2 even flow plate small opening is more sparse, aperture is bigger, closer to outer air-flow
The small opening of the even flow plate of passage 12 is closeer, aperture is smaller.Preferably for the one-level even flow plate 14 near charging valve, it is
The direct impact of cleaning gas tream flowed into from pipeline is avoided, it is as far as possible uniform also for the cleaning gas tream made in interior air-flow passage, its
Face pipeline and do not arrange small opening in 1~2 times of diameter region of pipeline interior diameter.
The optimization design of interior air-flow passage 13 is also for bell mouth shape, and its slot end is close to outer gas channel, wide opening
End is close to charging valve 2, thus, it is possible to the flow velocity for being effectively compressed clean gas, further improving its cleaning inside air-flow.So,
By the transition of multistage even flow plate, make clean gas finally gas channel outside the flow direction of uniform high speed.
Fig. 4 shows the sectional view of the main body of another embodiment of the dynamic gas lock of the present invention.With previous embodiment
The difference is that the pipeline is multiple pipelines (5 pipelines side by side are embodied as in the embodiment) side by side, the multiple pipeline
The interior air-flow passage is communicated to jointly.
Particular embodiments described above, the purpose of the present invention, technical scheme and beneficial effect are carried out further in detail
Describe in detail bright, it should be understood that the foregoing is only the present invention specific embodiment, be not intended to limit the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution and improvements done etc., the protection of the present invention should be included in
Within the scope of.
Claims (10)
1. a kind of dynamic gas lock, the part for two spaces to be connected carries out gas barrier, including main body, aerating device and
Sealing connection mechanism, wherein,
The main body (1) is tubular, has two openends, the direction of two openends of connection is axial direction, perpendicular to axial direction
Direction is lateral；
There is the medium position of the main body (1) axially dividing plate (11), the dividing plate (11) to be divided into the inner space of tubular
Two chambers；
Outer gas channel (12) is provided with the dividing plate (11), it connects described two chambers；
In the dividing plate (11) and in the side of the outer gas channel (12), lateral along the main body is provided with interior air-flow and led to
Road (13), the interior air-flow passage (13) connect the aerating device；
The aerating device is passed through clean gas via the interior air-flow passage (13) and outer gas channel (12) to body interior；
The sealing connection mechanism is used for two openends of the main body and needs the part for carrying out gas barrier to seal company
Connect.
2. dynamic gas lock as claimed in claim 1, it is characterised in that two openends of the outer gas channel (12)
There is difference in aperture, that is, be divided into slot end and wide mouth end, and slot end and wide mouth end respectively with clean vacuum chamber and ultra-clean
Vacuum chamber is connected.
3. dynamic gas lock as claimed in claim 1, it is characterised in that the aerating device includes exterior clean source of the gas, gas
Weight flow controller, charging valve (2) and pipeline (3), the pipeline (3) run through in the dividing plate (11) and with it is described
Interior air-flow passage (13) connects.
4. dynamic gas lock as claimed in claim 3, it is characterised in that the charging valve (2), pipeline (3) and interior air-flow
Passage (13) all has two respectively, is respectively symmetrically distributed in the both sides of the dividing plate (11).
5. dynamic gas lock as claimed in claim 1, it is characterised in that be provided with the interior air-flow passage (13) at least one
Even flow plate, the clean gas flow into the outer gas channel (12) by the even flow plate.
6. dynamic gas lock as claimed in claim 5, it is characterised in that be provided with level Four in each interior air-flow passage (13)
Even flow plate (14,15,16,17), and closer to the aerating device even flow plate small opening is more sparse, aperture is bigger, closer to institute
The small opening of stating the even flow plate of outer gas channel (12) is closeer, aperture is smaller.
7. dynamic gas lock as claimed in claim 6, it is characterised in that the aerating device includes pipeline (3), the pipeline
(3) run through in the dividing plate (11) and connected with the interior air-flow passage (13)；One-level near the aerating device is even
Flowing plate (14) does not arrange small opening in face pipeline and in 1~2 times of diameter region of pipeline interior diameter.
8. dynamic gas lock as claimed in claim 5, it is characterised in that be provided with multistage uniform flow in the interior air-flow passage (13)
Plate, effective small opening area sum of even flow plates at different levels are equal.
9. dynamic gas lock as claimed in claim 1, it is characterised in that the interior air-flow passage (13) is bell mouth shape, its
Slot end is close to the outer gas channel (12).
10. dynamic gas lock as claimed in claim 3, it is characterised in that the pipeline is multiple pipelines side by side, described more
Individual pipeline is communicated to the interior air-flow passage jointly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610391179.7A CN106094444B (en) | 2016-06-03 | 2016-06-03 | A kind of dynamic gas for extreme ultra violet lithography is locked |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610391179.7A CN106094444B (en) | 2016-06-03 | 2016-06-03 | A kind of dynamic gas for extreme ultra violet lithography is locked |
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| Publication Number | Publication Date |
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| CN106094444A CN106094444A (en) | 2016-11-09 |
| CN106094444B true CN106094444B (en) | 2017-11-10 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108398858B (en) * | 2018-03-20 | 2019-05-10 | 李笛 | A kind of gas isolator and partition method |
| CN108847568A (en) * | 2018-06-01 | 2018-11-20 | 武汉华星光电半导体显示技术有限公司 | Excimer laser and its laser window element replacement method |
| CN111965950B (en) * | 2020-08-25 | 2024-01-19 | 中国科学院微电子研究所 | Dynamic gas isolation device |
| CN114280893B (en) * | 2021-11-25 | 2023-08-01 | 中国科学院微电子研究所 | Pollution control system and method of photoetching machine and photoetching machine |
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| CN203480207U (en) * | 2013-08-08 | 2014-03-12 | 中国科学院光电研究院 | Spiral airflow dynamic gas lock for extreme ultraviolet lithography machine |
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| JP6280116B2 (en) * | 2012-08-03 | 2018-02-14 | エーエスエムエル ネザーランズ ビー．ブイ． | Lithographic apparatus and method |
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