CN106094268A - A kind of display floater cutting method - Google Patents
A kind of display floater cutting method Download PDFInfo
- Publication number
- CN106094268A CN106094268A CN201610423933.0A CN201610423933A CN106094268A CN 106094268 A CN106094268 A CN 106094268A CN 201610423933 A CN201610423933 A CN 201610423933A CN 106094268 A CN106094268 A CN 106094268A
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- China
- Prior art keywords
- roughened area
- roughened
- preparation
- cutting method
- display floater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention provides a kind of display floater cutting method, comprising: provide a display panels motherboard, it includes upper substrate and infrabasal plate；Display panels motherboard is cut；Upper substrate sets preparation the first roughened area；Infrabasal plate sets preparation the second roughened area；Preparation the first roughened area and preparation the second roughened area do roughening process, form the first roughened area and the second roughened area；Coated with adhesive in the first roughened area and in the second roughened area, bonds described upper substrate and described infrabasal plate.The display floater cutting method of the present invention is roughened by the cut edge at substrate, increases the contact area of itself and binding agent, makes binding agent difficult drop-off, and then does not results in liquid crystal leakage, improves product yield.
Description
Technical field
The present invention relates to display panels and manufacture field, particularly relate to a kind of display floater cutting method.
Background technology
Liquid crystal display (Thin Film Transinstor Liquid Crystal Display, TFT-LCD) becomes
For show tools the most common when daily life and work, display panels is the Important Components of liquid crystal display.
Display panels is generally cut by the motherboard of display panels in the fabrication process and forms, display panels
Motherboard comprise multiple display panels, each display panels include upper substrate, infrabasal plate and be positioned at upper substrate with
Liquid crystal between infrabasal plate.The cutting mode of the existing motherboard to display panels is: size is cut as required,
The most directly coating sealing compound is on section, and due to upper substrate and lower substrate surface smoother, being easily caused glue material comes off,
Thus liquid crystal leakage phenomenon occurs, have a strong impact on product yield.
Summary of the invention
The embodiment of the present invention provides a kind of and does the display floater cutting method that roughening processes on cutting section, to solve
Existing display floater cutting method is directly coated with sealing compound on cutting section, thus easily causes glue material and come off, and causes liquid
The brilliant technical problem revealed.
For solving the problems referred to above, the technical scheme that the present invention provides is as follows:
The embodiment of the present invention provides a kind of display floater cutting method, comprising:
Thering is provided a display panels motherboard, it includes upper substrate and infrabasal plate；
Described display panels motherboard is cut；
Described upper substrate sets preparation the first roughened area；Described infrabasal plate sets preparation the second roughening
Region；
Described preparation the first roughened area and described preparation the second roughened area are done roughening process, form the
One roughened area and the second roughened area；
Coated with adhesive in described first roughened area and in described second roughened area, by described upper substrate and
Described infrabasal plate bonds.
Described coated with adhesive in described first roughened area and described second roughened area, by described upper substrate
The step bonded with described infrabasal plate, also includes:
Described binding agent is carried out cured.
Described first roughened area is positioned at described upper substrate cutting side；Described second roughened area be positioned at described under
Substrate cut side.
After the described step cutting described display panels motherboard, described infrabasal plate includes one just to described
The upper surface of upper substrate, described upper surface includes view field and a non-view field of a upper substrate.
Described first roughened area is positioned at described upper substrate cutting side；Described second roughened area is positioned at described non-
In view field.
Described do in described preparation the first roughened area and described preparation the second roughened area roughening process
In step, radium-shine mode is used to be roughened.
Described do in described preparation the first roughened area and described preparation the second roughened area roughening process
In step, the mode of polishing is used to be roughened.
In display floater cutting method of the present invention, described binding agent is frame glue.
In the described step that described binding agent is carried out cured, described binding agent is carried out solid by the way of illumination
Change processes.
In the described step that described binding agent is carried out cured, described binding agent is carried out solid by the way of heating
Change processes.
Compared to the display floater cutting method of prior art, the display floater cutting method of the present invention is by cutting off
Do roughening on face to process, solve existing display floater cutting method because of upper substrate and lower substrate surface smoother, appearance
It is easily caused glue material glue material to come off, thus the technical problem of liquid crystal leakage phenomenon occurs.
Accompanying drawing explanation
Fig. 1 is the flow chart of the first preferred embodiment of the display floater cutting method of the present invention；
Fig. 2 A to Fig. 2 E is the steps flow chart schematic diagram of the first preferred embodiment of the display floater cutting method of the present invention；
Fig. 3 is the flow chart of the second preferred embodiment of the display floater cutting method of the present invention；
Fig. 4 A to Fig. 4 E is the steps flow chart schematic diagram of the second preferred embodiment of the display floater cutting method of the present invention.
Detailed description of the invention
Refer to the flow chart of the first preferred embodiment of the display floater cutting method that Fig. 1, Fig. 1 are the present invention.This is excellent
Select the display floater cutting method of embodiment, comprising:
Step S101, it is provided that a display panels motherboard, it includes upper substrate and infrabasal plate；
Step S102, cuts described display panels motherboard；
Step S103, sets preparation the first roughened area on described upper substrate；Described infrabasal plate sets preparation
Second roughened area；
Step S104, does at roughening in described preparation the first roughened area and described preparation the second roughened area
Reason, forms the first roughened area and the second roughened area；
Step S105, coated with adhesive in described first roughened area and in described second roughened area, by institute
State upper substrate and the bonding of described infrabasal plate；
The display floater cutting method of this preferred embodiment ends at step S105.
The detailed process of each step the following detailed description of the display floater cutting method of this preferred embodiment.
In step S101, as shown in Figure 2 A, it is provided that a display panels motherboard, it includes upper substrate 201 and lower base
Plate 203.Specifically, described upper substrate 201 can be thin film transistor (TFT) array mother substrate, and described infrabasal plate 203 can be colorized optical filtering
Sheet mother substrate.Wherein, described thin film transistor (TFT) array mother substrate includes multiple thin film transistor (TFT) array unit in matrix distribution,
Described colored filter mother substrate includes multiple in matrix distribution and relative with described thin film transistor (TFT) array cell position respectively
The color optical filter unit answered.The display panels motherboard that the embodiment of the present invention provides, described thin film transistor (TFT) array mother's base
Plate is fitted tightly by frame glue 202 with described colored filter mother substrate, and keeps a determining deviation.Then pass to step S102.
In step s 102, as shown in Figure 2 B, the display panels motherboard provided in step S101 is cut.Tool
Body ground, described display panels motherboard is cut by the size that the embodiment of the present invention needs according to display panels.With
After forward step S103 to.
In step s 103, as shown in Figure 2 C, described upper substrate sets preparation the first roughened area 204；Institute
State and on infrabasal plate, set preparation the second roughened area 205.Specifically, the embodiment of the present invention is by the cutting side on described upper substrate
Face is set as preparing the first roughened area 204, and the cutting side on described infrabasal plate is set as preparing the second roughened area
205.Then pass to step S103.
In step S104, as shown in Figure 2 D, coarse in described preparation the first roughened area 204 and described preparation second
Change and on region 205, do roughening process, form the first roughened area 206 and the second roughened area 207.Specifically, this
Bright embodiment by following two mode to described preparation the first roughened area 204 and described preparation the second roughened area
205 are roughened.
Preferably, the embodiment of the present invention by the way of radium-shine to described preparation the first roughened area 204 and described pre-
Standby second roughened area 205 is done roughening and is processed.Specifically, described preparation the first roughened area is removed first by air gun
204 and described preparation the second roughened area 205 on glass chip, it is ensured that without glass chip remain；Then laser is used to visit
Head, prepares the first roughened area 204 and described preparation the second roughened area 205 surface described in direct calcination so that it is surface
It is carbonized, thus reaches to be roughened effect.Then pass to step S105.
Preferably, the embodiment of the present invention can also be to described preparation the first roughened area 204 He by the way of polishing
Described preparation the second roughened area 205 is done roughening and is processed.Specifically, first use air gun to remove described preparation first to be roughened
Glass chip on region 204 and described preparation the second roughened area 205, it is ensured that remain without glass chip；Then mill is used
Stone, directly polish described first preparation roughened area 204 and described preparation the second roughened area 205 so that it is rough surface.
Then pass to step S105.
In step S105, as shown in Figure 2 E, in described first roughened area 206 and described second roughened area
Coated with adhesive on 207, bonds described upper substrate 201 and described infrabasal plate 203.Specifically, the embodiment of the present invention is passed through
Do roughening in described preparation the first roughened area 204 and described preparation the second roughened area 205 to process, and described the
Coated with adhesive in one roughened area 206 and described second roughened area 207, the described preparation first of roughened process
Roughened area 204 and described preparation the second roughened area 205 are bigger with the contact area of binding agent, make described binding agent not
Easily come off from upper substrate 201 and infrabasal plate 202.Preferably, the binding agent described in the embodiment of the present invention is frame glue.
Further, the embodiment of the present invention carries out cured by following two mode to described binding agent.
Preferably, the embodiment of the present invention can carry out cured to described binding agent by the way of illumination.
Preferably, the embodiment of the present invention can also carry out cured to described binding agent by the way of heating.
Originally the display floater cutting method being preferable to carry out processes by doing roughening on cutting section, increases and cuts off
Face and the contact area of binding agent so that binding agent is difficult to come off from upper substrate and infrabasal plate, thus does not results in liquid crystal and let out
Dew.
Refer to the flow chart of the second preferred embodiment of the display floater cutting method that Fig. 3, Fig. 3 are the present invention.This is excellent
Select the display floater cutting method of embodiment, comprising:
Step S201, it is provided that a display panels motherboard, it includes upper substrate and infrabasal plate；
Step S202, cuts described display panels motherboard；
Step S203, sets preparation the first roughened area on described upper substrate；Described infrabasal plate sets preparation
Second roughened area；
Step S204, does at roughening in described preparation the first roughened area and described preparation the second roughened area
Reason, forms the first roughened area and the second roughened area；
Step S205, coated with adhesive in described first roughened area and in described second roughened area, by institute
State upper substrate and the bonding of described infrabasal plate；
The display floater cutting method of this preferred embodiment ends at step S205.
The detailed process of each step the following detailed description of the display floater cutting method of this preferred embodiment.
In step s 201, as shown in Figure 4 A, it is provided that a display panels motherboard, it includes upper substrate 401 and lower base
Plate 403.Specifically, described upper substrate 401 can be thin film transistor (TFT) array mother substrate, and described infrabasal plate 403 can be colorized optical filtering
Sheet mother substrate.Wherein, described thin film transistor (TFT) array mother substrate includes multiple thin film transistor (TFT) array unit in matrix distribution,
Described colored filter mother substrate includes multiple in matrix distribution and relative with described thin film transistor (TFT) array cell position respectively
The color optical filter unit answered.The display panels motherboard that the embodiment of the present invention provides, described thin film transistor (TFT) array mother's base
Plate is fitted tightly by frame glue 402 with described colored filter mother substrate, and keeps a determining deviation.Then pass to step S202.
In step S202, as shown in Figure 4 B, the display panels motherboard provided in step S201 is cut.Tool
Body ground, described display panels motherboard is cut by the size that the embodiment of the present invention needs according to display panels.Cut
After cutting, described infrabasal plate includes a just upper surface to described upper substrate, and described upper surface includes the view field of a upper substrate
With a non-view field.Then pass to step S203.
In step S203, as shown in Figure 4 C, described upper substrate sets preparation the first roughened area 404；Institute
State and on infrabasal plate, set preparation the second roughened area 405.Specifically, the embodiment of the present invention is by the cutting side on described upper substrate
Face is set as preparing the first roughened area 404, and the non-view field on described infrabasal plate is set as preparing the second roughening district
Territory 405.Then pass to step S204.
In step S204, as shown in Figure 4 D, coarse in described preparation the first roughened area 404 and described preparation second
Change and on region 405, do roughening process, form the first roughened area 406 and the second roughened area 407.Specifically, this
Bright embodiment by following two mode to described preparation the first roughened area 404 and described preparation the second roughened area
405 are roughened.
Preferably, the embodiment of the present invention by the way of radium-shine to described preparation the first roughened area 404 and described pre-
Standby second roughened area 405 is done roughening and is processed.Specifically, described preparation the first roughened area is removed first by air gun
404 and described preparation the second roughened area 405 on glass chip, it is ensured that without glass chip remain；Then laser is used to visit
Head, prepares the first roughened area 404 and described preparation the second roughened area 405 surface described in direct calcination so that it is surface
It is carbonized, thus reaches to be roughened effect.Then pass to step S205.
Preferably, the embodiment of the present invention can also be to described preparation the first roughened area 404 He by the way of polishing
Described preparation the second roughened area 405 is done roughening and is processed.Specifically, first use air gun to remove described preparation first to be roughened
Glass chip on region 404 and described preparation the second roughened area 405, it is ensured that remain without glass chip；Then mill is used
Stone, directly polish described first preparation roughened area 404 and described preparation the second roughened area 405 so that it is rough surface.
Then pass to step S205.
In step S205, as shown in Figure 4 E, in described first roughened area 406 and described second roughened area
Coated with adhesive on 407, bonds described upper substrate 401 and described infrabasal plate 403.Specifically, the embodiment of the present invention is passed through
Do roughening in described preparation the first roughened area 404 and described preparation the second roughened area 405 to process, and described the
Coated with adhesive in one roughened area 406 and described second roughened area 407, the described preparation first of roughened process
Roughened area 404 and described preparation the second roughened area 405 are bigger with the contact area of binding agent, make described binding agent not
Easily come off from upper substrate 401 and infrabasal plate 403.Preferably, the binding agent described in the embodiment of the present invention is frame glue.
Further, the embodiment of the present invention carries out cured by following two mode to described binding agent.
Preferably, the embodiment of the present invention can carry out cured to described binding agent by the way of illumination.
Preferably, the embodiment of the present invention can also by heating by the way of year described binding agent carry out cured.
Originally the display floater cutting method being preferable to carry out processes by doing roughening on cutting section, increases and cuts off
Face and the contact area of binding agent so that binding agent is difficult to come off from upper substrate and infrabasal plate, thus does not results in liquid crystal and let out
Dew.
In sum, although the present invention is disclosed above with preferred embodiment, but above preferred embodiment and be not used to limit
The present invention processed, those of ordinary skill in the art, without departing from the spirit and scope of the present invention, all can make various change and profit
Decorations, therefore protection scope of the present invention defines in the range of standard with claim.
Claims (10)
1. a display floater cutting method, it is characterised in that including:
Thering is provided a display panels motherboard, it includes upper substrate and infrabasal plate；
Described display panels motherboard is cut；
Described upper substrate sets preparation the first roughened area；Described infrabasal plate sets preparation the second roughening district
Territory；
Described preparation the first roughened area and described preparation the second roughened area are done roughening process, form first thick
Roughened area and the second roughened area；
Coated with adhesive in described first roughened area and in described second roughened area, by described upper substrate and described
Infrabasal plate bonds.
Display floater cutting method the most according to claim 1, it is characterised in that described in described first roughened area
With coated with adhesive in described second roughened area, the step that described upper substrate and described infrabasal plate are bonded, also include:
Described binding agent is carried out cured.
Display floater cutting method the most according to claim 1, it is characterised in that described first roughened area is positioned at institute
State upper substrate cutting side；Described second roughened area is positioned at described infrabasal plate cutting side.
The cutting method of display floater the most according to claim 1, it is characterised in that described to described LCD
After plate motherboard carries out the step cut, described infrabasal plate includes a just upper surface to described upper substrate, and described upper surface includes
The view field of one upper substrate and a non-view field.
Display floater cutting method the most according to claim 4, it is characterised in that described first roughened area is positioned at institute
State upper substrate cutting side；Described second roughened area is positioned in described non-view field.
Display floater cutting method the most according to claim 1, it is characterised in that described be roughened in described preparation first
Do on region and described preparation the second roughened area in the step that roughening processes, use radium-shine mode to carry out at roughening
Reason.
Display floater cutting method the most according to claim 1, it is characterised in that described be roughened in described preparation first
Do in the step that roughening processes on region and described preparation the second roughened area, use the mode of polishing to carry out at roughening
Reason.
Display floater cutting method the most according to claim 2, it is characterised in that described binding agent is frame glue.
Display floater cutting method the most according to claim 2, it is characterised in that described described binding agent is solidified
In the step processed, by the way of illumination, described binding agent is carried out cured.
Display floater cutting method the most according to claim 2, it is characterised in that described carry out described binding agent is consolidated
In the step that change processes, by the way of heating, described binding agent is carried out cured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610423933.0A CN106094268A (en) | 2016-06-15 | 2016-06-15 | A kind of display floater cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610423933.0A CN106094268A (en) | 2016-06-15 | 2016-06-15 | A kind of display floater cutting method |
Publications (1)
| Publication Number | Publication Date |
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| CN106094268A true CN106094268A (en) | 2016-11-09 |
Family
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| CN201610423933.0A Pending CN106094268A (en) | 2016-06-15 | 2016-06-15 | A kind of display floater cutting method |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1164863A (en) * | 1997-08-22 | 1999-03-05 | Nec Corp | Liquid crystal display panel and its production |
| CN1621895A (en) * | 2003-11-29 | 2005-06-01 | Lg.菲利浦Lcd株式会社 | Method for cutting liquid crystal display panel |
| CN101134639A (en) * | 2006-08-29 | 2008-03-05 | 精工爱普生株式会社 | Method of scribing stuck mother substrate and method of dividing stuck mother substrate |
| CN105044997A (en) * | 2015-08-27 | 2015-11-11 | 京东方科技集团股份有限公司 | Liquid crystal display panel, a preparation method thereof and liquid crystal display device |
-
2016
- 2016-06-15 CN CN201610423933.0A patent/CN106094268A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1164863A (en) * | 1997-08-22 | 1999-03-05 | Nec Corp | Liquid crystal display panel and its production |
| CN1621895A (en) * | 2003-11-29 | 2005-06-01 | Lg.菲利浦Lcd株式会社 | Method for cutting liquid crystal display panel |
| CN101134639A (en) * | 2006-08-29 | 2008-03-05 | 精工爱普生株式会社 | Method of scribing stuck mother substrate and method of dividing stuck mother substrate |
| CN105044997A (en) * | 2015-08-27 | 2015-11-11 | 京东方科技集团股份有限公司 | Liquid crystal display panel, a preparation method thereof and liquid crystal display device |
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Application publication date: 20161109 |