CN106084639A - A kind of phenolic resin insulation material and preparation method thereof - Google Patents

A kind of phenolic resin insulation material and preparation method thereof Download PDF

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Publication number
CN106084639A
CN106084639A CN201610531332.1A CN201610531332A CN106084639A CN 106084639 A CN106084639 A CN 106084639A CN 201610531332 A CN201610531332 A CN 201610531332A CN 106084639 A CN106084639 A CN 106084639A
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phenolic resin
parts
insulation material
resin
hot pressing
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张海棠
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Individual
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/14Polymer mixtures characterised by other features containing polymeric additives characterised by shape
    • C08L2205/16Fibres; Fibrils

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)

Abstract

The invention discloses a kind of phenolic resin insulation material and preparation method thereof, described phenolic resin insulation material includes 15 25 parts of phenolic resin, the castor oil modified alkyd resin of Colophonium 38 parts, metaphenylene unsaturated polyester resin 26 parts, dcpd resin 15 parts, hydroxypropyl starch 37 parts, polyoxyethylene polyoxypropylene monobutyl ether 35 parts, clay 26 parts, polypropylene fibre 37 parts, silicon nitride fiber 25 parts;Preparation method is: step 1: take phenolic resin, the castor oil modified alkyd resin of Colophonium, metaphenylene unsaturated polyester resin, dcpd resin, hydroxypropyl starch, polyoxyethylene polyoxypropylene monobutyl ether, heated and stirred in reactor by weight;Step 2: add clay, polypropylene fibre, silicon nitride fiber again in reactor, stir while adding;Step 3: carry out hot pressing, for phenolic resin insulation material by mixing material in reactor again.

Description

A kind of phenolic resin insulation material and preparation method thereof
Technical field
The invention belongs to field of heat insulating materials, relate to a kind of phenolic resin insulation material and preparation method thereof.
Background technology
Phenolic-aldehyde heat-insulation board has good thermal and insulating performance, and its heat conductivity is relatively low, commonly uses on market Exterior-wall heat insulation product inorganic, organic, can reach higher energy-saving effect.Phenolic-aldehyde heat-insulation board can be not only used for outside external wall Heat-insulation system, it is also possible to be applied to prefabricated house, cleaning shop, freezer chromatic steel sandwich plate, air conditioning wind pipe, pipe insulation, curtain wall are protected Temperature, thermal insulation of roof, the insulation of machine room rack, insulation of equipment, carbon-crystal electric hot plate insulation and the various field needing insulation.Phenolic aldehyde Its most prominent feature of warming plate be do not fire, low cigarette, high temperature resistance distortion.Which overcome original foam plastics type insulation material easy Combustion, thickness, the shortcoming of heat deformation, remain the features such as original foam plastics type insulation material light weight, easy construction.Improve phenol The performance of urea formaldehyde insulation material can effectively expand the purposes of phenolic resin insulation material.
Summary of the invention
Solve the technical problem that: phenolic aldehyde foam thermal insulation material has obtained substantial amounts of application in architectural engineering, existing Phenolic resin insulation material has the problem that heat insulation effect has much room for improvement, and the intensity of its pressure-resistant folding-resistant is relatively low simultaneously, the present invention Purpose be improve phenolic resin insulation material above-mentioned performance.
Technical scheme: in order to solve the problems referred to above, the invention discloses a kind of phenolic resin insulation material, described phenolic aldehyde Resin insulation material includes the composition of following weight parts:
Phenolic resin 15-25 part,
Colophonium castor oil modified alkyd resin 3-8 part,
Metaphenylene unsaturated polyester resin 2-6 part,
Dcpd resin 1-5 part,
Hydroxypropyl starch 3-7 part,
Polyoxyethylene polyoxypropylene monobutyl ether 3-5 part,
Clay 2-6 part,
Polypropylene fibre 3-7 part,
Silicon nitride fiber 2-5 part.
Preferably, described phenolic resin insulation material includes the composition of following weight parts:
Phenolic resin 16-22 part,
Colophonium castor oil modified alkyd resin 4-7 part,
Metaphenylene unsaturated polyester resin 3-5 part,
Dcpd resin 2-4 part,
Hydroxypropyl starch 4-6 part,
Polyoxyethylene polyoxypropylene monobutyl ether 4-5 part,
Clay 3-5 part,
Polypropylene fibre 4-6 part,
Silicon nitride fiber 3-4 part.
The preparation method of a kind of phenolic resin insulation material, described preparation method comprises the steps:
Step 1: take phenolic resin 15-25 part, Colophonium castor oil modified alkyd resin 3-8 part, metaphenylene unsaturated polyester by weight Ester resin 2-6 part, dcpd resin 1-5 part, hydroxypropyl starch 3-7 part, polyoxyethylene polyoxypropylene monobutyl ether 3-5 Part, in reactor, it is heated to temperature is 140-180 DEG C, stir 15-40min;
Step 2: add clay 2-6 part, polypropylene fibre 3-7 part, silicon nitride fiber 2-5 part, addition limit, limit again in reactor Stirring, is stirred for 10-20min after addition;
Step 3: carrying out hot pressing by mixing material in reactor again, hot pressing temperature is 150-160 DEG C, and hot pressing pressure is 50- 70MPa, after hot pressing, for phenolic resin insulation material.
Preferably, the preparation method of described a kind of phenolic resin insulation material, described step 1 adds in reactor Heat to temperature is 160 DEG C, stirs 25min.
Preferably, the preparation method of described a kind of phenolic resin insulation material, described step 2 is stirred for 15min.
Preferably, the preparation method of described a kind of phenolic resin insulation material, in described step 3, hot pressing temperature is 155 DEG C, hot pressing pressure is 60MPa.
Beneficial effect: the heat conductivity of phenolic resin insulation material prepared by the preparation method of the present invention is 0.014 W/ Below m K, rupture strength is at more than 15MPa, and comprcssive strength, at more than 50MPa, has possessed extraordinary heat-insulating property and strong Degree, can effectively improve insulation and the energy-saving effect of construction material in construction material.
Detailed description of the invention
Embodiment 1
Step 1: take 25 parts of phenolic resin, the castor oil modified alkyd resin of Colophonium 3 parts, metaphenylene unsaturated polyester resin by weight 6 parts, dcpd resin 1 part, hydroxypropyl starch 7 parts, polyoxyethylene polyoxypropylene monobutyl ether 3 parts, add in reactor Heat to temperature is 180 DEG C, stirs 15min;
Step 2: add clay 6 parts, polypropylene fibre 3 parts, silicon nitride fiber 5 parts again in reactor, stir while adding, add 20min it is stirred for after entering;
Step 3: carrying out hot pressing by mixing material in reactor again, hot pressing temperature is 160 DEG C, and hot pressing pressure is 50MPa, hot pressing After, for phenolic resin insulation material.
The heat conductivity of the phenolic resin insulation material of embodiment 1 is 0.014 W/m K, and hot strength is 16.7MPa, Comprcssive strength is 51.5MPa.
Embodiment 2
Step 1: take 15 parts of phenolic resin, the castor oil modified alkyd resin of Colophonium 8 parts, metaphenylene unsaturated polyester resin by weight 2 parts, dcpd resin 5 parts, hydroxypropyl starch 3 parts, polyoxyethylene polyoxypropylene monobutyl ether 5 parts, add in reactor Heat to temperature is 140 DEG C, stirs 40min;
Step 2: add clay 2 parts, polypropylene fibre 7 parts, silicon nitride fiber 2 parts again in reactor, stir while adding, add 10min it is stirred for after entering;
Step 3: carrying out hot pressing by mixing material in reactor again, hot pressing temperature is 150 DEG C, and hot pressing pressure is 70MPa, hot pressing After, for phenolic resin insulation material.
The heat conductivity of the phenolic resin insulation material of embodiment 2 is 0.013W/m K, and hot strength is 18.5MPa, anti- Compressive Strength is 50.2MPa.
Embodiment 3
Step 1: take 22 parts of phenolic resin, the castor oil modified alkyd resin of Colophonium 4 parts, metaphenylene unsaturated polyester resin by weight 3 parts, dcpd resin 4 parts, hydroxypropyl starch 6 parts, polyoxyethylene polyoxypropylene monobutyl ether 5 parts, add in reactor Heat to temperature is 180 DEG C, stirs 15min;
Step 2: add clay 3 parts, polypropylene fibre 6 parts, silicon nitride fiber 3 parts again in reactor, stir while adding, add 20min it is stirred for after entering;
Step 3: carrying out hot pressing by mixing material in reactor again, hot pressing temperature is 160 DEG C, and hot pressing pressure is 50MPa, hot pressing After, for phenolic resin insulation material.
The heat conductivity of the phenolic resin insulation material of embodiment 3 is 0.011W/m K, and hot strength is 24.1MPa, anti- Compressive Strength is 57.6MPa.
Embodiment 4
Step 1: take 16 parts of phenolic resin, the castor oil modified alkyd resin of Colophonium 7 parts, metaphenylene unsaturated polyester resin by weight 5 parts, dcpd resin 2 parts, hydroxypropyl starch 4 parts, polyoxyethylene polyoxypropylene monobutyl ether 4 parts, add in reactor Heat to temperature is 140 DEG C, stirs 40min;
Step 2: add clay 5 parts, polypropylene fibre 4 parts, silicon nitride fiber 4 parts again in reactor, stir while adding, add 10min it is stirred for after entering;
Step 3: carrying out hot pressing by mixing material in reactor again, hot pressing temperature is 150 DEG C, and hot pressing pressure is 70MPa, hot pressing After, for phenolic resin insulation material.
The heat conductivity of the phenolic resin insulation material of embodiment 4 is 0.012W/m K, and hot strength is 27.2MPa, anti- Compressive Strength is 59.3MPa.
Embodiment 5
Step 1: take 19 parts of phenolic resin, the castor oil modified alkyd resin of Colophonium 5 parts, metaphenylene unsaturated polyester resin by weight 4 parts, dcpd resin 3 parts, hydroxypropyl starch 5 parts, polyoxyethylene polyoxypropylene monobutyl ether 4 parts, add in reactor Heat to temperature is 160 DEG C, stirs 25min;
Step 2: add clay 4 parts, polypropylene fibre 5 parts, silicon nitride fiber 3 parts again in reactor, stir while adding, add 15min it is stirred for after entering;
Step 3: carrying out hot pressing by mixing material in reactor again, hot pressing temperature is 155 DEG C, and hot pressing pressure is 60MPa, hot pressing After, for phenolic resin insulation material.
The heat conductivity of the phenolic resin insulation material of embodiment 5 is 0.011W/m K, and hot strength is 30.6MPa, anti- Compressive Strength is 62.4MPa.
Comparative example 1
Step 1: take 25 parts of phenolic resin, dcpd resin 1 part, hydroxypropyl starch 7 parts, polyoxyethylene polyoxy third by weight Alkene single-butyl ether 3 parts, being heated to temperature in reactor is 180 DEG C, stirs 15min;
Step 2: add clay 6 parts, polypropylene fibre 3 parts, silicon nitride fiber 5 parts again in reactor, stir while adding, add 20min it is stirred for after entering;
Step 3: carrying out hot pressing by mixing material in reactor again, hot pressing temperature is 160 DEG C, and hot pressing pressure is 50MPa, hot pressing After, for phenolic resin insulation material.
The heat conductivity of the phenolic resin insulation material of comparative example 1 is 0.018 W/m K, and hot strength is 13.2MPa, Comprcssive strength is 40.9MPa.
Comparative example 2
Step 1: take 25 parts of phenolic resin, the castor oil modified alkyd resin of Colophonium 3 parts, metaphenylene unsaturated polyester resin by weight 6 parts, polyoxyethylene polyoxypropylene monobutyl ether 3 parts, being heated to temperature in reactor is 180 DEG C, stirs 15min;
Step 2: add clay 6 parts, polypropylene fibre 3 parts, silicon nitride fiber 5 parts again in reactor, stir while adding, add 20min it is stirred for after entering;
Step 3: carrying out hot pressing by mixing material in reactor again, hot pressing temperature is 160 DEG C, and hot pressing pressure is 50MPa, hot pressing After, for phenolic resin insulation material.
The heat conductivity of the phenolic resin insulation material of comparative example 2 is 0.019 W/m K, and hot strength is 11.7MPa, Comprcssive strength is 38.2MPa.
Comparative example 3
Step 1: take 25 parts of phenolic resin, the castor oil modified alkyd resin of Colophonium 3 parts, metaphenylene unsaturated polyester resin by weight 6 parts, dcpd resin 1 part, hydroxypropyl starch 7 parts, polyoxyethylene polyoxypropylene monobutyl ether 3 parts, add in reactor Heat to temperature is 180 DEG C, stirs 15min;
Step 2: add clay 6 parts again in reactor, stir while adding, be stirred for 20min after addition;
Step 3: carrying out hot pressing by mixing material in reactor again, hot pressing temperature is 160 DEG C, and hot pressing pressure is 50MPa, hot pressing After, for phenolic resin insulation material.
The heat conductivity of the phenolic resin insulation material of comparative example 3 is 0.023 W/m K, and hot strength is 11.5MPa, Comprcssive strength is 44.3MPa.

Claims (6)

1. a phenolic resin insulation material, it is characterised in that described phenolic resin insulation material includes following weight parts Composition:
Phenolic resin 15-25 part,
Colophonium castor oil modified alkyd resin 3-8 part,
Metaphenylene unsaturated polyester resin 2-6 part,
Dcpd resin 1-5 part,
Hydroxypropyl starch 3-7 part,
Polyoxyethylene polyoxypropylene monobutyl ether 3-5 part,
Clay 2-6 part,
Polypropylene fibre 3-7 part,
Silicon nitride fiber 2-5 part.
A kind of phenolic resin insulation material the most according to claim 1, it is characterised in that described phenolic resin thermal insulating material Material includes the composition of following weight parts:
Phenolic resin 16-22 part,
Colophonium castor oil modified alkyd resin 4-7 part,
Metaphenylene unsaturated polyester resin 3-5 part,
Dcpd resin 2-4 part,
Hydroxypropyl starch 4-6 part,
Polyoxyethylene polyoxypropylene monobutyl ether 4-5 part,
Clay 3-5 part,
Polypropylene fibre 4-6 part,
Silicon nitride fiber 3-4 part.
3. the preparation method of a phenolic resin insulation material, it is characterised in that described preparation method comprises the steps:
Step 1: take phenolic resin 15-25 part, Colophonium castor oil modified alkyd resin 3-8 part, metaphenylene unsaturated polyester by weight Ester resin 2-6 part, dcpd resin 1-5 part, hydroxypropyl starch 3-7 part, polyoxyethylene polyoxypropylene monobutyl ether 3-5 Part, in reactor, it is heated to temperature is 140-180 DEG C, stir 15-40min;
Step 2: add clay 2-6 part, polypropylene fibre 3-7 part, silicon nitride fiber 2-5 part, addition limit, limit again in reactor Stirring, is stirred for 10-20min after addition;
Step 3: carrying out hot pressing by mixing material in reactor again, hot pressing temperature is 150-160 DEG C, and hot pressing pressure is 50- 70MPa, after hot pressing, for phenolic resin insulation material.
The preparation method of a kind of phenolic resin insulation material the most according to claim 3, it is characterised in that described step Being heated to temperature in 1 in reactor is 160 DEG C, stirs 25min.
The preparation method of a kind of phenolic resin insulation material the most according to claim 3, it is characterised in that described step 15min it is stirred in 2.
The preparation method of a kind of phenolic resin insulation material the most according to claim 3, it is characterised in that described step In 3, hot pressing temperature is 155 DEG C, and hot pressing pressure is 60MPa.
CN201610531332.1A 2016-07-08 2016-07-08 A kind of phenolic resin insulation material and preparation method thereof Pending CN106084639A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610531332.1A CN106084639A (en) 2016-07-08 2016-07-08 A kind of phenolic resin insulation material and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610531332.1A CN106084639A (en) 2016-07-08 2016-07-08 A kind of phenolic resin insulation material and preparation method thereof

Publications (1)

Publication Number Publication Date
CN106084639A true CN106084639A (en) 2016-11-09

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102174839A (en) * 2011-03-02 2011-09-07 王建军 Interlayer heat-insulating structural slab and manufacturing method thereof
CN102875096A (en) * 2012-10-26 2013-01-16 苏州市德莱尔建材科技有限公司 Building fire protection heat insulation material
CN104017285A (en) * 2014-05-09 2014-09-03 太仓市金锚新材料科技有限公司 Novel heat-resistant and flame-retardant mixed thermal-insulation material and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102174839A (en) * 2011-03-02 2011-09-07 王建军 Interlayer heat-insulating structural slab and manufacturing method thereof
CN102875096A (en) * 2012-10-26 2013-01-16 苏州市德莱尔建材科技有限公司 Building fire protection heat insulation material
CN104017285A (en) * 2014-05-09 2014-09-03 太仓市金锚新材料科技有限公司 Novel heat-resistant and flame-retardant mixed thermal-insulation material and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
梁辉: "双环戊二烯树脂研究", 《热固性树脂》 *

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