CN106084265A - A kind of heat lamination composite and preparation method thereof - Google Patents

A kind of heat lamination composite and preparation method thereof Download PDF

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Publication number
CN106084265A
CN106084265A CN201610355364.0A CN201610355364A CN106084265A CN 106084265 A CN106084265 A CN 106084265A CN 201610355364 A CN201610355364 A CN 201610355364A CN 106084265 A CN106084265 A CN 106084265A
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composite
coating
heat lamination
organic silicon
kapton
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朱肖楠
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/123—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D143/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Coating compositions based on derivatives of such polymers
    • C09D143/04—Homopolymers or copolymers of monomers containing silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/67—Particle size smaller than 100 nm
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2443/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Derivatives of such polymers
    • C08J2443/04—Homopolymers or copolymers of monomers containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to field of compound material.The invention provides a kind of heat lamination composite, this composite is using Kapton as base material, and the coated on one side of described Kapton has waterborne organic silicon modified acrylic acid emulsion coating, another side coating silicone release coating.The present invention also provides for a kind of heat lamination composite material and preparation method thereof, and this composite uses the mode machine-shaping of double spread.Composite of the present invention uses polyimides as skeleton, waterborne organic silicon modified acrylic acid emulsion coating is as elastomer layer, release coating provides composite material surface certain low-frictional force as functional coating, finally realize thickness of composite material effectively to reduce, it is reduced to 0.035mm from original 0.3mm, ensures the heat-conductive characteristic of composite simultaneously；Composite of the present invention is effectively increased the productivity ratio of LCD heat pressing process, by 17 original/hour, is promoted to 68/hour, improves production efficiency, reduces production cost.

Description

A kind of heat lamination composite and preparation method thereof
Technical field
The present invention relates to Material Field, particularly relate to a kind of heat lamination composite and preparation method thereof.
Background technology
LCD have undistorted, radiate the advantages such as low, power consumption is few, volume is little, become the most the most frequently used display, and LCD Processing technology extremely complex, Preliminary division just has 40 multiple working procedures.One of them important operation is exactly hot pressing, at LCD In hot pressing process, need to use a kind of high temperature resistant and composite of resistance to chemical attack, to complete the hot pressing process of LCD.This is multiple Condensation material mainly has two aspect effects: one is that the one side of composite has release effect, after LCD hot pressing and composite wood Material separation, two be protection material and another side has buffer protection function.The most conventional composite is that one side uses Politef (PTFE) is as release, and another side then selects elastomer silicone to do cushion.So politef tool The high temperature resistant resistance to chemical attack having and surface can be low, can produce and not glue release effect, and elastomer silicone is high temperature resistant And the advantage of good buffer effect, thus solve the base protection problem in LCD hot lamination process.But this composite exists at present Serious problem: polytetrafluoroethylene floor is more than or equal to 0.3mm with the thickness of composite material of silicone layer composition, and this is to a certain degree On have impact on the transmission of heat, thus reduce hot pressing effect.So can limit heat lamination production efficiency, present laminating efficiency is 17 goods per hour.
Summary of the invention
Thicker for solving existing LCD hot pressing thickness of composite material, thus affect the problem of lamination production efficiency, the present invention Offer techniques below scheme:
A kind of heat lamination composite, this composite is using Kapton as base material, and described polyimides is thin The coated on one side of film has waterborne organic silicon modified acrylic acid emulsion coating, another side coating silicone release coating.
As a preferred embodiment of the present invention, the thickness of described Kapton is 0.015mm～0.03mm, described The thickness of waterborne organic silicon modified acrylic acid emulsion coating is 0.02mm～0.05mm, the coating gram of described silicone release coating It is heavily 0.1g/m2～0.2g/m2。
As the another kind of preferred version of the present invention, described Kapton is the Kapton of moulding by casting.
As another preferred version of the present invention, the emulsion particle diameter of described waterborne organic silicon modified acrylic acid emulsion coating For 90nm～250nm.
As another preferred version of the present invention, in the formula of described waterborne organic silicon modified acrylic acid emulsion coating, The wear-resisting silicon ball material content of waterborne organic silicon is 0.5%～15%, and described wear-resisting silicon spherolite footpath is 25 μm～50 μm, aqueous silicon Sol content is 0.2%～20%, and its particle diameter is 10nm～100nm.
As another preferred version of the present invention, described silicone release coating be platinum curing type solvent organosilicon from Type coating.
Further object is that a kind of heat lamination composite material and preparation method thereof of offer, this composite uses The mode machine-shaping of double spread.
As a preferred embodiment of the present invention, the mode of described coating includes roller coating, blade coating and film rubbing method.
The present invention has the following advantages:
1, composite of the present invention uses polyimides as skeleton, it is provided that hot strength, and supports whole composite, High temperature resistant, resistance to compression, anti tear, waterborne organic silicon modified acrylic acid emulsion coating is as elastomer layer, it is provided that enough elasticity and Anti-interference song, and ensure compliance with material in the case of the lowest gross thickness, have good heat lamination performance；Release coating conduct Functional coating provides the low-frictional force that composite material surface is certain, can be antiseized, and prevents the wear of work, finally realizes composite wood Material thickness effectively reduces, and is reduced to 0.035mm from original 0.3mm, ensures the heat lamination performance of composite simultaneously；
2, composite of the present invention is effectively increased the productivity ratio of LCD heat pressing process, by 17 original/hour, promotes To 68/hour, improve production efficiency, reduce production cost；
3, composite of the present invention uses polyimide material, effectively reduces the cost of composite, makes composite Cost reduces by more than 50%, reduce further the cost that LCD hot pressing produces；
4, composite of the present invention, compared to existing politef and the composite of organosilicon, has higher Bond strength between layers, it is ensured that the safety of materials'use；
5, the preparation method of composite of the present invention, by using double spread technique so that the interlayer of composite glues Knotting strength is the highest, it is ensured that composite safe handling during hot lamination process.
Accompanying drawing explanation
Fig. 1 composite structure of the present invention schematic diagram.
1-organosilicon-modified acrylic coating
2-Kapton
3-silicone release coating
Detailed description of the invention
Below this process example is elaborated, so that advantages and features of the invention can be easier to by this area skill Art personnel understand, thus protection scope of the present invention is made apparent clear and definite defining.
Embodiment 1:
The casting type Kapton selecting thickness to be 0.015mm is base material.This film is carried out double-sided plasma surface Process.
The organosilicon-modified acrylic emulsion selecting emulsion particle diameter to be 100 nanometers, adds 8% waterborne organic silicon silicon ball, silicon Spherolite footpath is 30 microns, and the water silica sol of 0.8%, and particle diameter is 12 nanometers.Stir with 1000 rotating speeds, add thickening Agent regulation viscosity is to 500mPa.s, and adds the nonionic surfactant increase coating homogeneity of 0.01%.
Platinum curing type solvent-type organosilicon mould release is selected in silicone release agent, and its off-type force is at 10g/25mm.
First coating organosilicon mould release, uses anilox roll coating so that finally this figure layer dry weight is 1.2 grams of every square meters.
Being coated the emulsion prepared, using anilox roll to be coated with final film forming thickness is 0.02mm, obtains final products thick Degree is 0.035mm.
Embodiment 2:
The casting type Kapton selecting thickness to be 0.02mm is base material.This film is carried out at double-sided plasma surface Reason.
The organosilicon-modified acrylic emulsion selecting emulsion particle diameter to be 150 nanometers, adds 8% waterborne organic silicon silicon ball, silicon Spherolite footpath is 30 microns, and the water silica sol of 0.8%, and particle diameter is 12 nanometers.Stir with 1000 rotating speeds, add thickening Agent regulation viscosity is to 500mPa.s, and adds the nonionic surfactant increase coating homogeneity of 0.02%.
Platinum curing type solvent-type organosilicon mould release is selected in silicone release agent, and its off-type force is at 10g/25mm.
First coating organosilicon mould release, uses anilox roll coating so that finally this figure layer dry weight is 1.2 grams of every square meters.
Being coated the emulsion prepared, using anilox roll to be coated with final film forming thickness is 0.03mm, obtains final products thick Degree is 0.05mm.
Embodiment 3:
The casting type Kapton selecting thickness to be 0.03mm is base material.This film is carried out at double-sided plasma surface Reason.
The organosilicon-modified acrylic emulsion selecting emulsion particle diameter to be 250 nanometers, adds 8% waterborne organic silicon silicon ball, silicon Spherolite footpath is 30 microns, and the water silica sol of 0.8%, and particle diameter is 12 nanometers.Stir with 1000 rotating speeds, add thickening Agent regulation viscosity is to 500mPa.s, and adds the nonionic surfactant increase coating homogeneity of 0.03%.
Platinum curing type solvent-type organosilicon mould release is selected in silicone release agent, and its off-type force is at 10g/25mm.
First coating organosilicon mould release, uses anilox roll coating so that finally this figure layer dry weight is 1.3 grams of every square meters.
Being coated the emulsion prepared, using anilox roll to be coated with final film forming thickness is 0.05mm, obtains final products thick Degree is 0.08mm.
The three kinds of samples finally given and the contrast of existing composite property are as follows:
Prior art Embodiment 1 Embodiment 2 Embodiment 3
Gross thickness (mm) 0.26 0.035 0.05 0.08
Production efficiency (part/hour) 17 68 52 49
Service life (lamination number of times) 600 324 405 493
It is apparent that the production efficiency of composite of the present invention increases substantially from data, although service life Decreasing, but composite cost is lower, so that final production cost effectively reduces, production efficiency effectively carries High.
As shown in Figure 1, Kapton 2 is skeleton to composite structure of the present invention, and coated on one side is organic-silicon-modified Acrylic acid coatings 1, another side coating silicone release coating 3.
The above, only one of detailed description of the invention of the present invention, but protection scope of the present invention is not limited thereto, Any those of ordinary skill in the art in the technical scope that disclosed herein, the change can expected without creative work Change or replace, all should contain within protection scope of the present invention.Therefore, protection scope of the present invention should be with claims The protection domain limited is as the criterion.

Claims (8)

1. a heat lamination composite, it is characterised in that: this composite is using Kapton as base material, described poly- The coated on one side of imide membrane has waterborne organic silicon modified acrylic acid emulsion coating, another side coating silicone release coating.
A kind of heat lamination composite the most according to claim 1, it is characterised in that: the thickness of described Kapton Degree is 0.015mm～0.03mm, and the thickness of described waterborne organic silicon modified acrylic acid emulsion coating is 0.02mm～0.05mm, institute The coating grammes per square metre stating silicone release coating is 0.1g/m2～0.2g/m2。
A kind of heat lamination composite the most according to claim 1 and 2, it is characterised in that: described Kapton Kapton for moulding by casting.
A kind of heat lamination composite the most according to claim 1 and 2, it is characterised in that: described waterborne organic silicon changes The emulsion particle diameter of property acrylic emulsion coating is 90nm～250nm.
A kind of heat lamination composite the most according to claim 4, it is characterised in that: described waterborne organic silicon modification third In the formula of olefin(e) acid emulsion coatings, the wear-resisting silicon ball material content of waterborne organic silicon is 0.5%～15%, described wear-resisting silicon spherolite Footpath is 25 μm～50 μm, and water silica sol content is 0.2%～20%, and its particle diameter is 10nm～100nm.
A kind of heat lamination composite the most according to claim 1 and 2, it is characterised in that: described silicone release is coated with Layer is platinum curing type solvent silicone release coating.
7. the heat lamination composite material and preparation method thereof described in a claim 1, it is characterised in that: this composite uses double The mode machine-shaping of topcoating cloth.
The preparation method of a kind of heat lamination composite the most according to claim 7, it is characterised in that: described coating Mode includes roller coating, blade coating and film rubbing method.
CN201610355364.0A 2016-05-25 2016-05-25 A kind of heat lamination composite and preparation method thereof Pending CN106084265A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101457128A (en) * 2007-12-14 2009-06-17 3M创新有限公司 Composite high temperature gummed tape and method for producing the same
CN201904042U (en) * 2010-03-20 2011-07-20 厦门市英诺尔电子科技有限公司 Removable high temperature resistant label material
CN102253433A (en) * 2011-07-04 2011-11-23 江阴市通利包装材料有限公司 Prism sheet optical protective film and preparation method thereof
CN103779515A (en) * 2014-01-13 2014-05-07 江苏绿遥燃料电池系统制造有限公司 Fuel cell sealing material and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101457128A (en) * 2007-12-14 2009-06-17 3M创新有限公司 Composite high temperature gummed tape and method for producing the same
CN201904042U (en) * 2010-03-20 2011-07-20 厦门市英诺尔电子科技有限公司 Removable high temperature resistant label material
CN102253433A (en) * 2011-07-04 2011-11-23 江阴市通利包装材料有限公司 Prism sheet optical protective film and preparation method thereof
CN103779515A (en) * 2014-01-13 2014-05-07 江苏绿遥燃料电池系统制造有限公司 Fuel cell sealing material and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
刘庆普: "《建筑防水与堵漏》", 28 February 2002, 化学工业出版社 *

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