CN106068490A - The power using sheet type sensor and capacitor array determines - Google Patents

Abstract

The invention discloses a kind of equipment, this equipment is configured to the touch on the surface of sensor device.This equipment includes covering and is arranged on the power sensing structure below this covering.This power sensing structure can be positioned in below display and be used in combination to estimate the power of the touch on the covering of equipment with other power sensing elements.

Description

The power using sheet type sensor and capacitor array determines

Cross-Reference to Related Applications

This patent cooperation treaty patent application requires in the entitled " Force of JIUYUE in 2014 submission on the 8th Determination Employing Sheet Sensors and Capacitive Array " U.S. Provisional Patent Application 62/047,645, entitled " the Force Determination Employing Sheet submitted on February 19th, 2014 Sensors and Capacitive Array " U.S. Provisional Patent Application 61/941,988 and on February 12nd, 2014 Entitled " the Force Determination Employing Multiple Force-Sensing Structures " submitted to The priority of U.S. Provisional Patent Application 61/939,252, the disclosure of above-mentioned each patent application is incorporated by reference It is expressly incorporated herein.

Technical field

Present patent application relates generally to the system and method for power that sensing touches, and relate more specifically to for detecting And measure the capacitive force transducer putting on the integration of equipments of the size of touch of equipment surface or value together.

Background technology

Touch apparatus is typically characterized by receive on the surface of equipment the equipment of touch input.This input can be wrapped Including the position of one or more touches on equipment, it can be interpreted order, gesture or other kinds of user input.? In one example, the touch input on touch apparatus can be forwarded to calculating system and for explaining and graphic user interface (GUI) user is mutual, including the element such as selected on display, over the display redirect or reorientate element, Input text and user's input.In another example, the touch input on touch apparatus can be forwarded to computer system and use Mutual with the user of application program in explaining.User can include alternately such as manipulation of audio, video, photo, present, text etc. Deng.

Generally, the touch input on touch apparatus is limited to touch the position on equipment.But, in some cases, also The power of the touch that detection and measurement put on equipment is probably favourable.For instance, it is possible to use the first of relatively light touch The object that mode operating computer over the display generates, and alternatively to use the second of relatively heavy or sharper touch Mode and this object interaction are probably favourable for a user.By way of example, user uses relatively light touch to move The object that computer on dynamic display generates, the most alternatively uses relatively heavy or sharper touch relative to same calculating Machine selects or call instruction is probably favourable.More generally, user can provide input in many ways according to the power touched It is probably favourable.Such as, user can provide be interpreted to touch touch first method, the second method of medium touch and The input of the Third Way heavily touched etc..It addition, user can use different size of power to provide simulation input to be probably Profit.Such input is for such as controlling to emulate the accelerator pedal on vehicle or the control of the aircraft in aviation simulator Control surface or similar application are probably useful.User can provide such as simulated body motion or in other words, virtual Input in reality (VR) emulation (being likely to be of sense of touch feedback) or in augmented reality program may be also advantageous.Use tactile The power touched explains the phase of the multiple touches being supplied to multiple user interface object or the element simultaneously used on touch apparatus Degree (such as, power) and position may be also advantageous.Such as, the power of touch can be used for explaining the application at shoegaze In multiple touches of producing owing to user presses more than one element.Especially, the power of multiple touches can be used for explaining and uses The family multiple touches on piano key.Similarly, the power of multiple touches can be used for explaining (have use at control motor vehicles In accelerating, brake, give a signal lamp and the independent control turned to) application in multiple touches of user.

Summary of the invention

Present patent application provides technology, it is (the most touch-sensitive that this technology can be used for measuring or determine that user contacts touch apparatus Surface, an example of touch-surface is touch display) or other pressure-sensitive input elements (such as virtual analog control or key Dish), or the size of power that applied of other input equipments or value, and the size of the power applied or the change of value.This A little technology can be incorporated into and use each of touch recognition, the touch input touched in element and application program of GUI or manipulation In the equipment of kind (such as touch apparatus, Trackpad and touch screen).Present patent application also provides for can be used for measuring or determining user The size of power applied when contacting touch apparatus or value, and the size of the power applied or the change of value, and ring System and the technology of the additional function of the user's use being available for touch apparatus should be provided in this.

Some embodiment as herein described relates to also referred to as the power sensing of " power sensing structure " or " force-sensing sensor " Device.Force transducer can integrate with the shell of electronic equipment, and one example is touch-sensitive electronic device or referred to as touches Equipment.Exemplary force sensor can include by the separate upper part of compressible element or air gap and low portion.Top portion Point can include being connected to the upper body of top capacitor plate, and low portion can include the bottom master that is connected to bottom capacitor board Body.In some cases, upper part and low portion form size or the value that can be used for measuring or detect the power applied Capacitor.Compressible element is generally formed by conforming materials or elastomeric material.In some cases, compressible element is claimed For " deformable intermediate host ", intermediary element or " compressible stratum ".In some cases, force transducer includes that other power senses Element, such as resistance-type deformeter, piezoelectric element etc..

Some exemplary relate to a kind of electronic equipment, and this electronic equipment has covering, is positioned at covering Lower section display and be positioned at the power sensing structure below display.Power sensing structure can include top capacitor plate, be arranged on Compressible element on the side of top capacitor plate with on the side relative with top capacitor plate being arranged on compressible element Bottom capacitor board.Power sensing structure may also include and is attached to power sensing structure and supports the plate of this power sensing structure.At some In embodiment, electronic equipment also includes the sensing circuit being operatively coupled to power sensing structure.Sensing circuit can be configured The touch on covering is estimated in change for the electric capacity between top capacitor plate based on power sensing structure and bottom capacitor board Power.

In some embodiments, power sensing structure is by including that the compliance layer of air gap separates with display.At some In the case of, power sensing structure is separated with display by the compliance layer being made up of compressible foam.Power sensing structure by by The compliance layer of compliance post array and optical clear fluid composition separates with display.

In some embodiments, electronic equipment also includes the shell with the frame around covering, and is arranged on and covers The liner in gap between cover piece and frame.This equipment may also include be arranged on gap at least some of on oleophobic property be coated with Layer.

Some exemplary relate to a kind of electronic equipment, and this electronic equipment includes shell, is arranged on opening of shell Covering in Kou, and the strain sensitive liner being arranged between covering and shell along the periphery of covering.This equipment also may be used Including the power sensing structure being arranged on below covering.This equipment may also include and support force sensing structure fixing relative to shell Plate.In some cases, strain sensitive liner includes liner top capacitor plate, liner lower capacitor board and is arranged on liner Liner compressible element between portion's capacitor board and liner lower capacitor board.

In some embodiments, electronic equipment also includes the display being arranged between covering and power sensing structure, And the compressible stratum including air gap between display and power sensing structure.In some are embodied as, compressible stratum The power that air gap is configured to respond to touch exceedes first threshold and collapses at least in part.First threshold is smaller than the second threshold Value, this Second Threshold corresponds to the maximum, force detected by strain sensitive liner.

In some embodiments, electronic equipment also includes the display being arranged between covering and power sensing structure, And the compressible stratum between display and power sensing structure.In some cases, compressible stratum can be configured to respond to The power touched exceedes first threshold and collapses at least in part.First threshold is smaller than Second Threshold, and this Second Threshold corresponds to The maximum, force that can be detected by strain sensitive liner.

In some embodiments, power sensing structure includes top capacitor plate, bottom capacitor board；Be arranged on top electric capacity Compressible element between plate and bottom capacitor board.In some embodiments, power sensing structure includes deformeter and/or piezoelectricity Element.

Some exemplary relate to a kind of electronic equipment, and this electronic equipment includes covering, is positioned at covering The capacitance sensing layer of lower section, and it is positioned at the compressible stratum below capacitance sensing layer.In some embodiments, compressible stratum includes Air gap.This electronic equipment may also include the power sensing structure being arranged on below compressible stratum, and this power sensing structure can include top Capacitor board, the compressible element being arranged on the side of top capacitor plate and be arranged on compressible element with top capacitor plate phase To side on bottom capacitor board.Some embodiments include being positioned at below power sensing structure and support this power sensing structure Plate.

In some embodiments, electronic equipment includes the display being positioned at below covering.This equipment may also include It is positioned at the backlight below display.Capacitance sensing layer may be provided between display and backlight.

In some embodiments, electronic equipment includes being operatively coupled to capacitance sensing layer and the sense of power sensing structure Slowdown monitoring circuit.Sensing circuit can be configured to the mutual capacitance between top capacitor plate based on capacitance sensing layer and power sensing structure The power of the touch on covering is estimated in change.In some embodiments, sensing circuit can be configured to acquisition power sensing knot The first electric capacity between top capacitor plate and the bottom capacitor board of structure.This circuit is also configured to obtain top capacitor plate and electricity Hold the second electric capacity between sensed layer.This circuit is also configured to use the first electric capacity and the second electric capacity to generate covering On the estimation of power of touch.

Although disclosing multiple embodiment (including its variations), but those skilled in the art being according to illustrating and retouching State other embodiments that will readily occur to the disclosure described in detail below of the exemplary of the disclosure.As will be appreciated Arriving, the disclosure can modify at each obvious aspect, and all modifications is all without departing from the spirit and scope of the disclosure.Cause This, the drawings and specific embodiments will be considered substantially to be exemplary rather than restrictive.

Accompanying drawing explanation

Fig. 1 shows exemplary touch equipment.

Fig. 2 A shows the sectional view that the line 1-1 along Fig. 1 of the exemplary touch equipment with power sensing structure intercepts.

Fig. 2 B shows the section view that the line 1-1 along Fig. 1 of the exemplary touch equipment with alternative power sensing structure intercepts Figure.

Fig. 3 shows the sectional view that the line 2-2 along Fig. 2 of the exemplary touch equipment with power sensing structure intercepts.

Fig. 4 shows the sectional view that the line 2-2 along Fig. 2 of the exemplary touch equipment with power sensing structure intercepts.

Fig. 5 shows the sectional view that the line 2-2 along Fig. 2 of the exemplary touch equipment with power sensing structure intercepts.

Fig. 6 shows the sectional view of an embodiment of the touch apparatus with capacitive force transducer.

Fig. 7 shows another embodiment of the touch apparatus with capacitive force transducer.

Fig. 8 shows the sectional view of another embodiment of the touch apparatus with capacitive force transducer.

Fig. 9 shows the example communication touched between I/O equipment and calculating system.

Figure 10 shows the schematic diagram of the system including the quick touch apparatus of power.

Figure 11 A shows exemplary methods of operationthe.

Figure 11 B shows another exemplary operational approach.

Figure 12 shows the power sensing structure with electric connector lead-in wire.

Figure 13 shows the sectional view that electric connector goes between.

Figure 14 shows the illustrative methods manufacturing the power sensing structure with electric connector lead-in wire.

Figure 15 A shows the exemplary cross section of another power sensing structure being attached in electronic equipment.

Figure 15 B shows the exemplary cross section of another power sensing structure being attached in electronic equipment.

Figure 15 C shows the exemplary cross section of the another power sensing structure being attached in electronic equipment.

Figure 15 D-15E illustrates in greater detail a part for the cross section of Figure 15 C.

Figure 16 shows the exemplary cross section of the electronic equipment being combined with two power sensing structures.

Figure 17 shows and is combined with and is positioned at the multilayer sheet type power that the capacitive sense array in display stacking couples The exemplary cross section of the electronic equipment of sensor.

Detailed description of the invention

In general, embodiment can be taked can also sense power and can distinguish many in addition to simple binary senses The form of the electronic equipment of individual different force level.Some embodiments can have and are wherein combined with force transducer (such as, the quick biography of power Sensor, power sensing element or power sensing structure) housing.Force transducer can such as be combined in equipment one or more sidewalls or In the groove, otch or the hole that are formed in other surfaces.In certain embodiments, power sensing element can be along whole periphery, sidewall Or one group of sidewall extends.Such as, force transducer can be around the inner chamber in being formed at equipment, or can be otherwise around setting Standby inside extends.When the outside (such as upper surface) that power is applied in equipment is upper, force transducer can detect that this power life Become the input signal of correspondence to this equipment.

Some embodiments may incorporate multiple force transducers that the periphery around electronic equipment separates, rather than single power sense Geodesic structure or element.Additionally, multiple force transducers need not be formed continuous print array or structure, but can be between ground separate Separate.The quantity of force transducer in various embodiments can be different, and interval is also such.Each force transducer can sense applying In certain region of equipment adjacent or near power on surface.Therefore, execute at the point between the force transducer of two lower sections The power added may be sensed by both.

In general, force transducer or equipment can include by compressible element (such as, compliant member) separate Individual or multiple capacitor board, trace, electric wire etc..When power is transferred to force transducer by apparatus casing, compressible element is compressible, So that capacitor board mutually closer to.The change of the spacing of capacitor board can make the electric capacity measured between the two increase.Circuit can be surveyed This change of amount capacitance, and export the signal changed along with capacitance variation.Processor, integrated circuit or other electronics Capacitance variation can be associated by element with the power being applied on housing, consequently facilitating detection, measurement and use masterpiece are right The input of electronic equipment.Although term " plate " can be used for describing capacity cell, it is to be understood that, capacity cell is without for rigidity But can be flexible (as trace or electric wire) on the contrary.

1. term

Following term is exemplary, and is not intended to limit by any way.

Word " power applied " and variations thereof generally refer to put on the power of the touch of equipment surface.General next Saying, the degree of the power applied, size or value may utilize the techniques described herein and detect and measure.The journey of the power applied Degree, size or any certain scale of value need not have.Such as, the measurement of the power applied can be linear, logarithm or with Other modes are nonlinear, and can be with the power applied, the position of touch, time correlation or otherwise in response to Or multiple be conditioned because of the most periodically (or the most aperiodically, or the most at intervals).

Word " finger " and variations thereof generally refer to finger or other body parts of user.Such as and unrestricted Ground, " finger " can include user's finger or any part of thumb and any part of user's hands." finger " may also include use Family finger, thumb or any covering on hand.

Word " touches " and variations generally refers to the action of object contact equipment surface.Object can include user's hands Finger, stylus or other sensing objects.Example object includes other of hard stylus, soft stylus, pen, finger, thumb or user's hands Part." touch " power and the position being generally of the applying that the techniques described herein can be utilized to be detected and measured.

After having read this document, those skilled in the art will be it will be recognized that the statement of these terms will be applicable to respectively The technology of kind, method, physical component and system (the most currently known or other forms), including those skilled in the art Member read infer after present patent application or it can be inferred that the expansion of described various technology, method, physical component and system Exhibition.Also, it is to be understood that any size in this paper is merely illustrative, and can be different with different embodiments.

2. power sensitive device

In one embodiment, power sensitive device and system can include cover glass element, all if making touch apparatus Circuit or the material of relative transparent (in largely or entirely position) of other inner members and external object isolation.Term " glass " refers to the relatively hard lamellar quality of material, and is not that the material of cover glass element is limited to only glass Material.Cover glass element can be made of a variety of materials, including such as glass, treated glass, plastics, treated Plastics and sapphire.In many cases, cover glass is transparent, but cover glass is not necessarily fully or even part Transparent.Cover glass can substantially be set by rectilinear form, such as to cover the circuit of touch apparatus and to serve as user Touch pad.Cover glass is formed with other forms multiple also dependent on application.

In some embodiments, cover glass be configured to detect the transparent of touch location or nontransparent touch sensing Device is integrated or is attached to this touch sensor.Transparent touch sensor can be to be formed by one or more arrays of transparent conductors Capacitive touch sensors.Such as, transparent touch sensor can be by being operatively coupled to the most saturating of touch-sensing circuit The mutual capacitive touch sensor that two arrays of bright wire are formed.This type of transparent touch sensor can detect and follow the tracks of covering Multiple touches on glass surface.Touch can include that the multiple fingers on cover glass touch, multiple stylus touches or inhomogeneity The combination that type touches.It is used as other kinds of transparent touch sensor, including such as self-capacitance touch sensor, resistance Formula touch sensor etc..

In one example, cover glass element is couple to framework or the shell of touch apparatus, such as by metal, elasticity Body, plastics, combinations thereof or the housing of certain other material structure.In this case, the framework of touch apparatus can include Shelf that cover glass element is positioned on or protuberance.Cover glass is conventionally positioned at above the circuit of touch apparatus.Such as, Framework can include the shelf that the edge of cover glass element is positioned on, wherein the remainder (or of cover glass element Part) it is positioned at above the circuit of touch apparatus.

In many embodiments as herein described, (such as, power sensing structure, power sensing element or power are quick for force transducer Sensor) it is positioned at below cover glass and below framework or the shelf of shell or protuberance.Force transducer generally includes can Compressing member, and it is configured to detection and the relative displacement measured between cover glass and framework or shell.As previously noted And, the amount of cover glass displacement can be used for the power estimating to be applied.Embodiment below relates to detection and measures this position The different technologies moved and method.

3. there is the example devices of force transducer

Fig. 1 shows the example devices 100 being combined with one or more power sensing structure as described herein.With reference to figure 1, equipment 100 is depicted as tablet computing device, it is to be understood that, it can also be any equipment in other equipment multiple, Including mobile phone, portable computer, wearable device, touch screen etc..Equipment 100 can have the shell including multiple sidewall Body 102 and frame 106.In other embodiments, equipment 100 can be flush-mounted in larger surface or housing, and therefore Equipment can lack can identification frame or sidewall.

As it is shown in figure 1, electronic equipment 100 includes being positioned over the electronic displays below glass 104, for passing to user Pass figure and/or text message.Electronic displays can include liquid crystal display (LCD), Organic Light Emitting Diode (OLED) or its His electronic displaing part.In some embodiments, can there is no display.Such as, cover glass can be placed on and not joined It is set to transmit above figure and/or the control knob of text message or Trackpad to user.(in this case, cover glass Can not be transparent.)

As it is shown in figure 1, equipment include multiple port and mechanism for electrically with machinery mode by equipment coupling It is connected to external equipment or element.Input mechanism, port etc. are probably for different editions, type and the pattern of electronic equipment 100 Different.Therefore, they are only used as the example of this kind equipment and figure 1 illustrates in exemplary position.

Fig. 2 A shows the sectional view intercepted along the line 1-1 shown in Fig. 1.What sectional view showed equipment 100 has one The inside of the power sensing structure of type.The core of housing 102 can encapsulate electronic circuit, frame for movement and other internal units Part.As it can be seen, frame 106 is around the periphery formation of equipment 100.

Protuberance 202 can be formed along the periphery of frame 106.The accurate size of protuberance 202 in various embodiments can be Change.In this embodiment, protuberance 202 includes the width being configured to support the base portion of power sensing structure 200.Real at some Executing in scheme, the base portion of power sensing structure 200 can adjoin and be attached to the top of protuberance 202.Equally, as shown in Figure 2 A, power sense The inward flange of geodesic structure 200 can and substantial alignment parallel with the inner surface of frame 106.In other embodiments, power sense The inward flange of geodesic structure 200 can offset with the inward flange of frame 106.

As shown in Figure 2 A, single power sensing structure 200 can be around the whole inner chamber of housing 102.That is, power sensing structure 200 along the whole periphery of equipment and can extend along protuberance 202.It will be understood, therefore, that power sensing structure 200 can be formed single Unit or element.

Fig. 2 B shows the alternative sectional view intercepted along the line 1-1 shown in Fig. 1.As shown in Figure 2 B, equipment 100b includes separately The power sensing structure 200b of choosing.In the alternative embodiment of Fig. 2 B, multiple power sensing structure 200b can be along the periphery of frame 106 It is positioned at various location.In this example, power sensing structure 200b is positioned at each limit of frame 106 of electronic equipment 100b At edge or near.It addition, power sensing structure 200c is placed on each corner of frame.Therefore, in the example shown in Fig. 2 B Property equipment 100b in exist eight power sensing structures (200b, 200c).

With reference to Fig. 2 B, it will be appreciated that more or less of power sensing structure 200b can be used.Such as, three power can be used The position of sensing structure 200b and power can carry out triangulation by the output of relatively each equipment.Alternatively, can set The standby middle use array more than four power sensing structure 200b.It addition, each power sensing structure shown in Fig. 2 B can represent such as Multiple independent power sensing structure linearly or in two-dimensional array.Therefore, the quantity of each power sensing structure 200b shown in Fig. 2 B It is merely exemplary with location, and other modification are also possible.

Fig. 3 shows the sectional view that electronic equipment 100 intercepts along the 2-2 shown in Fig. 2 A.As it is shown on figure 3, cover glass 104, the physical relation between frame 106 and power sensing structure 300 is schematically depicted in more detail, it is to be understood that, geometry accurately Structure, size, tolerance, position etc. can be different.As it is shown on figure 3, power sensing structure 300 can be mounted or otherwise be determined Position is below a part for cover glass 104.Display element 304 can be positioned in below cover glass 104 equally.Real at some Executing in scheme, from the point of view of external view, power sensing structure 300 can be deposited by between cover glass 104 and power sensing structure 300 Ink layer or printing layer on cover glass are covered.In other embodiments, can be free of ink layer or printing layer.

In some embodiments, display element 304 may act as shielding part so that in power sensing structure and electronic equipment Miscellaneous part electrically insulates.Equally, shielding part can be formed in the part of the adjacent gap 302 of protuberance 202 and shell 102, so that Power sensing structure 300 electrically insulates with external signal, or at least reduces the external noise impact on power sensing structure.As one Non-limiting example, screen layer can be deposited by physical vapour deposition (PVD).It addition, the arbitrary screen layer in screen layer or all screens Cover layer to may extend in the inside of electronic equipment to be connected to public or system earth portion.Such as, screen layer can be from protuberance along shell The inwall of body 102 extends downward system earth portion.

In certain embodiments, the part of protuberance and/or shell itself may act as shielding construction rather than has formation Any shielding part thereon.Should be appreciated that in certain embodiments, one or more in various screen layer/structures can Connect each other to electrically, but this is not necessarily.

As it is shown on figure 3, frame 106 is adjacent with protuberance 202, this protuberance is recessed from the surface of frame 106 and is configured to Support force sensing structure 300.As it is shown on figure 3, can exist between the inward flange and the outward flange of cover glass 104 of frame 106 Gap 302.Gap can allow cover glass 104 to move freely relative to housing 102.

In certain embodiments, part or all of be coated with oleophobic material on the surface in gap 302.This oleophobic Property material can be used as opposing or preservative oil, dust, dirt or other similar materials enter gap 302 and/or power of influence sensing knot The barriers of structure 300.So, coating may be used to the operation in time of retentivity sensing structure.Be used as oleophobic property coating it Outer coating；In various embodiments, other dusts and/or oil and/or dirt exclusion coating can be used.

As it is shown on figure 3, power sensing structure 300 includes multiple layer.In this example, power sensing structure includes passing through deformable Intermediate host or the separate upper part of compressible element 330 310 and low portion 320.Upper part 310 includes upper body 311, this upper body can be formed by polyimide flex material layer.Upper part 310 also includes on by being bonded to or being deposited on The top capacitor plate 312 that the layers of copper of portion's main body 311 is formed.Equally, low portion 320 includes sub-body 321, this sub-body Also can be formed by polyimide flex material layer.Low portion 320 also includes by the copper being bonded to or being deposited on sub-body 321 The bottom capacitor board 322 that layer is formed.In this example, polyimide flex material is about 0.05 millimeters thick.But, can be used it His thickness and other materials form power sensing structure 300.

As it is shown on figure 3, electric capacity (being illustrated by capacitor symbol) can be between top capacitor plate 312 and bottom capacitor board 322 Being formed, in this example, top capacitor plate and bottom capacitor board are by compressible element 330 separately.In this example, compressible Element 300 is formed by the organosilicon material of about 0.2 millimeters thick, has the tolerance of positive and negative 0.09 millimeter.In other embodiments, Compressible element 300 can be formed by different materials, and has different-thickness.

Power sensing structure 300 shown in Fig. 3 can be used for detection and measures the power that user applies.Such as, user can covered On cover glass 104 (or in there is no the embodiment of display and/or cover glass, at the upper surface of electronic equipment 100 On) press down on to apply on the appliance 100 power.Cover glass 104 may be in response to this power and moves down, thus compression stress sense The compressible element 330 of geodesic structure 300.In some cases, compressible element 330 is compressed and is flattened, thus causes One capacitor board 312 and the second capacitor board 322 mutually closer to.Therefore, between the first capacitor board 312 and the second capacitor board 322 Variable capacitance.As previously mentioned, the change of electric capacity can produce the change of the signal of telecommunication or the signal of telecommunication, and this can be by being associated Circuit detects and measures and can be used for estimating that user puts on the power on cover glass 104.

As it is shown on figure 3, top capacitor plate 312 and bottom capacitor board 322 can be respectively from upper body 311 and sub-bodies 321 stretch out.That is, in some position of the length along power sensing structure 300, capacitor board 312, the part of 322 can be Unsheltered and expose.The expose portion of capacitor board can be conducive to the connection with electric wire, conduit or other electrical connectors and permit Permitted signal to send to measure capacitance variations and estimating power between power sensing structure 300 and associated electrical electronic circuit.

In some embodiments, the second supplementary structure can be formed in equipment 100 or in the section of power sensing structure. Supplementary structure may also comprise by the separate top capacitor plate of compressible element and bottom capacitor board.But, supplementary structure can not It is configured to capped glass 104 compress, may act as the benchmark electricity of change for the environmental condition around equipment is described on the contrary Hold.Such as, elasticity and/or the compressibility of compressible element (such as, organosilicon material) can be owing to absorbing the change of water quantities And change.In this case, it may be beneficial to use supplementary structure (directly or indirectly) to measure compressible element Change in physical properties, to illustrate the change of water content.In one example, supplementary structure can form capacitor, this electric capacity utensil Have by the separate top capacitor plate of compressible element and bottom capacitor board.Capacitor is connectable to second circuit, this second electricity Road is monitored independent of the electric capacity between the plate of the supplementary structure of any power sensing structure.Supplementary structure can be positioned on a part for equipment In so that it compresses without undergoing any (or few) when user presses down on cover glass, but is still exposed to and power The same or similar environment of sensing structure.Therefore, the electric capacity between the plate of supplementary structure any change may entirely due to Moisture that compressible element (such as silicon materials) is absorbed and/or aging.Output signal from supplementary structure can be used for adjusting Save the reading of sensing structure of relying on oneself, to compensate the changes in environmental conditions of the physical characteristic affecting compressible element.

Figure 4 and 5 show the alternative embodiment of power sensing structure.Specifically, Fig. 4 shows power sensing structure 400, and it has Upper part 410 including the upper body 411 being attached to top capacitor plate 412.Power sensing structure 400 also includes low portion 420, this low portion includes the sub-body 421 being attached to bottom capacitor board 422.Upper part 410 and low portion 420 lead to Cross compressible element 430 and separately and form the capacitor that can be used for detecting the power putting on cover glass 104.Shown in Fig. 4 Example in, top capacitor plate 412 and bottom capacitor board 422 are not extended past upper body 411 and sub-body 421.At this In the case of Zhong, the electric terminal or the conduit that are positioned at the profile of power sensing structure 400 can be conducive to and the telecommunication of power sensing structure 400.

Fig. 5 shows another alternative embodiment of the electronic equipment 100 combining strong sensing structure 500.This embodiment party In case, environmental seal 550 can be positioned between cover glass 104 and power sensing structure 500, to prevent water from dividing, dust, dirt and Other possible environmental contaminants enter.Environmental seal 550 can such as by extrude conforming materials (such as Buna rubber, Viton, EPDM etc.) formed.In some cases, environmental seal 550 be formed be applied in equipment 100 element it The sealant material pearl of rear solidification.

Optionally, as it is shown in figure 5, equipment may also include the support member being positioned between sealing member 550 and cover glass 104 552, to provide the bonding surface for environmental seal 550.In this example, support member 552 is attached to cover glass 104, It is thus possible to move relative to housing 102.Therefore, when power puts on cover glass 104, cover glass 104, optionally support Part 552 and sealing member 550 all can move down with compression stress sensing structure 500.Therefore, in the present embodiment, sealing member 550 Can be used for, by power sensing structure 500 and moisture and external debris isolation, still allowing for operating physical force sensing structure 500 simultaneously.Except Outside sealing member 550 or replace sealing member 550, equipment 100 may also include and is positioned over the edge of glass 104 and housing 102 A part between one or more wiping sealing members.Additionally, baffle seal or barrier film can be arranged on cover glass 104 With between a part for housing 102, this baffle seal can be configured to prevent the interior section of pollutant access arrangement 100.

In some embodiments, environmental seal 550 is compliance, and in other embodiments, environment is close Sealing 550 is not compliance and can be rigidity.The advantage of rigid seal is power is conveyed directly to power sensing knot Structure 500, and compliance or flexible seals can compress before transmitting any power to a certain extent.Can use any type of close Sealing, but the output of power sensing structure 500 can be compressed by flexible seals and be affected.

Fig. 6 shows another alternative embodiment of the equipment with capacitive force transducer.As shown in Figure 6, touch sets Standby housing 605 (such as, shell) can be formed and position to keep cover glass element 610.Such as, touch apparatus housing 605 Can include straight line framework, such as have the shape of photo frame, wherein cover glass element 610 has the shape of photo covering If (just as photo be placed on can occur below cover glass element 610 as).Touch apparatus housing 605 can include the back of the body Lining (not shown) or central frame element (not shown), they can stablize the opposing bending of this touch apparatus housing 605, warpage or its His physical deformation.Touch apparatus housing 605 also can limit the circuit (as described herein) of touch apparatus can be positioned sky therein Between.This has the effect that the circuit of touch apparatus can be protected from external contaminant or unnecessary touch, and is protected from Bending, warpage maybe may cause the circuit error of touch apparatus or other electric or physical influence of other problems.

As shown in Figure 6, touch apparatus housing 605 can include outward flange 615, such as can be by from touch apparatus housing 605 Baseline outer lip upwards or protruding limit, and it can be positioned as stoping cover glass element 610 in an x or y direction Excessive slip or other move.Under this situation, Z-direction be indicated generally at generallyperpendicular (may for becoming an angle of 90 degrees degree, but This is not necessarily required to) in the plane of cover glass element 610 and the direction of the top surface of touch apparatus, and X and Y-direction are often referred to The direction that shows generally in the same plane of cover glass element 610 (may be for being oriented relative to one another to an angle of 90 degrees degree, but this is also Nonessential).

As shown in Figure 6, cover glass element 610 and outward flange 615 limit the cover glass gap 620 between them, its There is cover glass element 610 do not strike against or the effect of frictional touch apparatus casing 605.In one embodiment, touch sets Standby optional elastomer 625 or other materials that can include being positioned between cover glass element 610 and outward flange 615.This can have Have the following effects: (such as set in touch in the case of accelerating suddenly on the direction of cover glass element 610 its outer edges 615 In the case of kicking for dropping, collide, being played or the most disastrously move) damping is provided.Such as, elastomer 625 can Edge around cover glass element 610 is arranged, and has formation O shape or the effect of analogous shape.Elastomer 625 also may be used Have the effect that prevention or at least hinder owing to dust or other objects are between cover glass element 610 and outward flange 615 The foreign body slided and may cause damages.

As shown in Figure 6, touch apparatus housing 605 includes cover glass shelf 630, such as can be by from touch apparatus housing Inboard lip that the outward flange 615 of 605 is inside or internal protrusion limit, and it can be positioned so that Support cover glass elements 610.Such as, cover glass element 610 can be located on cover glass shelf 630, and this cover glass shelf can stop cover glass Element 610 slips down in the circuit of touch apparatus.In the embodiment of alternative, touch apparatus 605 can include central frame (not Illustrate), such as can be limited by the internal support component being oriented to Support cover glass elements 610.Such as, central frame can Including being oriented to support at least one of opposing solid (the not having optional hole) element of the circuit of touch apparatus.

As shown in Figure 6, equipment includes power sensing structure 600.In this example, power sensing structure 600 includes the first top Part, this first upper part includes that the first contact adhesive (PSA) layer 635 and first with about 100 micron thickness is flexible Circuit 640.This first flexible circuit 640 includes being configured to conduct the signal of telecommunication and/or serve as one group of driving/sensing of capacitor board Line.Power sensing structure 600 also includes low portion, and this low portion includes the 2nd PSA the most also with about 100 micron thickness Layer 645 and the second flexible circuit 650, this second flexible circuit also has for conducting the signal of telecommunication and/or serving as leading of capacitor board Electric drive/sense wire.First flexible circuit 640 and the second flexible circuit 650 are configured to respond to the control of driving/sense wire And operate and capacitance sensor can be formed.Above in relation to as described in embodiment above, the top of power sensing structure 600 Part and low portion between electric capacity change can and the first flexible circuit 640 and the second flexible circuit 650 between deflection Or distance change is relevant.(in other embodiments, one or more deformeter can be used to replace capacitance sensor.) one In individual example, if cover glass element 610 tilts (being such as under pressure or other power applied), then the first flexible circuit 640 and second flexible circuit 650 can according to relative to the position of axle and obliquity become closer to or become further from.Such as this Literary composition further describes, and the first flexible circuit 640 and the second flexible circuit 650 can some positions on touch apparatus housing 605 Put and be replicated.

Power sensing structure 600 is typically operatively connected to be configured to detection and measure the power sensing electricity of capacitance variations Road.By measuring capacitance variations, power sensing circuit can be used for estimating the relative displacement of one or more power sensing structure, and this is relative Displacement can be subsequently used in sloping shaft and the position determining cover glass element 610.Additionally, capacitance variations can be used for estimating to apply Power to cover glass element 610.In some embodiments, power sensing circuit can include processor or be couple to processor.

In one embodiment, the region between the first flexible circuit 640 and the second flexible circuit 650 can limit substantially The space (that is, being filled with air) in overhead.In the embodiment of alternative, the first flexible circuit 640 and the second flexible circuit 650 Between region can include compressible stratum 655.For the first example, between the first flexible circuit 640 and the second flexible circuit 650 Space can include one group of spring element being dispersed in space.In this case, the first flexible circuit 640 and second is flexible Circuit 650 is kept separately by spring force, and does not typically contact.For the second example, compressible stratum 655 can include at least The micro structure partly constructed by organosilicon, such as one group of organosilicon vertebral body or one group of organosilicon spring, its effect lies also in One flexible circuit 640 and the second flexible circuit 650 are kept separately by spring force and typically do not contact.

As described in the most in general manner, cover glass element 610 can include being configured to detect one or more touch The transparent touch sensor of position.As previously mentioned, transparent touch sensor can be by being coupled to touch sensor circuit Transparent conductors one or more arrays formed.The class of the transparent touch sensor can being integrated in cover glass element 610 Type includes but not limited to mutual capacitance sensors, self-capacitance touch sensor and resistive touch sensor.

In one embodiment, the cover glass unit above the first flexible circuit 640 and the second flexible circuit 650 it is positioned at Part 610 region can be coated with ink mask 660.In one embodiment, ink mask 660 is arranged on cover glass 610 times Above side and the first flexible circuit 640.This has the effect that the user of touch apparatus typically can't see the first flexible circuit 640 or second flexible circuit 650, or they are couple to touch apparatus housing 605, cover glass element 610 or touch set Any element of standby any circuit (not shown).Such as, touch apparatus can include surface 665, and this surface can include covering glass The surface of the position that there is not ink mask 660 of glass the element 610 and ink mask that there is ink mask 660 can be included Surface.As it has been described above, Z-direction 670 may indicate that the direction on the surface 665 being substantially perpendicular to touch apparatus.

In one embodiment, the interaction between cover glass element 610 and outward flange 615 may result in covering glass One group of power of the outer edge of glass element 610.In some embodiments, power sensing structure 600 (or deformeter) is placed Two or more edges at cover glass element 610.Each power sensing knot in two or more power sensing structures Structure is operable to the ground power sensing circuit that is couple in touch apparatus of property and can be used for detecting and measure these power.It addition, it is logical Crossing the relative displacement of each power sensing structure estimated in two or more power sensing structures, circuit can be used for determining covering glass The normal vector of glass element 610, position (that is, the position of normal vector) that this normal vector represents applied power and the power applied Size (that is, the value of normal vector).

In one embodiment, normal vector may be in response to the pressure at the tilt quantity of cover glass element or X and Y location Size determines.Such as, two or more of one or more edges on the periphery being positioned over glass elements can be used Individual power sensing structure measures one group of displacement.In one embodiment, displacement is directly proportional to one or more applied power Or can be associated with it.Total power Fz may be in response to each power of the edge of cover glass element and determines, and can be based on Dependency between each power determines centroid position (x0, y0).Therefore, utilize two or more power sensing structures, can count Calculate total power Fz relevant to the actual forces put on cover glass element and center (x0, y0).It addition, multiple power senses The signal that geodesic structure is generated can couple (may be integrated in cover glass element) and cover to resolve with the output of touch sensor On cover glass element multiple fingers touch position and value (power applied).

Fig. 7 shows the another exemplary embodiment of the equipment with capacitive force transducer.This equipment can include touching Quick region 710, it can (or can not) overlap with viewing area (such as LED, LCD or OLED display).In this example In, touch sensitive regions 710 is formed by the transparent touch sensor integrated with cover glass element 610.

Fig. 7 shows the touch apparatus checked from top, and includes touch apparatus housing 605, cover glass element 610 With outward flange 615.Touch apparatus also includes that (in this touch sensitive regions, touch apparatus can make for main button 705 and touch sensitive regions 710 The position of one or more touch is determined) with such as capacitive touch sensors.Main button 705 can partially or even wholly exist In touch sensitive regions 710, or can be located at the outside of touch sensitive regions 710.

In one embodiment, the shape of touch apparatus can be by a pair centrage 715 (such as X-direction centrage 715x With Y-direction centrage 715y) instruction.Touch apparatus can include one along one or more edges (such as around touch sensitive regions 710) Group force transducer 700.Force transducer 700 can be by similar relative to the one or more capacitive force transducer shapes described in Fig. 3-6 Become.Alternatively, force transducer 700 can include other equipment that can sense applied power, such as deformeter.

As it is shown in fig. 7, multiple power that equipment can include the location, one or more edges of the periphery along touch sensitive regions 710 pass Sensor 700.Each force transducer 700 includes by compressible intermediate layer separate at least two capacitor board.An embodiment party In case, one group of force transducer 700 can be generally disposed at the outside of the transparent part of touch sensitive regions 710.Such as, force transducer 700 can be positioned on and (are such as similar to or as relative to described in Fig. 6) below ink mask 660.In this case, power passes Sensor 700 can normal pitch 725 between a pair force transducer 700 and with each force transducer in force transducer 700 and Distances Between Neighboring Edge Points 730 between the edge of touch apparatus positions.In the embodiment of alternative, force transducer 700 can be positioned on Below display stacking or be positioned in the another location of touch sensitive regions 710.Force transducer 700 can be evenly spaced from one another Open, spaced apart with non-homogeneous spacing, spaced apart with repetition interval or on-demand spaced apart.Equally, force transducer 700 can be along touching All sides in quick region 710, the corner of equipment, along touch sensitive regions 710 all or fewer than side or along touch sensitive regions The location, single edge of 710.Therefore, the sensor distribution shown in Fig. 7 is intended to exemplary local distribution, and is not to limit Property.

In one embodiment, each force transducer 700 is coupled to be configured to measure the first flexible circuit and second The power sensing circuit of the capacitance between flexible circuit, this capacitance can be associated to estimate the first flexible circuit and second soft Distance between property circuit.The relative position of the first flexible circuit and the second flexible circuit can be similar to joining shown in above-mentioned Fig. 6 Put.It is similar to the embodiment above, firmly testing circuit (it can include processor) can be made to detect and measure the first flexible circuit Capacitance between the second sensing element limited on first sensing element of upper restriction and the second flexible circuit.In this situation Under, the big I of the power applied is with relative to the resting position when not having power to put on cover glass element 610, and first is soft Property circuit and the relatively change of spacing of the second flexible circuit be associated.Should be appreciated that each force transducer 700 can be by first Flexible circuit and the second flexible circuit are formed, or can be independent component.

In the embodiment of alternative, each force transducer 700 is coupled to be configured to measure the first flexible circuit and the The power sensing circuit of the resistance between two flexible circuits.Such as, the first flexible circuit and the second flexible circuit can pass through resistance Layer couples.By measuring resistance or the change of resistance, power sensing circuit can be used for determining the first flexible circuit and the second flexible electrical Distance between road.Such as, the resistance between the first flexible circuit and the second flexible circuit can be with the first flexible circuit and Distance between two flexible circuits is associated.This is likely to occur in the most compressible resistive layer and depends on its thickness or pressure by having In the case of the material of the variable resistance rate of contracting amount is formed.At one in the case of this type of, compressible resistive layer includes having as bullet The micro structure of the resistance that spring force equally increases, is similar to deformeter.Power sensing circuit can be by measuring electricity in compressible resistive layer The distance between flexible circuit is estimated in the change of resistance or resistance.

With reference to Fig. 7, being couple to being operable to property of force transducer 700 power sensing circuit (including processor), this power senses Circuit is configured to determine that one group of distance corresponding to one group of force transducer 700 is (in the difference along cover glass element 110 edge Position).That is, power sensing circuit can estimate the first flexible circuit and based on the electric capacity measured by each force transducer Distance between two flexible circuits.In one embodiment, the displacement at each sensor 700 with at these force transducers The power applied at the position of 700 is associated.Being similar to the above-mentioned technology with reference to Fig. 6, total power Fz can be based on to each power Estimate to determine, and centroid position (x0, y0) can determine based on the weighting of the estimation to each power.An embodiment In, total power Fz and centroid position (x0, y0) are calibrated such that one group of power being computed and moment responses are in total power Fz and matter The value of heart position (x0, y0) with for observed by the displacement at each force transducer in this group force transducer 700 and power The optimal coupling of value.Therefore, utilize multiple force transducer, can calculate total power Fz relevant to the actual forces putting on equipment and Center (x0, y0).It addition, the signal that multiple force transducers are generated can be coupled with the output of touch sensor (may be integrated in cover glass element) with on analyzing device multiple fingers touch position and value (due to applied Power).

Fig. 8 shows the another exemplary embodiment of the equipment with capacitive force transducer.Specifically, institute in Fig. 8 The equipment shown includes deformable cover glass element.

As shown in Figure 8, cover glass element 805 can be couple to frame element 810, and this frame element can be couple to touch Device framework 815.In one embodiment, between cover glass element 805 and frame element 810, Existential Space separates. For the first example, cover glass element 805 can have the thickness of about 0.90mm, but this specific thicknesses exemplary only and also Nonessential.For the second example, frame element 810 can include elastomer, plastics or include the structure formed by other materials. Cover glass element 805 is alternatively positioned at above display stacking 820, and this display stacking is such as from touch apparatus and fitted Join the display stacking for providing figure or text to show.

In one embodiment, display stacking 820 can be positioned on and includes above the reflector plate 825 of electrode pattern, should Electrode pattern such as can be used for each sensor construction in the driving line in straight line current array and sense wire or array.Reflection Sheet 825 can be positioned on above air gap 830, and this air gap such as can be used for the electric capacity between reflector plate 825 and another element.Such as, Air gap 830 can have the thickness of about 0.10mm, but this specific thicknesses is exemplary only and is not necessarily required to.

In one embodiment, air gap 830 can be positioned on to be had above the circuit 835 of conductive trace or element, this electricity Road can include that one group of driving and sensing trace/element or the array by single sense trace/element are formed.Such as, circuit 835 can There is the thickness of about 0.10mm, but this specific thicknesses is exemplary only and is not necessarily required to.

In one embodiment, circuit 835 can be positioned on above contact adhesive (PSA) element 840.Such as, PSA unit Part 840 can have the thickness of about 0.03mm, but this specific thicknesses is exemplary only and is not necessarily required to.It addition, can at PSA and Use priming paint so that mechanism attaches is to shell between shell.Before bonding, structure can with cover optical be directed at.

In one embodiment, PSA element 840 can be positioned on above intermediate plate element 845.For the first example, in Between panel element 845 can have the thickness of about 0.25mm, but this specific thicknesses is exemplary only and is not necessarily required to.For first Example, intermediate plate element 845 is sustainable to be coupled with it and is positioned at the element below air gap 830.

In one embodiment, cover glass element 805, display stacking 820 and related elements can be relative variable Shape.This can have the effect that the power that the surface to touch apparatus is applied can cause between the element near air gap 830 Distance changes and causes the electric capacity measured by the circuit being positioned near air gap 830 to change.Such as, one group drives and sense wire or list The array of individual sensing element can be positioned in reflector plate 825 or in circuit 835, and it can measure the electric capacity at air gap 830 two ends.

In this case, the electric capacity at air gap 830 two ends can in response to cover glass element 805, display stacking 820, Change with the deformation of related elements.This will have the effect that being positioned at the element near air gap 830 can measure electric capacity change Change, and will be responsive to this change and determine size or the value of applied power.

In some embodiments, multiple force transducers may be formed at the overlying regions of cover glass element 805.At one In embodiment, one group of force transducer can be positioned in linear array, and wherein each force transducer in force transducer is fixed The array of [X, Y] position on the region of cover glass element 805, position.Such as, each force transducer in force transducer May be included in and show mutual capacitance between driver and sensor element or show the capacitive force transducer of self-capacitance.Separately In one example, each sensor in sensor can include that the resistance-type showing resistance variations in response to the power applied should Become instrument, such as with reference to Fig. 6 resistance-type as above deformeter.

In one embodiment, the power applied can affect each force transducer being sufficiently close together applied power.Root According between the size of the power applied and [X, Y] position and [X, Y] position of impacted force transducer of power of being applied away from From, the power applied produces Different Effects to this type of force transducer each.This has the effect that the processor in touch apparatus Or other circuit can determine that the mapping of applied power, and one group of [X, the Y] position and cover glass in response to this mapping is first The Z displacement of part 805.Such as, the specific Z displacement along the point at cover glass element 805 edge (or in touch sensitive regions) can be used for Determine [X, Y] position of applied power.In one embodiment, cover glass element 805 can be about 700 microns of thickness, but This thickness in various embodiments can be different.

In one embodiment, same or like information can be used for determining [X, Y] position of this type of applying power of more than one Put and Z displacement.In the case of applying this type of of multiple power, processor in touch apparatus or other circuit can determine that and applied The barycenter of power, touch apparatus can determine one or more single power according to the barycenter of the power applied.Such as, according to this letter Breath, processor or other circuit can determine that one or more [X, the Y] position just applying power, and in this type of position each just The size of the power applied or value.

In one embodiment, the interaction between cover glass element 805 and air gap 830 is limited to be applied One group of power of each position of power.Processor or other circuit in touch apparatus can such as use and be distributed in whole covering glass One or more capacitance type sensing elements (as described herein) of the position of glass element 805 or use one or more strain These power measured by instrument.In response to these power, circuit can determine that one of the power that the expression of cover glass element 805 applied or Multiple positions and the one or more sizes of power applied or one group of normal vector of value.

In one embodiment, the position of the power applied may be in response to each position on cover glass element 805 The distribution of the power of the applying that the place of putting (as it has been described above, at each X and Y location) is sensed determines, thus distributes and applied This type of position each of power and Z amount.For the first example, total barycenter of the power applied may be in response to sensed applying The distribution of power determine.Processor or other circuit can position each independent power that may apply then, identify the big of this power Little, and the power of the applying sensed in each position deducts identified power.This can have the effect that to place Reason device or other circuit provide the mode that each applied power is individually identified, until finding out this type of power individually applied all.

In one embodiment, it may be determined that the size of the power of each position in one group of diverse location or value, It is arranged on below cover glass element 805 at these position difference force transducers.Such as, in one embodiment, power passes Sensor can be arranged on below cover glass element 805 by grid.Obtain the size of this type of position power each, measurement can be used every The weighted sum of the position of individual applied power calculates the weighted mass center of this group power size.Determining this type of barycenter, processor can In response to nearest maximum, force sensor or in response to touch position sensor or the rwo determine nearest local maxima power.Determine Going out nearest local maxima power, processor can deduct this power and the anticipated impact to each force transducer thereof, and it is straight to repeat this process To the power determining each independent applying.In the embodiment of alternative, can additionally or alternatively use other and other skill Art.

4. power sensitive device system

Fig. 9 shows the example communication touched between I/O equipment and calculating system.In this example, I/O equipment is touched The 901 one or more sensors including the touch for detecting operator or user.Touch apparatus 901 is via communication channel 902 transmit electronic signal from one or more sensors to calculating system 903.Example calculation system is described below with reference to Figure 10 System 903, it includes one or more computer processor and stores for storing the computer-readable of computer executable instructions Device.Touch I/O equipment, communication channel 902 and calculating system 903 can all together be integrated into the part of same touch apparatus.

As shown in Figure 9, embodiment can include touch I/O equipment 901, this touch I/O equipment can receive for via Touch input and power input that wired or wireless communication channel 902 interacts with calculating system 903 (such as potentially include tactile Touch position and the power applied at those positions).It is all that touch I/O equipment 901 can be used for replacing or combine other input equipments As keyboard, mouse or other possible equipment provide user to input to calculating system 903.In the embodiment of alternative, touch Touching I/O equipment 901 can be with other input equipment (such as except or replace mouse, Trackpad or other possible sensing equipments) Rise and use.One or more touch I/O equipment 901 can be used for providing user to input to calculating system 903.Touch I/O equipment 901 Can be calculating system 903 integral part (such as, the touch screen on kneetop computer) or can with calculate system 903 points Open.

Touch I/O equipment 901 and can include that touch sensitive panel and/or power sensitive panel, this touch sensitive panel and/or power sensitive panel have been The most transparent, translucent, nontransparent, opaque or their any combination.Touching I/O equipment 901 can quilt Be embodied as touch screen, touch pad, the touch screen that plays touch pad effect (such as, replace the touch of touch pad of kneetop computer Screen) and any other input equipment combination or combine touch screen or touch pad (such as, be arranged on keyboard, be arranged on touch-control Touch screen on plate or other sensing equipments or touch pad), there is any multidimensional of Touch sensitive surface for receiving touch input Object or other kinds of input equipment or input-output apparatus.

In one example, touch I/O equipment 901 and be at least partially or fully positioned at display extremely for including Transparent and/or the translucent touch-sensitive and touch screen of power sensitive panel above a few part.Although (by touch-sensitive and power sensitive panel It is described as at least partially or fully being positioned at least some of top of display, but in the embodiment of alternative, uses Circuit in the embodiment of touch-sensitive and power sensitive panel or other elements at least partially can be at least partially or fully At least some of lower section and the circuit that are positioned at display interweave, and this circuit is used together at least partially with display, or In contrast.) according to this embodiment, touch I/O equipment 901 for display from the system of calculating 903 (and/or another source) The graph data of transmission, and also be used for receiving user's input.In other embodiments, touch I/O equipment 901 can be implemented For integrated touch screen, the most touch-sensitive and quick parts/devices of power is one with display unit/equipment.In other embodiments, Touch screen is used as showing supplementary graph data or the graph data identical with basic display unit and receiving touch input Supplementary display screen or additional display, this touch input includes possible touch location and is applied at those positions Power.

Touch I/O equipment 901 can be configured to replace or combine or combine and can touch I/O equipment 901 relative to close One or more touches or approximate touch and those appearance of power touched under usable condition measure any Phenomenon, detects on equipment 901 based on capacitive character, resistive, optics, acoustics, sensing, machinery, chemistry or electromagnetic measurement Individual or multiple touch or the position of approximate touch and those power touched under usable condition.Software, hardware can be used, consolidate Part or their any combination process detected touch and the measurement of those power touched under usable condition, to know Not and follow the tracks of one or more gesture.Gesture may correspond to touch the single or multiple of the static state or non-static on I/O equipment 901 Touch or approximate touch and under usable condition those touch power.Can by substantially simultaneously, continuously, in turn or Otherwise on touch I/O equipment 901, mobile one or more fingers or other objects perform gesture, and this gesture is such as Touch, press, wave, shampoo, reverse, change orientation, carry out pressing etc. with different pressure.Can through but not limited to extruding, Sliding, gently sweep, rotate, bend, drag, touch, promote and/or discharge or other actions are to characterize gesture, this other action is situated between Between any other one or more fingers or any other part of health or other objects or utilize these positions.Single Individual gesture can by one or more users utilize any other parts of one or more hands or health or other objects or they Any combination perform.

Calculating system 903 may utilize graph data to drive display with display graphic user interface (GUI).GUI can quilt Be configured to by touch I/O equipment 901 to receive touch input and under usable condition the power of this touch input.It is implemented as Touch screen, touches I/O equipment 901 and can show GUI.Alternatively, GUI is displayed at and the separate display of touch-control I/O equipment 901 On device.GUI may be included in the graphic element that the specific location in interface shows.Graphic element may include but be not limited to multiple institute Display virtual input device, including virtual scroll wheel, dummy keyboard, virtual knob or dial, virtual push button, virtual rod member, Any virtual UI, etc..User can be or many may be associated with the graphic element of GUI touched on I/O equipment 901 Individual specific location performs gesture.In other embodiments, user can be at one unrelated with the position of the graphic element of GUI Or multiple position performs gesture.Can handle directly or indirectly touching the gesture performed on I/O equipment 901, control, repair Change, move, activate, start or affect the graphic element in GUI in general manner, all cursors in this way of this graphic element, icon, media File, list, text, all or part image etc..Such as, for touch screen, user can be by figure on the touchscreen Perform gesture directly to interact with graphic element above element.Or, Trackpad generally provides indirect interaction.Gesture also may be used The GUI element (such as so that user interface manifests) that impact is not shown maybe can affect other actions in calculating system 903 (such as, affecting state or pattern, application program or the operating system of GUI).Be combined with shown cursor, gesture can or can Do not touching execution on I/O equipment 901.Such as, in the case of performing gesture on the touch pad, can be on display screen or touch screen Display highlighting (or pointer), and can via the touch input on Trackpad and under usable condition the power of this touch input come Control light is marked with and interacts with the Drawing Object on display screen.In other embodiments directly performing gesture on the touchscreen In, in spite of having, cursor or pointer are shown on the touchscreen, and user directly can interact with the object on touch screen.

May be in response to or based on the touch touched on I/O equipment 901 or approximate touch and those under usable condition The power touched provides feedback to user via communication channel 902.Can pass through optics, machinery, electrically, olfactory sensation, acoustics, sense of touch Mode etc. or their any combination and optionally transmit feedback in variable or immutable mode.

As previously mentioned, touch I/O equipment, communication channel 902 and calculating system 903 can be all integrated into touching In equipment or other system.Touch apparatus or system can be portable or non-portable device, include but not limited to that communication sets Standby (such as mobile phone, smart phone), multimedia equipment (such as, MP3 player, TV, radio), portable or hand-held Formula computer (such as, panel computer, net book, kneetop computer), desk computer, integrated desk computer, ancillary equipment, or Be suitable to include any other (portable or non-portable) system or equipment of system architecture shown in Figure 10, including these types Equipment in the combination of two or more equipment.

Figure 10 shows the block diagram of an embodiment of system 1000, and this system generallys include one or more computer The radio frequency that computer-readable recording medium 1001, processing system 1004, input/output (I/O) subsystem 1006, electromagnetic frequency circuit are the most possible Or other frequency circuits 1008 and voicefrequency circuit 1010 (RF).These parts can pass through one or more communication bus or signal Line 1003 couples.Every this type of bus or holding wire all can represent with form 1003-X, and wherein X can be unique number.Bus Or holding wire can transmit the data of suitable type between the parts；Each bus or holding wire can be different from other bus/lines, but The operation being substantially similar to can be performed.

Should be appreciated that the framework shown in Figure 10 is only an exemplary architecture of system 1000, and system 1000 can Have than the different configurations illustrating more or less of parts or parts.Various parts shown in Figure 10 can be at hardware, soft Part, firmware or their any combination (including one or more signal processing and/or special IC) are implemented.

As shown in Figure 10, radio circuit 1008 is for sending to other equipment one or more by wireless link or network With the information of reception, and include for performing the circuit known to this function.Radio circuit 1008 and voicefrequency circuit 1010 via Peripheral interface 1016 is coupled to processing system 1004.Interface 1016 includes in ancillary equipment and processing system 1004 Between set up and maintain the various known elements of communication.Voicefrequency circuit 1010 is couple to audio tweeter 1050 and mike 1052, and include allowing the user to and other users from the known circuit of the voice signal of interface 1016 reception for process Carry out real-time Communication for Power.In some embodiments, voicefrequency circuit 1010 includes earphone interface (not shown).

The input peripheral of system and output ancillary equipment are couple to processor 1018 He by peripheral interface 1016 Computer-readable medium 1001.One or more processors 1018 are situated between with one or more computer-readables via controller 1020 Matter 1001 communicates.Computer-readable medium 1001 can be to store the code for one or more processors 1018 And/or any equipment of data or medium.Medium 1001 can include hierarchy of memory, include but not limited to cache, Main storage and additional storage.Can use RAM (such as SRAM, DRAM, DDRAM), ROM, flash memory, magnetic storage apparatus and/or Any combination of optical storage apparatus (such as disc driver, tape, CD (CD) and DVD (digital video disk)) realizes This hierarchy of memory.Medium 1001 may also include the information carrying signal for transmitting instruction computer instruction or data Transmission medium (with or without the carrier wave of modulated signal thereon).Such as, transmission medium can include communication network, this communication Network includes but not limited to the Internet (also referred to as WWW), one or more Intranet, LAN (LAN), wide LAN (WLAN), storage area network (SAN), Metropolitan Area Network (MAN) (MAN) etc..

One or more processors 1018 run the various software parts being stored on medium 1001 with execution system 1000 Various functions.In some embodiments, software part include operating system 1022, communication module (or instruction set) 1024, Touch and force processing module (or instruction set) 1026, figure module (or instruction set) 1028 and one or more application program (or instruction set) 1030.In these modules and above-mentioned application program each correspond to for perform above-mentioned one or Several functions and method (such as, computer implemented method as herein described and other letters described in the present patent application Breath processing method) instruction set.These modules (i.e. instruction set) need not be implemented as independent software program, process or module, And can be combined or otherwise rearrange each subset of these modules the most in various embodiments.Implement at some In scheme, medium 1001 can store above identified module and the subset of data structure.Additionally, medium 1001 can store Add-on module that face does not describes and data structure.

Operating system 1022 includes that various process, instruction set, software part and/or driver are for controlling and management one As system task (such as, memorizer management, storage device control, power management etc.), and be conducive to each hardware and software Communication between parts.

Communication module 1024 be conducive to by one or more outside ports 1036 or via radio circuit 1008 and its He communicates by equipment, and includes that various software part is for processing from radio circuit 1008 and/or outside port 1036 The data received.

Figure module 1028 include various known software part for presenting on a display surface, with animation mode in Now with display Drawing Object.It is touch-sensitive and in the embodiment of the quick display of power (such as touch screen) touching I/O equipment 1012, Figure module 1028 includes the parts for presenting, show and show in animation mode object on the touch-sensitive and quick display of power.

One or more application programs 1030 can include any application program in the system that is arranged on 1000, including but do not limit In browser, address list, contacts list, Email, instant message, word processing, keyboard simulation, desktop widget, prop up Hold the application program of JAVA, encryption, Digital Right Management, speech recognition, speech reproduction, location determination capabilities (such as by this The location determination capabilities that in literary composition, the global positioning system of otherwise referred to as " GPS " is provided), music player etc..

Touch processing module 1026 and include for performing various soft with touch various tasks that I/O equipment 1012 is associated Part parts, these various tasks include but not limited to receive and process via touch I/O device controller 1032 from I/O equipment The touch input of 1012 and force input.In some cases, touch processing module 1026 to include for operating physical force sensor The computer instruction of 1060.Such as, touch processing module 1026 and can include the process for performing below with reference to Figure 11 A-B The instruction of the one or more operations described in 1100 and 1150.In some cases, touching processing module 1026, include can be in power The parameter realized in the operation of sensor 1060 or setting.

I/O subsystem 1006 is couple to touch I/O equipment 1012 and other I/O equipment 1014 one or more for control Make or perform various function.Touch I/O equipment 1012 and carry out with processing system 1004 via touching I/O device controller 1032 Communication, this touch I/O device controller includes (such as, sweeping for the various parts processing user's touch input and force input Retouch hardware).Other input controllers 1034 one or more receive/send the signal of telecommunication from/to other I/O equipment 1014.Other I/O equipment 1014 can include physical button, dial, slide switch, action bars, keyboard, Trackpad, additional display or they Any combination.

If being implemented touch screen, then touch I/O equipment 1012 and display to the user that visual output in the gui.Vision is defeated Go out to include text, figure, video and their any combination.Some or all visual outputs may correspond to user interface pair As.Touch I/O equipment 1012 and form the touch input and the touch-sensitive and power sensitive surfaces of force input accepted from user.Touch I/ O device 1012 and touch screen controller 1032 (together with any module being associated in medium 1001 and/or instruction set) detection And it is (and right to follow the tracks of the touch or approximate touch touched on I/O equipment 1012 and those power touched under usable condition Any movement touched or release, and any change of the power touched) and by detected touch input and force input It is transformed into the mutual of user interface object the most one or more with Drawing Object.In the feelings that equipment 1012 is embodied as touch screen Under condition, user directly can interact with display Drawing Object on the touchscreen.Alternatively, it is being embodied as touching by equipment 1012 In the case of touching the touch apparatus (such as, touch pad or Trackpad) outside screen, user can be implemented as another I/O equipment In the separate display screens of 1014, the Drawing Object of display interacts indirectly.

In touching the embodiment that I/O equipment 1012 is touch screen, touch screen can use LCD (liquid crystal display) skill Art, LPD (light emitting polymers display) technology, OLED (organic LED) or OEL (organic electroluminescent), but other embodiment party Case can use other Display Techniques.

Touch I/O equipment 2012 can touch input based on user and force input and just shown content and/or One or more states of calculating system provide feedback.Optics (such as optical signal or shown image), machinery can be passed through (such as sense of touch feedback, touch feedback, force feedback etc.), electric (such as electricity irritation), olfactory sensation, acoustics (such as beeping sound etc.) etc. or Their any compound mode and transmit feedback in variable or immutable mode.

System 1000 also includes the power system 1044 for powering for various hardware componenies, and can include power management System, one or more power supply, recharging system, power failure detection circuit, power converter or inverter, power supply status refer to Show device and generally with the generation of the electric power in portable set, manage and distribute any other parts being associated.

In some embodiments, peripheral interface 1016, one or more processor 1018 and Memory Controller 1020 can implement on one single chip such as processing system 1004.In some other embodiments, they can be at single core Realize on sheet.

In one embodiment, example system includes the force transducer 1060 integrated with touching I/O equipment 2012.Power Sensor 1060 can include above in regard in the power sensing structure described in any embodiment in exemplary Person or many persons.In general, force transducer 1060 is configurable to generate to be explained or be processed as to touch on O/I equipment 1012 and touches The electronic signal of the value of the power touched or response.In some cases, force transducer 1060 via holding wire 1003-10 directly to Touch O/I device transmission electronic signal.Signal can be forwarded to the force transducer controller 1061 in I/O subsystem 1006.? Under certain situation, signal is transmitted directly to force transducer controller 1061 via holding wire 1003-11 by force transducer 1060, and Without touching I/O equipment 1012.

Force transducer controller 1061 can individually or with one or more processors (such as, processor 1018 or safety Processor 1040) in combination as the power sensing circuit of force transducer 1060.Especially, force transducer controller 1061 can coupling Receive processor or other calculating equipment, such as processor 1018 or safe processor 1040.In one example, force transducer Controller 1061 is configured to calculate based on the electronic signal generated by force transducer 1060 and estimate power.About estimated The data of power can be transferred to processor 1018 or safe processor 1040, (such as touch with other aspects with system 1000 Touch processing module 1026) it is used together.In one example, force transducer controller 1061 is produced by force transducer 1060 Electronic signal perform signal processing, including such as analog digital conversion, filtering and sampling operation.In some cases, system 1000 In other processors (such as processor 1018 or safe processor 1040) calculate the power of estimation based on the signal after processing. Therefore, can use can be tested by signal or data produced by force transducer controller 1061, this signal or data for system 1000 Measure, calculate, estimate or otherwise handle.In one embodiment, the output of force transducer 1060 can be coupled to or The power of may have access to sensing controller 1061 or one or more processors of touch I/O equipment or other calculating equipment (such as process Device 1018, safe processor 1040 or other equipment) use.It addition, the output carrying out force sensor 1060 can be coupled to or The power of may have access to sensing controller 1061 or one or more analog circuits of touch I/O equipment 1012 or other special circuits make With.

After reading present patent application, it will be recognized by one skilled in the art that for relative to touching I/O equipment On the power that applied with contact the information of acquisition, and use this information being associated to determine touching to be executed on I/O equipment The technology of the power added and the value contacted and position in response to and change in truthful data such as being applied from the finger of user Power or the reflection attenuation that received of contact and capacitance sensor data, and touch I/O equipment Inspection utilizing and use institute The power applied can use and practical result with providing in the service contacted.Additionally, after reading present patent application, this area Skilled artisans appreciated that, the process of the calculating equipment power to being applied and touch sensor information includes basic computer control System and programming, relate to applied power and the master record of touch sensor information, and relates to and the power applied and contacting Sensor hardware and optionally for user interface mutual of the power applied and touch sensor information.

Some aspect of embodiment described in the disclosure may be provided as can including having stored instruction the most thereon Computer-readable recording medium or the computer program of non-transient state machine readable media or software, it can be used for calculating Machine system (or other electronic equipments) is programmed performing the process according to the disclosure.Non-transient state machine readable media includes using Any mechanism in form (such as software, process application program) the storage information readable with machine (such as computer).Non-temporarily State machine readable media can present following form but be not limited to: magnetic-based storage media (such as, floppy disk, video tape etc.)；Optics Storage medium (such as, CD-ROM)；Magnetic-optical storage medium；Read only memory (ROM)；Random access memory (RAM)；Erasable Programmable storage (such as, EPROM and EEPROM)；Flash memories；Etc..

Although the disclosure has been described with reference to various embodiments, it is to be understood that, these embodiments are exemplary, and And the scope of the present invention is not limited to these embodiments.Many modification, to revise, add and improve be possible.More generally, In the context of particular, described the embodiment according to the disclosure.In the various embodiments of the disclosure The most during the course by functional separation or combine, or can be been described by with different terms.These and other become Type, revise, add and improve can fall in the scope of the present disclosure defined by the following claims.

5. operational approach

Figure 11 A shows the example process of the equipment for operation with force transducer.This process is available joins above Apply according to the force transducer described in Fig. 2 A, 2B, 3-8.

Figure 11 A shows the exemplary process diagram of the process 1100 including flow points and operating procedure or function.Although this A little flow points and operation are shown with certain order, but in the context of more typically property technology, require operation the most especially Order must be according to shown in figure.Such as, flow points and operation can in a different order, simultaneously, concurrently or with its other party Formula performs.Similarly, although these flow points and operation are shown as being performed, but more one by the general processor in equipment As property method context in, require any such restriction the most especially.Such as, these generic operations one or more can be by specially Perform with processor or by another circuit, or other processors of being transferred in other equipment or other circuit, such as By using wireless technology these functions are transferred to nearby device or these functions are transferred to cloud computing function.In some feelings Under condition, before performing the operation of process 1100, electronic equipment has been opened and operating system has been loaded and has been currently running. It addition, include that the related hardware of such as touch panel sensor, display device and force sensor apparatus can be powered and can be by just Beginningization.

At operation 1105, exert a force to the position [X, Y] on the cover glass of equipment.Can use finger or other refer to Power is applied to equipment such as stylus or pen.In some cases, multiple touches can be applied to the cover glass of equipment.Example As, multi-touch gesture or order can be input on cover glass, thus cause only exerting a force.

At operation 1110, detect in response to the power applied and measure the signal of telecommunication.In one example, in equipment Power sensing circuit (it can include processor) measure the value from one or more force transducers in response to the power applied. In one embodiment, above with reference to described in Fig. 2 A, 2B and 3-5, power sensing circuit detects one or more power sensing structures The capacitance variations at place.Capacitance variations can be associated with or for estimating the flexure of cover glass caused by the power applied.Separately In one embodiment, as described with reference to figure 6, power sensing circuit is estimated based on the signal received from one or more force transducers Meter puts on the tilt quantity of cover glass.In another embodiment, as described in reference to Figure 7, power sensing circuit is used for detecting Be positioned between the capacitance sensor of one group of various location below glass (or under self-capacitance pattern, relative to single Sensor) capacitance variations.Capacitance variations can be used for the displacement on the cover glass that estimation is caused by the power applied.

At operation 1115, determine the position of one or more touch.In one example, power sensing circuit is based on from one One or more signals that individual or multiple force transducers are received determine applied a force on cover glass element or Multiple positions.Can be by such as comparing and use this output to carry out triangulation the output from multiple force transducers Or estimate that the position of the power applied is to determine position.

At operation 1120, the size of the power that estimation applies in each position or value.Such as, power sensing circuit can quilt For determining size or the value of the power applied in each measurement position, such as utilize weighted mass center skill described in reference diagram 8 Art.In some embodiments, the operation of method 1100 is repeatedly carried out.In some embodiments, if power sensitive device Switch on power, just repeat the operation of method 1100.

Figure 11 B shows another process of the equipment for operation with force transducer.This process available above with reference to Force transducer described in Fig. 2 A, 2B, 3-8 is applied.

Figure 11 B shows the another exemplary flow chart of the process 1150 including flow points and operating procedure or function.Though So these flow points and operation are shown with certain order, but in the context of more typically property technology, requirement the most especially Operation order must be according to shown in figure.Similarly, although it is general that these flow points and operation are shown as by equipment Reason device performs, but in the context of more typically property method, requires any such restriction the most especially.In certain situation Under, before performing the operation of process 1150, electronic equipment has been opened and operating system has been loaded and has been currently running.Separately Outward, the related hardware including such as touch panel sensor, display device and force sensor apparatus can be powered and can be by initially Change.

At operation 1155, charge signal is transmitted to power sensing structure.In being typically embodied as, including a series of electricity The capacitor board that the charge signal of lotus pulse is transferred in power sensing structure.Each charge pulse includes putting on power sensing structure The transient changing of voltage of capacitor board, it causes the faradic current at plate two ends.In some cases, charge signal is for putting on The alternating current (AC) at the capacitor board two ends of power sensing structure.Under many circumstances, if charge signal is discrete charge pulse, then Charge pulse is transmitted during equipment works at regular intervals.If charge signal is alternating current, then charge signal can be It is transmitted continuously during operation.In either case, operation 1155 is generally held with operation 1160,1165 and 1170 simultaneously OK, as described hereinafter.

At operation 1160, measure the first electric capacity of power sensing structure.Generally, it is in uncompressed at power sensing structure or does not activates Time under state, measure this electric capacity.Such as, can be in static at equipment and operate in the case of not touched by operator The measurement of 1160.In some cases, take multiple measurements within a time period and determine compound or average capacitance value.

At operation 1165, power is applied in equipment.According to above with reference to the embodiment described in Fig. 2 A, 2B, 3-8, use The cover glass of the tangible equipment in family, the position on cover glass applies power.User can touch with finger, stylus, pen etc. Touch equipment.In some cases, input according to multi-touch gesture or user, multiple touches are applied to cover glass simultaneously.Root According to above with reference to the embodiment described in Fig. 2 A, 2B, 3-8, the power applied typically results in the compression of power sensing structure or flexure, thus Cause the relative change of two capacitor board positions.

At operation 1170, measure the second electric capacity of power sensing structure.Generally, due to the power applied in operation 1165 When the power sensing structure of making is under compression or deflected, measure this electric capacity.In some cases, carry out repeatedly within a time period Measure and determine compound or representative capacitance.

At operation 1175, use the first capacitance measurement and the second capacitance measurement to estimate power.According to above with reference to Fig. 2 A, Embodiment described in 2B, 3-8, the power applied causes the change in location of two capacitor boards, thus changes the electricity of power sensing structure Hold.In operation 1175, capacitance variations is associated with or for calculating estimated power.Such as, if power sensing structure compressible Element shows as linear force spring, then capacitance variations (it is proportional to the change of spacing of capacitor board) will be proportional to the change of power Change.Owing to the material behavior such as flexible ratio of compressible element is known, therefore the big I of power is estimated as the first electricity Hold the difference multiplication by constants measured between the second capacitance measurement.In some embodiments, method 1150 is repeatedly carried out Operation.In some embodiments, as long as power sensitive device switches on power, the operation of method 1150 is just repeated.

6. the electrical connector of force transducer and manufacture method

According to some embodiment above-mentioned, capacitive force transducer generally includes to be had by middle compressible element separately The quick stacking of power of two capacitor boards.In being typically embodied as, charge signal is put at least one in capacitor board Capacitor board also carries out capacitance measurement.For delivery of charge signal (driving signal) and receive capacitance measurement from capacitor board (sense Survey signal), power sensing structure is generally connected to other elements of system by electrical connector.In order to be easy to dress during manufacture Joining, electrical connector is that the detachable electrical connector formed by flexible conduit is probably favourable.

Figure 12 shows exemplary touch equipment 1200, and it is fixed that it has around display element 1202 or part thereof of periphery Two power sensing structures 1210,1220 of position.Two power sensing structures 1210,1220 are electrically connected to electric connector lead-in wire 1250. In this example, each power sensing structure in two power sensing structures (1210,1220) is divided by by middle compressible element The first capacitor board opened and the second capacitor board are formed.In general, power sensing structure 1210 and 1220 can be used for determining equipment The value of the touch on surface.Above with reference to described in Fig. 3-5, the power putting on equipment makes compressible element be compressed or becomes Shape, thus change the distance between the first capacitor board and the second capacitor board.Can make between firmly sensing circuit is with two plates Capacitance variations measures distance change.Therefore, two structures 1210,1220 coordinate to sense power；So, they can individually or Commonly referred to as " power sensing structure ".

Electric connector lead-in wire 1250 can be used for two power sensing structures 1210,1220 and power sensing circuit electric coupling, power Sensing circuit can be positioned on the independent circuit block in equipment.In some cases it may be beneficial to electric connector lead-in wire 1250 are formed by flexible conduit, with beneficially with the connection of power sensing circuit.Such as, electric connector lead-in wire 1250 can be by printing The lamilated body of the polyimide material having or being formed with conductive trace is formed.In some cases, it is also possible to advantageously flexible Conduit is configured to be readily bent, beneficially to connect up in the confined space of apparatus casing.In order to improve adapter lead-in wire The pliability of 1250 or bending radius, it can be advantageous that at least eliminate or remove in the end section of adapter lead-in wire 1250 Middle compressible element.Remove centre compressible element may also be advantageous for electric connector lead-in wire 1250 one or more The electrical connection of inner surface.

Figure 13 shows the sectional view of electric connector lead-in wire 1250 3-3 along the line.As shown in figure 13, electric connector lead-in wire 1250 Formed by four circuit layers 1211,1212,1221,1222.In this example, each circuit layer includes that at least one flexible electrical is situated between Matter layer and at least one flexible conductive layer.Flexible dielectric layer can be formed by polyimide piece, and conductive layer can be by metal film Or metallization trace material is formed.It addition, in this example, each circuit layer and power sensing structure 1210,1220 (shown in Figure 12) One of capacitor board electrical connection.Such as, the conductive layer of circuit layer 1211 may be electrically connected to first (top) of power sensing structure 1210 Capacitor board.Similarly, the conductive layer of circuit layer 1212 may be electrically connected to second (bottom) capacitor board of power sensing structure 1210.Similar Ground, circuit layer 1221 and 1222 is electrically connected respectively to first (top) and second (bottom) capacitor board of power sensing structure 1220.? In this example, each circuit layer in circuit layer 1211,1221,1222 and 1212 is electrically coupled to respective terminal 1213, and 1223, 1224 and 1214.

Alternatively, the one or more circuit layers in circuit layer 1211,1221,1222 and 1212 can be used as power sensing structure The ground plane of 1250.In one example, any one in external circuit layer 1211 or 1212 or both are during working sensor It is maintained at constant voltage, to serve as electromagnetic shielding.In some cases, external circuit layer 1211 or 1212 is during working sensor Ground connection, with beneficially electromagnetic shielding.One or more in external circuit layer can be used as grounded shield according to the position of interference source. In some cases, one or more additional ground screened circuit layers are added to power sensing structure.These additional ground screen layers Can such as be added to the outer surface of external circuit layer 1211 and 1212.In one example, the conduction in any ground shield Trace can extend so that being grounded the maximum area that screen layer is shielded substantially across the whole surface of circuit layer.

As shown in Figure 13, the two circuit layer 1211 and 1221 is by middle compressible stratum 1230 and two other electricity Road floor 1212 and 1222 points are opened.In this example, compressible stratum 1230 is used as force transducer 1210, the compressible unit in 1220 Part.The most as shown in figure 13, during compressible stratum 1230 does not extends to the end section 1255 of electric connector lead-in wire 1250.In Figure 13 Shown in, circuit layer between formed interstice coverage 1350.In some embodiments, to may not include any centre compressible for lead-in wire Layer.

As it has been described above, from the point of view of in terms of several, this configuration can be favourable.First, due to the circuit in upper and lower Layer between do not exist material connect, therefore improve electric connector lead-in wire 1250 flexible, this can be conducive to less Bending radius.Further, since circuit layer between there is not material, therefore additional inside electric terminal 1223 and 1224 can be used In electrical connection.Which reduce circuit pathways or the needs of additional electric wiring, otherwise may additionally need interior circuit layers The conductive layer of 1221,1222 is electrically connected to outside terminal.

Lead-in wire 1250 can extend from power sensing structure 1210,1220 and to bend one or many soft be connected in equipment Property electrical connector or other electrical connectors.As a non-limiting example, lead-in wire 1250, or more suitably, flexible electrical is situated between Matter layer and flexible conductive layer can bend to each cross tie part in scroll mode.Two absolute construction can form lead-in wire；Each this Class mechanism can be formed by a flexible dielectric layer and a flexible conductive layer.In general, two pin configurations can be following In the range of follow different path: pin configuration extends from top power sensing structure 1210 and another pin configuration is from bottom Power sensing structure 1220 extends.But, the composition structure of lead-in wire 1250 is generally routed to them without undergoing putting on covering glass Any power of glass, shell or other external force sensitive surfaces.Therefore, lead-in wire 1250 can not provide the power of applying to walk around force transducer Secondary path, then can improve the accuracy of force transducer.Equally, the miscellaneous part of electronic equipment is configurable to them not Absorb or transfer is to the power of the power sensitive surfaces applying of electronic equipment.

Although equipment 1200 shown in Figure 12 includes two power sensing structures around display element 1202 periphery location, but Alternative embodiment can only include single power sensing structure.In this case, electric connector lead-in wire can only include two conductions Layer (on two circuit layers).In other embodiments selected else, equipment can include two or more power sensing structure and electricity Adapter lead-in wire can have multiple conductive layer to be beneficially connected with each power sensing structure.

Figure 14 shows the example process 1400 for manufacturing the force transducer with electric connector lead-in wire.Process 1400 Can be used for the embodiment manufacture according to Figure 12 and 13 and there is the force transducer 1210,1220 of electric connector lead-in wire 1250.Process 1400 can also be used for manufacturing the force transducer with multiple configuration, including the configuration with single pair of conductive layer.

At operation 1405, obtain the first circuit layer.In this example, the first circuit layer at least includes the first compliant conductive Layer and the first flexible dielectric layer.With reference to Figure 13, the first circuit layer can include circuit layer to 1211,1221 or 1222, in 1212 Any one.In some cases, the first circuit layer can obtain by forming the first conductive layer on the first dielectric layer.Lead Electric layer can be formed by the surface such as making metal forming be bonded to the first dielectric layer.In some cases, conductive layer can lead to Cross the deposition depositing on dielectric layer by conductive material or sputtering technology is formed.In one example, conductive layer is also formed One or more capacitor boards for force transducer.In some cases, the first circuit layer is as sheet material or punched part in advance Manufacture and obtain.

At operation 1410, obtain second circuit layer.In this example, second circuit layer the most at least includes that the second flexibility is led Electric layer and the second flexible dielectric layer.With reference to Figure 13, second circuit layer may also comprise circuit layer to 1211,1221 or 1222, Any one (separating with the first circuit layer also by middle compressible stratum 1230) in 1212.As it has been described above, the first circuit layer can By lamination metal forming or conductive material being deposited on the surface of dielectric layer forms first on the first dielectric layer lead Electric layer and obtain.Second circuit layer also can be prefabricated to be made as sheet material or punched part.

In operation 1415, form laminate structures.Specifically, laminate structures is formed so that compressible stratum is arranged on first Between circuit layer and second circuit layer.With reference to Figure 13, exemplary laminate structures includes four circuit layers 1211,1221,1222, 1212 and compressible stratum 1230.Under many circumstances, other a layers part as laminate structures is formed.Such as, can be formed attached Add circuit layer, adhesive phase and the coating part as laminate structures.Especially, adhesive phase is normally used for centre Other adjacent components bonding of compressible stratum and laminate structures.(operation 1405 and 1410 in obtain) the first circuit layer or It is unnecessary that second circuit layer abuts directly against or be bonded directly to compressible stratum.

Operation 1415 can perform by such as placing contact adhesive (PSA) layer between the parts of laminate structures.Layer Zoarium can stand pressing operation then with each layer that bonds.In some cases, heating or other curing technologies can be used to make respectively Layer is bonded together.In some embodiments, can apply PSA, make all layers bond, then this structure is die-cut into its end form Formula.

Operation 1415 is possible with injection or molding process performs.In this case, the first circuit layer and the second electricity Road floor can be together with other floor or parts lamination or preform.Then these layers can be placed on the phase in injection mold chamber half-and-half In portion, and form the compressible of centre between, the layers by melted or liquid material being injected in injection mold Layer.In one example, spacer element be placed between the first circuit layer and second circuit layer with keep the first circuit layer and Second circuit layer is close to corresponding half portion of injection mold.Spacer element can have roughly the same with the final size of compressible stratum Thickness.In one example, spacer element be compressible and slightly larger than be moulded in the first circuit layer and second circuit layer it Between the final size of compressible stratum.In this case, spacer element applies power to the first circuit layer and second circuit layer, should First circuit layer and the corresponding cavity wall of second circuit lamination patch injection mold.By making circuit layer overlay cavity wall, injection molding Material is more likely filled the region between two circuit layers rather than fills the region between circuit layer and cavity wall.At one In example, multiple spacer element, each spacer element is used to be formed by semicircular rings.Spacer element can be positioned adjacent to mould The position of injection point, it is generally proximal to the center of parts.Then can be by the core of punched part by interval unit Part removes, and this also can beneficially create checks region for display.

As a part for operation 1415, one or more electric path can be formed between each layer of laminate structures.? Under certain situation, electric path forms the circuit layer being arranged on the opposite side of compressible stratum with connection through compressible stratum.Logical Road can be formed by the conductive pole element that the conductive layer such as added from different circuit layers electrically connects.In addition or alternative Ground, the conductive region in compressible stratum can be formed, and is then refluxed for or otherwise electrically connects with the conductive layer of laminate structures.

In some cases, the laminate structures being formed in operation 1415 is cut to form has electric connector lead-in wire Force transducer.Such as, if (obtaining in operation 1405 and 1410) the first circuit layer and second circuit layer are formed reality Heartwood tablet, then laminate structures can be punched to form the expectation geometric profile feature of force transducer.Specifically, can tie from lamination The middle cut away core of structure, to be conducive to installing display element.Therefore, the hole by creating in the middle of laminate structures will It can be seen that display element.If as it has been described above, laminate structures includes the spacer element for injection moulding process, then can be die-cut by this They are removed by operation.The cutting that can perform to add is to form the adapter lead portion of force transducer.

If such as (operation 1405 and 1410 in obtain) the first circuit layer and second circuit layer has been pre-cut or Have been formed as expecting geometric profile shape, then cutting operation can be optional.In this case, operation 1415 may also comprise mark Draw and operate with the layer of the laminate structures that aligns.

In operation 1420, remove a part for compressible stratum from laminate structures.In this example, remove from laminate structures A part for the end section being positioned at electric connector lead-in wire of compressible stratum, thus leave the first component and second circuit unit Interstice coverage between part.Hereinbefore with reference to as described in Figure 12 and 13, remove compressible stratum can improve laminate structures pliability or Flexible.May also provide the access of the terminal on the circuit layer within laminate structures or electrical connector.

Available one or more technology realize removing compressible stratum.In the first example, go between near electric connector The compressible stratum of end section be perforated or precut.It addition, in the end section of electric connector lead-in wire, can omit and can press Contact adhesive between contracting layer and the adjacent layer of laminate structures or other adhesive layers.In this case, precut or perforation And do not have adhesive layer to allow the part being positioned at the end section that electric connector goes between of compressible stratum to be removed.

In the second example, from compressible stratum, one or more layers of laminate structures are layered or peel off, thus cruelly Reveal this compressible stratum.In this case, secondary cut operation can be performed go between with the electric connector that is positioned at removing compressible stratum The part of end section.

In the 3rd example, compressible stratum can be cut from the end section of electric connector lead-in wire, and first to lamination The layer of structure is layered or peels off.Such as, a part for the end section being positioned at adapter lead-in wire of compressible stratum can be led to Cross and make cutter or cutting tool pass between the layer of laminate structures to remove.

As the alternative form of operation 1420, laminate structures may be formed such that the end section that electric connector goes between does not wraps Include compressible stratum.Such as, form laminate structures if, with injection or molding process, then injection-moulded component can be placed in electrical connection In the end section of device lead-in wire, to avoid compressible stratum to be formed in this region.In this case, laminate structures is by the first circuit Interstice coverage between layer and second circuit layer is formed.

As it has been described above, process 1400 can also be used for manufacturing the force transducer with multiple configuration, including having single pair of conduction The configuration of layer.Such as, available process 1400 is formed and only has two circuit layers (on every side of middle compressible stratum each one Individual) force transducer.Or, it is possible to utilizing process 1400 to form force transducer, this force transducer has middle compressible The multiple circuit layers formed on the either side of layer.

The operation of process 1400 provides as an example.But, force transducer also can be by omitting in aforesaid operations One or more operations formed.Such as, how to create according to laminate structures, be not likely to be and have to carry out operation 1420 Remove a part for compressible stratum.

In certain embodiments, lead-in wire is connectable to flexible PCB or other electric contact pieces.In some embodiments In, can be placed in baking oven to be bonded to by lead-in wire by such as surface mounting technology (SMT) technique by whole power sensing structure Electric contact piece.In some embodiments, lead-in wire (or one part) and/or electric contact piece can be heated to 200 degree by SMT technique Or it is higher.But, the temperature of this rising may have adverse effect to the organosilicon of power sensing structure.Therefore, can be by power sense Geodesic structure is placed in heat-resisting encapsulation piece, bag or other containers, and lead-in wire stretches out from these containers.Therefore, it is heated when baking oven When SMT technique, lead-in wire can be heated to proper temperature, and the organosilicon of power sensing structure and other layers can be maintained at not Cause at a temperature of damage.In addition, it will be appreciated that power sensing structure can not be separated or be cut into before heating in an oven Its final form.

Figure 15 A shows the another embodiment 1500 of power sensing electronic equipment.It is similar to other embodiment party described herein Case, embodiment 1500 can include electronic equipment, and this electronic equipment has the covering being positioned above display stacking 1515 1505, its touch being configured to detect the power on the surface of covering 1505.Covering 1505 can be formed by multiple material, bag Include such as glass, Merlon or other plastics, sapphire etc..Display stacking 1515 can include liquid crystal display (LCD), have Machine light emitting diode (OLED) or other electronic displaing parts.

In some embodiments, covering 1505 can move relative to shell 1510.When being covered by the touch of user When applying power on cover piece 1505, covering 1505 can move downward.Should be appreciated that whole covering 1505 can be with this formal row Enter, and be more than deflecting partly, and the edge of covering 1505 generally remains stationary as.Covering 1505 is the most inclined Turn the relative rigidity of the components/elements that can be depending on covering 1505 and be positioned below covering 1505.

In some embodiments, being travel downwardly of covering 1505 makes display stacking 1515 move down equally, continues And can make to be positioned at the sheet type sensor 1520 below display stacking 1515 and be impacted and/or compress.Sheet type sensor 1520 can include the force transducer of capacitor board type, strain-ga(u)ge pickup or other force-sensing sensors, and may be commonly referred to as Power sensing structure, sensor or sheet type sensor.In general, sheet type sensor 1520 can display stacking 1515 main Upper extends.In some cases, sheet type sensor 1520 is by the power being arranged on whole sheet type sensor 1520 region Array or the series of sensing element are formed.

As shown in fig. 15, sheet type sensor 1520 can generally adjoin display stacking 1515.In some embodiments In, sheet type sensor 1520 can be separated by air gap and/or (in certain embodiments) miscellaneous part or layer.One In a little embodiments, sheet type sensor 1520 can directly be attached to the element of display stacking 1515.

Sheet type sensor 1520 can be relative with the side towards display stacking 1515 by being positioned below sensor 1520 Plate 1525 support.In some embodiments, plate 1525 can be rigidity or substantially rigid, and in other embodiments In, plate 1525 can be flexible.Generally, although need not be such, but sheet type sensor 1520 be also attached to plate 1525.At some In embodiment, plate 1525 can be fixed relative to the shell 1510 of equipment.In some embodiments, plate 1525 can be to electronics The shell 1510 of equipment 1500 provides structure to support and/or the middle plate of rigidity, and in other embodiments, plate 1525 can be main Or be used only for supporting sheet type sensor 1520.In other embodiments, other electronic unit (not shown) can pass with chip Sensor 1520 shares plate 1525.

When covering 1505 and display stacking 1515 move down, sheet type sensor 1520 can be compressed.This compression Can sense and generate corresponding output by sheet type sensor 1520.Such as, sheet type sensor 1502 can have the first capacitor board Or array 1530 and the second capacitor board or array 1535 (as used herein, term " plate " is also intended to contain array), thus limit The upper and lower surface of sheet type sensor, or be otherwise positioned in upper area and the lower area of sensor.The One capacitor board 1530 and the second capacitor board 1535 can be by compressible internal layer 1540 such as organosilicon or compliance gel or polymerizations Thing is separated from each other.

In some embodiments, the first capacitor board 1530 and the second capacitor board 1535 are operatively coupled to sensing electricity Road, this sensing circuit is configured to estimate to cover based on the capacitance variations between the first capacitor board 1530 and the second capacitor board 1535 The power of the touch on cover piece.In some are embodied as, sensing circuit is configurable to generate for detecting and measure the first electric capacity The driving signal of the capacitance variations between plate 1530 and the second capacitor board 1535 or electric current.At the first capacitor board 1530 towards second When capacitor board 1535 moves, the reduction of distance may correspond to the capacitance variations between plate, its can with put on covering 1505 Power is associated.

Should be appreciated that in this way, sheet type sensor 1520 can be measured as self-capacitance or mutual capacitance sensors Power.Therefore, mutual capacitance configure in, the one in the first capacitor board and the second capacitor board can be driving plate and another one can be Sensing plate.In self-capacitance configures, the one in the first capacitor board and the second capacitor board can be ground plane or screen layer and separately One can be sensing plate.It addition, the one or both in the plate of sheet type sensor 1520 can be formed with pattern of pixels (as chip passes Sensor 1520 self) so that the applying recording power partly the regional area providing power to be applied.

In there is the embodiment for supporting the flexible of sheet type sensor 1520 or deflectable plate 1525, if chip The layer of sensor 1520 is compressed, and capacitance variations just can be measured, though plate 1525 self bending.Similarly, sense at chip Have in the embodiment of air gap between device 1520 and display stacking 1515, until display stacking is mobile enough far with pressure Contracting or affect sheet type sensor, the power of touch just can be sensed.

Should be appreciated that the sheet type sensor 1520 shown in Figure 15 A is positioned at the situation below display stacking 1515 Under, it is without for transparent.It addition, this type of configuration not only may be adapted to be stacked together with the display with LED or LCD display Use, and the display that may be adapted to and be combined with OLED display layer is stacked together use.

Figure 15 B shows alternative embodiment 1500B of embodiment shown in Figure 15 A.In this embodiment 1500B, Foam 1545 or other conforming materials or compliance layer can be placed between display stacking 1515 and sheet type sensor 1520. Foam 1545 generally can make display stacking 1515 and/or covering 1505 hardening, thus prevents whole stacking/glass to moving down Dynamic.On the contrary, when applying power on covering 1505, the possible local deformation of foam 1545, so that the deformation in regional area And/or power concentration, this can strengthen the power sensing function of embodiment 1500B then.Should be appreciated that can be by any suitable material It is placed between display stacking 1515 and sheet type sensor 1520；A kind of exemplary materials of foam.

In some embodiments, compliance environment liner 1550 or sealing member can be positioned in covering 1505 and shell Between 1510.Compliant pad can prevent dirt, dust etc. from entering the inside of electronic equipment 1500B, but still can allow covering 1505 and display stacking 1515 be travel downwardly.In the embodiment of alternative, liner 1550 can be relative stiffness, and can Coordinate (or operating in the case of there is not foam 1545) to limit covering 1505 on one or more limits with foam 1545 Moving downward at edge, final result is that covering can locally deflect rather than overall traveling.In this type of embodiment, by sheet The partial compression of formula sensor 1520 still can sense power.

In some embodiments, liner 1550 part or all of be coated with oleophobic property material in the region occupied Material.Oleophobic material can be used as opposing or preservative oil, dust, dirt and other similar materials enter shell 1510 and/or The barriers of power of influence sensing structure 1520.So, coating may be used to the operation in time of retentivity sensing structure.It is used as Coating outside oleophobic property coating；In various embodiments, other dusts and/or oil and/or dirt exclusion coating can be used.

Figure 15 C shows another embodiment of power sensing electronic equipment 1500.This embodiment is generally similar to figure The embodiment of 15B, except the structure of sheet type sensor 1520C.Here, sheet type sensor 1520C can be answered by one or more Become instrument and carry out patterning rather than taking the form of capacitance sensor.Each deformeter can come with array, grid or other patterns Arrange to form sheet type sensor 1520C.Deformeter can be changed by the flexure due to sheet type sensor 1520C electrical characteristic or The material producing electrical response is formed.Deformeter such as can be formed by resistance material, piezoresistive material, piezoelectric etc..Should Becoming instrument and also can be formed the array of strain gauge element, each element by can be configured to detection local train or flexure one is Row trace or pattern composition.

When power is applied on covering 1505, its can by display stacking 1515, by foam 1545 (or other Compliance layer) transfer to one or more deformeters of sheet type sensor 1520C.Deformeter can stand owing to the power applied is led The strain caused increases；This strain increase can be associated with the value determining applied power, such as elsewhere herein general description 's.In some embodiments, sheet type sensor 1520C is operatively coupled to be configured to monitoring and detect electrical characteristic become The sensing circuit of the electrical response of the deformeter of change or measurement sheet type sensor 1520C.Such as, sensing circuit can be configured to inspection Survey the resistance variations caused by sheet type sensor 1520C flexure and/or change in electrical charge.

In the embodiment shown in Figure 15 A-15C, covering and display stacking are commonly angled relative to shell free shift. In some embodiments, covering and/or display stacking may be affixed to shell or otherwise fix relative to shell, The power putting on covering is made to cause covering local deformation rather than translation.In this type of embodiment, on the limit of covering In the case of boundary's condition retardation motion, power can be the most locally.Owing to covering still can bend partly, therefore power still can be led to Cross the transmission of each layer and sensed by force transducer (such as, sheet type sensor).

Figure 15 D shows the feature of region 15D in Figure 15 C, it illustrates and is positioned at sheet type sensor 1520 and display One embodiment of the compliance layer 1545D between the base portion of stacking 1515.Section view at the electronic equipment 1500 shown in Fig. 1 In figure, compliance layer 1545D is by being interposed in the top compliance substrate 1555 and bottom rigid substrates 1565 being made up of glass etc. Between the series of similar rod structure 1560 or array formed.(in some embodiments, lower basal plate is alternatively compliance ).In certain embodiments, upper sheet 1555 can be formed by organosilicon, and column structure 1555 also can be such.Chip senses Device 1520C is positioned at below lower basal plate 1565.In the present embodiment, sheet type sensor 1520C is by one or more strains Instrument is formed, above with reference to as described in Figure 15 C.Sheet type sensor 1520C can be supported, as discussed generally above by sensing plate 1525 's.

In some are embodied as, display stacking 1515 or electronic equipment 1500C compliance layer 1545D is executed Under the downward pressure that compliance layer 1545C is applied by any other element stressed, column structure 1555 may deformation.? One or more void space 1550 can be limited between post 1555 and/or around post 1555.Such as, adjacent pillars 1550 can be by sky Gap space 1560 is separately and each void space 1560 can be independent and different.Alternatively, single space is empty Between 1560 can comprise all posts 1555.Therefore it is proposed to void space and the various configuration of column structure.

Along with column structure 1555 deforms, top-sheet 1555 moves closer to bottom sheet 1565, and column structure The opposing collapsed further is strengthened.It addition, it is usual to put on the strain of sheet type sensor 1520C by compliance layer 1545D Increase, thus cause deformeter output to increase.The increase of output can be associated with the power putting on housing exterior.

In some embodiments, one or more void spaces 1550 can be filled with optically transparent or similar transparent Fluid, gel etc. (are referred to as " fluid ").In some embodiments, fluid can be matched with column structure in optical index Optical index.I.e., in certain embodiments, the refractive index of fluid can mate or be similar to the refractive index of column structure 1555. In this type of embodiment, in void space 1550 and column structure 1560, the combination of fluid can make the compliance layer 1545D to be Optically transparent and/or approximate sightless.In the case of display is such as OLED display, this can be useful.

In another embodiment and as shown in Fig. 15 E, compliance layer 1545D can be by bottom capacitance sensing array 1570 separate with top capacitance sensing array 1575.In this type of embodiment 1500E, capacitance sensing array 1570,1575 can Operate as described elsewhere herein so that an array is for driving array (or referential array), and another array is Sensing array.Compliance layer 1545D can be used to prevent two layers too close together, thus prevent or at least reduce two layers it Between contact and/or two layers between excessive capacitance coupling probability, this may cause inaccurate power to be measured.

Figure 16 shows the partial cross sectional of the another embodiment of power sensing electronic equipment 1630.This embodiment can be wrapped Include and be similar to shown in Fig. 2 A and 3 and at power sensing structure 1600 described elsewhere herein.Such as, power sensing structure 1500 Can be configured with by the separate multiple capacitor layers of deformable intermediate, modification and/or Fig. 3 as shown in reference to Fig. 4-6 General discussion.Power sensing structure 1600 can take any mat form being positioned between covering 1505 and shell 1510. In one embodiment, a part for the neighbouring covering 1505 of shell 1510 can include frame or frame portion.

Power sensing structure 1600 can around electronic equipment, the periphery of covering and/or the part of any one partly or Fully extend.Alternatively, multiple power sensing structures 1600 can coordinate with around electronic equipment 1630, the periphery of covering and/ Or the part of any one partially or even wholly extends.In some embodiments, power sensing structure 1600 can be configured to Stop pollutant to enter in the inside of shell 1510, thus also be used as liner.In some cases, combination liner and sensor It is referred to as strain sensitive liner or liner type power sensing structure.

Embodiment just as in the previous, power sensing structure 1600 can capacitively sensing the first plate 1620 and the second plate 1625 Or the distance between other sensor constructions；The output of power sensing structure 1600 can be with the sensing electricity of power sensing electronic equipment 1630 The power that road, processor or other electronic units are sensed is associated.In some embodiments, power sensing structure 1600 operability Be couple to be configured to detection and measure the sensing circuit of electrical characteristic change of power sensing structure 1600, it can be with covering The power of the touch on 1505 is associated.

Except being conventionally positioned at the power sensing structure 1600 of covering 1505 and frame or shell 1510, the present embodiment is also The quick sheet type sensor of the power that may incorporate 1520.Sheet type sensor 1520 is generally similar to above with reference to figure on configuration and operation Any one in sheet type sensor described in 15A-15D.

As shown in figure 16, sheet type sensor 1520 can be separated with display stacking by small air gap.In addition or alternative Ground, sheet type sensor 1520 can be by the compressible stratum similar with above with reference to compressible stratum described in Figure 15 B-E and display heap Fold separately.In the case of covering 1505 and display stacking 1515 bend in response to power, liner type power sensing structure 1600 is compressible and sense power, such as this paper general description.In the case of away from the edge applying power of covering, in order to prevent Covering and display stacking are preferably minimized, it may include sheet type sensor 1520.Fully deform in display stacking and covering In the case of, power is also transmitted to this sheet type sensor by they possible contact piece type sensors 1520.Two force transducers 1600 Can coordinate to determine power with 1520.Such as, the output that can obtain and operate two force transducers puts on covering to determine Power.So, the dynamic force sensing range of equipment 1500 can extended be large enough to cause covering to drop to sensing this general This power is also reacted by the low and power that makes single pad sensor 1600 record maximum.In some embodiments, air gap The power being configured to respond to touch exceedes first threshold and collapses at least in part.In some are embodied as, first threshold Less than Second Threshold, this Second Threshold is corresponding to practically or can be reliably detected by liner type power sensing structure 1600 Energetically.

Figure 17 show can use for capacitively measure put on covering 1505 (or, in other embodiments In, shell or the part on different types of input surface) on the chip of power or the electronic equipment of cushion sensor 1520 Another embodiment of 1700.In general, being structurally and operationally similar to herein with reference to the most attached of sheet type sensor 1520 Described in figure structurally and operationally.

In addition to the upper and lower capacitor array of sheet type sensor 1520, the second capacitance sensing layer/array 1705 also may be used It is placed in display stacking 1515.In one embodiment, the second capacitance sensing layer 1705 can be by tin indium oxide, silver nanoparticle Line, PEDOT or any other suitable conductive material are formed.In certain embodiments, it is desirable to the second capacitance sensing layer 1705 For transparent.

In the embodiment 1700 of Figure 17, the second capacitance sensing layer 1705 can be relative to display stacking 1515 placement. In some cases, capacitance sensing layer 1705 can be used as the capacitive touch screen position with the touch on sensing covering 1505 Put.In some embodiments, capacitance sensing layer 1705 is positioned at above back light unit 1710.If the second capacitance sensing layer 1705 is transparent or similar transparent, and it may not disturb back light unit 1710 and/or its remaining part of display stacking 1515 The operation divided.

As shown in figure 17, air gap can be positioned between capacitance sensing layer 1705 and sheet type sensor 1520.In addition or Alternatively, sheet type sensor 1520 can be by the compressible stratum similar with above with reference to compressible stratum described in Figure 15 B-E and electric capacity Sensed layer 1705 is separately.

Power be applied in covering 1505 (or in some embodiments, shell or input surface) upper time, covering Move closer to sheet type sensor 1520 with display stacking 1515.Therefore, the second capacitance sensing layer 1705 is the most mobile Closer to sheet type sensor 1520.Therefore, at least some of and sheet type sensor 1520 of the second capacitance sensing layer 1705 is upper Electric capacity between portion's capacitor array 1530 can increase with this type games.Further, since covering 1505, display stacking 1515 May be in response to power with the second capacitance sensing layer 1705 and deform partly, therefore electric capacity can correspond to the general of applied power Region increases (or increasing more).This change of electric capacity can be used for the power estimating to be applied, as elsewhere herein Describe.

Under enough power, back light unit 1710 (or other base portions of display stacking) is by contact piece type sensor 1520 Upper surface.The most this situation occurs, the second capacitance sensing layer 1705 and the top capacitor array of sheet type sensor 1520 Electric capacity between 1530 is generally up to maximum.Additional force can make sheet type sensor 1520 compress, so that top electric capacity battle array Row 1530 the most mobile is closer to bottom capacitor array 1535 and makes the electric capacity between the two element at least Increase in given area.Therefore, even if the electric capacity between the second capacitance sensing layer 1705 and top capacitor array 1530 can be Maximum or close to maximum, but the array 1530 of sheet type sensor 1520, the electric capacity between 1535 increases and can also be used for determining The estimation of the power applied.

In some embodiments, sensing circuit is operatively coupled to capacitance sensing layer 1705 and sheet type sensor 1520.Sensing circuit can be configured to based on capacitance sensing layer 1705 and the top capacitor plate of sheet type sensor 1520 and/or under The power of the touch on covering is estimated in the change of the mutual capacitance between portion's capacitor board.In some embodiments, sensing circuit The first electric capacity obtaining between top capacitor plate and the bottom capacitor board of sheet type sensor can be configured to, and also obtain top The second electric capacity between capacitor board and capacitance sensing layer.The first electric capacity utilizing sensing circuit to measure and the second electric capacity can be used Calculate or generate the estimation of the power to the touch on covering.

Then it is believed that the electric capacity between the second capacitance sensing layer 1705 and top capacitor array 1530 can be used for determining Or estimate the power applied between null value and certain first threshold, and the top capacitor array 1530 of sheet type sensor 1520 With the electric capacity between bottom capacitor array 1535 can be used for the power applied that determines between first threshold and Second Threshold.Sense This combination of geodesic structure can provide than the power sensing using the attainable wider value of single sensor.

Should be appreciated that embodiment described herein can measure the change of power, thus provide right to the electronic equipment being associated Should distance change between two capacitance structures or array or less than the non-binary of 2 microns or substantially continuous input. Therefore, although the one or both in capacitance structure or array can be moved relative to, but this motion is mutual with equipment People is imperceptible.As a non-limiting example, may correspond to put on surface with the distance change of nanometer tolerance The power of about one gram.

Although the disclosure has been described with reference to various embodiments, it is to be understood that, these embodiments are exemplary, and And the scope of the present invention is not limited to these embodiments.Many modification, to revise, add and improve be possible.More generally, In the context of particular, described the embodiment according to the disclosure.In the various embodiments of the disclosure The most during the course by functional separation or combine, or can be described with different terms.These and other become Type, revise, add and improve can fall in the scope of the present disclosure defined by the following claims.

Claims (20)

1. an electronic equipment, including:

Covering；

Display, described display is positioned in below described covering；

Power sensing structure, described power sensing structure is arranged on below described display, and wherein said power sensing structure includes:

Top capacitor plate；

Bottom capacitor board, described bottom capacitor board is arranged on below described top capacitor plate；With

Compressible element, described compressible element is arranged between described top capacitor plate and described bottom capacitor board；With

Plate, described plate is attached to described power sensing structure and supports described power sensing structure.

Electronic equipment the most according to claim 1, also includes:

Sensing circuit, described sensing circuit is operatively coupled to described power sensing structure, and wherein said sensing circuit is configured For estimating touch on described covering based on the capacitance variations between described top capacitor plate and described bottom capacitor board Power.

Electronic equipment the most according to claim 1, wherein said power sensing structure by including the compliance layer of air gap and Separate with described display.

Electronic equipment the most according to claim 1, wherein said power sensing structure is suitable by be made up of compressible foam Answering property layer and separate with described display.

Electronic equipment the most according to claim 1, wherein said power sensing structure is by by compliance post array and optics Transparent fluid composition compliance layer and separate with described display.

Electronic equipment the most according to claim 1, also includes:

Shell, described shell has the frame around described covering；

Liner, described liner is arranged in the gap between described covering and described frame；With

Oleophobic property coating, described oleophobic property coating is arranged at least some of top in described gap.

7. an electronic equipment, including:

Shell；

Covering, described covering is arranged in the opening of described shell；

Strain sensitive liner, described strain sensitive liner along the periphery of described covering be arranged on described covering and described outside Between shell；With

Power sensing structure, described power sensing structure is arranged on below described covering.

Electronic equipment the most according to claim 7, also includes fixing and support described power sensing knot relative to described shell The plate of structure.

Electronic equipment the most according to claim 7, wherein said strain sensitive liner includes:

Liner top capacitor plate；

Liner lower capacitor board；With

Liner compressible element, described liner compressible element is arranged on described liner top capacitor plate and described liner lower Between capacitor board.

Electronic equipment the most according to claim 7, also includes:

Display, described display is arranged between described covering and described power sensing structure；With

Including the compressible stratum of air gap, described compressible stratum is between described display and described power sensing structure.

11. electronic equipments according to claim 10, wherein:

The power that the described air gap of described compressible stratum is configured to respond to touch exceedes first threshold and collapses at least in part； And

Described first threshold is less than Second Threshold, and described Second Threshold is corresponding to can be detected by described strain sensitive liner Energetically.

12. electronic equipments according to claim 7, also include:

Display, described display is arranged between described covering and described power sensing structure；With

Compressible stratum, described compressible stratum is between described display and described power sensing structure, wherein

The power that described compressible stratum is configured to respond to touch exceedes first threshold and collapses at least in part；And

Described first threshold is less than Second Threshold, and described Second Threshold is corresponding to can be detected by described strain sensitive liner Energetically.

13. electronic equipments according to claim 7, wherein said power sensing structure includes:

Top capacitor plate；

Bottom capacitor board；With

Compressible element, described compressible element is arranged between described top capacitor plate and described bottom capacitor board.

14. electronic equipments according to claim 7, wherein said power sensing structure includes deformeter.

15. 1 kinds of electronic equipments, including:

Covering；

Capacitance sensing layer, described capacitance sensing layer is positioned in below described covering；

Compressible stratum, described compressible stratum is positioned at below described capacitance sensing layer；With

Power sensing structure, described power sensing structure is arranged on below described compressible stratum, and wherein said power sensing structure includes:

Top capacitor plate；

Compressible element, described compressible element is arranged on the side of described top capacitor plate；With

Bottom capacitor board, described bottom capacitor board is arranged on relative with described top capacitor plate of described compressible element On side.

16. electronic equipments according to claim 15, also include:

It is positioned in below described power sensing structure and supports the plate of described power sensing structure.

17. electronic equipments according to claim 15, wherein said compressible stratum includes air gap.

18. electronic equipments according to claim 15, also include:

It is positioned in the display below described covering；With

Being positioned in the backlight below described display, wherein said capacitance sensing layer is arranged on described display and described Between backlight.

19. electronic equipments according to claim 15, also include:

Sensing circuit, described sensing circuit is operatively coupled to described capacitance sensing layer and described power sensing structure, Qi Zhongsuo That states that sensing circuit is configured between described top capacitor plate based on described capacitance sensing layer and described power sensing structure is mutual The power of the touch on described covering is estimated in the change of electric capacity.

20. electronic equipments according to claim 19, wherein said sensing circuit is configured to:

Obtain the first electric capacity between the described top capacitor plate of described power sensing structure and described bottom capacitor board；

Obtain the second electric capacity between described top capacitor plate and described capacitance sensing layer；And

Described first electric capacity and described second electric capacity is used to generate the estimation of the power to the touch on described covering.