CN106067369A - Transformator and include its power supply device - Google Patents

Transformator and include its power supply device Download PDF

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Publication number
CN106067369A
CN106067369A CN201610037803.3A CN201610037803A CN106067369A CN 106067369 A CN106067369 A CN 106067369A CN 201610037803 A CN201610037803 A CN 201610037803A CN 106067369 A CN106067369 A CN 106067369A
Authority
CN
China
Prior art keywords
substrate
conductive pattern
coil
transformator
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201610037803.3A
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Chinese (zh)
Inventor
李皓宰
郑乐俊
韩盛然
卢永昇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN106067369A publication Critical patent/CN106067369A/en
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/288Shielding
    • H01F27/2885Shielding with shields or electrodes
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/44Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M5/00Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases
    • H02M5/02Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc
    • H02M5/04Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc by static converters
    • H02M5/10Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc by static converters using transformers
    • H02M5/12Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc by static converters using transformers for conversion of voltage or current amplitude only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • H01F2027/2809Printed windings on stacked layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • H01F2027/2819Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The present invention relates to transformator and include its power supply device, including according to the transformator of one embodiment of the invention: core, including a pair mutually magnetically coupled ferrite core;Baseplate part, including multiple substrates, the plurality of substrate arranged is also stacking between the pair of ferrite core, and is formed with conductive pattern;Insulation division, including the multiple insulators being arranged between the plurality of substrate.The plurality of substrate includes: first substrate;A pair shielding board, is arranged in top and the bottom of described first substrate;Second substrate, arrange opposite to each other with a pair ferrite core to the outside of the pair of shielding board, the described conductive pattern being formed at first substrate is formed with identical shape with the conductive pattern being formed at the pair of shielding board, and can be formed as consistent along the stacked direction of the plurality of substrate.

Description

Transformator and include its power supply device
Technical field
The present invention relates to a kind of planar transformer and include its power supply device.
Background technology
Power supply device should meet the electromagnetic interference (EMI:Electro-Magnetic required in safety standard Interference) specification.To this end, by X_ capacitor (cross-line capacitor, across-the-line capacitor), CM filter The parts of the multiple electromagnetic interference suppression such as ripple device (common-mode filter, common mode filter) are connected to power supply supply dress The input put.There is size and the volume increasing power supply device parts in using of this electromagnetic interference suppression parts And cause the problem that the manufacturing cost of parts rises.
Summary of the invention
It is an object of the invention to provide a kind of in the case of power input does not connect special parts, it is possible to subtract Lack the transformator of electromagnetic interference and comprise its power supply device.
Transformator according to one embodiment of the invention includes: core, including a pair mutually magnetically coupled ferrite core; Baseplate part, including multiple substrates, the plurality of substrate arranged is also stacking between the pair of ferrite core, and is formed with conduction Pattern;And insulation division, including the multiple insulators being arranged between the plurality of substrate, the plurality of substrate includes: first Substrate;A pair shielding board, is arranged in top and the bottom of described first substrate;Second substrate, to the pair of shielding base The outside of plate is arranged opposite to each other with a pair ferrite core, is formed at the conductive pattern of described first substrate and is formed at the pair of The pattern of the conductive pattern of shielding board can be formed with identical shape, and along the stacked direction shape of the plurality of substrate Become consistent.
Power supply device according to one embodiment of the invention includes: transformator, possesses: first coil, is formed at one Secondary side, obtains the applying of input voltage from one end;Second coil, is formed at secondary side, from the electricity transmitted from described first coil Source generates out-put supply;And shielded coil, to be formed in the way of described first coil and the second coil insulation;And crystal Pipe, is arranged between described first coil and ground connection and carries out switching manipulation, described first coil, described second coil and institute State shielded coil and correspond to be respectively formed in the conductive pattern of multiple substrates of stacking, corresponding to the conductive pattern of described first coil Case can be with identical shape with the conductive pattern corresponding to described shielded coil, formation and the layer along the plurality of substrate Folded direction is formed as consistent.
Transformator according to one embodiment of the invention constitutes the coil of magnetic cell by laminated multi-layer substrate, it is possible to achieve Magnetic cell lightening.
Power supply device according to one embodiment of the invention can reduce the magnetizing inductance of transformator and transistor The electromagnetic interference of the low-frequency band that the resonance of parasitic capacitance causes.
Accompanying drawing explanation
Fig. 1 is the decomposing section of the outline of the transformator according to one embodiment of the invention.
Fig. 2 is the example of the front elevation of the multiple substrates according to one embodiment of the invention.
Fig. 3 and Fig. 4 illustrates that and is formed at first substrate and shielding board according to one embodiment of the invention The relation of conductive pattern and the figure that provides.
Fig. 5 is the equivalence of the conductive pattern being formed at first substrate and shielding board according to one embodiment of the invention Circuit diagram.
Fig. 6 is the figure of the example illustrating the power supply device according to one embodiment of the invention.
Fig. 7 is the simulation figure according to one embodiment of the invention.
Symbol description
100: transformator 110: core
111,112: ferrite core 120: baseplate part
121: first substrate 122a, 122b: shielding board
123a, 123b: second substrate 130: insulation division
Detailed description of the invention
Detailed description of the invention described later reference illustrates as example can implement the attached of only certain embodiments of the present invention Figure.For making those skilled in the art can implement the present invention, embodiments of the invention are fully described in detail.This Although bright various embodiments is different it should be appreciated that this does not have exclusiveness.Such as, described in this specification Specific shape, structure and feature in one embodiment can in the case of without departing from the spirit and scope of the present invention with Other embodiments realize.And it is understood that the position of indivedual elements in each disclosed embodiment or arrange permissible It is changed in the case of without departing from the spirit and scope of the present invention.So, detailed description described later is not to be construed as The determinate meaning, and the scope of the present invention is under suitable explanation, the content only advocated according to claim and its All scopes and the appended claims item of equivalent define.Reference marks similar in accompanying drawing refers to identical on multiple sides Or similar function.
Hereinafter, embodiments of the invention are described in detail so that those skilled in the art can hold with reference to accompanying drawing Change places the enforcement present invention.
Fig. 1 is the decomposing section of the outline of the transformator according to one embodiment of the invention.
With reference to Fig. 1, the planar transformer of the present invention may include that core 110, baseplate part 120, insulation division 130.
Core 110 can include a pair ferrite core 111,112 of mutual electromagnetic coupling.A pair ferrite core 111,112 The leg (leg) of mutual electromagnetic coupling can be included respectively.A pair ferrite core 111,112 is as it can be seen, can be EE core, also Can be made up of variforms such as EI core, UU core, UI cores.
As it can be seen, a pair ferrite core 111,112 can be respectively provided with the first to the 3rd leg 111a, 112a, 111b, 112b, 111c, 112c, and can be by the combination of first to the 3rd pin 111a, 112a, 111b, 112b, 111c, 112c And electromagnetic coupled.
Baseplate part 120 and insulation division 130 can be disposed with between a pair ferrite core 111,112.
Baseplate part 120 can include multiple substrate 121,122a, 122b, 123a, 123b.
Multiple substrates 121 of baseplate part 120,122a, 122b, 123a, 123b can the prints of printed circuit by surface Brush circuit substrate (Printed Circuit Board;PCB) constitute.Multiple substrates 121,122a, 122b, 123a, 123b can be Middle place multiple insulator 131a, 131b, 131c, 131d and stacking.
Specifically, baseplate part 120 may include that first substrate 121;A pair shielding board 122a, 122b, be arranged in first The top and the bottom of substrate 121;A pair second substrate 123a, 123b, to the outside of shielding board 122a, 122b and a pair ferrite core Layout in opposite directions.
Fig. 2 is an example of the front elevation of the multiple substrates according to one embodiment of the invention.
With reference to Fig. 2, can be respectively formed with for inserting a pair ferrum at multiple substrates 121,122a, 122b, 123a, 123b The through hole H of the foot of oxysome core 111,112.Further, conductive pattern P can along multiple substrates 121,122a, 122b, Being formed around the substrate of 123a, 123b, multiple through hole h1, h2 can be formed at inner side or the outside of conductive pattern P.
Multiple through hole h1, h2 can include outer side through hole h11, h12, h13, h14, h15 and interior side through hole h21, h22, h23.Be respectively formed in multiple substrate 121,122a, 122b, 123a, 123b conductive pattern P can with outer side through hole h11, In h12, h13, h14, h15 one and a connection in interior side through hole h21, h22, h23.
It is formed at the conductive pattern of different types of substrate and can be connected to mutually different outer side through hole and inner side leads to Hole.Such as, in the case of the conductive pattern of first substrate 121 turns on outer side through hole h12 and interior side through hole h22, a pair The conductive pattern of shielding board 122a, 122b can be connected with outer side through hole h11 and interior side through hole h23.
Multiple through hole h1, h2 can be connected to the conductive pattern P of a pair shielding board 122a, 122b and be electrically connected each other Connect, it is also possible to the conductive pattern P being connected to a pair second substrate 123a, 123b electrically connects each other
Multiple substrates 121,122a, 122b, 123a, 123b can be the structure being laminated with multiple tellite respectively. Conductive pattern can be formed at each tellite two sides or one side, conductive pattern can pass through multiple through hole h1, H2 and electrically connect with the tellite of different layers.
Such as, in the case of first substrate 121 is formed with the structure being laminated with multiple tellite, conductive pattern Two sides or the one side of tellite can be formed at, and the conductive pattern of each layer can pass through multiple through hole h1, h2 And electrically connect with the tellite of different layers.
The conductive pattern P being formed at the first substrate 121 and conductive pattern P being formed at second substrate 123a, 123b is permissible Play the effect forming primary winding and the coil of the turn ratio of secondary coil in transformator.It is formed at first substrate 121 Conductive pattern P is as first siding ring function, and the conductive pattern P being formed at second substrate 123a, 123b can be as two Secondary lateral coil function, thus turn ratio set in advance can be formed.
In order to obtain target turn ratio, it is formed at the conductive pattern P of first substrate 121 and second substrate 123a, 123b Spiral type can be formed as along the surrounding of substrate and centered by through hole H.
As described above, first substrate 121 and second substrate 123a, 123b can be stacking multiple printed circuit base respectively The structure of plate, the number of described tellite can determine according to target turn ratio.
The conductive pattern P being formed at shielding board 122a, 122b can be as shielding a side line at transformator Enclose the shielded coil of noise of transmission between second siding ring and function.It is formed at leading of shielding board 122a, 122b Electrical pattern P can according to identical for the conductive pattern P shape being formed at first substrate 121 and identical directional patterns and Obtain.
Fig. 3 and Fig. 4 illustrates that and is formed at first substrate and shielding board according to one embodiment of the invention The relation of conductive pattern and the figure that provides.
Fig. 3 (a) and Fig. 4 (a) is the figure illustrating the conductive pattern being formed at first substrate 121, Fig. 3 (b) and Fig. 4 B () respectively illustrates and the shape corresponding to the conductive pattern being formed at first substrate 121 shown in Fig. 3 (a) and Fig. 4 (a) Become the figure of the conductive pattern of shielding board 122a, 122b.
As shown in Fig. 3 (a), it is formed at the conductive pattern P of first substrate 121 from inboard to outside pattern in the counterclockwise direction Change and obtain in the case of, as shown in Fig. 3 (b), the conductive pattern P being formed at shielding board 122a, 122b can also be from inner side Pattern the most in the counterclockwise direction and obtain.Specifically, the conductive pattern P of first substrate 121 it is formed at from interior side through hole In the case of h22 to outer side through hole h12 obtains along counterclockwise patterning, as shown in Fig. 3 (b), it is formed at shielding base The conductive pattern P of plate 122a, 122b can obtain along counterclockwise patterning from interior side through hole h23 to outer side through hole h11 ?.Now, the conductive pattern P being formed at the first substrate 121 and conductive pattern P being formed at shielding board 122a, 122b is permissible Be formed as consistent with identical shape formation and the stacked direction along multiple substrates.
Further, as shown in Fig. 4 (a), it is formed at the conductive pattern P outside-in of first substrate 121 along side clockwise In the case of obtaining to patterning, as shown in Fig. 4 (b), the conductive pattern P being formed at shielding board 122a, 122b can also Outside-in patterns along clockwise direction and obtains.Specifically, be formed at the conductive pattern P of first substrate 121 from In the case of outer side through hole h12 inside side through hole h22 patterns along clockwise direction and obtains, as shown in Fig. 4 (b), it is formed at The conductive pattern P of shielding board 122a, 122b can pattern along clockwise direction from outer side through hole h11 inside side through hole h23 And obtain.Now, it is formed at the conductive pattern P of first substrate 121 and is formed at the conductive pattern P of shielding board 122a, 122b Be formed as consistent with identical shape formation and the stacked direction along multiple substrates.
Fig. 5 is the equivalence of the conductive pattern being formed at first substrate and shielding board according to one embodiment of the invention Circuit diagram.The inductance composition that first coil N1 of Fig. 5 causes with the conductive pattern P being formed at first substrate 121 is corresponding, shielding line Nsh is corresponding with the inductance composition that the conductive pattern P being formed at shielding board 122a, 122b causes for circle.
Point (dot) shown in Fig. 5 refers to beginning or the end of coil, as shown in Figure 3 and 4, makes leading of substrate The formation direction of electrical pattern P be designed to identical in the case of, first coil N1 can be with shielded coil Nsh along equidirectional shape Cheng Dian.
Fig. 6 is the figure of the example illustrating the power supply device according to one embodiment of the invention.
With reference to Fig. 6, include according to the power supply device of one embodiment of the invention: first coil N1, be formed at once Side;Second coil N2, is formed at secondary side, generates out-put supply with first coil N1 inductive;Transformator, including arranging Shielded coil Nsh between described first coil N1 and the second coil N2;Transistor Q, connects with first coil N1.Shielding line Circle Nsh can be to be formed in the way of first coil N1 and the second coil N2 insulation.
Power supply device can be applied to the input power of first coil N1 by means of the switching manipulation of transistor Q Vin is transferred to the second coil.
If comparing figure 3 described above and Fig. 4 and Fig. 6, with the leading of first substrate 121 being formed at Fig. 3 and Fig. 4 The through hole h21 that electrical pattern P connects can be connected with transistor Q, and input power Vin can be applied to through hole h12.Further, with shape Becoming the through hole h23 that the conductive pattern P of shielding board 122a, 122b connects can be with ground connection, and through hole h11 can float (floating).Further, with the most contrary, be connected with the conductive pattern P of the first substrate 121 being formed at Fig. 3 and Fig. 4 is logical Hole h12 can be connected with transistor Q, and input power Vin can be applied to through hole h21.Further, be formed at shielding board The through hole h11 that the conductive pattern P of 122a, 122b connects can be with ground connection, and through hole h23 can float.
According to one embodiment of the invention, make in the two ends of first coil N1 from the one end being connected with transistor Q to reception From one end of ground connection to the figure of the other end floated in the pattern direction of the other end of input power and the two ends of shielded coil Nsh Case direction and shape are identical, such that it is able to reduce because the resonance of the magnetizing inductance of transformator and the parasitic capacitance of transistor causes The electromagnetic interference (EMI:Electromagnetic Interference) of low-frequency band.
Fig. 7 is the simulation figure according to one embodiment of the invention.Fig. 7 (a) is the simulation figure of comparative example, and Fig. 7 (b) is Simulation figure according to one embodiment of the invention.
With reference to Fig. 7 (a), it has been confirmed that the electricity that the resonance of the parasitic capacitance of the magnetizing inductance of transformator and transistor causes Magnetic disturbance causes output level to steeply rise abnormally in the low-frequency range of 700hz~900hz.But, with reference to Fig. 7 (b), If making in the two ends of first coil N1 the pattern direction from the one end being connected with transistor Q to the other end receiving input power Identical to the pattern direction of the other end floated from one end of ground connection with in the two ends of shielded coil Nsh, and make first coil N1 and the pattern form of shielded coil are formed as consistent, such that it is able to make the magnetization of transformator along the stacked direction of multiple substrates Electromagnetic interference (the EMI:Electromagnetic of the low-frequency band that the resonance of the parasitic capacitance of inductance and transistor causes Interference) it is reduced.
Above, by the feature items such as concrete element and the embodiment of restriction and accompanying drawing, the present invention is carried out Illustrate, but this is intended merely to help understanding of the entirety of the present invention and provide, and the invention is not restricted to described embodiment, and this The technical staff in field can attempt multiple finishing and deformation from this record.
So, the present invention should not be limited to the embodiment of described explanation and defines, and right and right Within the equalization of claimed range or the deformation of equivalence should belong to the thought range of the present invention.

Claims (12)

1. a transformator, including:
Core, including a pair mutually magnetically coupled ferrite core;
Baseplate part, including multiple substrates, the plurality of substrate arranged is between the pair of ferrite core and stacking, and is formed and leads Electrical pattern;
Insulation division, including the multiple insulators being arranged between the plurality of substrate,
The plurality of substrate includes: first substrate;A pair shielding board, is arranged in top and the bottom of described first substrate; Second substrate, arranges with a pair ferrite core opposite to each other to the outside of the pair of shielding board,
The conductive pattern being formed at described first substrate and the patterning side of the conductive pattern that is formed at the pair of shielding board The most identical.
2. transformator as claimed in claim 1, it is characterised in that
It is formed at the conductive pattern of described first substrate with the conductive pattern being formed at the pair of shielding board with identical shape Shape is formed, and is formed as consistent along the stacked direction of the plurality of substrate.
3. transformator as claimed in claim 1, it is characterised in that
The plurality of substrate is respectively formed with the through hole for being combined with the pair of ferrite core.
4. transformator as claimed in claim 3, it is characterised in that
The conductive pattern of the plurality of substrate respectively centered by described through hole along the plurality of substrate each around shape Become.
5. transformator as claimed in claim 4, it is characterised in that
The conductive pattern of the plurality of substrate respectively centered by described through hole along the plurality of substrate each around with Spiral type is formed.
6. transformator as claimed in claim 1, it is characterised in that
It is formed at the conductive pattern of described first substrate there is the number of turn with the conductive pattern being formed at the pair of second substrate The mode of ratio is formed.
7. transformator as claimed in claim 1, it is characterised in that
Outer side through hole and interior side through hole is formed respectively at the plurality of substrate,
In described outer side through hole one and in described interior side through hole and the conduction being respectively formed in the plurality of substrate Pattern connects.
8. transformator as claimed in claim 7, it is characterised in that
The conductive pattern of described first substrate and the conductive pattern of described second substrate with in mutually different described outer side through hole One and described interior side through hole in a connection.
9. a power supply device, it is characterised in that including:
Transformator, possesses: first coil, is formed at primary side, obtains the applying of input voltage from one end;Second coil, is formed In secondary side, generate out-put supply and shielded coil from the power supply transmitted from described first coil, with described first coil Formed with the mode of the second coil insulation;And
Transistor, is arranged between described first coil and ground connection and carries out switching manipulation,
Described first coil, described second coil and described shielded coil are corresponding to being respectively formed in multiple substrates of stacking Conductive pattern,
Conductive pattern and the conductive pattern corresponding to described shielded coil corresponding to described first coil are with identical shape shape Become, and be formed as consistent along the stacked direction of the plurality of substrate.
10. transformator as claimed in claim 9, it is characterised in that
Described first coil has the one end being connected with described transistor and obtains the other end of applying of described input power;
Described shielded coil has one end of ground connection and the other end of floating.
11. transformators as claimed in claim 10, it is characterised in that
From one end of described first coil to the patterning direction of the conductive pattern of the described other end with from described shielded coil One end is mutually the same to the patterning direction of the conductive pattern of the described other end.
12. transformators as claimed in claim 9, it is characterised in that
The low-frequency band that the parasitic capacitance of magnetizing inductance and described transistor that described shielded coil reduces described transformator causes Electromagnetic interference.
CN201610037803.3A 2015-04-23 2016-01-20 Transformator and include its power supply device Withdrawn CN106067369A (en)

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Application Number Priority Date Filing Date Title
KR1020150057313A KR101690262B1 (en) 2015-04-23 2015-04-23 Transformer and power supply apparatus including the same
KR10-2015-0057313 2015-04-23

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KR102154155B1 (en) * 2018-08-24 2020-09-09 주식회사 솔루엠 Planar transformer having y-capacitor
KR102584360B1 (en) * 2022-02-24 2023-10-05 가천대학교 산학협력단 Planar transformer and method for manufacturing thereof

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US20110018676A1 (en) * 2007-09-12 2011-01-27 George Young Transformer assembly
US20100289610A1 (en) * 2009-05-12 2010-11-18 Jacobson Boris S Planar magnetic structure
US20130207767A1 (en) * 2010-07-01 2013-08-15 Micromass Uk Limited Planar Transformers
KR101452827B1 (en) * 2014-06-17 2014-10-22 삼성전기주식회사 Transformer and adapter

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* Cited by examiner, † Cited by third party
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CN108512425A (en) * 2017-02-23 2018-09-07 通用电气公司 Energy conversion device, and for for oil exploration equipment power for electric installation

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KR101690262B1 (en) 2016-12-28

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Application publication date: 20161102