CN106067056A - A kind of wiring board with electronic tag and preparation method thereof - Google Patents
A kind of wiring board with electronic tag and preparation method thereof Download PDFInfo
- Publication number
- CN106067056A CN106067056A CN201610474055.5A CN201610474055A CN106067056A CN 106067056 A CN106067056 A CN 106067056A CN 201610474055 A CN201610474055 A CN 201610474055A CN 106067056 A CN106067056 A CN 106067056A
- Authority
- CN
- China
- Prior art keywords
- line layer
- base material
- rfid antenna
- wiring board
- electronic tag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Details Of Aerials (AREA)
Abstract
The invention discloses a kind of wiring board with electronic tag, including base material, circuit board line layer, RFID antenna line layer and RFID chip, at least one side in the two relative side of described base material is provided with described circuit board line layer, at least one side in the two relative side of base material is provided with described RFID antenna line layer, and described RFID chip electrically connects with described RFID antenna line layer.A kind of wiring board with electronic tag that the present invention provides, not only preparation method is simple, and manufacturing cost is relatively low, and is difficult to damaged and steals, beneficially product false proof and reviewing.
Description
Technical field
The present invention relates to circuit board structure, particularly relate to a kind of wiring board with electronic tag and preparation method thereof.
Background technology
Wiring board is the critical elements of electronic product.Existing wiring board does not the most have function that is false proof and that trace to the source, for
Make the electronic product have function false proof, that trace to the source, typically electronic tag can be set on electronic product or wiring board.
Electronic tag (being called for short RFID), as a kind of automatic identification technology, can pass through radio signals identification target and read and write
Related data, is widely used to Item Management, production line balance automatization, gate control system, warehousing management, vehicle anti-theft etc..
At present, the electronic tag made mainly is arranged on product by the way of fitting in outside by arranging of electronic tag
On product or wiring board.As the patent document of Application No. 02260569.X discloses a kind of Intelligent electronic labels in electronic components,
Being made up of radio frequency identification intelligent chip and substrate thereof and shell, radio frequency identification intelligent chip is bonded on substrate, its antenna arrangement
Circular, shell is that flat pattern, chip and substrate thereof are included in shell, and housing is provided with 2 copper cash feet, this copper cash foot with
Chip and antenna dielectric thereof.Whole label profile is similar to an electronic component.Copper cash foot is required for being weldingly fixed on by label
On the electronic device wiring board used, fixed form can make whole label parallel with electric appliance circuits plate.The electronics mark of this patent
Label be through early stage technique manufacture with antenna and the product of chip, be then fixed on the circuit manufactured by copper cash foot
On plate, the antenna of electronic tag is fabricated separately with wiring board, and not only technological process is complicated, and can cause the waste of antenna substrate
Pollution with environment；Electronic tag uses splicing process with wiring board simultaneously, and electronic tag is the most damaged or steals, and is unfavorable for
Reviewing with false proof of electronic tag.
Summary of the invention
The technical problem to be solved is: provide a kind of antifalse effect good, lower-cost with electronic tag
Wiring board, the preparation method of a kind of wiring board with electronic tag is provided further.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is:
A kind of wiring board with electronic tag, including base material, circuit board line layer, RFID antenna line layer and RFID core
Sheet, at least one side in the two relative side of described base material is provided with described circuit board line layer, in the two relative side of base material
At least one side be provided with described RFID antenna line layer, described RFID chip electrically connects with described RFID antenna line layer.
The present invention also provides for the preparation method of a kind of wiring board with electronic tag:
The surface of the base material with Copper Foil is exposed successively, develops and etches, is formed at least one surface of base material
Circuit board line layer, at least one surface in base material forms RFID antenna line layer simultaneously, by RFID chip and RFID antenna line
Road floor electrical connection, it is thus achieved that the described wiring board with electronic tag.
The beneficial effects of the present invention is:
(1) circuit board line layer and RFID antenna line layer are separately positioned at least one side of base material, circuit printed line
Road floor and RFID antenna line layer share a base material, not only can save former material, reduce cost, and can alleviate the dirt to environment
Dye；RFID antenna line layer is directly integrated in wiring board inside and forms one, when wiring board is applied to prevent with wiring board
Time in pseudo-, tamper and the electronic product such as trace to the source, RFID antenna be not easy damaged, steal or change, beneficially electronic product
False proof and review.
(2) circuit board line layer and RFID antenna line layer disposably expose etching and complete, and not only can avoid circuit
Plate line layer and RFID antenna line layer are fabricated separately the cost waste brought, and processing technology is simple, the most also can be to whole
The individual technological process of production carries out disposable management and control, is conducive to improving the quality of product.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the wiring board with electronic tag of the embodiment of the present invention one；
Fig. 2 is the schematic diagram of the wiring board with electronic tag of the embodiment of the present invention two；
Fig. 3 is the schematic diagram of the wiring board with electronic tag of the embodiment of the present invention three.
Label declaration:
1, base material；2, circuit board line layer；21, First Line line circuit layer；22, the second circuit board line layer；3、RFID
Antenna traces layer；31, the first RFID antenna line layer；32, the second RFID antenna line layer；4, RFID chip；5, insulating barrier.
Detailed description of the invention
By describing the technology contents of the present invention, structural feature in detail, being realized purpose and effect, below in conjunction with embodiment
And coordinate accompanying drawing to be explained in detail.
The design of most critical of the present invention is: circuit board line layer is wholely set with RFID antenna line layer, not only prepares
Method is simple, and cost is relatively low, and electronic tag is not easy damaged and steals.
Referring to Fig. 1 to Fig. 3, a kind of wiring board with electronic tag, including base material 1, circuit board line layer 2, RFID
Antenna traces layer 3 and RFID chip 4, at least one side in the two relative side of described base material 1 is provided with described circuit board line
Layer 2, at least one side in the two relative side of base material 1 is provided with described RFID antenna line layer 3, described RFID chip 4 and institute
State RFID antenna line layer 3 to electrically connect.
Knowable to foregoing description, the beneficial effects of the present invention is: circuit board line layer and RFID antenna line layer are respectively
Being arranged at least one side of base material, circuit board line layer and RFID antenna line layer share a base material, not only can save
Former material, reduces cost, and can alleviate the pollution to environment；RFID antenna line layer is directly integrated in wiring board inside and line
Road plate forms one, when wiring board is applied in false proof, tamper and the electronic product such as trace to the source, RFID antenna be not easy by
Damage, steal or change, beneficially electronic product false proof and reviewing.
Further, any one side in the two relative side of described base material 1 is simultaneously provided with described circuit board line layer 2
With described RFID antenna line layer 3, between circuit board line layer 2 and RFID antenna line layer 3, there is distance.
Seen from the above description, when circuit board line layer and RFID antenna line layer are in same layer, circuit board line layer
And between RFID antenna line layer, there is distance, can prevent between circuit board line layer and RFID antenna line layer, producing signal and do
Disturb, it is ensured that wiring board normally uses with RFID antenna.
Further, described distance is more than 5mm.
Seen from the above description, when the distance between circuit board line layer and RFID antenna line layer is more than 5mm, can protect
Card RFID antenna has preferably performance.
Further, described circuit board line layer 2 includes First Line line circuit layer 21 and the second circuit board line layer 22,
The one side of described base material 1 is provided with described First Line line circuit layer 21 and described RFID antenna line layer 3, described base material 1
Another side is provided with described second circuit board line layer 22.
Further, described RFID antenna line layer 3 includes the first RFID antenna line layer 31 and the second RFID antenna line
Road floor 32, the one side of described base material 1 is respectively equipped with described First Line line circuit layer 21 and described first RFID antenna circuit
Layer 31, the another side of described base material 1 is respectively equipped with described second circuit board line layer 22 and described second RFID antenna circuit
Layer 32.
Further, described circuit board line layer 2 is arranged at the one side in the two relative side of described base material 1, described
RFID antenna line layer 3 is arranged at the another side in the two relative side of described base material 1.
Further, described base material 1 is FCCL base material.
Seen from the above description, FCCL base material has good performance and stability, it is ensured that RFID antenna and wiring board
Steady operation.
Further, also include that insulating barrier 5, described insulating barrier 5 are arranged on described circuit board line layer 2 and RFID antenna line
Road floor 3 is away from the one side of described base material 1.
Seen from the above description, RFID antenna line layer can be protected by surface configuration insulating barrier, prevents RFID antenna
Line layer is replaced or steals.
The preparation method of a kind of wiring board with electronic tag, exposes successively to the surface of the base material with Copper Foil
Light, developing and etch, forming circuit board line layer at least one surface of base material, at least one surface in base material is formed simultaneously
RFID antenna line layer, electrically connects RFID chip with RFID antenna line layer, it is thus achieved that the described wiring board with electronic tag.
Seen from the above description, circuit board line layer and RFID antenna line layer disposably expose etching and complete, no
Only can avoid the cost waste that circuit board line layer and RFID antenna line layer are fabricated separately bringing, and processing technology is simple,
The most whole technological process of production can be carried out disposable management and control, be conducive to improving the quality of product.
Further, with the surface recombination insulating barrier of wiring board of electronic tag, described compound behaviour described in obtain
As: described in obtaining, paste dielectric film, then to the line being covered with dielectric film with the surface of the wiring board of electronic tag
The surface of road plate carries out pressing process, and the temperature that described pressing processes is 180-200 DEG C, and pressure is 90-110KG, and the time is 60-
100s, carries out heat treated to the wiring board after pressing, and the temperature of described heat treated is 140-160 DEG C, and the time is 1-2H.
Seen from the above description, by using High Temperature High Pressure pressing, carry out high-temperature baking the most again, dielectric film can be made firm
Paste in the circuit board, thus RFID antenna line layer can be protected, make RFID antenna line layer be not easy damaged
Or change.
Refer to Fig. 1, embodiments of the invention one are:
A kind of wiring board with electronic tag, including base material 1, circuit board line layer 2, RFID antenna line layer 3, RFID
Chip 4 and insulating barrier 5, base material 1 is FCCL base material, and circuit board line layer 2 includes First Line line circuit layer 21 and the second circuit
Plate line layer 22, the one side in the two relative side of base material 1 is provided with First Line line circuit layer 21 and RFID antenna line layer
3, the another side of base material 1 is provided with the second circuit board line layer 22, and insulating barrier 5 is arranged on circuit board line layer 2 and RFID antenna
Line layer 3 is away from the one side of base material 1.RFID antenna line layer 3 can be shielded by insulating barrier 5, prevents RFID antenna by more
Change or steal.Having distance between First Line line circuit layer 21 and RFID antenna line layer 3, its distance is 5mm, it is ensured that
The normal use of RFID antenna, prevents First Line line circuit layer 21 from RFID antenna is produced signal disturbing.RFID chip 4 has
Unique ID code, RFID chip 4 is arranged on the top of RFID antenna line layer 3 and electrically connects with RFID antenna line layer 3, passing through
RFID chip 4 is implemented in combination with the false proof of product with RFID antenna and reviews.Owing to RFID antenna is arranged on wiring board internal layer,
RFID chip 4 cannot be taken off by entirety with RFID antenna or change so that product cannot be replaced, thus can play the most anti-
Pseudo-effect, when RFID chip 4 is individually removed, can directly judge that product is defective.
The preparation method of the present embodiment one is:
The surface of the base material with Copper Foil is exposed successively, develops and etches, forms first in a surface of base material
Circuit board line layer and RFID antenna line layer, form the second circuit board line layer in another surface of base material, by RFID simultaneously
Chip electrically connects with RFID antenna line layer, it is thus achieved that with the wiring board of electronic tag.In the line with electronic tag obtained
The surface recombination insulating barrier of road plate, specifically, pastes dielectric film, then in the surface with the wiring board of electronic tag obtained
The base material being covered with dielectric film carries out pressing process, and the temperature that pressing processes is 180-200 DEG C, and pressure is 90-110KG, time
Between be 60-100s, the wiring board after pressing is carried out heat treated, the temperature of heat treated is 140-160 DEG C, and the time is 1-
2H。
Refer to Fig. 2, embodiments of the invention two are:
A kind of wiring board with electronic tag, sees embodiment one, the wiring board with electronic tag of the present embodiment
Difference with embodiment one is:
RFID antenna line layer 3 includes the first RFID antenna line layer 31 and the second RFID antenna line layer 32, base material 1
One side is respectively equipped with First Line line circuit layer 21 and the first RFID antenna line layer 31, and the another side of base material 1 sets respectively
There is the second circuit board line layer 22 and the second RFID antenna line layer 32.
The preparation method of the present embodiment two is:
Seeing the preparation method of embodiment one, the preparation method of the present embodiment exists with the difference of the preparation method of embodiment one
In:
The surface of the base material with Copper Foil is exposed successively, develops and etches, forms first in a surface of base material
Circuit board line layer and the first RFID antenna line layer, form the second circuit board line layer and the in another surface of base material simultaneously
Two RFID antenna line layers, electrically connect RFID chip with RFID antenna line layer, it is thus achieved that with the wiring board of electronic tag.
Refer to Fig. 3, embodiments of the invention three are:
A kind of wiring board with electronic tag, sees embodiment one, the wiring board with electronic tag of the present embodiment
Difference with embodiment one is:
Circuit board line layer 2 is arranged at the one side in the two relative side of base material 1, and RFID antenna line layer 3 is arranged at
Another side in the two relative side of base material 1.
The preparation method of the present embodiment three is:
Seeing the preparation method of embodiment one, the preparation method of the present embodiment exists with the difference of the preparation method of embodiment one
In:
The surface of the base material with Copper Foil is exposed successively, develops and etches, forms circuit in a surface of base material
Plate line layer, forms RFID antenna line layer simultaneously in another surface of base material, by RFID chip and RFID antenna line layer electricity
Connect, it is thus achieved that with the wiring board of electronic tag.
In sum, a kind of wiring board with electronic tag that the present invention provides, not only preparation method is simple, is manufactured into
This is the most relatively low, and is difficult to damaged and steals, beneficially product false proof and reviewing.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this
The equivalents that bright description and accompanying drawing content are made, or directly or indirectly it is used in relevant technical field, the most in like manner include
In the scope of patent protection of the present invention.
Claims (10)
1. the wiring board with electronic tag, it is characterised in that include base material, circuit board line layer, RFID antenna circuit
Layer and RFID chip, at least one side in the two relative side of described base material is provided with described circuit board line layer, the two of base material
At least one side in opposite flank is provided with described RFID antenna line layer, described RFID chip and described RFID antenna line layer
Electrical connection.
Wiring board with electronic tag the most according to claim 1, it is characterised in that the two relative side of described base material
In any one side be simultaneously provided with described circuit board line layer and described RFID antenna line layer, circuit board line layer and RFID
Between antenna traces layer, there is distance.
Wiring board with electronic tag the most according to claim 2, it is characterised in that described distance is more than 5mm.
Wiring board with electronic tag the most according to claim 2, it is characterised in that described circuit board line layer includes
First Line line circuit layer and the second circuit board line layer, the one side of described base material be provided with described First Line line circuit layer and
Described RFID antenna line layer, the another side of described base material is provided with described second circuit board line layer.
Wiring board with electronic tag the most according to claim 4, it is characterised in that described RFID antenna line layer bag
Including the first RFID antenna line layer and the second RFID antenna line layer, the one side of described base material is respectively equipped with described first line
Plate line layer and described first RFID antenna line layer, the another side of described base material is respectively equipped with described second circuit board line
Layer and described second RFID antenna line layer.
Wiring board with electronic tag the most according to claim 1, it is characterised in that described circuit board line layer is arranged
One side in the two relative side of described base material, described RFID antenna line layer is arranged at the two relative side of described base material
In another side.
Wiring board with electronic tag the most according to claim 1, it is characterised in that described base material is FCCL base material.
Wiring board with electronic tag the most according to claim 1, it is characterised in that also include insulating barrier, described absolutely
Edge layer is arranged on described circuit board line layer and the RFID antenna line layer one side away from described base material.
9. the preparation method with the wiring board of electronic tag, it is characterised in that
The surface of the base material with Copper Foil is exposed successively, develops and etches, forms circuit at least one surface of base material
Plate line layer, at least one surface in base material forms RFID antenna line layer simultaneously, by RFID chip and RFID antenna line layer
Electrical connection, it is thus achieved that the described wiring board with electronic tag.
The preparation method of the wiring board with electronic tag the most according to claim 9, it is characterised in that in obtain
The surface recombination insulating barrier of the described wiring board with electronic tag, described composition operation is: in obtain described in electronics
The surface of the wiring board of label pastes dielectric film, and then the surface to the wiring board being covered with dielectric film carries out pressing process, institute
The temperature stating pressing process is 180-200 DEG C, and pressure is 90-110KG, and the time is 60-100s, carries out the wiring board after pressing
Heat treated, the temperature of described heat treated is 140-160 DEG C, and the time is 1-2H.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610474055.5A CN106067056A (en) | 2016-06-24 | 2016-06-24 | A kind of wiring board with electronic tag and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610474055.5A CN106067056A (en) | 2016-06-24 | 2016-06-24 | A kind of wiring board with electronic tag and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106067056A true CN106067056A (en) | 2016-11-02 |
Family
ID=57420612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610474055.5A Pending CN106067056A (en) | 2016-06-24 | 2016-06-24 | A kind of wiring board with electronic tag and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106067056A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102480850A (en) * | 2010-11-25 | 2012-05-30 | 软控股份有限公司 | Method for mounting RFID (radio frequency identification device) electronic label on printed circuit board |
| CN104050495A (en) * | 2014-06-18 | 2014-09-17 | 陶福平 | Efficient electronic label sample manufacturing technology |
| CN204256773U (en) * | 2014-12-19 | 2015-04-08 | 厦门英诺尔信息科技有限公司 | RFID ultra high frequency IC tag |
| CN205959231U (en) * | 2016-06-24 | 2017-02-15 | 厦门英诺尔电子科技股份有限公司 | Circuit board with electronic tags |
-
2016
- 2016-06-24 CN CN201610474055.5A patent/CN106067056A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102480850A (en) * | 2010-11-25 | 2012-05-30 | 软控股份有限公司 | Method for mounting RFID (radio frequency identification device) electronic label on printed circuit board |
| CN104050495A (en) * | 2014-06-18 | 2014-09-17 | 陶福平 | Efficient electronic label sample manufacturing technology |
| CN204256773U (en) * | 2014-12-19 | 2015-04-08 | 厦门英诺尔信息科技有限公司 | RFID ultra high frequency IC tag |
| CN205959231U (en) * | 2016-06-24 | 2017-02-15 | 厦门英诺尔电子科技股份有限公司 | Circuit board with electronic tags |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161102 |
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| RJ01 | Rejection of invention patent application after publication |