CN106064520B - A method of using shadowless glue adhesive base plate - Google Patents
A method of using shadowless glue adhesive base plate Download PDFInfo
- Publication number
- CN106064520B CN106064520B CN201610400916.5A CN201610400916A CN106064520B CN 106064520 B CN106064520 B CN 106064520B CN 201610400916 A CN201610400916 A CN 201610400916A CN 106064520 B CN106064520 B CN 106064520B
- Authority
- CN
- China
- Prior art keywords
- shadowless glue
- base plate
- glued board
- adhesive base
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
Abstract
The present invention relates to the preparing technical fields of glued board, disclose a kind of method using shadowless glue adhesive base plate.On the one hand it is acted on by vacuum suction and pumping, generation bubble is extruded between making bonding plane, on the other hand by ultraviolet radiator to the solidification of shadow glue, realize the stable adhesion of glued board, so as to effectively prevent the generation of bubble, the yield rate and finished product area of the glued board of high optical requirement are increased substantially.In addition, this preparation method also has the advantages that technological process simply and bonding stability is high, it is convenient for practical promotion and application.
Description
Technical field
The present invention relates to the preparing technical fields of glued board, and in particular, to a kind of side using shadowless glue adhesive base plate
Method.
Background technology
Glued board is composite plate made of one kind is bonded multilager base plate in a manner of viscose glue, and is widely used in each
In a field.In the preparation process of glued board, it is easy to bubble is generated between bonding plane, and for the glue of high optical requirement
Plywood（Such as double-colored plate or the glass plate art work）For, since bubble is flagrant, existing adhering technique limits this
The yield rate and finished product area of a little glued boards.
Invention content
The problem of for aforementioned existing adhering technique, the present invention provides a kind of method using shadowless glue adhesive base plate,
On the one hand it is acted on by vacuum suction and pumping, generation bubble is extruded between making bonding plane, on the other hand by ultraviolet radiator to shadow
The solidification of glue realizes the stable adhesion of glued board, so as to effectively prevent the generation of bubble, increases substantially high optics
It is required that glued board yield rate and finished product area.In addition, this preparation method also has technological process simply and bonding is firm
Property high advantage, be convenient for practical promotion and application.
The technical solution adopted by the present invention provides a kind of method using shadowless glue adhesive base plate, includes the following steps：
S101. gluing：Last layer shadowless glue is applied in the adhesion zone of the first substrate；S102. plywood：Second substrate is covered in described
It on the adhesion zone of first substrate, and rolls to obtain glued board, and is at least arranged in the first substrate and the second substrate
One is transparent panel；S103. suction and pumping：The glued board is put into aspirating chamber, aspiration pump is then started, reduces room pressure；
S104. light is solid：When room pressure is reduced to the first atmospheric pressure value, ultraviolet radiator is opened, the transparent panel in the glued board is irradiated,
Shadowless glue in two substrates is cured.
Optimization, further include following steps before the step S101：S100. it slots：In the viscous of the first substrate
It connects area edge and opens up the wire casing for surrounding the adhesion zone, the width of the wire casing is between 2~8mm, the depth of the wire casing
Also between 2~8mm.
Optimization, in the step S101, the shadowless glue is coated with thickness between 0.3~1mm.
Optimization, in the step S102, is rolled between 2~5 minutes the time to the glued board.
Optimization, in the step S104, so that the ultraviolet radiator is directed at the center of the adhesion zone, then with gradual
The mode for increasing irradiation light intensity is irradiated.
Optimization, in the step S104, the irradiation time T of the ultraviolet radiator is determined according to following formula：T=20/
P+1 minutes, wherein P was the performance number or average power content of the ultraviolet radiator, and unit is watt.
Optimization, further include following steps after the step S104：S105. it scans：Translate the glued board or institute
Ultraviolet radiator is stated, carrying out scan-type at least once to the adhesion zone irradiates.
Optimization, the transparent panel is glass plate or poly (methyl methacrylate) plate.
To sum up, it using a kind of method using shadowless glue adhesive base plate provided by the present invention, has the advantages that：
（1）It in technological process, is acted on by vacuum suction and pumping, the bubble generated between bonding plane can be made to be extruded, so as to effective
The generation for preventing bubble increases substantially the yield rate and finished product area of the glued board of high optical requirement；（2）Pass through ultraviolet radiator
To the solidification of shadow glue, the stable adhesion of glued board may be implemented；（3）It, can be with by opening up wire casing at adhesion zone edge
The shadowless glue being extruded due to rolling or vacuum suction and pumping act on is accommodated, prevents shadowless glue from overflowing, following process is facilitated to handle；（4）
It can be bonded and be cured at room temperature, it is energy saving, reduce process costs；（5）This preparation method also has technological process
Advantage simple and that bonding stability is high, is convenient for practical promotion and application.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the process flow chart provided by the invention using shadowless glue adhesive base plate.
Fig. 2 is the finished product structure schematic diagram provided by the invention using shadowless glue adhesive base plate.
In above-mentioned attached drawing：1, first substrate 2, second substrate 3, adhesion zone 4, wire casing.
Specific implementation mode
Hereinafter reference will be made to the drawings, is described in detail by way of example provided by the invention using shadowless glue adhesive base plate
Method.It should be noted that the descriptions of the manners of these embodiments are used to facilitate the understanding of the present invention, but do not constitute
Limitation of the invention.
Various technologies described herein can be used for but be not limited to the preparing technical field of glued board, can be also used for it
Its similar field.
The terms "and/or", only a kind of incidence relation of description affiliated partner, indicates that there may be three kinds of passes
System, for example, A and/or B, can indicate：Individualism A, individualism B exist simultaneously tri- kinds of situations of A and B, the terms
"/and " it is another affiliated partner relationship of description, indicate may exist two kinds of relationships, for example, A/ and B, can indicate：Individually deposit
In A, two kinds of situations of individualism A and B, in addition, character "/" herein, it is a kind of "or" pass to typically represent forward-backward correlation object
System.
Embodiment one
Fig. 1 shows that the process flow chart provided by the invention using shadowless glue adhesive base plate, Fig. 2 are provided by the invention
Using the finished product structure schematic diagram of shadowless glue adhesive base plate.The side using shadowless glue adhesive base plate provided in this embodiment
Method includes the following steps.
S101. gluing：Last layer shadowless glue is applied in the adhesion zone of the first substrate.
In step S101, the adhesion zone is the entire plane or part planar of the first substrate, the shadowless glue
Also known as UV（Ultraviolet Rays, ultraviolet light）Glue, light-sensitive emulsion or ultraviolet cured adhesive, which are one kind, must pass through ultraviolet light
Light（Ultraviolet is one section of electromagnetic radiation as waves except visible light, range of the wavelength between 10~400nm）Irradiation ability
Cured adhesive, in addition to that bonding agent can be used as to use, the sizing material for being alternatively arranged as paint, coating, ink etc. uses.The nothing
The principle of solidification of shadow glue is as follows：Photoinitiator is configured in UV curing materials（Or photosensitizer）, can be in the photograph of ultraviolet
The energy of lower absorption ultraviolet light is penetrated, and generates living radical or cation, causes monomer polymerization, be crosslinked and meet Zhi Huaxue and is anti-
It answers, adhesive is made to be converted into solid-state by liquid within the several seconds.Optimization, further include walking as follows before the step S101
Suddenly：S100. it slots：The wire casing for surrounding the adhesion zone, the width of the wire casing are opened up at the adhesion zone edge of the first substrate
Degree is between 2~8mm, and the depth of the wire casing is also between 2~8mm.Since the shadowless glue is liquid before curing,
Therefore by opening up the wire casing at adhesion zone edge, can accommodate be extruded due to rolling or vacuum suction and pumping act on without shadow
Glue prevents shadowless glue from overflowing, and following process is facilitated to handle.As an example, the width and depth of wire casing described in the present embodiment
Median 6mm is chosen respectively.In addition as an optimization, the shadowless glue is coated with thickness between 0.3~1mm.By into
The row thickness setting, balance can be realized between effective adhesive effect and material cost, can not only ensure the firm of bonding
Property, preparation process cost can also be reduced.As an example, the thickness that is coated with of shadowless glue described in the present embodiment chooses median
0.5mm。
S102. plywood：Second substrate is covered on the adhesion zone of the first substrate, and rolls to obtain glued board, and
It is transparent panel that one is at least arranged in the first substrate and the second substrate.
In step s 102, the transparent panel can be, but not limited to as glass plate or poly (methyl methacrylate) plate.In addition it is used as excellent
Change, is rolled between 2~5 minutes the time to the glued board.By carrying out certain time to the glued board（Such as 3 points
Clock）Roll, can tentatively squeeze out the bubble between two substrates.
S103. suction and pumping：The glued board is put into aspirating chamber, aspiration pump is then started, reduces room pressure.
In step s 103, with the reduction of room pressure, if there are bubbles between two substrates, it will so that bubble with it is outer
Pressure difference between portion gradually increases, to promote bubble to extend and gradually be moved to bonding area edge, until bubble breakage
（Air i.e. in bubble is pumped）, acted on from there through vacuum suction and pumping above-mentioned, the bubble quilt generated between bonding plane can be made
It squeezes out, so as to effectively prevent the generation of bubble.
S104. light is solid：When room pressure is reduced to the first atmospheric pressure value, ultraviolet radiator is opened, is irradiated in the glued board
Transparent panel, the shadowless glue in two substrates is cured.
In step S104, first atmospheric pressure value is the atmospheric pressure value that may insure when bubble is squeezed out completely, and value can
With but be not limited to 1K pas.After ensuring that bubble is squeezed out completely, low-pressure state is being maintained（Close the aspiration pump）Or
Continue decompression state（Continue on the aspiration pump）It is lower to open the ultraviolet radiator, make to send out ultraviolet to being in two substrates
Between shadowless glue carry out solidification, realize two substrates between firm bonding.Optimization, make ultraviolet radiator alignment institute
The center of adhesion zone is stated, is then irradiated in such a way that light intensity is irradiated in gradual increase.It, can by carrying out the irradiation of the mode
It is consistent with the moving direction of bubble to cure to the periphery to the shadowless glue in the adhesion zone from center, thus solid
During change leaving for bubble will not be avoided to the mobile generation inhibition of bubble.
In step S104, optimization, the irradiation time T of the ultraviolet radiator is determined according to following formula：T=20/P+1
Minute, wherein P is the performance number or average power content of the ultraviolet radiator, and unit is watt.The performance number is fixed value,
The average power content is the average value of the dynamic power value in certain irradiation time.Such as the performance number when the ultraviolet radiator
For 10W when, the irradiation time of the ultraviolet radiator is 3 minutes, when the performance number of the ultraviolet radiator is 5W, the ultraviolet light
The irradiation time of lamp is 5 minutes, and power is bigger, and the time of irradiation is shorter, but at least maintains 1 minute duration, it can be ensured that energy
It is enough that the shadowless glue is effectively cured.
Optimization, further include following steps after the step S104：S105. it scans：Translate the glued board or institute
Ultraviolet radiator is stated, carrying out scan-type at least once to the adhesion zone irradiates.It is irradiated by last scan-type, it can be ensured that right
The adhesion zone completes the solidification of full coverage type, further increases bonding stability.
To sum up, the method using shadowless glue adhesive base plate that the present embodiment is provided, has the advantages that：（1）
It in technological process, is acted on by vacuum suction and pumping, the bubble generated between bonding plane can be made to be extruded, so as to effectively prevent gas
The generation of bubble increases substantially the yield rate and finished product area of the glued board of high optical requirement；（2）By ultraviolet radiator to shadow
The stable adhesion of glued board may be implemented in the solidification of glue；（3）By opening up wire casing at adhesion zone edge, can accommodate because
It rolls or vacuum suction and pumping effect and the shadowless glue that is extruded, prevents shadowless glue from overflowing, following process is facilitated to handle；（4）It can be in room
It is bonded and is cured under temperature, it is energy saving, reduce process costs；（5）This preparation method also have technological process simply and
The high advantage of stability is bonded, practical promotion and application are convenient for.
As described above, the present invention can be realized preferably.For a person skilled in the art, religion according to the present invention
It leads, designs various forms of methods using shadowless glue adhesive base plate and do not need to performing creative labour.This hair is not being departed from
These embodiments are changed in the case of bright principle and spirit, changes, replace, integrating and modification still falls within the present invention's
In protection domain.
Claims (4)
1. a kind of method using shadowless glue adhesive base plate, which is characterized in that include the following steps：
S101. gluing：Last layer shadowless glue is applied in the adhesion zone of first substrate；
S102. plywood：Second substrate is covered on the adhesion zone of the first substrate, and rolls 2~5 minutes and obtain gluing
Plate, and it is transparent panel to be at least arranged one in the first substrate and the second substrate；
S103. suction and pumping：The glued board is put into aspirating chamber, aspiration pump is then started, reduces room pressure；
S104. light is solid：When room pressure is reduced to the first atmospheric pressure value, alignment bonding district center is opened in the case where continuing decompression state
Ultraviolet radiator, and by gradual increase irradiate light intensity in a manner of irradiate the transparent panel in the glued board, between being in two substrates
Shadowless glue cured, while the irradiation time T of the ultraviolet radiator is determined according to following formula：T=20/P+1 minutes,
Middle P is the average power content of the ultraviolet radiator, and unit is watt.
2. a kind of method using shadowless glue adhesive base plate as described in claim 1, which is characterized in that in the step S101
In, the shadowless glue is coated with thickness between 0.3~1mm.
3. a kind of method using shadowless glue adhesive base plate as described in claim 1, which is characterized in that in the step S104
Further include following steps later：
S105. it scans：The glued board or the ultraviolet radiator are translated, carrying out scan-type at least once to the adhesion zone shines
It penetrates.
4. a kind of method using shadowless glue adhesive base plate as described in claim 1, which is characterized in that the transparent panel is glass
Glass plate or poly (methyl methacrylate) plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610400916.5A CN106064520B (en) | 2016-06-08 | 2016-06-08 | A method of using shadowless glue adhesive base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610400916.5A CN106064520B (en) | 2016-06-08 | 2016-06-08 | A method of using shadowless glue adhesive base plate |
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| Publication Number | Publication Date |
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| CN106064520A CN106064520A (en) | 2016-11-02 |
| CN106064520B true CN106064520B (en) | 2018-07-17 |
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| CN201610400916.5A Expired - Fee Related CN106064520B (en) | 2016-06-08 | 2016-06-08 | A method of using shadowless glue adhesive base plate |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107142026A (en) * | 2017-07-05 | 2017-09-08 | 固安县朝阳生物科技有限公司 | Lucite large area technique for sticking |
| CN109708938B (en) * | 2019-01-08 | 2021-11-09 | 同济大学 | Artificial transparent rock based on shadowless glue and fused quartz sand and preparation method thereof |
| CN111558511A (en) * | 2019-02-14 | 2020-08-21 | 重庆四联光电科技有限公司 | Bonding processing method and system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101211049A (en) * | 2006-12-25 | 2008-07-02 | 株式会社日立显示器 | Manufacturing method of display device |
| CN102896874A (en) * | 2012-10-30 | 2013-01-30 | 昆山希盟自动化科技有限公司 | Liquid glue jointing method for double-station touch screen |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4243499B2 (en) * | 2002-06-11 | 2009-03-25 | 富士通株式会社 | Bonded substrate manufacturing apparatus and bonded substrate manufacturing method |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101211049A (en) * | 2006-12-25 | 2008-07-02 | 株式会社日立显示器 | Manufacturing method of display device |
| CN102896874A (en) * | 2012-10-30 | 2013-01-30 | 昆山希盟自动化科技有限公司 | Liquid glue jointing method for double-station touch screen |
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| CN106064520A (en) | 2016-11-02 |
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Granted publication date: 20180717 Termination date: 20190608 |