CN106064520A - Method for bonding substrate through adopting shadowless glue - Google Patents

Method for bonding substrate through adopting shadowless glue Download PDF

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Publication number
CN106064520A
CN106064520A CN 201610400916 CN201610400916A CN106064520A CN 106064520 A CN106064520 A CN 106064520A CN 201610400916 CN201610400916 CN 201610400916 CN 201610400916 A CN201610400916 A CN 201610400916A CN 106064520 A CN106064520 A CN 106064520A
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substrate
adhesive
method
plywood
gluing
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CN 201610400916
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Chinese (zh)
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CN106064520B (en )
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马颖
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马颖
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1246Other adhesives
    • B32B2037/1253Other adhesives curable

Abstract

The invention relates to the technical field of production of glued boards, and discloses a method for bonding a substrate through adopting shadowless glue. Bubbles between bonding surfaces are squeezed out through vacuum suction, and stable bonding of the glued boards is realized through the curing effect of an ultraviolet lamp on shallow glue, so generation of bubbles is effectively avoided, and the yield and the finished product area of the glued boards with high optical requirement are greatly improved. Additionally, the production method has the advantages of simple process flow, high bonding stability, and convenience for practical promotion and application.

Description

一种采用无影胶粘合基板的方法 One kind of gluing method shadowless substrate

技术领域 FIELD

[0001]本发明涉及胶合板的制备技术领域,具体地,涉及一种采用无影胶粘合基板的方法。 [0001] The present invention relates to the technical field of the preparation of plywood, in particular, to a method of gluing groups of a substrate employed.

背景技术 Background technique

[0002]胶合板是一种以粘胶方式对多层基板进行粘接而成的复合板,并被广泛应用在各个领域中。 [0002] Plywood is a viscose bonding composite board obtained by way of the multilayer substrate, and is widely used in various fields. 在胶合板的制备过程中,很容易在粘接面之间产生气泡,而对于高光学要求的胶合板(例如双色板或玻璃板艺术品)而言,由于气泡是不能容忍的,现有的粘合技术限制这些胶合板的成品率及成品面积。 In the preparation of plywood, it is easy to produce air bubbles between the adhesive surface and for plywood (e.g., glass plate or a color artwork) in terms of high optical requirements, the bubbles can not be tolerated, a conventional adhesive these technical limitations and finished plywood yield area.

发明内容 SUMMARY

[0003]针对前述现有粘合技术的问题,本发明提供了一种采用无影胶粘合基板的方法,一方面通过真空吸抽作用,使粘接面之间产生气泡被挤出,另一方面通过紫外线灯对光影胶的固化作用,实现胶合板的稳定粘接,从而可以有效杜绝气泡的产生,大幅度提高高光学要求的胶合板的成品率及成品面积。 [0003] For bonding the aforementioned prior art problems, the present invention provides a method of using a substrate without leaving glue, on the one hand by the suction action of a vacuum pump, so that air bubbles between the adhesive surface of the extruded, other on the one hand by the action of ultraviolet light on the light curing adhesive, plywood adhesive is stable, which can effectively prevent the generation of the bubble, plywood greatly improved yield and high optical requirements of the finished product area. 此外,这种制备方法还具有工艺流程简单和粘合稳固性高的优点,便于实际推广和应用。 In addition, this preparation method also has a simple process and the advantages of high stability of the adhesive, to facilitate the practical promotion and application.

[0004]本发明采用的技术方案,提供了一种采用无影胶粘合基板的方法,包括如下步骤:SlOl.涂胶:在所述第一基板的粘接区涂上一层无影胶;S102.合板:将第二基板覆盖在所述第一基板的粘接区上,并碾压得到胶合板,且在所述第一基板和所述第二基板中至少设置一个为透明板;S103.吸抽:将所述胶合板放入抽气室中,然后启动抽气栗,降低室内气压; [0004] The present invention adopts the technical solution provided a method of using the composite substrate without leaving an adhesive, comprising the steps of: coating the SLOL: UV adhesive in the adhesive coated area of ​​the first substrate, ; plywood S102: the second substrate on the adhesive covering the first region of the substrate, and rolling to give plywood, and at least one transparent plate to the first substrate and the second substrate; S103 suction pump: the plywood into the pumping chamber, and then start pumping Li, the pressure reducing chamber;

S104.光固:当室内气压降低至第一气压值时,开启紫外线灯,照射所述胶合板中的透明板,对处于两基板间的无影胶进行固化。 . Photocurable S104: when the pressure chamber decreases to a first pressure value, the ultraviolet lamp is turned on, illuminating the transparent plate plywood, of groups of plastic between the substrates is cured.

[0005]优化的,在所述步骤SlOl之前还包括如下步骤:S100.开槽:在所述第一基板的粘接区边沿开设包围所述粘接区的线槽,所述线槽的宽度介于2〜8mm之间,所述线槽的深度也介于2〜8mm之间。 [0005] optimized prior to said step SlOl further comprising the step: SlOO slot: open trough surrounding the region of the adhesive bonding region of the first substrate edge, the groove width of between 2~8mm, also the depth of the groove between 2~8mm.

[0006] 优化的,在所述步骤SlOl中,所述无影胶的涂设厚度介于0.3〜Imm之间。 [0006] Optimization, in the step SlOl, the shadowless adhesive coating thickness disposed between 0.3~Imm.

[0007]优化的,在所述步骤S102中,对所述胶合板的碾压时间介于2〜5分钟。 [0007] optimized in the step S102, the rolling time is between 2 ~ 5 minutes plywood.

[0008]优化的,在所述步骤S104中,使所述紫外线灯对准所述粘接区的中心,然后以逐渐增大照射光强的方式进行照射。 [0008] optimized in the step S104, the ultraviolet lamp aligned with the central adhesive zone, and then gradually increasing the irradiation intensity of light irradiated manner.

[0009]优化的,在所述步骤S104中,按照如下公式确定所述紫外线灯的照射时间T:T=20/Ρ+1分钟,其中P为所述紫外线灯的功率值或者平均功率值,单位为瓦特。 [0009] optimized in the step S104, is determined according to the following formula ultraviolet light irradiation time T: T = 20 / Ρ + 1 min where P is the power of the UV lamp or the average value of the power value, in watts.

[0010]优化的,在所述步骤S104之后还包括如下步骤:S105.扫描:平移所述胶合板或所述紫外线灯,对所述粘接区进行至少一次扫描式照射。 [0010] Optimization, after said step S104, further comprising the step of:. Scan S105: translating the plywood or the ultraviolet light, the adhesive zone of at least one scanning irradiation.

[0011 ]优化的,所述透明板为玻璃板或者有机玻璃板。 [0011] Optimization of the transparent plate is a glass or plexiglass plate.

[0012]综上,采用本发明所提供的一种采用无影胶粘合基板的方法,具有如下有益效果: [0012] In summary, a method using glue using groups of the present invention the substrate is provided, has the following advantages:

(I)在工艺流程中,通过真空吸抽作用,可使粘接面之间产生的气泡被挤出,从而可以有效杜绝气泡的产生,大幅度提高高光学要求的胶合板的成品率及成品面积;(2)通过紫外线灯对光影胶的固化作用,可以实现胶合板的稳定粘接;(3)通过在粘接区边沿开设线槽,可以容纳因碾压或真空吸抽作用而被挤出的无影胶,防止无影胶溢出,方便后续加工处理;(4)可在室温下进行粘合及固化,节约能源,降低工艺成本;(5)这种制备方法还具有工艺流程简单和粘合稳固性高的优点,便于实际推广和应用。 (I) in the process flow, by vacuum pumping action generated between the bonding surface of the bubble is extruded, which can effectively prevent the generation of the bubble, a substantial increase in claim plywood high optical yield and product area ; (2) to effect light curing adhesive, plywood adhesive stability can be achieved by an ultraviolet lamp; (3) the adhesive by opening trough edge region, can accommodate an aspiration vacuum or by rolling the extruded action groups of plastic, to prevent overflow of groups of plastic, to facilitate subsequent processing; (4) can be adhered and cured at room temperature, save energy, reduce the cost of the process; (5) preparation of such a simple process and further having an adhesive the advantage of high stability, ease of application and actual promotion.

附图说明 BRIEF DESCRIPTION

[0013]为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。 [0013] In order to more clearly illustrate the technical solutions in the embodiments or the prior art embodiment of the present invention, briefly introduced hereinafter, embodiments are described below in the accompanying drawings or described in the prior art needed to be used in describing the embodiments the drawings are only some embodiments of the present invention, those of ordinary skill in the art is concerned, without creative efforts, can derive from these drawings other drawings.

[0014]图1是本发明提供的采用无影胶粘合基板的工艺流程图。 [0014] FIG. 1 is a process flow diagram of the present invention provides a bonded substrate without leaving an adhesive.

[0015]图2是本发明提供的采用无影胶粘合基板的成品结构示意图。 [0015] FIG. 2 is a schematic view of the structure of the finished board without leaving glue provided by the present invention.

[0016]上述附图中:1、第一基板2、第二基板3、粘接区4、线槽。 [0016] The drawings: 1, a first substrate 2, second substrate 3, the adhesive area 4, trough.

具体实施方式 detailed description

[0017]以下将参照附图,通过实施例方式详细地描述本发明提供的采用无影胶粘合基板的方法。 [0017] The following groups of gluing using a method of the present invention provides a substrate is described in detail by way of embodiments with reference to the accompanying drawings embodiments. 在此需要说明的是,对于这些实施例方式的说明用于帮助理解本发明,但并不构成对本发明的限定。 Note that here, for the description of these embodiments of the embodiment to aid in understanding the present invention but do not limit the present invention.

[0018]本文中描述的各种技术可以用于但不限于胶合板的制备技术领域,还可以用于其它类似领域。 [0018] Various techniques described herein can be used but are not limited to plywood BACKGROUND prepared, it may also be used in other similar fields.

[0019]本文中术语“和/或”,仅仅是一种描述关联对象的关联关系,表示可以存在三种关系,例如,A和/SB,可以表示:单独存在A,单独存在B,同时存在A和B三种情况,本文中术语“/和”是描述另一种关联对象关系,表示可以存在两种关系,例如,A/和B,可以表示:单独存在A,单独存在A和B两种情况,另外,本文中字符,一般表示前后关联对象是一种“或”关系O [0019] As used herein the term "and / or" merely describe a relationship of associated objects representing three relationships may exist, for example, A and / SB, it may indicate: the presence of A alone, B alone is present, exist A and B are three cases, the term "and /" is described in another related object relationships, there may be two kinds of relationships indicates, for example, A / A and B, can be expressed: A exists alone, the presence of two separate A and B case, further, the character used herein, generally indicates a context-target "or" relationship O

[0020] 实施例一 [0020] Example a

图1示出了本发明提供的采用无影胶粘合基板的工艺流程图,图2是本发明提供的采用无影胶粘合基板的成品结构示意图。 Figure 1 shows a process flow diagram in groups of glue of the present invention provides a substrate, FIG. 2 is a schematic structure using groups of gluing finished substrate of the present invention is provided. 本实施例提供的所述采用无影胶粘合基板的方法,包括如下步骤。 The present embodiment provides a method using glue shadowless substrate, comprising the steps of

[0021] S101.涂胶:在所述第一基板的粘接区涂上一层无影胶。 [0021] S101 gumming: UV adhesive in the adhesive coated area of ​​the first substrate.

[0022]在步骤SlOl中,所述粘接区为所述第一基板的整个平面或部分平面,所述无影胶又称UV(Ultravic)Iet Rays,紫外光线)胶、光敏胶或紫外光固化胶,是一种必须通过紫外线光(紫外线光是处于可见光之外的一段电磁福射波,波长介于10〜400nm的范围)照射才能固化的胶粘剂,除了可以作为粘接剂使用,还可作为油漆、涂料、油墨等的胶料使用。 [0022] In step SlOl, the first adhesive region is the entire surface or part of the planar substrate, the groups of plastic known as UV (Ultravic) Iet Rays, UV light) plastic, ultraviolet light, or photosensitive adhesive curing adhesive, an ultraviolet light must pass (ultraviolet light in a period other than the electromagnetic wave emitted Fu visible wavelength range between 10~400nm) is irradiated to cure the adhesive, in addition to use as an adhesive, may also be as paints, coatings, inks and other compound. 所述无影胶的固化原理如下:在UV固化材料中配置有光引发剂(或光敏剂),其可在紫外线光的照射下吸收紫外光的能量,并产生活性自由基或阳离子,引发单体聚合、交联和接支化学反应,使胶粘剂在数秒钟内由液态转化为固态。 The principle of the cured UV adhesive as follows: Configuration photoinitiator (or photosensitizer), which energy-absorbing ultraviolet radiation in the ultraviolet light, and the generation of reactive radical or cationic UV curable material, a single initiator polymerized, and a graft crosslinking chemical reaction, the adhesive in seconds from liquid into solid. 优化的,在所述步骤SlOl之前还包括如下步骤:S100.开槽:在所述第一基板的粘接区边沿开设包围所述粘接区的线槽,所述线槽的宽度介于2〜8mm之间,所述线槽的深度也介于2〜8mm之间。 Optimized, prior to said step SlOl further comprising the step: SlOO slot: open trough surrounding the region of the adhesive bonding region of the first substrate edge, the groove width of between 2 between ~8mm, also the depth of the groove between 2~8mm. 由于所述无影胶在固化前为液态,因此通过在粘接区边沿开设所述线槽,可以容纳因碾压或真空吸抽作用而被挤出的无影胶,防止无影胶溢出,方便后续加工处理。 Since the groups of plastic in a liquid state before curing, thus opening the groove by the adhesive edge region, can accommodate groups of plastic by vacuum suction or rolling action are extruded, to prevent overflow of groups of plastic, to facilitate subsequent processing. 作为举例的,本实施例中所述线槽的宽度和深度分别选取中间值6mm。 By way of example, the width and depth of the trough embodiment of the present embodiment were selected intermediate values ​​6mm. 此外作为优化的,所述无影胶的涂设厚度介于0.3〜Imm之间。 Further optimization as 0.3~Imm between the groups of plastic coating thickness set. 通过进行所述厚度设置,可以在有效粘接效果与材料成本之间实现平衡,不但可保障粘接的稳固性,还可以降低制备工艺成本。 By setting the thickness to be effective to achieve a balance between bonding effect and material costs, not only to protect the stability of the adhesive, the preparation process can also reduce costs. 作为举例的,本实施例中所述无影胶的涂设厚度选取中间值 By way of example, the thickness of the coating is provided in the embodiment of the intermediate value selection shadowless adhesive of the present embodiment

0.5mm ο 0.5mm ο

[0023] S102.合板:将第二基板覆盖在所述第一基板的粘接区上,并碾压得到胶合板,且在所述第一基板和所述第二基板中至少设置一个为透明板。 [0023] S102 plywood: second substrate on the adhesive covering the first region of the substrate, and rolling to give plywood, and at least one transparent plate to the first substrate and the second substrate .

[0024]在步骤S102中,所述透明板可以但不限于为玻璃板或者有机玻璃板。 [0024] In step S102, the transparent plate may be, but is not limited to a glass plate or organic glass plate. 此外作为优化的,对所述胶合板的碾压时间介于2〜5分钟。 Further as the optimization of the time of rolling plywood is between 2 ~ 5 minutes. 通过对所述胶合板进行一定时间(例如3分钟)的碾压,可以初步挤压出在两基板之间的气泡。 By rolling the plywood predetermined time (e.g. 3 minutes), the bubbles can be initially extruded between two substrates.

[0025] S103.吸抽:将所述胶合板放入抽气室中,然后启动抽气栗,降低室内气压。 . [0025] S103 an aspiration: plywood into the pumping chamber, and then start pumping Li, the pressure reducing chamber.

[0026]在步骤S103中,随着室内气压的降低,若两基板之间存在气泡,将会使得气泡与外部之间的压差逐渐增大,从而促使气泡扩展并逐渐向粘接区边缘移动,直到气泡破损为止(即气泡内的空气被抽走),由此通过前述的真空吸抽作用,可使粘接面之间产生的气泡被挤出,从而可以有效杜绝气泡的产生。 [0026] In step S103, with the decrease of the pressure chamber, if bubbles exist between the two substrates, so will the pressure differential between the outside and the bubble is gradually increased, thereby causing the bubbles to expand and gradually moves toward the edge of the bonding region , up until the air bubble breakage (i.e. air is pumped inside the bubble), thereby by the suction effect of the vacuum, is generated between the adhesive surface of the bubble is extruded, which can effectively prevent the generation of bubbles.

[0027] S104.光固:当室内气压降低至第一气压值时,开启紫外线灯,照射所述胶合板中的透明板,对处于两基板间的无影胶进行固化。 . [0027] S104 photocurable: when the pressure reducing chamber to a first pressure value, the ultraviolet lamp is turned on, illuminating the transparent plate plywood, of groups of plastic between the substrates is cured.

[0028]在步骤S104中,所述第一气压值为可以确保气泡被完全挤出时的气压值,其值可以但不限于为IK帕。 [0028] In step S104, the value of the first pneumatic pressure can be ensured when the value is completely out of the bubble, which may be, but is not limited to the value of IK Pa. 在确保气泡已经被完全挤出后,在维持低压状态(关闭所述抽气栗)或继续降压状态(继续开启所述抽气栗)下开启所述紫外线灯,使发出紫外线光对处于两基板之间的无影胶进行固化作用,实现两基板之间的稳固粘接。 Ensure the bubble has been completely extruded, while maintaining a low pressure state (closes the suction Li) or a depressurized state continues (continue opening the exhaust Li) opening under the ultraviolet lamp, so that emits ultraviolet light in a two-pair groups of plastic between the substrate solidification, to achieve a firm bonding between the two substrates. 优化的,使所述紫外线灯对准所述粘接区的中心,然后以逐渐增大照射光强的方式进行照射。 Optimized, so that the ultraviolet lamp aligned with the central adhesive zone, and then gradually increasing the irradiation intensity of light irradiated manner. 通过进行所述方式的照射,可以从中心向外围地对所述粘接区中的无影胶进行固化,与气泡的移动方向一致,由此在固化过程中不会对气泡的移动产生阻碍作用,避免气泡的遗留。 , Can be carried out by way of the irradiation from the center to the periphery of the adhesive region curable groups of plastic, in line with the movement direction of the bubble, thereby will not hinder the movement of bubbles during the curing process , avoid leaving the air bubbles.

[0029]在步骤S104中,优化的,按照如下公式确定所述紫外线灯的照射时间T:T=20/P+1分钟,其中P为所述紫外线灯的功率值或者平均功率值,单位为瓦特。 [0029] In step S104, the optimization according to the following equation to determine the irradiation time of the ultraviolet lamp T: T = 20 / P + 1 min where P is the power value of the power of the UV lamp or the average value, in watt. 所述功率值为固定值,所述平均功率值为在一定照射时间内动态功率值的平均值。 The power value is fixed, the average value of the power average value of the dynamic power in a certain irradiation time. 例如当所述紫外线灯的功率值为1W时,所述紫外线灯的照射时间为3分钟,当所述紫外线灯的功率值为5W时,所述紫外线灯的照射时间为5分钟,功率越大,照射的时间越短,但是至少保持有I分钟时长,可确保能够对所述无影胶进行有效固化。 For example, when the power of the UV lamp is 1W, the ultraviolet lamp irradiation time was 3 minutes, when the power of the UV lamp is 5W, the UV light irradiation time was 5 minutes, the greater the power , the shorter the irradiation time, but when there is a long hold at least I minute, can ensure effective curing of the UV adhesive.

[0030]优化的,在所述步骤S104之后还包括如下步骤:S105.扫描:平移所述胶合板或所述紫外线灯,对所述粘接区进行至少一次扫描式照射。 [0030] Optimization, after said step S104, further comprising the step of:. Scan S105: translating the plywood or the ultraviolet light, the adhesive zone of at least one scanning irradiation. 通过最后的扫描式照射,可以确保对所述粘接区完成了全覆盖式的固化作用,进一步提高粘合稳固性。 Through a final scanning irradiation, to ensure the completion of the curing of the adhesive zones full coverage to further improve the adhesion stability.

[0031 ]综上,本实施例所提供的采用无影胶粘合基板的方法,具有如下有益效果:(I)在工艺流程中,通过真空吸抽作用,可使粘接面之间产生的气泡被挤出,从而可以有效杜绝气泡的产生,大幅度提高高光学要求的胶合板的成品率及成品面积;(2)通过紫外线灯对光影胶的固化作用,可以实现胶合板的稳定粘接;(3)通过在粘接区边沿开设线槽,可以容纳因碾压或真空吸抽作用而被挤出的无影胶,防止无影胶溢出,方便后续加工处理;(4)可在室温下进行粘合及固化,节约能源,降低工艺成本;(5)这种制备方法还具有工艺流程简单和粘合稳固性高的优点,便于实际推广和应用。 [0031] In summary, a method using glue shadowless provided substrate according to the present embodiment has the following advantages: (I) in the process flow, vacuum suction by suction effect, can produce the adhesive surface between the bubbles is extruded, which can effectively prevent the generation of the bubble, plywood greatly improved yield and high optical requirements of the finished product area; (2) by the action of ultraviolet light on the light curing adhesive, plywood adhesive stability can be achieved; ( 3) the adhesive by opening trough edge region, can accommodate groups of plastic by vacuum suction or rolling action are extruded, to prevent overflow of groups of plastic, to facilitate subsequent processing; (4) may be carried out at room temperature and curing the adhesive, save energy, reduce the cost of the process; (5) this method of preparation is also a simple process and an adhesive having the advantages of high stability, ease of application and actual promotion.

[0032]如上所述,可较好地实现本发明。 [0032] As described above, the present invention can be better realized. 对于本领域的技术人员而言,根据本发明的教导,设计出不同形式的采用无影胶粘合基板的方法并不需要创造性的劳动。 For those skilled in the art, according to the teachings of the present invention, a design method of groups of different forms of gluing the substrate does not need creative work. 在不脱离本发明的原理和精神的情况下对这些实施例进行变化、修改、替换、整合和变型仍落入本发明的保护范围内。 Be made without departing from the principles and spirit of the present invention to these embodiments variations, modifications, substitutions, modifications and integration still fall within the scope of the present invention.

Claims (8)

  1. 1.一种采用无影胶粘合基板的方法,其特征在于,包括如下步骤: SlOl.涂胶:在所述第一基板的粘接区涂上一层无影胶; S102.合板:将第二基板覆盖在所述第一基板的粘接区上,并碾压得到胶合板,且在所述第一基板和所述第二基板中至少设置一个为透明板; 5103.吸抽:将所述胶合板放入抽气室中,然后启动抽气栗,降低室内气压; 5104.光固:当室内气压降低至第一气压值时,开启紫外线灯,照射所述胶合板中的透明板,对处于两基板间的无影胶进行固化。 A method shadowless glue substrate, comprising the steps of: coating the SLOL: UV adhesive in the adhesive coated area of ​​the first substrate; plywood S102: The a second substrate on the adhesive covering the first region of the substrate, and rolling to give plywood, and at least one transparent plate to the first substrate and the second substrate; 5103. suction pump: the plywood into said pumping chamber, and then start pumping Li, the pressure reducing chamber; 5104. solid light: when lowering the pressure chamber to a first pressure value, the ultraviolet lamp is turned on, illuminating the transparent plate plywood, for in groups of plastic between the two substrates is cured.
  2. 2.如权利要求1所述的一种采用无影胶粘合基板的方法,其特征在于,在所述步骤SlOl之前还包括如下步骤: S100.开槽:在所述第一基板的粘接区边沿开设包围所述粘接区的线槽,所述线槽的宽度介于2〜8mm之间,所述线槽的深度也介于2〜8mm之间。 2. one of said groups of method claim 1 gluing a substrate, wherein, prior to said step SlOl further comprising the step of:. S100 slot: is bonded to the first substrate It defines the edge region of the adhesive surrounding the trough region, the groove width between 2~8mm, also the depth of the groove between 2~8mm.
  3. 3.如权利要求1所述的一种采用无影胶粘合基板的方法,其特征在于,在所述步骤SlOl中,所述无影胶的涂设厚度介于0.3〜Imm之间。 One of the claim 1 method shadowless gluing a substrate, wherein, in the step SlOl, the shadowless adhesive coating thickness disposed between 0.3~Imm.
  4. 4.如权利要求1所述的一种采用无影胶粘合基板的方法,其特征在于,在所述步骤S102中,对所述胶合板的碾压时间介于2〜5分钟。 4. one of the claim 1, the method shadowless gluing a substrate, wherein, in the step S102, the rolling time is between 2 ~ 5 minutes plywood.
  5. 5.如权利要求1所述的一种采用无影胶粘合基板的方法,其特征在于,在所述步骤S104中,使所述紫外线灯对准所述粘接区的中心,然后以逐渐增大照射光强的方式进行照射。 5. one of said groups of method claim 1 gluing a substrate, wherein, in the step S104, the ultraviolet lamp aligned with the central adhesive zone, then gradually increase in irradiation light intensity irradiation manner.
  6. 6.如权利要求1或4所述的一种采用无影胶粘合基板的方法,其特征在于,在所述步骤S104中,按照如下公式确定所述紫外线灯的照射时间T:T=20/P+1分钟,其中P为所述紫外线灯的功率值或者平均功率值,单位为瓦特。 6. one or more of claims 1 to 4, wherein the method shadowless gluing a substrate, wherein, in the step S104, determining that the ultraviolet light irradiation time T according to the following equation: T = 20 / P + 1 min where P is the power of said ultraviolet lamp or average power value in watts.
  7. 7.如权利要求1所述的一种采用无影胶粘合基板的方法,其特征在于,在所述步骤S104之后还包括如下步骤: 5105.扫描:平移所述胶合板或所述紫外线灯,对所述粘接区进行至少一次扫描式照射。 7. The one of the claim 1, the method shadowless gluing a substrate, wherein, after the step S104 further includes the step of: 5105. Scan: translating the plywood or the ultraviolet lamp, the at least one adhesive zone scanning irradiation.
  8. 8.如权利要求1所述的一种采用无影胶粘合基板的方法,其特征在于,所述透明板为玻璃板或者有机玻璃板。 8 1 one of said groups of method claim gluing a substrate, wherein the transparent plate is a glass or plexiglass plate.
CN 201610400916 2016-06-08 2016-06-08 Groups of gluing using methods substrate CN106064520B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030226633A1 (en) * 2002-06-11 2003-12-11 Fujitsu Limited Method and apparatus for fabricating bonded substrate
CN101211049A (en) * 2006-12-25 2008-07-02 株式会社日立显示器 Manufacturing method of display device
CN102896874A (en) * 2012-10-30 2013-01-30 昆山希盟自动化科技有限公司 Liquid glue jointing method for double-station touch screen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030226633A1 (en) * 2002-06-11 2003-12-11 Fujitsu Limited Method and apparatus for fabricating bonded substrate
CN101211049A (en) * 2006-12-25 2008-07-02 株式会社日立显示器 Manufacturing method of display device
CN102896874A (en) * 2012-10-30 2013-01-30 昆山希盟自动化科技有限公司 Liquid glue jointing method for double-station touch screen

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