CN106064486A - Fiber molded product - Google Patents
Fiber molded product Download PDFInfo
- Publication number
- CN106064486A CN106064486A CN201510847538.0A CN201510847538A CN106064486A CN 106064486 A CN106064486 A CN 106064486A CN 201510847538 A CN201510847538 A CN 201510847538A CN 106064486 A CN106064486 A CN 106064486A
- Authority
- CN
- China
- Prior art keywords
- hole
- fiber
- film
- thermoplastic resin
- inner peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000835 fiber Substances 0.000 title claims abstract description 48
- 230000002093 peripheral effect Effects 0.000 claims abstract description 35
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 25
- 230000000149 penetrating effect Effects 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 45
- 238000000465 moulding Methods 0.000 description 25
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 1
- 208000003251 Pruritus Diseases 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/74—Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding
- B29C70/747—Applying material, e.g. foam, only in a limited number of places or in a pattern, e.g. to create a decorative effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/54—Component parts, details or accessories; Auxiliary operations, e.g. feeding or storage of prepregs or SMC after impregnation or during ageing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/54—Component parts, details or accessories; Auxiliary operations, e.g. feeding or storage of prepregs or SMC after impregnation or during ageing
- B29C70/545—Perforating, cutting or machining during or after moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B1/00—Layered products having a non-planar shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/12—Thermoplastic materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
According to an embodiment, fiber molded product (1) include being impregnated with the fiber of thermoplastic resin, the flat base (11) from fiber molded and the wall portion (12) from fiber molded, and this wall portion extends to outside the surface of base portion to form the outer rim of base portion.Wall portion (12) includes through hole (13).The whole periphery of the inner peripheral surface (14) of through hole (13) is coated with film (15).By making the described thermoplastic resin penetrating in fiber fusing form described film (15) in inner peripheral surface (14).
Description
Cross-Reference to Related Applications
This application claims the U.S. Provisional Application No.62/152 submitted on April 24th, 2015, the rights and interests of 638, it is all interior
Hold by quote combined and this.
Technical field
Embodiment described herein and relate generally to a kind of fiber molded product.
Background technology
It is known by carbon or glass fibre resin by injection are formed fiber-reinforced resin.Fiber-reinforced resin has lightweight and height
The special characteristic of intensity.
By if punch process is from the mechanograph that fiber-reinforced resin moulds, cross section often exposes at edge or end.
In this case, fiber is likely exposed on the cross section of mechanograph and the fiber that exposes likely drops out cross section.
Such as, drop out from the inner peripheral surface of the through hole being formed at mechanograph and contact the carbon fiber of skin and may cause pruritus.
Summary of the invention
For this reason, the cross section of the mechanograph to fiber-reinforced resin is needed to process to stop fiber to expose transversal
Face.Such as, mechanograph must be subjected to come the cross section of covering resin as inserted molding.Therefore, resin is strengthened at molded fiber
Time, need the cross section of mechanograph is more effectively processed.
Hereinafter with reference to accompanying drawing, various embodiment is described.In the ordinary course of things, according to embodiment, it is impregnated with thermoplastic resin
Fiber；From the flat base of fiber molded；And from the wall portion of fiber molded, and this wall portion extends to outside the surface of base portion
Side is to form the outer rim of base portion.Wall portion includes through hole.The whole edges cover of the inner peripheral surface of through hole has film.By in inner circumferential
Make the thermoplastic resin penetrating in fiber melt on surface and form film.
According to embodiment, the inner peripheral surface of through hole thus tunicle cover, it is possible to stop fiber to expose (exposure) from inner peripheral surface.
Accompanying drawing explanation
The general structure of each feature realizing embodiment is described referring now to accompanying drawing.Accompanying drawing and associated description be used for that embodiment is described and
It is not used in restriction the scope of the present invention.
Fig. 1 is the exemplary perspective view of the mechanograph of embodiment.
Fig. 2 is the exemplary enlarged perspective of the through hole of the mechanograph of Fig. 1.
Fig. 3 is the exemplary plan view of the sheet material of the mechanograph by being molded as Fig. 1.
Fig. 4 is the exemplary amplification view of the through hole of the sheet material in Fig. 3.
Fig. 5 is the exemplary perspective view of the material of the primary molding moulded by the sheet material of Fig. 3.
Fig. 6 is the examples of materials perspective view of the primary molding from Fig. 5 different from the visual angle of Fig. 5.
Fig. 7 is exemplary cross sectional view, it is shown that the direction of the sheet material of Fig. 3 arrow A3 instruction from Fig. 3 is placed
On mould, sheet material to be molded as the state of the material of primary molding.
Fig. 8 is exemplary cross sectional view, it is shown that the direction that the arrow A6 from Fig. 6 of the sheet material in Fig. 7 represents is pressed
Press and be molded as the state of the primary material moulded.
Fig. 9 is exemplary cross sectional view, it is shown that the direction of arrow A6 instruction from Fig. 6, by the primary molding of Fig. 8
Material be placed on mould, to form the state of film on the through hole of the material moulded in primary.
Figure 10 is exemplary cross sectional view, it is shown that the direction of arrow A6 instruction from Fig. 6, is inserted by the slide block of mould
The state of the through hole of the material of the primary molding of Fig. 9.
Figure 11 is exemplary cross sectional view, the direction of arrow A10 instruction from Figure 10, it is shown that the primary mould of Figure 10
Gap between through hole and the slide block of mould of the material of system.
Figure 12 is exemplary cross sectional view, it is shown that the direction of arrow A6 instruction from Fig. 6, by the primary mould of Figure 10
The material pressing of system forms the state of the film of through hole.
Figure 13 is that the exemplary amplification in the gap between through hole and the slide block of mould of the material of the primary molding of Figure 12 is transversal
Face figure.
Figure 14 is exemplary cross sectional view, it is shown that the direction of arrow A12 instruction from Figure 12, utilizes fusing Figure 13
Shown in the through hole of material that moulds from primary of gap be filled the state of fusing resin.
Figure 15 is the exemplary viewgraph of cross-section of the film of the through hole in the direction that the arrow A2 in Fig. 2 represents.
Figure 16 is the direction of the arrow A2 instruction from Fig. 2, the exemplary cross-sectional of the form of through hole in other embodiments
The view in face.
Figure 17 is the direction of the arrow A2 instruction from Fig. 2, the exemplary cross-sectional of the form of through hole in other embodiments
The view in face.
Detailed description of the invention
The fiber molded product of embodiment are hereinafter with reference to Fig. 1 to 15, by comprising this mechanograph and with this mechanograph as shell
Electronic equipment is described.Mechanograph 1 is molded from the fiber being impregnated with thermoplastic resin.In the present embodiment, carbon is used
Fiber is as fiber.It is also possible, however, to use other kinds of fiber, such as glass fibre.Use such as Polyetherimide,
Polyethers or polyester are as thermoplastic fibre.However, it is also possible to use other kinds of resin, as long as this resin can be by heating
Repeatedly plastified.
As it is shown in figure 1, mechanograph 1 includes base portion 11 and wall portion 12.Fig. 1 illustrates to have and is shaped as rectangular flat
The form of base portion 11 of plane.But, the shape of base portion 11 is not limited to this, can change according to the application of mechanograph 1
Become.Wall portion 12 extends to outside the surface of base portion 11, and forms the outer rim of base portion 11.Fig. 1 illustrates wall portion
A kind of form of 12, this wall portion 12 extends vertically and is formed the framework around base portion 11 from base portion 11 in one direction.
But, this wall portion 12 need not be configured to framework, and can part be cut off.Base portion 11 and wall portion 12 form mould
Goods 1 box-like.
Therefore, mechanograph 1 can be configured to accommodate the shell of all parts, and all parts is such as mounted in electronic equipment
On control unit, display unit and memory element, this electronic equipment is positioned at the space surrounded by base portion 11 and wall portion 12
In S1.Such as, molded article can be used as the shell of electronic equipment of such as panel computer or notebook computer.
As depicted in figs. 1 and 2, wall portion 12 has through hole 13, and space S 1 is by this through hole 13 communication with the outside world.Such as,
Through hole 13 exposes the coupling part can being connected with external equipment.More specifically, through hole 13 can be used as USB (universal serial bus)
And high definition digital multimedia interface (HDMI) end, storage card slot etc. (USB).The size of through hole 13 and quantity
Can arbitrarily arrange.
On the whole periphery of the inner peripheral surface 14 that film 15 is formed at each through hole 13.In other words, each through hole 13 is interior
The whole periphery tunicle 15 of perimeter surface 14 covers.(carbon is fine by the fiber penetrated into as mechanograph 1 stock for film 15
Dimension) in thermoplastic resin formed.In this case, the inner circumferential at through hole 13 of the thermoplastic resin in fiber is penetrated into
It is melted on surface 14, and the thermoplastic resin melted is cured in inner peripheral surface 14.Solidification thermoplastic resin with
Inner peripheral surface 14 combines (integrated) and becomes the film 15 covering inner peripheral surface 14.That is, oozed by heating and re-melting
Thoroughly form film 15 to the thermoplastic resin in fiber.
Thus, the inner peripheral surface 14 of through hole 13 is covered by film 15, and this film 15 is prevented from fiber in inner peripheral surface 14
Expose (exposing).Drop out from the inner peripheral surface 14 of through hole 13 owing to being prevented from fiber, so for example, it is possible to avoiding skin
Skin contact problem caused by carbon fiber.
As it has been described above, the mechanograph 1 of the present embodiment is characterised by, the inner peripheral surface 14 of each through hole 13 is by by penetrating into
The film 15 that thermoplastic resin in fiber is formed covers.The method of moulding of mechanograph 1 is described below with reference to Fig. 3 to Figure 15
An example, this method of moulding is included in the method for molded membrane 15 in the inner peripheral surface 14 of each through hole 13.Such as Fig. 3
To shown in Figure 15, the resin plate 20 being impregnated with thermoplastic resin by punching press and pressing moulds this mechanograph 1.
As shown in Figure 3 and Figure 4, when moulding this mechanograph 1, through hole 13 is formed on rectangular plate 20.By profit
With such as computer numerical control (CNC) equipment, punching press (in figure 3, is clipped in plate near every edge area of sheet material 20
Region 21 between every side and the dotted line of material 20) form through hole 13.Form the limit of the close sheet material 20 of through hole 13
The region of edge is corresponding to becoming the region in the wall portion 12 of mechanograph 1.
Being formed in each inner peripheral surface 14 in view of film 15, each through hole 13 is formed at sheet material 20 (wall portion with a size
12), on, this size is by amplifying the thickness of film 15 extremely by the size (aperture area) of hole 13a necessary to mechanograph 1
Similar pattern.That is, aperture area and the thickness of film 15 needed for the aperture area of through hole 13 counts minimum in.Therefore, through hole
The aperture area of 13 reduces the thickness of film 15, and by forming film 15 in whole inner peripheral surface 14, can be at mechanograph
Forming institute on 1 must the hole 13a of size.Necessary to mechanograph 1, the size of hole 13a is, such as, in wall portion 12
Need to be inserted into the adapter meeting various standard the aperture area of the coupling part of electronic equipment, meet the company of various standard
Connect device and another equipment is connected to this electronic equipment.
As shown in Figure 5 and Figure 6, the sheet material 20 it being formed with through hole 13 is (that is, logical in the region at the edge near every side
Hole 13 formed region) and its inside between be bending.Thus, form wall portion near the region at the edge of sheet material 20
12, and inside it, form base portion 11.
Fig. 7 and Fig. 8 shows the reality of the method in the wall portion 12 moulding the side corresponding to the mechanograph 1 in die assembly 30
Example.Die assembly 30 has the first static mould 31 and moveable second mould 32.First mould 31 has and is contracted
Enter with cavity portion 31a of form (that is, base portion 11 and the form in wall portion 12) of the sheet material 20 corresponding to bending.Second
Mould 32 is configured to move into or leave cavity portion 31a.
As it is shown in fig. 7, when mold walls portion 12, sheet material 20 is placed on the first mould 31 and crosses cavity portion 31a.
In this state, the second mould 2 is moved into cavity portion 31a, and by the second mould 32 of movement by sheet material
20 are pressed in cavity portion 31a.According to such as the quality of sheet material 20, arbitrarily arrange and sheet material 20 is pressed into cavity portion 31a
In pressure, temperature and time.Thus, frame wall portion 12 that sheet material 20 is molded on outward flange and being enclosed by wall portion 12
Around base portion 11.Through hole 13 is formed in wall portion 12.Therefore, hereinafter, the sheet material 20 being molded is referred to as primary
The material 40 of molding.By in the wall portion 12 in 13 materials 40 being formed at primary molding.
As shown in Fig. 9 to Figure 15, carry out punch process, at each through hole 13 by the material 40 that moulds in primary
Film 15 is formed in inner peripheral surface 14.Fig. 9 to 15 shows and is molded in by the film 15 in die assembly 50 corresponding to molding
Method on each through hole 13 in the wall portion 12 of the side of product 1.Die assembly 50 includes the 3rd static mould 51 He
Moveable 4th mould 52.3rd mould 51 has base portion 11 He being retracted as the material 40 corresponding to primary molding
Cavity portion 51a of the form in wall portion 12.3rd mould 51 has relative to stationary mold concrete 51b movable sliding block 51c.
Slide block 51c includes jut 51d, and this jut 51d has the transversal of the similar pattern less than the aperture area of through hole 13
Face area.The projection length of jut 51d is equal to the hole depth (corresponding to the thickness of sheet material 20) of through hole 13.4th mould
Tool 52 is configured to move into or leave cavity portion 51a.
As it is shown in figure 9, when molded membrane 15, the material 40 of primary molding is positioned and is arranged in the sky of the 3rd mould 51
In chamber portion 51a.Then, as shown in Figure 10, the slide block 51c of the 3rd mould 51 moves towards through hole 13, and jut
In the through hole 13 of the material 40 that 51d is inserted into primary molding.In this state, as shown in figure 11, at jut
Gap S2 is formed between the whole periphery of perimeter surface 51e of 51d and the inner peripheral surface 14 of through hole 13.Then, such as Figure 12
Shown in, the 4th mould 52 moves in cavity portion 51a, with the material 40 of predetermined pressure pressing primary molding.In this feelings
Under condition, as shown in figure 13, the 4th mould 52 contacts with lug tips 51f of jut 51d.
In this state, the material 40 of primary molding is heated to penetrate in the fiber forming the material 40 that primary moulds
The temperature that is melted of thermoplastic resin, and the material 40 of heated primary molding is pressed the scheduled time.By this
Kind of heat pressing, quilt in the inner peripheral surface 14 of the through hole 13 penetrating into the material 40 that the thermoplastic resin of fiber moulds in primary
Fusing.As shown in figure 14, the resin of fusing flows into gap S2 and fills gap S2.In this state, primary molding
Material 40 be cooled to the temperature that thermoplastic resin is hardened.As shown in figure 15, by the material of cooling primary molding
40, the thermoplastic resin filling gap S2 is cured, and film 15 is molded in inner peripheral surface 14 whole of through hole 13
Individual periphery.Thus, the mechanograph 1 (Fig. 1 and Fig. 2) as secondary molding product is molded, in this mechanograph 1, often
The inner peripheral surface 14 of individual through hole 13 is coated with film 15.
Film 15 is molded according to the form of gap S2.That is, the thickness of film 15 is corresponding to the outer surface 51e of jut 51d
And the interval between the inner peripheral surface 14 of through hole 13.Therefore, the cross-sectional area of jut 51d and the opening of through hole 13
Area is set according to the thickness of the film 15 that will mould.
As it has been described above, according to the present embodiment, the inner peripheral surface 14 of each through hole 13 is coated with film 15.Owing to being prevented from
Fiber drops out from the inner peripheral surface 14 of through hole 13, it is possible to avoid such as by the problem caused by contact skin carbon fiber.
Additionally, due to carry out molded membrane 15 from the thermoplastic resin penetrated into fiber, so such as, it is not necessary to by setting respectively
Fat injects the material 40 of primary molding to carry out inserting molding etc., to cover inner peripheral surface 14.Owing to having the mould of film 15
The heat pressing of the material 40 that goods 1 can only be moulded by primary is molded, so simplifying operation.
In the above-described embodiments, through hole 13 is the cylindrical hole with constant bore dia.Alternatively, as shown in figure 16, permissible
By making opening portion be angled to form through hole 13 at both ends, with the axle (axle of the depth direction of through hole 13) in hole
Expand the diameter of each opening portion towards outside on direction.That is, through hole 13 has bigger towards an end of through hole 13
The diameter of opening portion.In this case, compared with the form shown in Figure 15, the inner peripheral surface 14 of through hole 13
Area is expanded by inclined surface 16.
Figure 17 shows the form of the film 15 under through hole 13 has in the case of this form.As shown in figure 17, film
There is on the hole direction of principal axis of 15 through holes 13 on the inclined surface 16 of through hole 13 bigger thickness towards outside.Therefore, with
Form in Figure 15 is compared, and inner peripheral surface 14 and the film 15 of through hole 13 are combined each other integratedly, and this can be relatively reliable
Prevent from fiber inner peripheral surface 14 from the opening portion of each through hole 13 and the borderline region between film 15 drop out.
Figure 16 and Figure 17 shows the form of through hole 13, in through hole 13, is to tilt in the opening portion of two ends,
But through hole 13 can be to have the form only making the opening portion in end side tilt.Such as, in the outer surface side in wall portion 12
On (opposition side of space S 1 i.e., in FIG), inclined surface 16 is set in an opening portion of through hole 13.
Even if in this case, it is also possible to be reliably prevented the fiber outer surface from the wall portion 12 readily accessing hands and drop out.
Therefore, it can be effectively prevented fiber contacts skin.
In the above-described embodiments, wall portion 12 and film 15 are to be molded in different die assemblies 30 and 50, but permissible
Identical die assembly is molded.In this case, wall portion 12 and film 15 can be molded simultaneously, and such as
Flange, tongue, boss etc. can also be moulded simultaneously together.In other words, wall portion 12, flange etc. can be simultaneously
It is molded as film 15.Therefore, it can more improve the efficiency of the moulding process of mechanograph 1.
Although having been described above some embodiment, but these embodiments being presented the most in an illustrative manner, it is not intended to limit this
The scope of invention.It practice, novel embodiment described herein can be implemented with other various forms；Furthermore, it is possible to
Without departing from the case of spirit of the present invention, the form that embodiment described herein is carried out various omissions, substitutions and changes.Appended
Claim and equivalent thereof are intended to cover these forms or amendment falls within the spirit and scope of the invention.
Claims (7)
1. fiber molded product, it is characterised in that including:
It is impregnated with the fiber of thermoplastic resin；
Flat base from described fiber molded；With
Wall portion, described wall portion is from fiber molded, and extends to outside the surface of described base portion to form the outer rim of described base portion；
Described wall portion includes through hole, and the whole periphery of the inner peripheral surface of described through hole is coated with film；
By making the described thermoplastic resin penetrating in described fiber fusing form described film in described inner peripheral surface.
2. fiber molded product as claimed in claim 1, it is characterised in that
The aperture area of described through hole count minimum in needed for aperture area and the thickness of described film.
3. fiber molded product as claimed in claim 1, it is characterised in that
Described through hole has the diameter of bigger opening portion towards an end of described through hole.
4. the electronic equipment including shell, it is characterised in that described shell includes:
It is impregnated with the fiber of thermoplastic resin；
Through hole, for exposing the coupling part that may be connected to external equipment；With
Cover the film of the whole periphery of the inner peripheral surface of described through hole,
By making the described thermoplastic resin penetrating in described fiber fusing form described film in described inner peripheral surface.
5. electronic equipment as claimed in claim 4, it is characterised in that
Described through hole has aperture area, and described aperture area is counted the thickness of described film in and inserts the connector into described connection
Minimum required aperture area needed for part.
6. electronic equipment as claimed in claim 4, it is characterised in that
Described through hole has the diameter of bigger opening portion towards an end of described through hole.
7. the method for a molded fiber, it is characterised in that described method includes:
The fiber be impregnated with thermoplastic resin is formed through hole；
Heat pressing dipping has the described fiber of described thermoplastic resin；
The inner peripheral surface of described through hole make described thermoplastic resin melt；And
The film of the whole periphery of the described inner peripheral surface covering described through hole is formed by the thermoplastic resin of fusing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562152638P | 2015-04-24 | 2015-04-24 | |
| US62/152,638 | 2015-04-24 |
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| CN106064486A true CN106064486A (en) | 2016-11-02 |
| CN106064486B CN106064486B (en) | 2019-09-24 |
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| CN201510847538.0A Active CN106064486B (en) | 2015-04-24 | 2015-11-27 | The method of moulding and electronic equipment of fiber molded product |
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| Country | Link |
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| US (1) | US10173390B2 (en) |
| CN (1) | CN106064486B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101101491B1 (en) * | 2010-02-25 | 2012-01-03 | 삼성전기주식회사 | Antenna pattern frame, case of electronic device and mould for manufacturing the same |
| KR102624006B1 (en) * | 2016-12-20 | 2024-01-11 | 삼성디스플레이 주식회사 | Display Apparatus |
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| JPS58173625A (en) * | 1982-04-07 | 1983-10-12 | Toshiba Corp | Reproductive preparation of information disk |
| JPS6147221A (en) * | 1984-08-14 | 1986-03-07 | Toshiba Corp | Manufacture of molded body |
| JPH11165786A (en) * | 1997-12-05 | 1999-06-22 | Rohm Co Ltd | Structure of tape-like packaged body for electronic parts |
| JP2003258432A (en) * | 2002-03-06 | 2003-09-12 | Sharp Corp | Printed wiring board and its manufacturing method |
| CN102285017A (en) * | 2011-08-30 | 2011-12-21 | 东莞劲胜精密组件股份有限公司 | Manufacturing method of carbon fiber shell |
| CN102395460A (en) * | 2009-04-16 | 2012-03-28 | 梅西耶-布加蒂-道提公司 | Method for manufacturing a composite material connecting rod having reinforced ends |
| CN103297565A (en) * | 2012-02-24 | 2013-09-11 | 比亚迪股份有限公司 | Mobile phone shell and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4955442B2 (en) * | 2007-03-30 | 2012-06-20 | ポリマテック株式会社 | Decorative sheet, decorative molded body, decorative key sheet, and method for producing decorative sheet |
| JP2009078519A (en) | 2007-09-27 | 2009-04-16 | Hitachi Ltd | Method of manufacturing resin case, and electronic controller |
| JP5166815B2 (en) | 2007-10-04 | 2013-03-21 | 三菱電機株式会社 | Housing manufacturing method and mold |
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- 2015-11-09 US US14/936,521 patent/US10173390B2/en active Active
- 2015-11-27 CN CN201510847538.0A patent/CN106064486B/en active Active
Patent Citations (7)
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|---|---|---|---|---|
| JPS58173625A (en) * | 1982-04-07 | 1983-10-12 | Toshiba Corp | Reproductive preparation of information disk |
| JPS6147221A (en) * | 1984-08-14 | 1986-03-07 | Toshiba Corp | Manufacture of molded body |
| JPH11165786A (en) * | 1997-12-05 | 1999-06-22 | Rohm Co Ltd | Structure of tape-like packaged body for electronic parts |
| JP2003258432A (en) * | 2002-03-06 | 2003-09-12 | Sharp Corp | Printed wiring board and its manufacturing method |
| CN102395460A (en) * | 2009-04-16 | 2012-03-28 | 梅西耶-布加蒂-道提公司 | Method for manufacturing a composite material connecting rod having reinforced ends |
| CN102285017A (en) * | 2011-08-30 | 2011-12-21 | 东莞劲胜精密组件股份有限公司 | Manufacturing method of carbon fiber shell |
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Also Published As
| Publication number | Publication date |
|---|---|
| US10173390B2 (en) | 2019-01-08 |
| US20160316581A1 (en) | 2016-10-27 |
| CN106064486B (en) | 2019-09-24 |
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