CN106063108A

CN106063108A - Power conversion device

Info

Publication number: CN106063108A
Application number: CN201480076655.5A
Authority: CN
Inventors: 贯刚司; 原英则
Original assignee: Yaskawa Electric Corp
Current assignee: Yaskawa Electric Corp
Priority date: 2014-10-06
Filing date: 2014-10-06
Publication date: 2016-10-26
Also published as: WO2016056055A1; JPWO2016056055A1

Abstract

[Problem] To reduce the impact of heat on other components resulting from an electronic component that generates heat when energized. [Solution] A power conversion device 1 comprising a first substrate 30, a plurality of second substrates 32 and 34 that are erected on the first substrate 30, and power modules PM1 to PM8 that are arranged on the facing surfaces 32a and 34a of two second substrates 32 and 34 arranged so as to face one another, that constitute a power conversion circuit 10, and that generate heat when energized. In addition, the power modules PM1 to PM8 are arranged side by side on the facing surfaces 32a and 34a along the plate surface direction of the first substrate 30.

Description

Power inverter

Technical field

Embodiment of the present disclosure relates to power inverter.

Background technology

Having recorded control unit in patent documentation 1, the radiator being provided with semiconductor element is installed by described control unit Housing base plate, make cooling wind stream on the fin of radiator pass to cool down.

Citation

Patent documentation

Patent documentation 1: Japanese Patent Laid-Open 10-150284 publication.

Summary of the invention

The problem that invention is to be solved

In the above prior art, the electronic unit of the heating situation on the impact of the heat of miscellaneous part when reducing energising Under, it is desirable to device is constituted further optimization.

The present invention makes in view of such problem, it is therefore intended that provide the ministry of electronics industry of heating when can reduce energising The part power inverter on the impact of the heat of miscellaneous part.

Means for solving the above

In order to solve the problems referred to above, according to a viewpoint of the present invention, apply the power inverter of a kind of power conversion, Described power inverter includes: first substrate；Second substrate, described second substrate erects setting on described first substrate； And first electronic unit, described first electronic unit is arranged in the opposed faces of the described second substrate of arranged opposite two, structure Become power conversion circuit the heating when energising.

It addition, according to other viewpoints of the present invention, apply the power inverter of a kind of power conversion, described electric power is changed Device have by constitute power conversion circuit and when energising electronic unit and the substrate of heating separate the unit of configuration.

The effect of invention

Power inverter according to the present invention, it is possible to reduce energising time heating electronic unit to miscellaneous part heat Impact.

Accompanying drawing explanation

Fig. 1 is the circuit diagram of an example of the circuit composition of the power inverter representing an embodiment；

Fig. 2 is the axonometric chart of an example of the structure representing power inverter；

Fig. 3 is the top view of an example of the structure representing power inverter；

Fig. 4 is the front view of an example of the structure representing power inverter；

Fig. 5 is the front view of an example of the structure representing the power inverter in the 1st variation；

Fig. 6 is the front view of an example of the structure representing the power inverter in the 2nd variation；

Fig. 7 is the front view of an example of the structure representing the power inverter in the 3rd variation；

Fig. 8 is the front view of an example of the structure representing the power inverter in the 4th variation；

Fig. 9 is the front view of an example of the structure representing the power inverter in the 5th variation；

Figure 10 is the front view of an example of the structure representing the power inverter in the 6th variation；

Figure 11 is the front view of an example of the structure representing the power inverter in the 7th variation；

Figure 12 is the front view of an example of the structure representing the power inverter in the 8th variation；

Figure 13 is the front view of an example of the structure representing the power inverter in the 9th variation；

Figure 14 is the front view of an example of the structure representing the power inverter in the 10th variation；

Figure 15 is the front view of an example of the structure representing the power inverter in the 11st variation；

Figure 16 is the front view of an example of the structure representing the power inverter in the 12nd variation；

Figure 17 is the front view of an example of the structure representing the power inverter in the 13rd variation.

Detailed description of the invention

Hereinafter, referring to the drawings an embodiment is illustrated.It addition, in this specification and drawing, for essence On there is the element of identical function, represent with identical symbol in principle, about the repeat specification of these elements The most suitably omit.It addition, in drawing mark "front", "rear", "left", "right", " on ", the direction of D score correspond respectively to this Explanation in description is narrated into "front", "rear", "left", "right", " on ", the direction of D score.But, power inverter Each position relationship constituted be not limited to "front", "rear", "left", "right", " on ", the concept of D score.

First, with reference to Fig. 1, an example of the circuit composition of the power inverter of present embodiment is illustrated.

As it is shown in figure 1, the electric power inputted from external power source is converted into predetermined electric power and to load by power inverter 1 Output.Specifically, the alternating electromotive force inputted from three-phase alternating-current supply 100 is converted into other exchange by power inverter 1 Electric power, exports to eight three phase alternating current motors M1, M2, M3, M4, M5, M6, M7, M8 (following general name " three phase alternating current motor M "), And control action.That is, power inverter 1 be can 8 axles control motor control assembly.

It addition, the number of axle that can control of power inverter 1, i.e. motor (are three phase alternating current motors in above-mentioned example M) quantity is not limited to eight, it is also possible to be other quantity.It addition, external power source is not limited to three-phase alternating-current supply, it is also possible to It is other power supplys.It addition, load is not limited to three phase alternating current motor, it is also possible to be other loads.

Power inverter 1 has multiple electronic unit, and multiple electronic units include diode (led) module DM, four capacitors C1, C2, C3, C4 (following general name " capacitor C "), eight power modules PM1, PM2, PM3, PM4, PM5, PM6, PM7, PM8 (with Lower general name " power module PM "), as resistor an example regeneration resistance R and switch Q.

Diode (led) module DM includes diode, and the three-phase ac power inputted from alternating current power supply 100 carries out rectification, and to Dc bus P, N export direct current power.

Capacitor C1～C4 connects across dc bus P, N, carries out the DC voltage after diode (led) module DM rectification Smooth.

Power module PM1～PM8 such as includes that the multiple switch element SW being made up of semiconductor elements such as IGBT are (in Fig. 1 Only illustrate one).Further, direct current power is converted into predetermined three-phase ac power by power module PM1～PM8 respectively, and to Three phase alternating current motor M1～M8 exports.

It addition, in the case of carrying out electric power conversion by power module PM as described above, due to by above-mentioned electric capacity The smooth of DC voltage of device C etc. is necessary, and the most above-mentioned capacitor C1～C4 is referred to as being attached to power module PM1 ～the electronic unit of PM8.

The switch element SW of the diode of above-mentioned diode (led) module DM, capacitor C1～C4 and power module PM1～PM8 Constitute power conversion circuit 10.

Above-mentioned regeneration resistance R and the series circuit of switch Q is had it addition, connect between dc bus P, N.Switch Q such as wraps Include the semiconductor elements such as MOSFET, such as, open when the quick deceleration of three phase alternating current motor M or when quickly stopping, so that logical Cross regeneration resistance R and consume the regenerated electric power inputted to dc bus P, N from three phase alternating current motor M.Regeneration resistance R is at switch Q quilt Regenerated electric power is consumed during unlatching.

It addition, it is only an example that the circuit of the power inverter 1 of described above is constituted, it is also possible to be above-mentioned Circuit in addition is constituted.Such as, resistor is not limited to regenerate resistance R, it is also possible to be other the resistor such as dynamic brake.Separately Outward, the quantity of power module PM is not limited to eight, it is also possible to be other quantity.It addition, be not limited on a capacitor C in parallel company Connect the situation of two power module PM, it is also possible on a capacitor C connect a power module PM or be connected in parallel three with On power module PM.It addition, the quantity of capacitor C is not limited to four, it is also possible to be other quantity.Alternatively, it is also possible to substitute Capacitor C arranges reactor.

Here, above-mentioned multiple electronic unit all generates heat when energising.In multiple electronic units, capacitor C energising time Caloric value is the little caloric value that miscellaneous part does not produces effect, and power module PM, regeneration resistance R are in energising Time caloric value be to miscellaneous part produce effect big caloric value.That is, power module PM and regeneration resistance R is than electricity Container C caloric value is big.It addition, capacitor C be should suppress from miscellaneous part be heated, the electronic unit of poor heat resistance.

It addition, in power inverter 1, two radiator bases 501,521 (also referring to Fig. 2 described later etc.) are arranged opposite (being described in detail later).In power module PM1～PM8, power module PM1～PM4 being connected with capacitor C1～C4 respectively is arranged on On radiator base 501.It addition, be parallel-connected in capacitor C1～C4 with each in above-mentioned power module PM1～PM4 Power module PM5～PM8 on each is arranged on radiator base 521.Further, the total heating of power module PM1～PM4 Measure and regenerate the magnitude relationship of caloric value and the total caloric value of power module PM5～PM8 of resistance R and regenerate resistance R's The magnitude relationship of caloric value changes sometimes according to the working order etc. of power inverter 1 or three phase alternating current motor M1～M8. But, in the present embodiment, the caloric value total caloric value than power module PM1～PM4 or the power supply mould to regeneration resistance R The situation that the total caloric value of block PM5～PM8 is big illustrates.

It addition, there is deviation, power module between power module PM1～PM4 in the caloric value of power module PM1～PM4 Deviation is there is in the caloric value of PM5～PM8 between power module PM5～PM8.Caloric value between power module PM1～PM4 The magnitude relationship of the heat between magnitude relationship and power module PM5～PM8 is sometimes according to power inverter 1 or three-phase The working order of alternating current generator M1～M8 etc. and change.But, in the present embodiment, to power module PM1～PM4 it Between, quantitative change of generating heat by the order of power module PM1, power module PM2, power module PM3, power module PM4 is big and power supply mould Between block PM5～PM8, by power module PM5, power module PM6, power module PM7, the order caloric value of power module PM8 Become big situation to illustrate.

It addition, the magnitude relationship of the caloric value between multiple electronic units as described above is only example, also It can be magnitude relationship other than the above.

Then, with reference to Fig. 2, Fig. 3 and Fig. 4, an example of the structure of power inverter 1 is illustrated.It addition, In Fig. 2, eliminate the upper plate portion of the framework of power inverter 1 and the diagram of front panel portion, in figure 3, eliminate upper plate portion Diagram, in the diagram, eliminate the diagram of front panel portion.It addition, in Fig. 2～Fig. 4, suitably eliminate power inverter 1 The diagram of the composition beyond major part.

As shown in Figure 2 to 4, power inverter 1 has the framework 2 of the approximately parallelepiped body shape constituting its profile, with frame The plate portion 21 of body 2 becomes upside, plate portion 22 becomes downside, plate portion 23 becomes front side, plate portion 24 becomes rear side, plate portion 25 becomes left Side, plate portion 26 become the mode on right side and arrange.Hereinafter, sometimes the plate portion 21 of the upside of framework 2 is referred to as " upper plate portion 21 ", incites somebody to action The plate portion 22 of downside be referred to as " lower board unit 22 ", the plate portion 23 of front side is referred to as " front panel portion 23 ", the plate portion 24 of rear side is referred to as " after Plate portion 24 ", the plate portion 25 in left side is referred to as " left plate portion 25 ", the plate portion 26 on right side is referred to as " right panel portion 26 ".It addition, below, In power inverter 1, also left and right directions is referred to as " width ", above-below direction is referred to as " short transverse ", will front and back Direction is referred to as " depth direction ".

It addition, the shape of framework 2 is not limited to approximately parallelepiped body shape, it is also possible to be other shapes.It addition, power inverter 1 become upside towards the plate portion 21 being not limited to framework 2, after plate portion 22 becomes downside, plate portion 23 becomes front side, plate portion 24 becomes Side, plate portion 25 become left side, plate portion 26 become right side towards, it is also possible to be other towards.

Framework 2 accommodates 30, two second substrates of first substrate 32,34, include above-mentioned diode (led) module DM, capacitor C1～C4, power module PM1～PM8, regeneration resistance R and switch multiple electronic units of Q, three radiator 50,52,54 and Fan 60.It addition, be formed with the vent 4,6 (with reference to Fig. 3) of two in framework 2.

(example of 3-1. first substrate)

First substrate 30 is the single substrate being only configured with parts at one side.That is, the face of the side of first substrate 30 is to join Be equipped with part side 30a of parts, the face of opposite side be by welding solder face 30b.It addition, first substrate 30 has the longest Square shape, the size in its direction, plate face is roughly equal with the inside dimension in the direction, face of the short transverse being perpendicular to framework 2.And And, first substrate 30 is vertical with short transverse with its direction, plate face, part side 30a becomes upper surface, solder face 30b becomes following table The mode in face, the bottom in framework 2 is fixed in framework 2.

It addition, first substrate 30 towards being not limited to position, direction, plate face is vertical with short transverse, part side 30a becomes Upper surface, solder face 30b become lower surface towards and framework 2 in bottom, it is also possible to be other towards with other positions Put.It addition, the shape of first substrate 30 is not limited to generally rectangular shape, it is also possible to be other shapes.It addition, first substrate 30 situations being not limited to a substrate, it is also possible to be made up of multiple substrates.It addition, the size in the direction, plate face of first substrate 30 is not The situation that the inside dimension in direction, face of the short transverse being limited to and be perpendicular to framework 2 is roughly equal, it is also possible to less than this inside dimension. It addition, first substrate 30 is not limited to the situation of single substrate, it is also possible to be that to be configured with the double-sided substrate of parts, stacking on two-sided many The multilager base plate etc. of individual substrate.

(example of 3-2. second substrate)

Second substrate 32,34 erects part side 30a being arranged on first substrate 30.Specifically, second substrate 32,34 tool Having generally rectangular shape, the size of each long side direction is of substantially equal with the inside dimension of the depth direction of framework 2, each minor face side To size more smaller than the inside dimension of the short transverse of framework 2.Further, second substrate 32,34 with each long side direction along the degree of depth Direction, each short side direction is along short transverse and separates pre-fixed gap in the direction of the width and the mode left, at first substrate Parallel opposed configuration near the width central part of 30.That is, the second substrate 32 of second substrate 32,34 right surface 32a and The left surface 34a of second substrate 34 is the most arranged opposite.That is, right surface 32a and left surface 34a is equivalent to opposed faces An example, width is the opposed direction of opposed faces.It addition, below, also right surface 32a is referred to as " opposed faces 32a ", Left surface 34a is referred to as " opposed faces 34a ".

It addition, second substrate 32,34 be not limited to each long side direction along depth direction, each short side direction towards with position Along short transverse towards and, position near the width central part of first substrate 30, it is also possible to be other towards With other positions.It addition, second substrate 32,34 may not be and parallel erects setting.It addition, the shape of second substrate 32,34 It is not limited to the most generally rectangular shape, it is also possible to be other shapes.It addition, the chi of the long side direction of second substrate 32,34 Very little it is not limited to the situation roughly equal with the inside dimension of the depth direction of framework 2, it is also possible to less than this inside dimension.It addition, second The size of the short side direction of substrate 32,34 is not limited to the situation more smaller than the inside dimension of the short transverse of framework 2, it is also possible to this Inside dimension is roughly equal.It addition, second substrate 32,34 is not limited to erect the situation of part side 30a being arranged on first substrate 30, The solder face 30b being arranged on first substrate 30 can also be erected.It addition, the quantity of second substrate is not limited to two, it is also possible to be More than three.Alternatively, it is also possible to substitute second substrate 32,34 one or both, arrange constitute wind-tunnel component (wind deflector or Dividing plate etc.).

(3-3. vent, the example of fan)

Vent 4, in the way of being arranged in the direction of the width between second substrate 32,34, is formed at the width of front panel portion 23 Near the central part of degree direction.Vent 6 is in the way of being arranged in the direction of the width between second substrate 32,34, after being formed at Near the width central part in plate portion 24.That is, vent 4,6 is arranged opposite at depth direction.

It addition, vent 4,6 is not limited to each vent all configures the situation between second substrate 32,34, Ke Yishi A part for each vent is arranged between substrate 32,34.It addition, the position of the vent 4 in front panel portion 23 is not limited to width Near the central part of degree direction, it is also possible to be other positions.It addition, multiple vent can also be formed on front panel portion 23.After it addition, The position of the vent 6 in plate portion 24 is not limited near width central part, it is also possible to be other positions.It addition, back plate portion Multiple vent can also be formed on 24.It addition, substitute front panel portion 23 and at least one in back plate portion 24 or except front panel portion 23 Outside at least one in back plate portion 24, vent can be formed in other plate portions of framework 2.

Fan 60 is arranged in the inner side of the vent 6 between second substrate 32,34, to comprising for cooling down above-mentioned power supply mould Wind-tunnel 70 (the will be described below in detail) air-supply of the cooling flowing path 75 of block PM1～PM8, capacitor C1～C4 and regeneration resistance R.Wind-tunnel 70 and the cooling flowing path 75 of inside be formed as extending (will be described below in detail) to depth direction.Cooling flowing path 75 so is prolonged Stretch direction, i.e. depth direction and be referred to as " path direction ".In the following, for convenience of description, sometimes path direction is called out work deep Degree direction etc..

Specifically, fan 60 is scavenger fan, using vent 4 as air entry, vent 6 as air vent, and will be from Vent 4 sucks the air of wind-tunnel 70 interior (in framework 2) and discharges to (framework 2 is outer) wind-tunnel 70 from vent 6.Therefore, wind is worked as Fan 60 is when wind-tunnel 70 is blown, and in wind-tunnel 70, air mainly flows to vent 6 from vent 4.By such fan 60 at wind In hole 70 as primary air flow direction, from vent 4 to the direction of vent 6, i.e. as one of depth direction Direction, direction from front to back be referred to as " direction of ventilation ".It addition, be referred to as " ventilating by vent 4 side of wind-tunnel 70, i.e. front side Direction upstream side ", vent 6 side of wind-tunnel 70, i.e. rear side are referred to as " direction of ventilation downstream ".In the following, in order to just In explanation, sometimes direction of ventilation is called out and make depth direction etc..

Additionally, fan 60 is not limited to scavenger fan, it is also possible to be drawing fan.It addition, fan 60 is not limited to be arranged at logical The situation of the inner side in air port 6, it is also possible to be arranged at the inner side of vent 4.It addition, fan 60 is not limited to be arranged at vent 6 The situation of inner side, it is also possible to be arranged at the outside of vent 4.It addition, the quantity being arranged on the fan of vent is not limited to one, May also be two or more.It addition, such as use fan can not be being carried out because of the biggest grade of the caloric value of electronic unit In the case of forcing cooling, it is also possible to be not provided with fan.It addition, direction of ventilation or path direction are not limited to depth direction, it is possible to With according to second substrate 32,34 etc. towards and change.

(3-4. radiator, the example of wind-tunnel)

Radiator 50,52 is the radiator cooling down above-mentioned power module PM1～PM8, opposed along second substrate 32,34 Face 32a, 34a and configure.Specifically, radiator 50 configures along opposed faces 32a of second substrate 32, and has and be provided with State radiator base 501 and multiple fin 502 of power module PM1～PM4.It addition, radiator 52 is along second substrate 34 The configuration of opposed faces 34a, and have and be provided with the radiator base 521 of above-mentioned power module PM5～PM8 and multiple fin 522。

Radiator base 501 has generally rectangular shape, deep than second substrate 32,34 of the size of its long side direction The size in degree direction is little, and the size of its short side direction is more bigger than the half of the size of the short transverse of second substrate 32,34.And And, radiator base 501 by its long side direction along depth direction and its short side direction along in the way of short transverse, along Opposed faces 32a of second substrate 32 configures abreast with second substrate 32,34, and via being such as arranged in the pad of its surrounding SP1 is fixed on second substrate 32.It addition, radiator base 521 includes the shape equal with above-mentioned radiator base 501 and chi Very little.Further, radiator base 521 by its long side direction along depth direction and its short side direction along in the way of short transverse, Opposed faces 34a along second substrate 34 configures abreast with second substrate 32,34, and via being such as arranged in the pad of its surrounding Sheet SP2 is fixed on second substrate 34.

Specifically, upper with the most each upper end position and second substrate 32,34 of radiator base 501,521 The basically identical mode of end position configures.Therefore, high than second substrate 32,34 of the lower end position of radiator base 501,521 Degree direction central part is the most on the lower.That is, radiator base 501,521 is between second substrate 32,34, at second substrate 32,34 Upper end side the most arranged opposite.Now, in the configuration space S1 of radiator base 501,521 and said fans 60 The diameter of air supplying part 60a being such as made up of impeller etc. roughly equal.Specifically, configuration space S1 is radiator base The left surface 501a of 501 and the configuration space of the right surface 521a of radiator base 521.It addition, left surface 501a is radiator The face of the side the most opposed with radiator base 521 in pedestal 501, right surface 521a be in radiator base 521 with dissipate The face of the side that hot device pedestal 501 is the most opposed.

Alternatively, it is also possible to the configuration space on the right surface of radiator base 501 and the left surface of radiator base 521 is set Configuration space S1 for radiator base 501,521.It addition, the configuration space S1 of radiator base 501,521 is not limited to and wind The situation that the diameter of air supplying part 60a of fan 60 is roughly equal, it is also possible to more than or less than this diameter.It addition, radiator base 501, the lower end position of 521 is not limited to the short transverse central part situation the most on the lower than second substrate 32,34, it is also possible to Near the bottom of second substrate 32,34.It addition, radiator base 501,521 is not limited to be fixed on second substrate 32,34 Situation, it is also possible to be fixed on other components.For example, it is also possible to be: radiator base 501,521 is fixed on first substrate 30 On, these radiator bases 501,521 are fixed with second substrate 32,34.It addition, radiator base 501,521 can not Certain and second substrate 32,34 configured in parallel.It addition, the shape and size of radiator base 501,521 are not limited to above-mentioned shape And size, it is also possible to it is other shape and size.

Multiple fin 502 from the upper end of radiator base 501 to than its short transverse central part the most on the lower In the range of, from radiator base 501 along width, highlight the most to the right.Multiple fin 522 are from radiator base The upper end of 521 to than its short transverse central part the most on the lower in the range of, from radiator base 521 along width, Highlight the most to the left.That is, fin 502,522 is prominent to direction close to each other from radiator base 501,521.Concrete and Speech, fin 502,522 is prominent in the way of vacating predetermined gap each other.

It addition, the projected direction of fin 502,522 is not limited to above-mentioned direction, it is also possible to be other directions.It addition, heat radiation The scope of the fin 502,522 of device pedestal 501,521 is not limited to above-mentioned scope, it is also possible to be other scopes.

On the other hand, radiator 54 is the radiator cooling down above-mentioned regeneration resistance R.Radiator 54 is arranged in second substrate 32, the top of upper end 32b, 34b of 34, has and arranges the radiator base 541 of above-mentioned regeneration resistance R and multiple fin 542.It addition, upper end 32b, 34b are the top ends erected in setting direction, i.e. short transverse of second substrate 32,34.

Radiator base 541 has generally rectangular shape, and the size of its long side direction is than above-mentioned radiator base 501, the undersized of the depth direction of 521, the size of its short side direction is more bigger than the configuration space of second substrate 32,34.And And, radiator base 541 by its long side direction along depth direction, its short side direction along in the way of width, second Upper end 32b, 34b of substrate 32,34 configure abreast with first substrate 30, and are fixed on via support member (not shown) Plate portion 24.

That is, radiator base 541 is the most arranged opposite with first substrate 30.Now, radiator base 541 is joined Putting the upper end position of air supplying part 60a in said fans 60, above-mentioned first substrate 30 is arranged in the lower end position than air supplying part 60a Position on the lower.Therefore, the configuration space of first substrate 30 and radiator base 541 is more than the air supplying part of said fans 60 The diameter of 60a.

It addition, the configuration space of first substrate 30 and radiator base 541 be not limited to than air supplying part 60a of fan 60 straight The situation that footpath is big, it is also possible to roughly equal with this diameter, it is also possible to less than this diameter.It addition, radiator base 541 is not limited to solid It is scheduled on the situation in upper plate portion 24, it is also possible to be fixed on other components.It addition, radiator base 541 can be not necessarily with One substrate 30 configured in parallel.It addition, the shape and size of radiator base 541 are not limited to above-mentioned shape and size, it is also possible to be Other shape and size.

Multiple fin 542 between above-mentioned fin 502,522, from radiator base 541 towards first substrate 30, i.e. Highlight downwards.Specifically, fin 542 is with the upper end from radiator base 541 prominent (extension) to capacitor C1～C4 Near portion, capacitor C1～C4 is to be arranged on first substrate 30 as described later in the way of first substrate 30 highlights upward Part side 30a.

It addition, fin 542 projects to the position of upper end near capacitor C1～C4, but can also project to The position of the upper end contact of capacitor C1～C4.It addition, fin 542 can not necessarily project to the upper of capacitor C1～C4 Near end.It addition, the projected direction of fin 542 is not limited to above-mentioned direction, it is also possible to be other directions.

Here, by the radiator 50 cooling down above-mentioned power module PM1～PM4, fin 502 is from radiator base 501 prominent prominent length are set to L1.It addition, by the radiator 52 cooling down above-mentioned power module PM4～PM8, fin 522 are set to L2 from the prominent prominent length of radiator base 521.It addition, by the radiator 54 cooling down above-mentioned regeneration resistance R , fin 542 be set to L3 from the prominent length that radiator base 541 is prominent.In this case, fin 502 is prominent Prominent length L2 of length L1 and fin 522 is equal.It addition, at prominent length L1, L2 and the fin of fin 502,522 In prominent length L3 of 542, the one that the caloric value of corresponding electronic unit is big is longer.That is, as it was previously stated, regenerate resistance R's Caloric value is more than total caloric value or the total caloric value of power module PM5～PM8 of power module PM1～PM4, therefore dispels the heat Prominent length L3 of sheet 542 is more longer than prominent length L1 of fin 502,522, L2.

It addition, prominent length L2 of prominent length L1 of fin 502, fin 522 and fin 542 is prominent The magnitude relationship of length L3 is not limited to the described above the magnitude relationship of such caloric value according to corresponding electronic unit, it is possible to To be other magnitude relationship (being such as all set to equal length etc.).It addition, prominent length L1 of fin 502 and fin Prominent length L2 of 522 is the most equal.It addition, fin 502 is mutual, fin 522 is mutual, fin 542 is mutual Between, prominent length can be equal.

Further, in the present embodiment, in framework 2, by first substrate 30 and second substrate 32,34 encirclement and first substrate Space 71 (space surrounded by the chain-dotted line in Fig. 4) between part side 30a and the radiator base 541 of 30 is formed as wind-tunnel 70.That is, first substrate 30, second substrate 32,34 and radiator base 541 (regeneration resistance R) is used to form wind-tunnel 70. Said fans 60 is blown to the space 71 formed as this wind-tunnel 70.

(3-5. electronic unit, the example of cooling flowing path)

Above-mentioned power module PM1～PM8 is arranged in opposed faces 32a of second substrate 32,34,34a, and is arranged on radiator On the respective left surface 501a and right surface 521a of pedestal 501,521.So, by the opposed faces at second substrate 32,34 32a, 34a upper configuration power module PM1～PM8, it is possible to power module PM1～PM8 is separated configuration from first substrate 30.This Time, it is also possible in radiator base 501,521, embed heat pipe.In the case of embedding heat pipe in radiator base 501,521, The temperature that can make radiator base 501,521 is the most close.It addition, as described above, power module PM1～PM8 is arranged At the respective left surface 501a and right surface 521a of radiator base 501,521, in other words, it may be said that be radiator 50,52 Join in the way of power module PM1～PM8 is clipped between radiator 50,52 and opposed faces 32a of second substrate 32,34,34a Put at opposed faces 32a of second substrate 32,34,34a.

Specifically, power module PM1～PM4 that be connected with above-mentioned capacitor C1～C4 respectively and respectively with above-mentioned electricity Container C1～C4 connect power module PM5～PM8 in opposed faces 32a, 34a of second substrate 32,34 in the direction of the width Arranged opposite.

More specifically, the bottom 32aa than opposed faces 32a that power module PM1～PM4 is in second substrate 32 more leans on The position of upper end 32ab and along first substrate 30 direction, plate face, be i.e. arranged side-by-side along depth direction and be arranged on The left surface 501a of radiator base 501.Further, power module PM1～the PM4 terminal t quilt by respective such as pin shape It is arranged on second substrate 32 mechanical with second substrate 32 and electrically connects (with reference to Fig. 4).It addition, power module PM5～PM8 exists The position of the bottom 34aa more top end 34ab than opposed faces 34a in second substrate 34 and along first substrate 30 Direction, plate face, be i.e. arranged side-by-side and be arranged on the right surface 521a of radiator base 521 along depth direction.Further, power supply Module PM5～PM8 are installed on second substrate 34 and second substrate 34 machinery by the terminal t of respective such as pin shape And electrical connection (with reference to Fig. 4).It addition, bottom 32aa is the end of first substrate 30 side in opposed faces 32a, upper end 32ab It it is the end with 32aa opposition side, bottom in opposed faces 32a.It addition, bottom 34aa is the first base in opposed faces 34a The end of plate 30 side, upper end 34ab is the end with 34aa opposition side, bottom in opposed faces 34a.

Now, power module PM1～PM4 from direction of ventilation upstream side towards downstream, according to the big order of caloric value, i.e. It is arranged side-by-side with power module PM1, power module PM2, power module PM3, the order of power module PM4.Now, power module PM5～PM8 from direction of ventilation upstream side towards downstream, according to the big order of caloric value, i.e. with power module PM5, power supply mould Block PM6, power module PM7, the order of power module PM8 are arranged side-by-side.The power module PM1 that i.e., is connected with capacitor C1, PM5 is arranged opposite and electric at width at width power module PM2, PM6 being connected with capacitor C2 arranged opposite Power module PM3, PM7 that container C3 connects are at width power module PM4, PM8 being connected with capacitor C4 arranged opposite Arranged opposite at width.

It addition, the configuration of power module PM1～PM8 is not limited to above-mentioned configuration, it is also possible to be other configurations.Such as, power supply Module PM1～PM4 can from direction of ventilation upstream side towards downstream, by caloric value big and little alternately in the way of, such as with electricity Source module PM1, power module PM3, power module PM2, the order of power module PM4 are arranged side-by-side.For power module PM5～ PM8 is also same, from direction of ventilation upstream side towards downstream, by caloric value big and little alternately in the way of, such as with power supply mould Block PM5, power module PM7, power module PM6, the order of power module PM8 are arranged side-by-side.It addition, power module PM1～PM8 It is not limited to the end 32ab more top than bottom 32aa, 34aa being arranged in opposed faces 32a, 34a, the situation of 34ab, it is possible to With the short transverse central part being arranged in opposed faces 32a, 34a or than upper end 32ab, 34ab end 32aa more on the lower, 34aa.It addition, power module PM1～PM8 is not necessarily intended to be arranged side-by-side along depth direction.It addition, power module PM can not Be arranged in opposed faces 32a, 34a each on, it is also possible to be arranged in opposed faces 32a, 34a on any one.

It addition, above-mentioned capacitor C1～C4 is between second substrate 32,34, it is arranged in than above-mentioned power module PM1～PM8 Closer to the position of first substrate 30, specifically it is arranged in part side 30a of first substrate 30.It addition, as it has been described above, electric capacity Device C1～C4 is arranged between second substrate 32,34, in other words, it may be said that be that second substrate 32,34 is with by capacitor C1～C4 The mode being clipped in the middle erects part side 30a being arranged on first substrate 30.It addition, as it has been described above, capacitor C1～C4 configuration For than power module PM1～PM8 closer to the position of first substrate 30, in other words, it may be said that be that power module PM1～PM8 joins Put than capacitor C1～C4 more by above-mentioned regeneration resistance R side, i.e. be arranged in upside.

Specifically, capacitor C1～C4 such as has the shape of substantial cylindrical, between radiator base 501,521 And the fin 502,522 put than lowermost position position on the lower, with from first substrate 30 towards radiator 54, i.e. towards upper The mode that side highlights is arranged on part side 30a of first substrate 30.Therefore, the width both ends configuration of capacitor C1～C4 Between each fin 502,522 and the first substrate 30 of radiator 50,52, other of capacitor C1～C4 are partly arranged at scattered Between fin 542 and the first substrate 30 of hot device 54.

More specifically, capacitor C1～C4 is arranged side-by-side along depth direction in part side 30a of first substrate 30. More specifically, capacitor C1～C4 configures two power supplys the most arranged opposite, that be connected on this capacitor C Between module PM.That is, capacitor C1 is arranged between power module PM1, PM5.It addition, capacitor C2 is arranged in power module Between PM2, PM6.It addition, capacitor C3 is arranged between power module PM3, PM7.It addition, capacitor C4 is arranged in power supply mould Between block PM4, PM8.It addition, as it has been described above, capacitor C1～C4 is arranged between arranged opposite two power module PM, change Yan Zhi, it may be said that be that power module PM1～PM8 and capacitor C1～C4 is arranged in the position of correspondence in the depth direction, i.e. joins Put at least some of position repeated.

It addition, the configuration of capacitor C1～C4 is not limited to above-mentioned configuration, it is also possible to be other configurations.Such as, capacitor C1 ～C4 is not limited to configure the feelings between the most arranged opposite two the power module PM being connected with this capacitor C Condition, it is also possible to be arranged between two the power module PM not being connected with this capacitor C, or do not configure the most opposed Between two power module PM of configuration.It addition, capacitor C1～C4 can not necessarily be arranged side-by-side along depth direction.Separately Outward, capacitor C1～C4 can be by not necessarily to be arranged on first substrate 30 in the way of first substrate 30 is prominent towards radiator 54 Part side 30a.It addition, capacitor C1～C4 can be not necessarily positioned to part side 30a of first substrate 30.It addition, electric capacity Device C1～C4 is not limited to be arranged in than the power module PM1～the PM8 situation near the position of first substrate 30, it is also possible to be arranged in Distance to first substrate 30 and the equidistant position to power module PM1～PM8 or be configured to compare power module PM1～PM8 is away from the position of first substrate 30.It addition, capacitor C1～C4 can be not necessarily disposed in second substrate 32,34 it Between.

It addition, above-mentioned regeneration resistance R in the way of its main heat delivery surface Ra is opposed with part side 30a of first substrate 30, The mode that i.e. its main heat delivery surface Ra becomes lower surface configures the position leaving first substrate 30 in the height direction, concrete and Speech, 32b, 34b side, respective upper end being arranged in second substrate 32,34, and it is set to heat delivery surface Ra and radiator base The upper surface 541a contact of 541.It addition, heat delivery surface Ra be regeneration resistance R heating mainly by the face of heat release, be should be with heat radiation The face of device pedestal 541 contact.It addition, upper surface 541a is the face with first substrate 30 opposition side in radiator base 541.Separately Outward, as it has been described above, regeneration resistance R is arranged in the upper surface 541a of radiator base 541, in other words, it may be said that be, radiator 54 It is arranged between first substrate 30 and regeneration resistance R.

It addition, the configuration of regeneration resistance R is not limited to above-mentioned configuration, it is also possible to be other configurations.Such as, regeneration resistance R can To be not necessarily disposed in respective upper end 32b, 34b of second substrate 32,34.

Further, in the present embodiment, the encirclement in framework 2 is configured with the space 76 of fin 502,522,542 (in Fig. 4 The space surrounded by double dot dash line), the upper end of radiator base 501,521,541 and capacitor C1～C4 formed above-mentioned Cooling flowing path 75.That is, the upper end of each radiator base 501,521,541 and each capacitor C1～C4 forms cooling flowing path 75 A part.Alternatively, it is also possible to by between the fin 502 of radiator 50, between the fin 522 of radiator 52 and dissipate Each space between the fin 542 of hot device 54 is referred to as cooling flowing path.

It addition, in present embodiment, power module PM1～PM8 is equivalent to the first electronic unit and constitutes electric power conversion Circuit and when energising one example of electronic unit of heating, capacitor C1～C4 is equivalent to an example of the second electronic unit Son, regeneration resistance R is equivalent to an example of the 3rd electronic unit.It addition, first substrate 30 is equivalent to an example of substrate. Second substrate 32,34 is equivalent to separate electronic unit from substrate the unit of configuration.

It addition, in present embodiment, radiator 50,52 is equivalent to an example of the first radiator.Therefore, radiator base Seat 501,521 is equivalent to an example of the first radiator base, and fin 502,522 is equivalent to an example of the first fin Son.It addition, radiator 54 is equivalent to an example of the second radiator.Therefore, radiator base 541 is equivalent to the second radiator One example of pedestal, fin 542 is equivalent to an example of the second fin.

As described above, in the power inverter 1 of present embodiment, power conversion circuit 10 will be constituted also When energising first electronic unit (being eight power module PM1～PM8 in above-mentioned example) of heating, be arranged in erect and set Put and on opposed faces 32a of two second substrates 32,34 on first substrate 30 arranged opposite, 34a.Thus, due to can First substrate 30 and power module PM1～PM8 are separated, therefore, it is possible to reduce the heat shadow to the installing component etc. of first substrate 30 Ring.Further, since the heat-seal of power module PM1～PM8 can surrounded by first substrate 30 and second substrate 32,34 In space 71, therefore, it is possible to reduce the heat impact on being arranged on its outside electronic unit etc..As a result of which it is, can easily enter The design of row heat.

It addition, in the present embodiment, especially, power module PM1～PM8 is arranged side-by-side along depth direction On opposed faces 32a of two substrates 32,34,34a.Thus, such as with by power module PM1～PM8 on the 1st substrate 30 along it The situation that direction, plate face is arranged side-by-side is compared, it is possible to reduce the size in the direction, plate face of power inverter 1.Therefore, it is possible to In the case of not making power inverter 1 maximize in the direction of the width, increase the number of power module PM, it is possible to turned by electric power Changing device miniaturization in the direction of the width.It addition, be arranged side by side direction, i.e. depth direction to power module PM by being configured to Air-supply, it is possible to simultaneously and efficiently cool down power module PM1～PM8.

It addition, in present embodiment, especially, fan 60 send to the space 71 surrounded by the 1st substrate, the 2nd substrate 32,34 Wind.Thereby, it is possible to the space 71 by first substrate 30 and second substrate 32,34 encirclement as wind-tunnel, and cool down efficiently simultaneously Power module PM1～PM8, therefore, it is possible to improve cooling effectiveness.It addition, can be by power module PM1～PM8 centralized configuration cold But, therefore compared with the situation being distributed power module PM1～PM8, it is possible to reduce the number of units of fan 60.Further, since make Form wind-tunnel 70 with first substrate 30 and second substrate 32,34, therefore need not constitute wind-tunnel 70 component (wind deflector or point Dividing plate etc.).Therefore, it is possible to make power inverter 1 miniaturization, reduce cost.

It addition, in the present embodiment, especially, power module PM1～PM8 is arranged in second substrate 34,34 Than opposed faces 32a, the position of bottom 32aa, 34aa top end 32ab, 34ab of 34a.Thus, owing to being able to ensure that first Substrate 30 and the spacing distance of power module PM1～PM8, therefore, it is possible to improve the installing component etc. reducing heat to first substrate 30 The reliability of impact.It addition, it can be formed in the downside in the space 71 surrounded by first substrate 30 and second substrate 31,34 The installation space of his electronic unit (being capacitor C1～C4 in above-mentioned example).As a result of which it is, as it has been described above, by will be by The space 71 that first substrate 30 and second substrate 32,34 surround is as wind-tunnel 70, it is possible to cold together with power module PM1～PM8 But capacitor C1～C4, therefore, it is possible to effectively utilize the air-supply of fan 60.

It addition, in the present embodiment, especially, the second electronic unit by composition power conversion circuit 10 is (above-mentioned For capacitor C1～C4 in example) it is arranged in than power module PM1～PM8 closer to the first base between second substrate 32,34 The position of plate 30.Thus, configuration caloric value be the most not to miscellaneous part produce effect capacitor C1～C4 In the case of so that hot radical does not produces impact from capacitor C1～C4 to first substrate 30, it becomes possible to by first substrate 30 He Configuration power module PM1～PM8 and capacitor C1～C4 in the space 71 that second substrate 32,34 surrounds.It addition, should in configuration Suppress from miscellaneous part be heated, in the case of capacitor C1～C1 of poor heat resistance, by by first substrate 30 and the The space 71 that two substrates 32,34 surround is as wind-tunnel 70, it is possible to make heat retention in this space 71, therefore, it is possible to by power module PM1～PM8 and capacitor C1～C4 is arranged in close position.It addition, by will be by first substrate 30 and second substrate 32,34 The space 71 surrounded is as wind-tunnel 70, it is possible to by power module PM1～PM8 and capacitor C1～C4 centralized configuration in wind-tunnel 70 And and cool down efficiently, therefore, it is possible to improve cooling effectiveness simultaneously.

It addition, in the present embodiment, especially, power module PM1～PM8 is arranged in the right of second substrate 32,34 Put in each in face 32a, 34a, and capacitor C1～C4 is arranged between arranged opposite two power module PM.By This, it is possible to power module PM1～PM8 and capacitor C1～C4 is arranged in close position.As a result of which it is, by power module In the case of PM1～PM8 and capacitor C1～C4 connects with wiring, owing to the length of wiring can be shortened therefore, it is possible to improve electricity Gas characteristic.It addition, as in the present embodiment, each in connecting the power module PM of capacitor C1～C4 and its both sides In the case of, it is possible to make two length connected up impartial, therefore, it is possible to prevent the electrical characteristic imbalance of both sides.

It addition, in present embodiment, especially, by the radiator 50,52 of cooling power module PM1～PM8 with by power supply The mode that module PM1～PM8 are clipped in the middle of radiator 50,52 and opposed faces 32a of second substrate 32,34,34a is arranged in second On opposed faces 32a of substrate 32,34,34a.Thus, by the space 71 surrounded by first substrate 30 and second substrate 32,34 Air-supply, it is possible to efficiently cooling power module PM1～PM8.

It addition, in the present embodiment, especially, it is possible to obtain following effect.That is, in wind-tunnel 70, it is not provided with heat radiation The resistance in the region of device (fin) is less than the resistance in the region being provided with radiator, and therefore wind readily flows to this region.As Really wind increases, then cause cooling effectiveness to reduce.In the present embodiment, between radiator 50,52 and first substrate 30, i.e. exist The region being not provided with radiator in wind-tunnel 70 arranges capacitor C1～C4.Thereby, it is possible to cooling down the same of capacitor C1～C4 Time, it is possible to increase the resistance in this region, so that the wind being provided with the region of the fin 502,522 of radiator 50,52 increases, Can the most effectively utilize the cooling wind of fan 60.

It addition, in the present embodiment, especially, by radiator 50,52 with fin 502,522 from arranged opposite two Mode that individual radiator base 501,521 is prominent to the direction that fin 502,522 is close to each other and with by power module PM1 ～the mode that PM8 is clipped between radiator 50,52 and opposed faces 32a of second substrate 32,34,34a is arranged respectively at the second base On opposed faces 32a of plate 32,34,34a.Thereby, it is possible to by radiator 50,52 centralized configuration and cool down, therefore be distributed The situation of radiator is compared, it is possible to reduce the number of units of fan 60.Further, since can the fin 502 of radiator 50,52, Other electronic unit or radiators etc. are configured, therefore, it is possible to improve the design freedom of cooling structure between 522.

It addition, in the present embodiment, especially, radiator 50,52 is configured to joining of each radiator base 501,521 Put the equal diameters of interval S1 and fan 60.Thus, due to can be by fan 60 to being clipped by radiator base 501,521 Space 76 consentrated air supply, therefore, it is possible to improve cooling effectiveness further.

It addition, in the present embodiment, especially, by the 3rd electronic unit (in above-mentioned example of heating during energising Regeneration resistance R) radiator base 541 of radiator 54 that carries out cooling down is arranged in second substrate 32,34 along first substrate 30 Upper end 32b, 34b so that multiple second fin 542 fin 502,522 of each in radiator 50,52 it Between, prominent to first substrate 30 from radiator base 541.Thus, by by radiator base 501,521 and radiator base 541 cooling flowing paths 75 formed are blown, it is possible to cool down power module PM1～PM8 and regeneration resistance R, therefore simultaneously and efficiently Cooling effectiveness can be improved.It addition, fin 542 is arranged between the first fin 502,522, therefore, it is possible to reducing as far as possible Gap in cooling flowing path 75, it is possible to the most effectively utilize the air-supply of fan 60.

It addition, in the present embodiment, especially, at prominent length L3 of fin 542 and the radiator of radiator 54 50,52 prominent length L1 of fin 502,521, among L2 so that bigger that of the caloric value of corresponding electronic unit The prominent length of one is longer.So, according to the caloric value of corresponding electronic unit, by the fin of radiator 50,52,54 502, the length optimization of 522,542, it is possible to cool down each electronic unit efficiently.

It addition, in the present embodiment, especially, radiator base 501,521,541 and capacitor C1～C4 is formed and uses In cooling power module PM1～PM8, capacitor C1～C4, the cooling flowing path 75 of regeneration resistance R.Thus, it is not necessary to constitute cooling The component (wind deflector or demarcation strip etc.) of stream 75, it is possible to make power inverter 1 miniaturization, reduces cost.

<5. variation etc.>

It addition, embodiment is not limited to foregoing, can carry out without departing from the range of its purport and technological thought Various deformation.Hereinafter, such variation is illustrated successively.It addition, in following variation etc., main explanation and above-mentioned reality The part that mode of executing is different.It addition, there is the element being substantially the same with above-mentioned embodiment in principle with identical symbol Number represent, suitably omit the repeat specification about these elements.

It addition, in present embodiment, especially, the 3rd electronic unit is regeneration resistance R.As in the embodiment described in, exist In the case of power inverter 1 is motor control assembly, the heating quantitative change of regeneration resistance R is big.Therefore, by resistance will be regenerated R separates and arranged opposite with first substrate 30, it is possible to constitute the configuration of electronic unit according to optimizations such as caloric values, it is possible to Reduce heat to cool down efficiently while the impact of first substrate 30.

(5. variation)

(5-1. the 1st variation)

Hereinafter, with reference to Fig. 5, to part different from the embodiment described above in the structure at the power inverter of this variation Illustrate.

As it is shown in figure 5, in the power inverter 1A of this variation, multiple fin 542A of radiator 54A are in heat radiation Project to downward compare radiator base between the radiator base 501,521 of device 50A, 52A, from radiator base 541 501, the position on the downside of the upper end summary of 521.

It addition, multiple fin 502A of radiator 50A in the downside from the fin 542A of radiator 54A to than heat radiation The short transverse central part of device pedestal 501 the most on the lower in the range of, prominent towards right side from radiator base 501.It addition, dissipate Multiple fin 522A of hot device 52A in the downside from the fin 542A of radiator 54A to the height than radiator base 521 Central part scope the most on the lower in direction is prominent towards left side from radiator base 521.That is, fin 502A, 522A is from dissipating Hot device pedestal 501,521 is prominent to direction close to each other.Specifically, fin 502A, 522A be not the most substantially to have The mode having gap highlights.

Further, in this variation, the encirclement in framework 2 is configured with the space 76A (figure of fin 502A, 522A, 542A The space surrounded by double dot dash line in 5), the upper end of radiator base 501,521,541 and capacitor C1～C4 formed Above-mentioned cooling flowing path 75.

Other than the above being configured in the same manner as above-mentioned embodiment is constituted, and therefore omits the description.

It addition, in this variation, radiator 50A, 52A are equivalent to an example of the first radiator.Therefore, radiator base Seat 501,521 is equivalent to an example of the first radiator base, and fin 502A, 522A are equivalent to of the first fin Example.It addition, radiator 54A is equivalent to an example of the second radiator.Therefore, radiator base 541 be equivalent to second dissipate One example of hot device pedestal, fin 542A is equivalent to an example of the second fin.

The effect as above-mentioned embodiment it is obtained in that in this variation.

(5-2. the 2nd variation)

Hereinafter, with reference to Fig. 6, to part different from the embodiment described above in the structure at the power inverter of this variation Illustrate.

As shown in Figure 6, in the power inverter 1B of this variation, multiple fin 542B of radiator 54B are dissipating Project to downward compare radiator base between the radiator base 501,521 of hot device 50B, 52B, from radiator base 541 501, the position on the downside of the upper end summary of 521.

It addition, multiple fin 502B of radiator 50B in the downside from the fin 542B of radiator 54B to radiator In the range of the bottom of pedestal 501, prominent towards right side from radiator base 501.It addition, multiple heat radiations of radiator 52B Sheet 522B is in the range of the downside of the fin 542B of radiator 54B to the bottom of radiator base 521, from radiator Pedestal 521 is prominent towards left side.That is, fin 502B, 522B is prominent to direction close to each other from radiator base 501,521 Go out.Specifically, fin 502B, 522B is prominent in the way of the most very close to each other.

It addition, in this variation, substitute above-mentioned capacitor C1～C4, in the bottom of opposed faces 32a of second substrate 32 32aa side is configured with four capacitors being connected with above-mentioned power module PM1～PM4 respectively and (only illustrates in Fig. 6 and power supply mould The capacitor C1a that block PM1 connects).Specifically, four capacitor C1a etc. have a shape of such as substantial cylindrical, and with from The mode that second substrate 32 highlights to the right is arranged in opposed faces 32a of second substrate 32a, and along depth direction deploying Put.It addition, be configured with in the 34aa side, bottom of opposed faces 34a of second substrate 34 respectively with above-mentioned power module PM5～PM8 Four capacitors (only illustrating the capacitor C1b being connected with power module PM5 in Fig. 6) connected.Specifically, four electric capacity Device C1b etc. has the shape of such as substantial cylindrical, and is arranged on the second base from second substrate 34 in the way of highlighting to the left In opposed faces 34a of plate 34, and it is arranged side-by-side along depth direction.

It addition, between capacitor C1a the most arranged opposite etc. and capacitor C1b etc. and above-mentioned radiator The downside of fin 502B, 522B that the lowermost position in 50B, 52B is put is configured with pad SP3, and is arranged on first substrate 30 Part side 30a.

Further, in this variation, the encirclement in framework 2 is configured with the space 76B (figure of fin 502B, 522B, 542B The space surrounded by double dot dash line in 6), the upper end of radiator base 501,521,541 and pad SP3 formed for cold The most above-mentioned power module PM1～PM8 and the cooling flowing path 75B of regeneration resistance R.

It addition, in this variation, capacitor C1a etc. and capacitor C1b etc. is equivalent to an example of the second electronic unit Son.

It addition, in this variation, radiator 50B, 52B are equivalent to an example of the first radiator.Therefore, radiator base Seat 501,521 is equivalent to an example of the first radiator base, and fin 502B, 522B are equivalent to of the first fin Example.It addition, radiator 54B is equivalent to an example of the second radiator.Therefore, radiator base 541 be equivalent to second dissipate One example of hot device pedestal, fin 542B is equivalent to an example of the second fin.

(5-3. the 3rd variation)

Hereinafter, with reference to Fig. 7, to part different from the embodiment described above in the structure at the power inverter of this variation Illustrate.

As it is shown in fig. 7, in the power inverter 1C of this variation, multiple fin 542C of radiator 54C are rear Project to downward compare radiator base between the radiator base 501,521 of the radiator 56 stated, from radiator base 541 501, the position on the downside of the upper end summary of 521.

It addition, in this variation, substitute two radiators 50,52 and be provided with a radiator 56.Radiator 56 has Be arranged in opposed faces 32a of second substrate 32,34,34a each on above-mentioned radiator base 501,521 and multiple fin 562。

Multiple fin 562 in the downside of the top ends from the fin 542C of radiator 54C to than radiator base 501, the short transverse central part of 521 the most on the lower in the range of, along width in the way of striding across between radiator base 501,521 Direction highlights.

Further, in this variation, the encirclement in framework 2 is configured with fin 542C, the space 76C (in Fig. 7 of 562 The space surrounded by double dot dash line), the upper end of radiator base 501,521,541 and capacitor C1～C4 formed above-mentioned cold But stream 75.

It addition, in this variation, radiator 56 is equivalent to an example of the first radiator.Therefore, radiator base 501,521 example being equivalent to the first radiator base, fin 562 is equivalent to an example of the first fin.Separately Outward, radiator 54C is equivalent to an example of the second radiator.Therefore, radiator base 541 is equivalent to the second radiator base An example, fin 542C is equivalent to an example of the second fin.

(5-4. the 4th variation)

Hereinafter, with reference to Fig. 8, part different from the embodiment described above in the structure of the power inverter of this variation is entered Row explanation.

As shown in Figure 8, in the power inverter 1D of this variation, the newest in addition to three radiators 50,52,54 It is provided with radiator 58.It is provided with composition power conversion circuit 10 it addition, substitute above-mentioned capacitor C1～C4 and sends out when energising Four reactors (only illustrating a reactor LE1 in Fig. 8) of heat.

Radiator 58 is the radiator of cooling aforementioned four reactor LE1 etc..Radiator 58 is arranged in above-mentioned radiator base The bottom of seat 501,521, has radiator base 581 and the multiple fin 582 arranging above-mentioned reactor LE1 etc..

Radiator base 581 has generally rectangular shape, the size of its long side direction such as with above-mentioned radiator base The size of depth direction of seat 501,521 is roughly equal, and the size of its short side direction is such as and between the configuration of second substrate 32,34 Every roughly equal.Further, radiator base 581 with its long side direction along depth direction, its short side direction along width Mode, configure abreast with first substrate 30 in the bottom of radiator base 501,521, and be fixed on such as second substrate 32,34 opposed faces 32a, 34a.

Multiple fin 582 are between radiator base 501,521, from radiator base 581 projects to upward State near the top ends of fin 542.

Above-mentioned reactor LE1 etc. between second substrate 32,34, than above-mentioned power module PM1～PM8 closer to the first base Plate 30, specifically, is arranged in the lower surface of above-mentioned radiator base 581.Specifically, reactor LE1 etc. are with from radiator The mode that pedestal 581 highlights downward is arranged on the lower surface of radiator base 581, and is arranged side-by-side along depth direction. It addition, part side 30a of the bottom of reactor LE1 etc. and first substrate 30 separates.

Further, in this variation, the encirclement in framework 2 is configured with the space 76D of fin 502,522,542,582 The radiator base 501,521,541,581 in (space surrounded by double dot dash line in Fig. 8) is formed and is used for cooling down above-mentioned power supply Module PM1～PM8, reactor E1 and the cooling flowing path 75D of regeneration resistance R.

It addition, in this variation, reactor LE1 etc. is equivalent to an example of the second electronic unit.

(5-5. the 5th variation)

Hereinafter, with reference to Fig. 9, part different from the embodiment described above in the structure of the power inverter of this variation is entered Row explanation.

As it is shown in figure 9, in the power inverter 1E of this variation, at upper end 32b, 34b of second substrate 32,34 Top be configured without above-mentioned regeneration resistance R and radiator 54.

Multiple fin 502E of radiator 50E from the upper end of radiator base 501 to than its short transverse central authorities Portion the most on the lower in the range of, prominent towards right side from radiator base 501.It addition, multiple fin 522E of radiator 52E From the upper end of radiator base 521 to than its short transverse central part the most on the lower in the range of, from radiator base 521 Prominent towards left side.That is, fin 502E, 522E is prominent to direction close to each other from radiator base 501,521.Concrete and Speech, fin 502E, 522E are prominent in the way of the most very close to each other.

Further, in this variation, in framework 2, that surrounded by first substrate 30 and second substrate 32,34, be positioned at the The component (not shown) of part side 30a of one substrate 30 and the top of upper end 32b, the 34b being arranged in second substrate 32,34 it Between space 71E (space surrounded by single dotted broken line in Fig. 9) form wind-tunnel 70E.

It addition, in framework 2, surround be configured with fin 502E, 522E space 76E (in Fig. 9 by double dot dash line bag The space enclosed), radiator base 501,521, be arranged in the top of upper end 32b, 34b of second substrate 32,34 component, The cooling stream for cooling down above-mentioned power module PM1～PM8 and capacitor C1～C4 is formed with the upper end of capacitor C1～C4 Road 75E.

It addition, in this variation, radiator 50E, 52E are equivalent to an example of the first radiator.Therefore, radiator base Seat 501,521 is equivalent to an example of the first radiator base, and fin 502E, 522E are equivalent to of the first fin Example.

(5-6. the 6th variation)

Hereinafter, with reference to Figure 10, to part different from the embodiment described above in the structure of the power inverter of this variation Illustrate.

As shown in Figure 10, in the power inverter 1F of this variation, at upper end 32b, 34b of second substrate 32,34 Top be configured without above-mentioned regeneration resistance R and radiator 54.

In each radiator base 501F, 521F of radiator 50F, 52F, respective short transverse size and second substrate 32, the short transverse size of 34 is roughly equal, and respective lower end position is substantially uniform with the lower end position of second substrate 32,34.

Multiple fin 502F of radiator 50F are in the scope from the upper end of radiator base 501F to its bottom In, prominent towards right side from radiator base 501F.It addition, multiple fin 522F of radiator 52F are from radiator base The upper end of 521F is in the range of its bottom, prominent towards left side from radiator base 521F.I.e., fin 502F, 522F is prominent to direction close to each other from radiator base 501F, 521F.Specifically, fin 502F, 522F is with mutually Between mode the most very close to each other highlight.

It addition, in this variation, substitute above-mentioned capacitor C1～C4, join in the side, bottom of the left surface of second substrate 32 It is equipped with four capacitors being connected respectively with above-mentioned power module PM1～PM4 (Figure 10 only to illustrate with power module PM1 even The capacitor C1c connect).Specifically, four capacitor C1c etc. have the shape of such as substantial cylindrical, and with from the second base The mode that plate 32 highlights to the left is arranged on the left surface of second substrate 32, and is arranged side-by-side along depth direction.It addition, The side, bottom on the right surface of two substrates 34 is configured with four capacitors (figure being connected respectively with above-mentioned power module PM5～PM8 The capacitor C1d being connected with power module PM5 is only illustrated) in 10.Specifically, four capacitor C1d etc. have the biggest The shape that cause is cylindrical, and in the way of highlighting to the right, it is arranged on the right surface of second substrate 34, and edge from second substrate 34 Depth direction to be arranged side-by-side.

Further, in this variation, in framework 2, that surrounded by first substrate 30 and second substrate 32,34, be positioned at the The component (not shown) of part side 30a of one substrate 30 and the top of upper end 32b, the 34b being arranged in second substrate 32,34 it Between space 71F (space surrounded by single dotted broken line in Figure 10) form wind-tunnel 70F.

It addition, in framework 2, surround be configured with fin 502F, 522F space 76F (in Figure 10 by double dot dash line The space surrounded), radiator base 501F, 521F, be arranged in the top of upper end 32b, 34b of second substrate 32,34 Part side a of component and first substrate 30 forms the cooling flowing path 75F for cooling down above-mentioned power module PM1～PM8.

It addition, in this variation, capacitor C1c etc. and capacitor C1d etc. is equivalent to an example of the second electronic unit Son.

It addition, in this variation, radiator 50F, 52F are equivalent to an example of the first radiator.Therefore, radiator base Seat 501F, 521F are equivalent to an example of the first radiator base, and fin 502F, 522F are equivalent to the one of the first fin Individual example.

(5-7. the 7th variation)

Hereinafter, with reference to Figure 11, to part different from the embodiment described above in the structure of the power inverter of this variation Illustrate.

As shown in figure 11, in the power inverter 1G of this variation, at each radiator base of radiator 50G, 52G In 501G, 521G, respective short transverse size is roughly equal with the short transverse size of second substrate 32,34, respective under End position is substantially uniform with the lower end position of second substrate 32,34.

Multiple fin 502G of radiator 50G are in the scope from the upper end of radiator base 501G to its bottom In, prominent towards right side from radiator base 501G.It addition, multiple fin 522G of radiator 52G are from radiator base The upper end of 521G is in the range of its bottom, prominent towards left side from radiator base 521G.I.e., fin 502G, 522G is prominent to direction close to each other from radiator base 501G, 521G.Specifically, 502G, 522G are with empty each other The mode going out predetermined gap highlights.

Multiple fin 542G of radiator 54G are above-mentioned between fin 502G, 522G, from radiator base 541 court Highlight downwards.Specifically, fin 542G is near the upper end that radiator base 541 projects to capacitor C1～C4.

It addition, in this variation, capacitor C1～C4 is above-mentioned between fin 502G, 522G and than above-mentioned heat radiation The top ends of sheet 542G position on the lower, is arranged on first substrate 30 from first substrate 30 in the way of highlighting upward In part side 30a.

Further, in this variation, in framework 2, encirclement is configured with the space 76G of fin 502G, 522G, 542G (space surrounded by double dot dash line in Figure 11), radiator base 501G, 521G, 541, the upper end of capacitor C1～C4 Formed with part side 30a of left and right sides, first substrate 30 be used for cooling down above-mentioned power module PM1～PM8, capacitor C1～ C4 and the cooling flowing path 75G of regeneration resistance R.

It addition, in this variation, radiator 50G, 52G are equivalent to an example of the first radiator.Therefore, radiator Pedestal 501G, 521G are equivalent to an example of the first radiator base, and fin 502G, 522G are equivalent to the first fin One example.It addition, radiator 54G is equivalent to an example of the second radiator.Therefore, radiator base 541 is equivalent to One example of second radiator pedestal, fin 542G is equivalent to an example of the second fin.

(5-8. the 8th variation)

Hereinafter, with reference to Figure 12, to part different from the embodiment described above in the structure of the power inverter of this variation Illustrate.

As shown in figure 12, in the power inverter 1H of this variation, opposed faces 32a of second substrate 32,34,34a On be configured without above-mentioned power module PM1～PM8 and radiator 50,52.It addition, at the radiator base 541 of radiator 54H Upper surface 541a does not configure above-mentioned regeneration resistance R, and configures power module PM1～PM8.

In this variation, the configuration space of second substrate 32,34 is less than above-mentioned embodiment.Such as, second substrate 32, The configuration space of 34 is of substantially equal with the diameter of air supplying part 60a of said fans 60.

It addition, in this variation, radiator 54H is the radiator cooling down above-mentioned power module PM1～PM8.Radiator Multiple fin 542H of 54H are between second substrate 32,34, project to downward capacitor C1 from radiator base 541 ～near the upper end of C4.

Power module PM1～PM8 is arranged on the upper surface 541a of radiator base 541.Specifically, power module PM1 ～PM4 and power module PM5～PM8 is on the upper surface 541a of radiator base 541, the most arranged opposite.More Specifically, power module PM1～PM4 is arranged side-by-side along depth direction, and is arranged on the upper surface of radiator base 541 Left side on 541a.It addition, power module PM5～PM8 is arranged side-by-side along depth direction, and it is arranged on radiator base 541 Upper surface 541a on right side.

It addition, in this variation, capacitor C1～C4 is between opposed faces 32a, 34a of second substrate 32,34 and compares The top ends of above-mentioned fin 542H position on the lower, is arranged on first in the way of highlighting upward from first substrate 30 Part side 30a of substrate 30.

Further, in this variation, in framework 2, by first substrate 30 and second substrate 32,34 encirclement and the first base Space 71H (space surrounded by the chain-dotted line in Figure 12) between part side 30a and the radiator base 541 of plate 30 is formed as Wind-tunnel 70H.

It addition, in framework 2, surround space 76H (being surrounded by double dot dash line in Figure 12 being configured with fin 542H Space), the upper end of opposed faces 32a of second substrate 32,34,34a, radiator base 541, capacitor C1～C4 forms and uses Cooling flowing path 75H in cooling above-mentioned power module PM1～PM8 and capacitor C1～C4.

It addition, in this variation, radiator 54H is equivalent to an example of the first radiator.Therefore, radiator base 541 examples being equivalent to the first radiator base, fin 542H is equivalent to an example of the first fin.

(5-9. the 9th variation)

Hereinafter, with reference to Figure 13, to part different from the embodiment described above in the structure of the power inverter of this variation Illustrate.

As shown in figure 13, in the power inverter 1I of this variation, opposed faces 32a of second substrate 32,34,34a On be configured without above-mentioned power module PM1～PM8 and radiator 50,52.It addition, at the radiator base 541 of radiator 54I Upper surface 541a does not configure above-mentioned regeneration resistance R, and configures power module PM1～PM8.

It addition, in this variation, radiator 54I is the radiator cooling down above-mentioned power module PM1～PM8.Radiator Multiple fin 542I of 54I are between second substrate 32,34, project to downward first substrate from radiator base 541 Near part side 30a of 30.

It addition, in this variation, substitute above-mentioned capacitor C1～C4, join in the side, bottom of the left surface of second substrate 32 It is equipped with four capacitors being connected respectively with above-mentioned power module PM1～PM4 (Figure 13 only to illustrate with power module PM1 even The capacitor C1e connect).Specifically, four capacitor C1e etc. have the shape of such as substantial cylindrical, and with from the second base The mode that plate 32 highlights to the left is arranged on the left surface of second substrate 32, and is arranged side-by-side along depth direction.It addition, The side, bottom on the right surface of two substrates 34 is configured with four capacitors (figure being connected respectively with above-mentioned power module PM5～PM8 The capacitor C1f being connected with power module PM5 is only illustrated) in 13.Specifically, four capacitor C1f etc. have the biggest The shape that cause is cylindrical, and in the way of highlighting to the right, it is arranged on the right surface of second substrate 34, and edge from second substrate 34 Depth direction to be arranged side-by-side.

Further, in this variation, in framework 2, surrounded by first substrate 30 and second substrate 32,34 and be positioned at the Space 71I (space surrounded by the chain-dotted line in Figure 13) shape between part side 30a and the radiator base 541 of one substrate 30 Become wind-tunnel 70I.

It addition, surround be configured with fin 542I above-mentioned space 71I, opposed faces 32a of second substrate 32,34, Part side 30a of 34a, radiator base 541 and first substrate 30 is formed for cooling down the cold of above-mentioned power module PM1～PM8 But stream 75I.

It addition, in this variation, radiator 54I is equivalent to an example of the first radiator.Therefore, radiator base 541 examples being equivalent to the first radiator base, fin 542I is equivalent to an example of the first fin.

(5-10. the 10th variation)

Hereinafter, with reference to Figure 14, to part different from the embodiment described above in the structure of the power inverter of this variation Illustrate.

As shown in figure 14, in the power inverter 1J of this variation, opposed faces 34a of second substrate 34 does not has Configure above-mentioned power module PM5～PM8 and radiator 52.That is, in this variation, each capacitor C1～C4 only connects and has Each power module PM1～PM4.

In this variation, second substrate 34 is arranged in than above-mentioned embodiment in part side 30a of first substrate 30 Keep left the position of side, and the configuration space of second substrate 32,34 is less than above-mentioned embodiment.

Multiple fin 542J of radiator 54J are between the fin 502 and second substrate 34 of radiator 50, from heat radiation Device pedestal 541 projects to downward near the upper end of capacitor C1～C4.

Further, in this variation, in framework 2, surrounded by first substrate 30 and second substrate 32,34 and be positioned at first Space 71I (space surrounded by the chain-dotted line in Figure 14) between part side 30a and the radiator base 541 of substrate 30 is formed For wind-tunnel 70J.

It addition, surround the space 76J (space surrounded by double dot dash line in Figure 14) being configured with fin 502,542J , radiator base 501,541, part side 30a of opposed faces 34a of second substrate 34 and first substrate 30 formed for cold The most above-mentioned power module PM1～PM4, capacitor C1～C4 and the cooling flowing path 75J of regeneration resistance R.

It addition, in this variation, radiator 54J is equivalent to an example of the second radiator.Therefore, radiator base 541 examples being equivalent to the second radiator base, fin 542J is equivalent to an example of the second fin.

(5-11. the 11st variation)

Hereinafter, with reference to Figure 15, different for above-mentioned embodiment in the structure of the power inverter of this variation Aspect illustrates.

As shown in figure 15, in the power inverter 1K of this variation, opposed faces 34a of second substrate 34 does not has Configure above-mentioned power module PM5～PM8 and radiator 52.That is, in this variation, each capacitor C1～C4 only connects and has respectively Power module PM1～PM4.

In the radiator base 501K of radiator 50K, short transverse size and the short transverse chi of second substrate 32,34 Very little roughly equal, lower end position is substantially uniform with the lower end position of second substrate 32,34.Multiple fin of radiator 50K 502K, in the range of the upper end of radiator base 501K to its bottom, dashes forward towards right side from radiator base 501K Go out.

Multiple fin 542K of radiator 54K are between the fin 502K and second substrate 34 of radiator 50L, from dissipating Hot device pedestal 541 projects to downward near the upper end of capacitor C1～C4.

Further, in this variation, in framework 2, surrounded by first substrate 30 and second substrate 32,34 and be positioned at the Space 71K (space surrounded by the chain-dotted line in Figure 15) shape between part side 30a and the radiator base 541 of one substrate 30 Become wind-tunnel 70K.

It addition, surround the space 76K (space surrounded by double dot dash line in Figure 15) being configured with fin 502K, 542K , radiator base 501K, 541, opposed faces 34a of second substrate 34, the upper end of capacitor C1～C4 and left surface, first Part side 30a of substrate 30 is formed and is used for cooling down above-mentioned power module PM1～PM4, capacitor C1～C4 and regeneration resistance R Cooling flowing path 75K.

It addition, in this variation, radiator 50K is equivalent to an example of the first radiator.Therefore, radiator base 501K is equivalent to an example of the first radiator base, and fin 502K is equivalent to an example of the first fin.It addition, Radiator 54K is equivalent to an example of the second radiator.Therefore, radiator base 541 is equivalent to the second radiator base One example, fin 542K is equivalent to an example of the second fin.

(5-12. the 12nd variation)

Hereinafter, with reference to Figure 16, to part different from the embodiment described above in the structure of the power inverter of this variation Illustrate.

As shown in figure 16, in the power inverter 1L of this variation, opposed faces 34a of second substrate 34 does not has Configure above-mentioned power module PM5～PM8 and radiator 52.That is, in this variation, each capacitor C1～C4 only connects and has Each power module PM1～PM4.It addition, be configured without above-mentioned regeneration above upper end 32b, 34b of second substrate 32,34 Resistance R and radiator 54.

In the radiator base 501L of radiator 50L, short transverse size and the short transverse chi of second substrate 32,34 Very little roughly equal, lower end position is substantially uniform with the lower end position of second substrate 32,34.Multiple fan 502L of radiator 50L In the range of the upper end of radiator base 501L to its bottom, highlight towards right side from radiator base 501L.Tool For body, in multiple fin 502L, the heat radiation corresponding with the position of side more top than capacitor C1～C4 in the height direction Sheet 502L projects near opposed faces 34a of second substrate 34 from radiator base 501L.It addition, in multiple fin 502L, Fin 502L corresponding with capacitor C1～C4 in the height direction projects to capacitor C1～C4 from radiator base 501L Left surface near.

Further, in this variation, in framework 2, that surrounded by first substrate 30 and second substrate 32,34 and be positioned at The component (not shown) of part side 30a of first substrate 30 and the top of upper end 32b, the 34b being arranged in second substrate 32,34 Between space 71L (space surrounded by single dotted broken line in Figure 16) form wind-tunnel 70L.

It addition, in framework 2, surround space 76L (being surrounded by double dot dash line in Figure 16 being configured with fin 502L Space), radiator base 501L, opposed faces 34a of second substrate 34, be arranged in second substrate 32,34 upper end 32b, Part side 30a of the component of the top of 34b, the upper end of capacitor C1～C4 and left surface and first substrate 30 is formed to be used Cooling flowing path 75L in cooling above-mentioned power module PM1～PM4 and capacitor C1～C4.

It addition, in this variation, radiator 50L is equivalent to an example of the first radiator.Therefore, radiator base 501L is equivalent to an example of the first radiator base, and fin 502L is equivalent to an example of the first fin.

(5-13. the 13rd variation)

Hereinafter, with reference to Figure 17, to part different from the embodiment described above in the structure of the power inverter of this variation Illustrate.

As shown in figure 17, in the power inverter 1M of this variation, second substrate 34 is at the parts of first substrate 30 Being arranged in the position of the side that keeps left than above-mentioned embodiment on the 30a of face, the configuration space of second substrate 32,34 is than above-mentioned embodiment Little.

Radiator 52M is arranged in the right surface of second substrate 34.The radiator base 521 of radiator 52M is at second substrate Configure abreast with second substrate 32,34 on the right surface of 34, and be fixed on via the pad SP2 being such as arranged in its corner Two substrates 34.Multiple fin 522 of radiator M from the upper end of radiator base 521 to than its short transverse central part In the range of the most on the lower, from radiator base 521 along width, highlight the most to the right.

Multiple fin 542M of radiator 54M are between the fin 502 and second substrate 34 of radiator 50, from heat radiation Device pedestal 541 projects to downward near the upper end of capacitor C1～C4.

Power module PM5～PM8 is arranged on the left surface of radiator base 521, and is arranged side-by-side along depth direction.

Further, in this variation, in framework 2, surrounded by first substrate 30 and second substrate 32,34 and be positioned at the Space 71M (space surrounded by the chain-dotted line in Figure 17) shape between part side 30a and the radiator base 541 of one substrate 30 Become wind-tunnel 70M.

It addition, in framework 2, surround be configured with fin 502,542M space 76M (in Figure 17 by double dot dash line bag The space enclosed), radiator base 501,541, opposed faces 34a of second substrate 34 and the upper end of capacitor C1～C4 Formed for cooling down above-mentioned power module PM1～PM4, capacitor C1～C4 and the cooling flowing path 75M of regeneration resistance R.Separately Outward, power module PM5～PM8 or the radiator 52 that are arranged in the right surface of second substrate 34 are arranged in above-mentioned wind-tunnel 70M not In same wind-tunnel (not shown).

It addition, in this variation, radiator 54M is equivalent to an example of the second radiator.Therefore, radiator base 541 examples being equivalent to the second radiator base, fin 542M is equivalent to an example of the second fin.

The effect as above-mentioned embodiment it is obtained in that in this variation.It addition, in this variation, it is possible to make The structure of second substrate 32,34 is common, it is possible to reduce cost.

It addition, in the above description, in the case of there is the records such as " vertically ", " parallel ", " central ", this record is also It it not strict implication.That is, these " vertically ", " parallel ", " central " etc. allow the tolerance in design, in manufacture, error, meaning " substantial orthogonality ", " substantial parallel ", the meaning of " substantially central authorities ".

It addition, in the above description, " identical ", " equal ", " different " etc. are existed for apparent size or size Record in the case of, this record is not strict implication.That is, these " identical ", " equal ", " different " etc. allow design upper, Tolerance in manufacture, error, it is meant that " being substantially the same ", " being substantially equal ", " being different in essence " etc..

It addition, in addition to having been described above, it is also possible to appropriately combined utilize above-mentioned embodiment, each variation.

Although additionally, illustrate the most one by one, but above-mentioned embodiment or each variation are in the scope without departing from its purport In, can implement plus various changes.

Symbol description

1 power inverter

1A～M power inverter

10 power conversion circuits

30 first substrates

30a part side

32 second substrates

32a opposed faces

32b upper end (example of the top ends erecting setting direction of second substrate)

32aa bottom (example of the end of first substrate side)

32ab upper end (with an example of the end of the opposition side, end of first substrate side)

34 second substrates

34a opposed faces

34b upper end (example of the top ends erecting setting direction of second substrate)

34aa bottom (example of the end of first substrate side)

34ab upper end (with an example of the end of the opposition side, end of first substrate side)

50 radiators

50A, B, E～G, K, L radiator

52 radiators

52A, B, E～G, M radiator

54 radiators

54A～C, G～K, M radiator

58 radiators

60 fans

501 radiator bases

501F, G, K, L radiator base

502 fin

502A, B, E～G, K, L radiator base

521 radiator bases

521F, G radiator base

522 fin

522A, B, E～G fin

541 radiator bases

542 fin

542A～C, G～K, M fin

581 radiator bases

582 fin

70 wind-tunnel

70E, F, H～M wind-tunnel

75 cooling flowing paths

75B, D～M cooling flowing path

C1～4 capacitors

C1a, b capacitor

C1c, d capacitor

C1e, f capacitor

L1 highlights length

L2 highlights length

L3 highlights length

LE1 reactor

PM1～8 power modules

R regeneration resistance (example of resistor)

Ra heat delivery surface

S1 configuration space

Claims

1. a power inverter, electric power is changed by described power inverter, it is characterised in that including:

First substrate；

Multiple second substrates, the plurality of second substrate erects and is arranged on described first substrate；And

First electronic unit, described first electronic unit is arranged in the opposed faces of the described second substrate of arranged opposite two, structure Become power conversion circuit the heating when energising.

Power inverter the most according to claim 1, it is characterised in that

Described first electronic unit at least two, and be arranged side-by-side described opposed along the direction, plate face of described first substrate On face.

Power inverter the most according to claim 1 and 2, it is characterised in that also include:

Fan, described fan is for the space air-supply surrounded by described first substrate and described second substrate.

Power inverter the most according to any one of claim 1 to 3, it is characterised in that

Described first electronic unit more leans on the end of its opposition side to join than the end of described first substrate side in described opposed faces Put.

Power inverter the most according to any one of claim 1 to 4, it is characterised in that

Also include the second electronic unit constituting described power conversion circuit,

Described second electronic unit is arranged in than described first electronic unit closer to described between said two second substrate The position of first substrate.

Power inverter the most according to claim 5, it is characterised in that

Described first electronic unit at least two, and be configured in the described opposed faces of said two second substrate each On individual,

Described second electronic unit is arranged between described first electronic unit of arranged opposite two.

7. according to the power inverter described in claim 5 or 6, it is characterised in that

Also include the first radiator cooling down described first electronic unit,

Described first radiator is to clamp described first between itself and the described opposed faces being configured with described first electronic unit The mode of electronic unit is arranged in described opposed faces.

Power inverter the most according to claim 7, it is characterised in that

Being arranged at least partially between described first radiator and described first substrate of described second electronic unit.

9. according to the power inverter described in claim 7 or 8, it is characterised in that

Described first radiator includes:

First radiator base, described first radiator base configures along described second substrate and is provided with described first electricity Subassembly；And

Multiple first fin, the plurality of first fin is from opposed along described opposed faces of described first radiator base Direction highlights,

Described first radiator has two, two described first radiators with described first fin from two institutes arranged opposite State the mode that the first radiator base is prominent to the direction that described first fin is close to each other, and with by described first ministry of electronics industry The mode that part is clipped between described first radiator and the described opposed faces of described second substrate is arranged in said two the second base In each of the described opposed faces of plate.

Power inverter the most according to claim 9, it is characterised in that

Said two the first radiator is with the diameter of configuration space between the first radiator base described in said two with fan Equal mode configures.

11. according to the power inverter described in claim 9 or 10, it is characterised in that also include:

3rd electronic unit, described 3rd electronic unit is arranged in the top ends erecting setting direction of said two second substrate Side, and the heating when energising；And

Cool down the second radiator of described 3rd electronic unit,

Described second radiator includes:

Second radiator base, described second radiator base in the described top ends of said two second substrate along described One substrate configuration, described 3rd electronic unit is arranged on described second radiator base；And

Multiple second fin, the plurality of second fin in said two the first radiator each described first Between fin prominent to described first substrate from described second radiator base.

12. power inverters according to claim 11, it is characterised in that also include:

Described first electronic unit is different with the caloric value of described 3rd electronic unit,

At described second fin from the prominent prominent length of described second radiator base and described first fin from institute State in the prominent length that the first radiator base is prominent, the prominent length of that one that the caloric value of corresponding electronic unit is bigger Spend longer.

13. according to the power inverter described in claim 11 or 12, it is characterised in that

Said two the first radiator base, described second radiator base, described second electronic unit are formed and are used for cooling down institute State the first electronic unit, described second electronic unit and the cooling flowing path of described 3rd electronic unit.

14. according to the power inverter according to any one of claim 5 to 13, it is characterised in that

Described first electronic unit is power module, and described power module includes the switch unit constituting described power conversion circuit Part,

Described second electronic unit is the capacitor constituting described power conversion circuit.

15. according to the power inverter according to any one of claim 11 to 13, it is characterised in that described 3rd ministry of electronics industry Part is resistor.