CN106061098B - A kind of dielectric-slab being used for transmission high speed signal - Google Patents
A kind of dielectric-slab being used for transmission high speed signal Download PDFInfo
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- CN106061098B CN106061098B CN201610506942.6A CN201610506942A CN106061098B CN 106061098 B CN106061098 B CN 106061098B CN 201610506942 A CN201610506942 A CN 201610506942A CN 106061098 B CN106061098 B CN 106061098B
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- Prior art keywords
- high speed
- speed signal
- pin
- signal device
- dielectric
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
Abstract
The embodiment of the invention discloses a kind of dielectric-slabs being used for transmission high speed signal, including：Substrate；The first high speed signal device and the second high speed signal device in the first side of substrate is set, first high speed signal device includes the first high speed signal pin and the first grounding pin, second high speed signal device includes the second high speed signal pin and the second grounding pin, and the impedance value being configured between the first high speed signal pin and the first grounding pin is more than the impedance value being configured between the second high speed signal pin and the second grounding pin；Signal wire in the first side of substrate is set, and signal wire is arranged between the first high speed signal pin and the second high speed signal pin；Reference line in the first side of substrate is set, and Guide Settings is between the first grounding pin and the second grounding pin, and along the second high speed signal device on the direction of the first high speed signal device, the distance between reference line and signal wire value are linearly increasing.While the continuous change for realizing impedance, processing technology becomes simple.
Description
Technical field
The present invention relates to high speed transmission of signals technical field field more particularly to a kind of media being used for transmission high speed signal
Plate.
Background technology
With intelligentized development, people need the data transmitted to become more and more, and the transmission speed of signal is also more next
It is higher, but in the transmission of high speed signal, if necessary to the mutation of impedance, will produce stronger back wave so that high speed is believed
Number transmission quality be greatly reduced.
Attached drawing 1 provides a kind of design method of impedance continuity comprising for the transmission line width in the sides PCB is arranged
Part and transmission line narrow portion, are arranged the reference layer in the other sides PCB, by the calculating of impedance standard, by transmission line wide portion
The corresponding reference layer of view field is set as area of knockout.
As said program needs for reference layer and transmission line to be laid in the two of pcb board respectively when making pcb board
It side and then carries out reference layer and hollows out, complex process.
Invention content
The present invention's provides the dielectric-slab for being used for transmission high speed signal, the defect for solving pcb board complex process.
This application provides a kind of dielectric-slabs being used for transmission high speed signal, including：Substrate；It is arranged in the first side of substrate
First high speed signal device and the second high speed signal device, the first high speed signal device include the first high speed signal pin and first
Grounding pin, the second high speed signal device include the second high speed signal pin and the second grounding pin, the first high speed signal pin
And first the impedance value that is configured between grounding pin be more than and be configured between the second high speed signal pin and the second grounding pin
Impedance value；Signal wire in the first side of substrate is set, and signal wire is arranged in the first high speed signal pin and the second high speed signal
Between pin；Reference line in the first side of substrate is set, Guide Settings between the first grounding pin and the second grounding pin,
Along the second high speed signal device on the direction of the first high speed signal device, the distance between reference line and signal wire value are linear to be increased
Add.
Reference line in dielectric-slab and signal wire in the application are arranged on the first face of dielectric-slab, are the same of dielectric-slab
Side, and along the second high speed signal device on the direction of the first high speed signal device, between reference line and signal wire away from
It is linearly increasing from being worth, realize the continuous change of impedance.For prior art, since reference line and signal wire setting exist
The same side of dielectric-slab, and secondary operation need not be carried out, so technological requirement when dielectric-slab produces substantially reduces, do not need
It carries out hollowing out the continuity that impedance can be realized design, it is simple for process.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art
With obtain other attached drawings according to these attached drawings.
Fig. 1 is that impedance a kind of continuously method is realized in prior art；
Fig. 2 is a kind of dielectric-slab being used for transmission high speed signal provided in the present embodiment；
Fig. 3 is the dielectric-slab that the another kind provided in the present embodiment is used for transmission high speed signal.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Term " first ", " second " are used for description purposes only, be not understood to indicate or imply relative importance or
It implicitly indicates or what is implied includes one or more technical characteristic.The feature of " first ", " second " is defined as a result,
It can explicitly or implicitly include one or more this feature.In the description of the present invention, unless otherwise indicated, " more
It is a " it is meant that two or more.
As shown in Fig. 2, this application provides a kind of dielectric-slabs being used for transmission high speed signal, including：Substrate 5；Setting exists
The the first high speed signal device 1 and the second high speed signal device 2 of 5 first side of substrate, the first high speed signal device 1 include first high
Fast signal pins 11 and the first grounding pin 12, the second high speed signal device 2 connect including the second high speed signal pin 21 and second
Ground pin 22, the impedance value being configured between the first high speed signal pin 11 and the first grounding pin 12 are more than the second high speed signal
The impedance value being configured between pin 21 and the second grounding pin 22；Signal wire 3 in the first side of substrate is set, and signal wire 3 is set
It sets between the first high speed signal pin 11 and the second high speed signal pin 21；Reference line 4 in the first side of substrate is set, is referred to
Line 4 is arranged between the first grounding pin 12 and the second grounding pin 22, along the second high speed signal device to the first high speed signal
On the direction of device（I.e. on the increased direction of impedance）, the distance between reference line and signal wire are worth linearly increasing.
Reference line in dielectric-slab and signal wire in the application are arranged on the first face of dielectric-slab, are the same of dielectric-slab
Side, for prior art, technological requirement when dielectric-slab produces substantially reduces, and need not hollow out can be realized
The continuity of impedance designs.Also, the design of the same side does not need the coating that two sides carries out metal layer in process, subtracts
Production process is lacked.
As shown in figure 3, for the present invention provides there is an embodiment, along the second high speed signal device to the first high speed signal
On the direction of device, under the premise of the distance between reference line and signal wire value are linearly increasing, the line width of signal wire 6, along second
High speed signal device is on the direction of the first high speed signal device（I.e. on the increased direction of impedance）In the trend of reduction.This be by
In the calculating in impedance, impedance Z=377** wherein, Z is the impedance of signal wire to h/w, and ε is dielectric constant, and h indicates letter
Distance number between line and reference line, w indicate signal wire line width.Therefore adjustment the distance between signal wire and reference line while
Reduce line width along the increased direction of impedance, can make, in same impedance variations, signal wire and reference line distance change
Reduce, reduces the area that cabling occupies, be conducive to the dense layout of dielectric-slab.
Concretely, the first high speed signal device is BNC connector（Bayonet Nut Connector）Socket, second is high
Fast signal device is SMA connectors.Wherein, the impedance standard that BNC connector socket is used to connect broadcasting and TV equipment end is 75 ohm
BNC connector, SMA connectors are 50 ohm of SMA connectors for connecting impedance standard on mobile terminal.To realize melting for three nets
It closing, the signal of CHINA RFTCOM Co Ltd can be transferred to by BNC connector in mobile device, but due to the interface in broadcasting and TV signal network
Common BNC connector, but mobile terminal often uses SMA connectors, since the impedance of the two is also with 25 ohm of difference, in order to ensure
The transmission of high speed signal needs to make the impedance in transmission path to generate gradual change, the impedance of mutation is avoided to will produce signal reflex
Risk, it is therefore desirable to the transmission of high speed signal is realized using the dielectric-slab in this programme.As another realization method, described
One high speed signal device is BNC connector, and the second high speed signal device is SMA connectors, wherein BNC connector is for connecting
The BNC connector socket that the impedance standard of broadcasting and TV equipment end is 75 ohm, SMA connectors are for connecting impedance standard on mobile terminal
For 50 ohm of SMA connectors.Certainly, it is other interfaces that the first high speed signal device and the second high speed signal device, which can also be,
The impedance standard that the first high speed signal device is configured only is needed to be more than the impedance standard that the second high speed signal device is configured.
As an alternative embodiment, the line width of signal wire remains unchanged, and on the increased direction of impedance, reference line
The distance between signal wire value is linearly increasing；As another optional situation, on the increased direction of impedance, reference line and letter
The distance between number line value is linearly increasing, and the line width of synchronous signal line linearly reduces；Increase as having a kind of realization method, impedance
Direction on, the distance between reference line and signal wire value it is constant, the line width of signal wire linearly reduces.Above-mentioned three kinds of embodiments
It can be so that impedance consecutive variations, not will produce mutation.
As a kind of optional situation, substrate is printed circuit board.As another optional situation, substrate is flexible electrical
Road plate.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (6)
1. a kind of dielectric-slab being used for transmission high speed signal, it is characterised in that：Including：
Substrate；
The first high speed signal device and the second high speed signal device in the first side of substrate, the first high speed signal device are set
Including the first high speed signal pin and the first grounding pin, the second high speed signal device include the second high speed signal pin and
Second grounding pin, the impedance value being configured between the first high speed signal pin and first grounding pin are more than described
The impedance value being configured between second high speed signal pin and second grounding pin；
Signal wire in the first side of substrate is set, and the signal wire setting is in the first high speed signal pin and described second high
Between fast signal pins；
Reference line in the first side of substrate is set, and the Guide Settings is in first grounding pin and second grounding lead
Between foot, along the second high speed signal device on the direction of the first high speed signal device, the reference line and the signal
The distance between line value is linearly increasing.
2. dielectric-slab as described in claim 1, it is characterised in that：
Along the second high speed signal device on the direction of the first high speed signal device, line width is gradually reduced the signal wire.
3. the dielectric-slab as described in claims 1 or 2 any one, it is characterised in that：
The first high speed signal device is BNC connector socket, and the second high speed signal device is SMA connectors.
4. the dielectric-slab as described in claims 1 or 2 any one, it is characterised in that：
The first high speed signal device is BNC connector, and the second high speed signal device is SMA connectors.
5. the dielectric-slab as described in claims 1 or 2 any one, it is characterised in that：
The substrate is printed circuit board.
6. the dielectric-slab as described in claims 1 or 2 any one, it is characterised in that：
The substrate is flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610506942.6A CN106061098B (en) | 2016-07-01 | 2016-07-01 | A kind of dielectric-slab being used for transmission high speed signal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610506942.6A CN106061098B (en) | 2016-07-01 | 2016-07-01 | A kind of dielectric-slab being used for transmission high speed signal |
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| Publication Number | Publication Date |
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| CN106061098A CN106061098A (en) | 2016-10-26 |
| CN106061098B true CN106061098B (en) | 2018-11-02 |
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| CN201610506942.6A Active CN106061098B (en) | 2016-07-01 | 2016-07-01 | A kind of dielectric-slab being used for transmission high speed signal |
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| CN112672517A (en) * | 2020-12-31 | 2021-04-16 | 株洲菲斯罗克光电技术有限公司 | Circuit board impedance optimization method and impedance optimization circuit board |
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| CN1656652A (en) * | 2002-06-21 | 2005-08-17 | 莫莱克斯公司 | High-density, impedance-tuned connector having modular construction |
| CN200941425Y (en) * | 2006-08-29 | 2007-08-29 | 特腾高频股份有限公司 | Mini flat antenna |
| CN101346040A (en) * | 2007-07-09 | 2009-01-14 | 佳能株式会社 | Circuit connection structure and printed circuit board |
| CN104348525A (en) * | 2013-07-31 | 2015-02-11 | 启碁科技股份有限公司 | Transmission device for near field communication device and near field communication device |
| CN204335143U (en) * | 2014-12-29 | 2015-05-13 | 深圳市一博科技有限公司 | The pcb board structure of a kind of optimizing metal finger devices impedance |
| CN104704679A (en) * | 2012-09-28 | 2015-06-10 | 株式会社村田制作所 | Signal line module and communication terminal |
| US9185794B1 (en) * | 2013-07-31 | 2015-11-10 | Juniper Networks, Inc. | Apparatus and methods for placement of discrete components on internal printed circuit board layers |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09312507A (en) * | 1996-05-20 | 1997-12-02 | Oki Electric Ind Co Ltd | High frequency circuit board and connection method of the same |
| CN102056399A (en) * | 2009-10-28 | 2011-05-11 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| KR102263056B1 (en) * | 2014-11-19 | 2021-06-09 | 삼성디스플레이 주식회사 | Printed circuit board and display device having the same |
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1656652A (en) * | 2002-06-21 | 2005-08-17 | 莫莱克斯公司 | High-density, impedance-tuned connector having modular construction |
| CN200941425Y (en) * | 2006-08-29 | 2007-08-29 | 特腾高频股份有限公司 | Mini flat antenna |
| CN101346040A (en) * | 2007-07-09 | 2009-01-14 | 佳能株式会社 | Circuit connection structure and printed circuit board |
| CN104704679A (en) * | 2012-09-28 | 2015-06-10 | 株式会社村田制作所 | Signal line module and communication terminal |
| CN104348525A (en) * | 2013-07-31 | 2015-02-11 | 启碁科技股份有限公司 | Transmission device for near field communication device and near field communication device |
| US9185794B1 (en) * | 2013-07-31 | 2015-11-10 | Juniper Networks, Inc. | Apparatus and methods for placement of discrete components on internal printed circuit board layers |
| CN204335143U (en) * | 2014-12-29 | 2015-05-13 | 深圳市一博科技有限公司 | The pcb board structure of a kind of optimizing metal finger devices impedance |
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| CN106061098A (en) | 2016-10-26 |
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