CN106059499B - Media resonant oscillator - Google Patents
Media resonant oscillator Download PDFInfo
- Publication number
- CN106059499B CN106059499B CN201610575417.XA CN201610575417A CN106059499B CN 106059499 B CN106059499 B CN 106059499B CN 201610575417 A CN201610575417 A CN 201610575417A CN 106059499 B CN106059499 B CN 106059499B
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- Prior art keywords
- circuit board
- microstrip line
- shell
- resonant oscillator
- dielectric resonator
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- 238000010276 construction Methods 0.000 claims abstract description 37
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- 238000005859 coupling reaction Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000004891 communication Methods 0.000 description 10
- 230000010355 oscillation Effects 0.000 description 5
- -1 accumulation silver Chemical class 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
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- 239000004743 Polypropylene Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/20—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising resistance and either capacitance or inductance, e.g. phase-shift oscillator
Landscapes
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
The present invention relates to a kind of media resonant oscillators, including shell, dielectric resonator and microstrip line；The dielectric resonator is installed on microstrip line in the shell；The dielectric resonator be located at the microstrip line side and with the microstrip line electromagnetic coupling；It is characterized in that, the media resonant oscillator further includes first circuit board and support construction；The microstrip line is set on the first circuit board；The support construction is connected between the first circuit board and the shell, and the support construction is installed on the same side in the shell with the dielectric resonator；The first circuit board, support construction and shell collectively form a cavity, and the inside and outside space of the cavity communicates.Therefore, the electromagnetic wave below microstrip line can be coupled by cavity with dielectric resonator, to reduce the electromagnetic wave absorbed by shell, reduce the loss of electromagnetic wave energy, improve the Q values of the media resonant oscillator.
Description
Technical field
The present invention relates to technical field of microwave circuits, more particularly to a kind of media resonant oscillator.
Background technology
In VSAT satellite communication system, satellite small station (VSAT) can be widely distributed in different regions, in addition to
City proper, additionally it is possible to be distributed in mountain area etc..Meanwhile VSAT satellite communication system disclosure satisfy that Internet service, voice/fax
The different communications demand such as service, data service, to be more and more widely used.
As shown in Figure 1, VSAT satellite communication system generally includes a main website 12, satellite repeater 13 and is distributed in each
The satellite small station 11 in region.Satellite repeater 13 is typically distributed on above equator on the geostationary orbit of 36000 kms.Main website
12 be the central communication and monitor terminal in entire VSAT satellite communication system, it usually needs all weather operations.Main website 12 passes through
Signal is directly transmitted to the satellite small station 11 for being distributed in different zones to control and be communicated with each satellite small station 11.Such as Fig. 2
Shown, satellite small station 11 includes an outdoor unit 15 and an indoor unit 14.Wherein, indoor unit 14 includes to be used for interacting
Equipment, such as modem, computer equipment, and indoor unit 14 passes through wired mode and connects outdoor unit 15.It is outdoor
Unit 15 includes antenna module 17, transceiver 16 and other accessories.Antenna module 17 includes reflector, feed, installation bottom
Seat etc..Transceiver 16 includes up-converter module (BUC, block up converter), down conversion module (LNB, low noise
) and other transmitting-receiving subassembly parts block.
In VSAT satellite communication system, transceiver is the communication core part in satellite small station, and signal receiving module
For one of the key components of transceiver.Fig. 3 is the link schematic diagram of signal receiving module.Wherein, it is logical first to receive signal
It crosses waveguide-microstrip line construction and goes on the microstrip line 201 of PCB and transmit, by low noise amplification module 202, filter module 203, obtain
To required high-frequency signal.Meanwhile local oscillation signal generator 205 generates local oscillation signal, passes through frequency mixer with above-mentioned high-frequency signal
204 mixing, are down-converted to mf band, amplify using intermediate frequency amplifier 206, are output to late-class circuit.
In signal receiving module, performance important that the performance of local vibration source receives signal.Under normal conditions,
Select the local oscillation signal of specific frequency that chip or media resonant oscillator (Dielectric Resonator occurs
Oscillator, DRO) generate local vibration source.Wherein, local oscillation signal generation chip is simple, but price is costly, needs outside
Reference clock frequency.The unique advantages such as media resonant oscillator is small by its, Q values are high, simple in structure, at low cost, are believing
Application in number receiving module is relatively broad.
However, media resonant oscillator is applied in signal receiving module, low-loss need to be met and small phase is made an uproar
The requirement of sound.Due to media resonant oscillator Q values (quality factor) with loss inversely, and low Q values can increase and be
The phase noise of system, therefore to reduce loss and noise, then need the Q values for improving media resonant oscillator.Therefore how medium is improved
The Q values of resonant oscillator are a problem to be solved.
Invention content
Based on this, it is necessary to the problem of for the Q values for how improving media resonant oscillator, provide a kind of dielectric resonance and shake
Swing device.
A kind of media resonant oscillator, including shell, dielectric resonator and microstrip line；The dielectric resonator and microstrip line
It is installed in the shell；The dielectric resonator be located at the microstrip line side and with the microstrip line electromagnetic coupling；It is described
Media resonant oscillator further includes first circuit board and support construction；The microstrip line is set on the first circuit board；It is described
Support construction is connected between the first circuit board and the shell, and the support construction is installed with the dielectric resonator
In the same side in the shell；The first circuit board, support construction and shell collectively form a cavity, and the cavity
Inside and outside space communicates.
The material of the support construction is made of nonpolar molecule in one of the embodiments,.
The support construction is situated between in the height on the first circuit board direction in one of the embodiments,
Between the 1/8 to 1/2 of the length of the first circuit board；Wherein, the corresponding straight line of the length of the first circuit board and institute
State the straight line parallel at the wide place of microstrip line.
The support construction includes the first support unit and the second support unit in one of the embodiments,；Described
One support unit, the second support unit are located at the lower section of the first circuit board opposite end；Wherein, first circuit
The straight line parallel of vertical line and the wide place of the microstrip line between plate opposite end.
The distance between first support unit and the second support unit are more than described micro- in one of the embodiments,
Width with line.
The media resonant oscillator further includes bed course in one of the embodiments,；The bed course, which is connected to, to be given an account of
Between matter resonator and shell.
The dielectric constant of the bed course is less than the dielectric resonator in one of the embodiments,.
The shell is metal shell in one of the embodiments,.
The media resonant oscillator further includes second circuit board in one of the embodiments,；The second circuit board
It is installed in the shell；The support construction and dielectric resonator are respectively positioned on the second circuit board.
Above-mentioned media resonant oscillator have the advantage that for：In the media resonant oscillator, microstrip line is set to the
On one circuit board, support construction is connected between first circuit board and shell, and support construction is installed on shell with dielectric resonator
Internal the same side.Meanwhile first circuit board, support construction and shell collectively form a cavity, and the inside and outside space phase of the cavity
It is logical.Therefore, the electromagnetic wave below microstrip line can be coupled by cavity with dielectric resonator, be inhaled by shell to reduce
The electromagnetic wave of receipts reduces the loss of electromagnetic wave energy, improves the Q values of the media resonant oscillator.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The attached drawing of other embodiment is obtained according to these attached drawings.
Fig. 1 is the composed structure schematic diagram of VSAT satellite communication system；
Fig. 2 is the composed structure schematic diagram in VSAT satellite communication system Satellite small station shown in FIG. 1；
Fig. 3 is the composed structure schematic diagram of signal receiving module in satellite small station shown in Fig. 2；
Fig. 4 is the schematic cross-section for the media resonant oscillator that an embodiment provides；
Fig. 5 is another schematic cross-section of the media resonant oscillator of embodiment illustrated in fig. 4.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing
Give presently preferred embodiments of the present invention.But the present invention can realize in many different forms, however it is not limited to this paper institutes
The embodiment of description.Keep the understanding to the disclosure more thorough on the contrary, purpose of providing these embodiments is
Comprehensively.
Unless otherwise defined, the skill of all of technologies and scientific terms used here by the article and the technical field for belonging to invention
The normally understood meaning of art personnel is identical.Description to be intended merely in the term used in the description of invention specific herein
The purpose of embodiment, it is not intended that the limitation present invention.Term as used herein "and/or" includes one or more relevant institutes
Any and all combinations of list of items.
One embodiment provides a kind of media resonant oscillator, the media resonant oscillator can be applied to Ka wave bands or its
His microwave band.As shown in figure 4, the media resonant oscillator includes shell 100, dielectric resonator 200, microstrip line 300, first
Circuit board 400 and support construction 500.Wherein, dielectric resonator 200, microstrip line 300, first circuit board 400 and support construction
500 are mounted in shell 100.
Dielectric resonator 300 is a kind of nonmetallic electromagnetic resonator, and dielectric constant is higher, can be 20~100, and have
There is lower electromagnetic medium to be lost.Meanwhile dielectric resonator 300 be located at 300 side of microstrip line and with 300 electromagnetism coupling of microstrip line
It closes.Dielectric resonator 200 is worked with microstrip line 300 by magnetic coupling, can be applied in oscillating circuit as frequency-selective network.Its
In, dielectric resonator 300 can be coupled with single microstrip line 300, and also referred to as band resistive couples, which can answer
For in serial Feedback type DRO.In other embodiments, dielectric resonator can also with two microstrip lines, i.e., by two
Microstrip line is symmetricly set on dielectric resonator both sides, and at this moment dielectric resonator generates coupling with two microstrip lines simultaneously,
Referred to as band general formula couples, which can be applied in parallel feedback type DRO.
Microstrip line 300 is set on first circuit board 400.Wherein, microstrip line 300 is formed in the first circuit using covering process for copper
On plate 400, and thickness d is between 17 μm to 34 μm.The impedance of microstrip line 300 is 50 ohm.Meanwhile on microstrip line 300 also
It can be with metals such as accumulation silver, to prevent copper from aoxidizing, to improve the reliability of microstrip line 300.In addition, first circuit board
400 be high frequency plate.It should be noted that only showing the width and height of microstrip line 300 in Fig. 4, microstrip line 300 is not shown
Length.
Support construction 500 is connected between first circuit board 400 and shell 100, and support construction 500 and dielectric resonator
200 are installed on the same side in shell 100.Specifically, support construction 500 is vertical with first circuit board 400.Meanwhile first circuit
Plate 400, support construction 500 and shell 100 collectively form a cavity 800, and 800 inside and outside space of cavity communicates.Therefore, empty
Chamber 800 is not only hollow structure, and at least one is open, and to make 800 inside and outside space of cavity communicate, therefore electromagnetic wave is logical
Crossing the loss of the cavity 800 can then substantially reduce.
Therefore, in above-mentioned media resonant oscillator provided in this embodiment, since microstrip line 300 is formed in the first circuit
On plate 400, the lower section of microstrip line 300 is then above-mentioned cavity 800, therefore the electromagnetic wave of 300 lower section of microstrip line can then pass through cavity
800 couple with dielectric resonator 200, reduce the electromagnetic wave absorbed by shell 100, to reduce electromagnetic wave energy
Loss, improves the Q values of media resonant oscillator, reduces the noise of media resonant oscillator, and then improve dielectric resonance
The performance of oscillator.
Specifically, the material of support construction 500 is made of nonpolar molecule.The material being made of nonpolar molecule is substantially
Do not absorb or seldom electromagnetic wave absorption, this kind of material include polytetrafluoroethylene (PTFE), polypropylene, polyethylene, polysulfones etc., plastic products,
Glass, ceramics etc., they can penetrate electromagnetic wave, without electromagnetic wave absorption, therefore further reduced the loss of electromagnetic wave energy.
Meanwhile support construction 500 is in the height c on 400 direction of first circuit board, between first circuit board 400
Length e 1/8 to 1/2 between, such as 1/4.Wherein, the corresponding straight lines of length e of first circuit board 400 and microstrip line 300
It is wide where straight line parallel.In addition, the whole height of support construction 500, first circuit board 400 and microstrip line 300, should make
The height of 300 surface present position of microstrip line is equal to or less than the height of 200 surface present position of dielectric resonator, to enhance
The ability that the electromagnetic wave that dielectric resonator 200 is sent out is coupled with microstrip line 300.
As shown in figure 4, support construction 500 includes the first support unit 510 and the second support unit 520.First support is single
First 510, second support unit 520 is located at the lower section of 400 opposite end of first circuit board.Wherein, 400 phase of first circuit board
The straight line parallel of vertical line and the wide place of microstrip line 300 between both ends.Therefore, the first support unit 510 and second supports
Unit 520 is mutually parallel, and vertical with first circuit board 400 and microstrip line 300.In the present embodiment, the both ends of cavity 800 are equal
For opening, then generated by microstrip line 300 and positioned at the electromagnetic wave of the lower section of microstrip line 300 can by the two openings directly with
Dielectric resonator 200 couples, so as to avoid being absorbed and caused by be lost.
In addition, the distance between the first support unit 510 and the second support unit 520 a are more than the width b of microstrip line 300.
That is, the first support unit 510, the second support unit 520 are located at the throwing of 400 lower section microstrip line 300 of first circuit board
The both sides of shadow position, to ensure after the lower section of microstrip line 300 penetrates first circuit board 400 to be cavity 800.Therefore, micro-strip
The electromagnetic wave of 300 lower section of line can be coupled by cavity 800 with dielectric resonator 200.
It is understood that the specific design method of support construction 500 is not limited to the above situation, as long as electromagnetism can be reduced
The loss of wave energy.For example, under the premise of Q values are met the requirements, also can by changing the structure of support construction 500, with
Making 800 tools of cavity, there are one opening or more than two openings.
Further, as shown in figure 4, media resonant oscillator further includes bed course 600.Bed course 600 is connected to dielectric resonance
Between device 200 and shell 100.Meanwhile the dielectric constant of bed course 600 is less than dielectric resonator 200.Therefore, the present embodiment passes through
Bed course 600 is set, the loaded quality factor of dielectric resonator 200 can be improved, so as to improve the phase of media resonant oscillator
Noiseproof feature.It is understood that dielectric resonator 200 also can improve loaded quality factor by other means.
In addition, the shape of dielectric resonator 200 is cylinder.Wherein, the basal diameter Φ 1 of dielectric resonator 200 can be with
High f for 5.93mm, dielectric resonator 200 can be 2.57mm.Correspondingly, bed course 600 is similarly cylindrical, in order to Jie
Matter resonator 200 reaches matched effect.Wherein, the basal diameter Φ 2 of bed course 600 can be 3.90mm, the high g of bed course 600
Can be 1.37mm.
Since the dielectric resonator 200 of cylindrical is operated in TE01δPattern, and electromagnetic wave is in TE01δMost hold under pattern
It is easily coupled with microstrip line 300, therefore enhances the coupling performance of dielectric resonator 200 and microstrip line 300.It is appreciated that
It is, according to actual use demand, dielectric resonator 200 or other shapes, such as rectangle, circular ring shape, spherical shape etc..
Specifically, shell 100 is metal shell, so as to avoid causing to do inside outer bound pair media resonant oscillator
It disturbs, improves the working performance of media resonant oscillator.
Further, as shown in figure 5, media resonant oscillator further includes second circuit board 700.Second circuit board 700 is pacified
Loaded in shell 100, and support construction 500 and dielectric resonator 200 are respectively positioned on second circuit board 700.Wherein, second circuit
Plate 700 can be high frequency plate, and area is more than first circuit board 400.It can be with install medium resonance oscillations on second circuit board 700
The other elements that device includes, such as amplifying circuit.In addition, the material of bed course 600 is identical as second circuit board 700, to make pad
Layer 600 is identical as the technique of second circuit board 700, is more convenient for processing.
It is understood that media resonant oscillator be not limited to include second circuit board 700 a kind of this situation, such as
First circuit board 400 can be only set, at this moment the device of other in media resonant oscillator can be installed on first circuit board 400
On.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (8)
1. a kind of media resonant oscillator, including shell, dielectric resonator and microstrip line；The dielectric resonator is pacified with microstrip line
Loaded in the shell；The dielectric resonator be located at the microstrip line side and with the microstrip line electromagnetic coupling；Its feature
It is, the media resonant oscillator further includes first circuit board and support construction；The microstrip line is set to first circuit
On plate, the height of microstrip line surface present position is equal to or less than the height of dielectric resonator surface present position；
The support construction is connected between the first circuit board and the shell, and the support construction and the dielectric resonator
It is installed on the same side in the shell；The first circuit board, support construction and shell collectively form a cavity, and the sky
Intracavitary, the external space communicate；
The material of the support construction is made of nonpolar molecule.
2. media resonant oscillator according to claim 1, which is characterized in that the support construction is perpendicular to described
Height on one circuit board direction, between the 1/8 to 1/2 of the length of the first circuit board；Wherein, first circuit
The straight line parallel of the corresponding straight line of length of plate and the wide place of the microstrip line.
3. media resonant oscillator according to claim 1, which is characterized in that the support construction includes that the first support is single
Member and the second support unit；First support unit, the second support unit are located at the first circuit board opposite end
Lower section；Wherein, the straight line parallel of the line between the first circuit board opposite end and the wide place of the microstrip line.
4. media resonant oscillator according to claim 3, which is characterized in that first support unit and the second support
The distance between unit is more than the width of the microstrip line.
5. media resonant oscillator according to claim 1, which is characterized in that the media resonant oscillator further includes pad
Layer；The bed course is connected between the dielectric resonator and shell.
6. media resonant oscillator according to claim 5, which is characterized in that the dielectric constant of the bed course is less than described
Dielectric resonator.
7. the media resonant oscillator according to any claim in claim 1 to 6, which is characterized in that the shell
For metal shell.
8. the media resonant oscillator according to any claim in claim 1 to 6, which is characterized in that the medium
Resonant oscillator further includes second circuit board；The second circuit board is installed in the shell；The support construction and medium
Resonator is respectively positioned on the second circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610575417.XA CN106059499B (en) | 2016-07-20 | 2016-07-20 | Media resonant oscillator |
| PCT/CN2017/092829 WO2018014780A1 (en) | 2016-07-20 | 2017-07-13 | Dielectric resonator oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610575417.XA CN106059499B (en) | 2016-07-20 | 2016-07-20 | Media resonant oscillator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106059499A CN106059499A (en) | 2016-10-26 |
| CN106059499B true CN106059499B (en) | 2018-07-24 |
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ID=57188404
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610575417.XA Expired - Fee Related CN106059499B (en) | 2016-07-20 | 2016-07-20 | Media resonant oscillator |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106059499B (en) |
| WO (1) | WO2018014780A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106059499B (en) * | 2016-07-20 | 2018-07-24 | 深圳市华讯星通讯有限公司 | Media resonant oscillator |
| CN107863598A (en) * | 2017-12-11 | 2018-03-30 | 四川九鼎智远知识产权运营有限公司 | A kind of TM moulds dielectric resonator |
| CN108054475A (en) * | 2017-12-11 | 2018-05-18 | 四川九鼎智远知识产权运营有限公司 | A kind of TM moulds dielectric filter |
| CN107863591A (en) * | 2017-12-11 | 2018-03-30 | 四川九鼎智远知识产权运营有限公司 | A kind of wave filter |
| CN107834145A (en) * | 2017-12-11 | 2018-03-23 | 四川九鼎智远知识产权运营有限公司 | A kind of dielectric resonator |
| CN108091976A (en) * | 2017-12-11 | 2018-05-29 | 四川九鼎智远知识产权运营有限公司 | A kind of resonant oscillator |
| CN108054478A (en) * | 2017-12-11 | 2018-05-18 | 四川九鼎智远知识产权运营有限公司 | A kind of ultra-wide band filter |
| CN107978833A (en) * | 2017-12-11 | 2018-05-01 | 四川九鼎智远知识产权运营有限公司 | A kind of TM moulds resonant oscillator |
| CN107863946A (en) * | 2017-12-11 | 2018-03-30 | 四川九鼎智远知识产权运营有限公司 | A kind of media resonant oscillator |
| CN111487591B (en) * | 2020-05-22 | 2023-05-12 | 重庆邮电大学 | Low-phase-noise microstrip oscillator applied to millimeter wave radar |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87103472A (en) * | 1986-05-14 | 1987-11-25 | 格特电信公司 | Microstrip transmission line with the dielectric resonant chamber coupling |
| US5801590A (en) * | 1995-07-31 | 1998-09-01 | Matsushita Electric Industrial Co., Ltd. | Dielectric resonator oscillator and down converter using the same |
| CN103811832A (en) * | 2012-11-08 | 2014-05-21 | 华为技术有限公司 | Filter, receiver, transmitter and transceiver |
| CN203734619U (en) * | 2014-01-09 | 2014-07-23 | 南京熊猫电子股份有限公司 | High-stability media oscillation source |
| CN205864371U (en) * | 2016-07-20 | 2017-01-04 | 深圳市华讯星通讯有限公司 | Media resonant oscillator |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106059499B (en) * | 2016-07-20 | 2018-07-24 | 深圳市华讯星通讯有限公司 | Media resonant oscillator |
-
2016
- 2016-07-20 CN CN201610575417.XA patent/CN106059499B/en not_active Expired - Fee Related
-
2017
- 2017-07-13 WO PCT/CN2017/092829 patent/WO2018014780A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87103472A (en) * | 1986-05-14 | 1987-11-25 | 格特电信公司 | Microstrip transmission line with the dielectric resonant chamber coupling |
| US5801590A (en) * | 1995-07-31 | 1998-09-01 | Matsushita Electric Industrial Co., Ltd. | Dielectric resonator oscillator and down converter using the same |
| CN103811832A (en) * | 2012-11-08 | 2014-05-21 | 华为技术有限公司 | Filter, receiver, transmitter and transceiver |
| CN203734619U (en) * | 2014-01-09 | 2014-07-23 | 南京熊猫电子股份有限公司 | High-stability media oscillation source |
| CN205864371U (en) * | 2016-07-20 | 2017-01-04 | 深圳市华讯星通讯有限公司 | Media resonant oscillator |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018014780A1 (en) | 2018-01-25 |
| CN106059499A (en) | 2016-10-26 |
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