CN106054056A - Method for acquiring IGBT failure information - Google Patents

Method for acquiring IGBT failure information Download PDF

Info

Publication number
CN106054056A
CN106054056A CN201610444134.1A CN201610444134A CN106054056A CN 106054056 A CN106054056 A CN 106054056A CN 201610444134 A CN201610444134 A CN 201610444134A CN 106054056 A CN106054056 A CN 106054056A
Authority
CN
China
Prior art keywords
igbt
parameter
drive circuit
module
described igbt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610444134.1A
Other languages
Chinese (zh)
Inventor
谢峰
叶林
郭辰
吴凡
张伟
臧孟涛
吕航
吕一航
周党生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huaneng Eryuan Wind Power Generation Co Ltd
Huaneng Renewables Corp Ltd
Original Assignee
Huaneng Eryuan Wind Power Generation Co Ltd
Huaneng Renewables Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huaneng Eryuan Wind Power Generation Co Ltd, Huaneng Renewables Corp Ltd filed Critical Huaneng Eryuan Wind Power Generation Co Ltd
Publication of CN106054056A publication Critical patent/CN106054056A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/27Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements

Abstract

The invention is applicable in the technical field of electronics, and provides a method for acquiring IGBT (Insulated Gate Bipolar Transistor) failure information. The method comprises the following steps: acquiring at least one IGBT parameter of an IGBT module; judging whether the IGBT module has a failure sign according to the acquired IGBT parameter; and when the IGBT module has a failure sign, storing the IGBT parameter within a preset time. By adopting the method, the IGBT failure information can be acquired, and the IGBT failure reason can be positioned.

Description

The acquisition methods of IGBT fault message
Technical field
The invention belongs to electronic technology field, particularly relate to the acquisition methods of a kind of IGBT fault message.
Background technology
IGBT is widely used in large power power electronic appliance as the power semiconductor of generation excellent performance, The field such as such as wind-force generating converter, photovoltaic DC-to-AC converter, high-low pressure converter, electric automobile, but be as IGBT device and exist Use in these devices is more and more extensive, and the economic loss caused due to the damage of IGBT device is the most increasing, such as, send out Equipment generates electricity electricity less, the unexpected stall of motor causes fault etc..Chip often appearance internal after general IGBT device damage is complete Non-, it is difficult to judge failure cause from the IGBT device lost efficacy, causes to improve up from design, make IGBT device Application enhancements is extremely difficult.
In prior art, some driver is prevented on the life failure of IGBT, and such as Chinese Patent Application No. is 201110097266.9, in patent documentation entitled " a kind of IGBT early warning method for failure ", become by the thermal resistance of detection IGBT Change and carry out the life failure feature that early warning IGBT module causes due to fatigue.This patent only have detected about in life failure one Divide failure phenomenon, and this feature the most seldom occurs.And for example Chinese Patent Application No. be 201210446218.0, name It is referred to as that the patent documentation of " IGBT failure detector circuit " discloses one to be judged by a series of testing circuit The method that IGBT lost efficacy, but simply quote the fault message of IGBT and whether damage, can not effectively record relevant IGBT The fault message occurred, thus the IGBT lost efficacy can not be carried out failure cause analysis.
Summary of the invention
The purpose of the embodiment of the present invention is to provide the acquisition methods of a kind of IGBT fault message, it is intended to solve existing The problem that IGBT fault message cannot obtain.
The embodiment of the present invention is achieved in that the acquisition methods of a kind of IGBT fault message, and described method includes as follows Step:
Gather at least one IGBT parameter of IGBT module;
Judge whether described IGBT module exists inefficacy sign according to the described IGBT parameter collected;
Described IGBT parameter when there is inefficacy sign, in storage Preset Time.
Further, described Preset Time is a preset time period before and after IGBT module fault occurs.
Further, described IGBT module is IGBT drive circuit and/or IGBT device.
Further, described IGBT parameter is described IGBT drive circuit and/or the driving voltage of IGBT device, colelctor electrode Voltage, Vce saturation voltage drop, collector current, emitter current, shell temperature.
Further, it is concrete that the IGBT parameter that described basis collects judges whether described IGBT module exists inefficacy sign Including:
The value of the IGBT parameter collected described in Bi compare and predetermined threshold value;
Decide whether to there is inefficacy sign according to comparative result.
The method of the embodiment of the present invention, may be used for the high-power electric in the fields such as wind-power electricity generation, photovoltaic generation, converter The diagnosis of IGBT failure of removal and analysis in electronic installation, by the anticipation losing efficacy IGBT module, and when storage was lost efficacy in time Various parameters, failure cause is positioned, effectively reduces fault rate and the maintenance cost of power electronic equipment, there is good warp Ji benefit.
Accompanying drawing explanation
Fig. 1 is the flow chart of the acquisition methods of the IGBT fault message that the embodiment of the present invention one provides.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, right The present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, and It is not used in the restriction present invention.
As it is shown in figure 1, the embodiment of the present invention proposes the acquisition methods of a kind of IGBT fault message, comprise the steps:
S1, at least one IGBT parameter of collection IGBT module;Described IGBT module is IGBT drive circuit and/or IGBT Device.The driving voltage of IGBT, collector voltage, Vce saturation voltage drop, collector current, shell temperature can be gathered by sample circuit One of them parameter;Or gather Vce saturation voltage drop and collector current;Or gather driving voltage and Vce saturation pressure Fall;Or gather driving voltage, Vce saturation voltage drop and collector current.The information simultaneously these collected is by sampling Circuit (a/d converter) changes into digital information, in no write de-lay RAM.Specifically, can be driven by gate pole G, E terminal test of IGBT Galvanic electricity pressure, is detected and Vce saturation voltage by C, E terminal test collector voltage of IGBT, is internally integrated by IGBT module NTC resistance detection shell temperature, use current coil through IGBT power terminal detection collector current/emitter current.
The IGBT parameter collected described in S2, basis judges whether described IGBT module exists inefficacy sign;Pass through IGBT The processors such as DSP, ARM, FPGA in driving means are by information and predetermined threshold value such as the IGBT voltage detected, electric current, temperature Parameter compares, it is judged that IGBT whether have inefficacy sign, described predetermined threshold value be test empirical value or Theoretical Calculation obtain Reasonable approximation.
S3, when there is inefficacy sign, storage Preset Time in IGBT parameter.This Preset Time is IGBT module fault A preset time period before and after generation.
If have the faults such as overvoltage, overcurrent, excess temperature, trigger IGBT driving and make corresponding troubleshooting.Generally Occurred needing to report master control system when stream, the fault such as overheated, and blocked driving signal.After driver triggers fault, by driving Memory element storage record IGBT module on dynamic the device voltage of a period of time (10ms before and after such as), electricity before and after fault The IGBT parameters such as stream, temperature.This memorizer has power down and preserves function, prevents system cut-off from causing loss of data, such as, and storage Device connects the electric supply installation such as battery or electric capacity.
The method that the embodiment of the present invention one provides is by the anticipation losing efficacy IGBT module, and each during storage inefficacy in time Plant parameter, failure cause is positioned, effectively reduce fault rate and the maintenance cost of power electronic equipment, there is well economy effect Benefit.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention Any amendment, equivalent and the improvement etc. made within god and principle, should be included within the scope of the present invention.

Claims (8)

1. the acquisition methods of an IGBT fault message, it is characterised in that described method comprises the steps:
Gather at least one IGBT parameter of IGBT module;
Judge whether described IGBT module exists inefficacy sign according to the described IGBT parameter collected;
Described IGBT parameter when there is inefficacy sign, in storage Preset Time.
2. the method for claim 1, it is characterised in that described Preset Time is pre-before and after IGBT module fault occurs If the time period.
3. method as claimed in claim 1, it is characterised in that described IGBT module is IGBT drive circuit and/or IGBT device.
4. method as claimed in claim 3, it is characterised in that described IGBT parameter be described IGBT drive circuit and/or The driving voltage of IGBT device, collector voltage, Vce saturation voltage drop, collector current, one of them parameter of shell temperature.
5. method as claimed in claim 3, it is characterised in that described IGBT parameter be described IGBT drive circuit and/or The Vce saturation voltage drop of IGBT device and the combination of collector current.
6. method as claimed in claim 3, it is characterised in that described IGBT parameter be described IGBT drive circuit and/or The driving voltage of IGBT device and the combination of Vce saturation voltage drop.
7. method as claimed in claim 3, it is characterised in that described IGBT parameter be described IGBT drive circuit and/or The driving voltage of IGBT device, Vce saturation voltage drop and the combination of collector current.
8. the method as according to any one of Claims 1-4, it is characterised in that the IGBT parameter that described basis collects is sentenced Whether disconnected described IGBT module exists inefficacy sign specifically includes:
The value of the IGBT parameter collected described in Bi compare and predetermined threshold value;
Decide whether to there is inefficacy sign according to comparative result.
CN201610444134.1A 2016-04-08 2016-06-20 Method for acquiring IGBT failure information Pending CN106054056A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610214084 2016-04-08
CN2016102140848 2016-04-08

Publications (1)

Publication Number Publication Date
CN106054056A true CN106054056A (en) 2016-10-26

Family

ID=57168597

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610444134.1A Pending CN106054056A (en) 2016-04-08 2016-06-20 Method for acquiring IGBT failure information

Country Status (1)

Country Link
CN (1) CN106054056A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108072819A (en) * 2016-11-10 2018-05-25 西门子公司 The abatement detecting method and device of IGBT
CN110161396A (en) * 2018-02-13 2019-08-23 通用汽车环球科技运作有限责任公司 The health evaluating based on thermal model of IGBT
CN112067966A (en) * 2020-09-19 2020-12-11 哈尔滨理工大学 Simulation type IGBT failure mechanism analysis system
CN112632843A (en) * 2020-12-30 2021-04-09 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) Electronic component fault management method and device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2416168B1 (en) * 2010-07-26 2013-05-15 Semikron Test bench for power electronic blocks.
CN103427809A (en) * 2012-05-21 2013-12-04 永济新时速电机电器有限责任公司 Protective circuit of insulated gate bipolar transistor
CN104133132A (en) * 2014-07-21 2014-11-05 中国东方电气集团有限公司 IGBT drive fault detection and diagnosis system
CA2852963A1 (en) * 2013-06-13 2014-12-13 General Electric Company Insulated gate bipolar transistor failure mode detection and protection system and method
CN204462763U (en) * 2015-04-02 2015-07-08 西安捷航电子科技有限公司 A kind of drive and protection device of high-power IGBT
CN105242189A (en) * 2015-10-13 2016-01-13 中国人民解放军海军工程大学 IGBT health state monitoring method based on saturation voltage drop of emitter collector and voidage of solder layer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2416168B1 (en) * 2010-07-26 2013-05-15 Semikron Test bench for power electronic blocks.
CN103427809A (en) * 2012-05-21 2013-12-04 永济新时速电机电器有限责任公司 Protective circuit of insulated gate bipolar transistor
CA2852963A1 (en) * 2013-06-13 2014-12-13 General Electric Company Insulated gate bipolar transistor failure mode detection and protection system and method
CN104133132A (en) * 2014-07-21 2014-11-05 中国东方电气集团有限公司 IGBT drive fault detection and diagnosis system
CN204462763U (en) * 2015-04-02 2015-07-08 西安捷航电子科技有限公司 A kind of drive and protection device of high-power IGBT
CN105242189A (en) * 2015-10-13 2016-01-13 中国人民解放军海军工程大学 IGBT health state monitoring method based on saturation voltage drop of emitter collector and voidage of solder layer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108072819A (en) * 2016-11-10 2018-05-25 西门子公司 The abatement detecting method and device of IGBT
CN108072819B (en) * 2016-11-10 2021-07-30 西门子公司 IGBT failure detection method and device
CN110161396A (en) * 2018-02-13 2019-08-23 通用汽车环球科技运作有限责任公司 The health evaluating based on thermal model of IGBT
CN112067966A (en) * 2020-09-19 2020-12-11 哈尔滨理工大学 Simulation type IGBT failure mechanism analysis system
CN112067966B (en) * 2020-09-19 2022-07-05 哈尔滨理工大学 Simulation type IGBT failure mechanism analysis system
CN112632843A (en) * 2020-12-30 2021-04-09 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) Electronic component fault management method and device

Similar Documents

Publication Publication Date Title
Givi et al. Switch and diode fault diagnosis in nonisolated DC–DC converters using diode voltage signature
CN106054056A (en) Method for acquiring IGBT failure information
CN101344572B (en) Chopped wave test circuit and method for semiconductor power device
CN108614167B (en) Power component fault recording and diagnosing system and method
CN102545639B (en) For regulating the circuit of direct voltage and method and electric power converter
Patil et al. Anomaly detection for IGBTs using Mahalanobis distance
CN107121629B (en) Detection device and method for judging failure of power electronic module
CN102970012A (en) On-off output module with diagnosing function
CN111258303B (en) Servo system fault detection method and device, computer equipment and storage medium
CN112986784B (en) Abnormity identification method and device for high-power welding type IGBT module
CN102347753A (en) Reset circuit and apparatus including the reset circuit
CN103278692B (en) Brake circuit of wind power generation converter detection method
CN107204613B (en) A kind of over-pressure safety device and method
CN108138686A (en) Vehicle-mounted semiconductor device
CN105049010B (en) A kind of IGBT current foldback circuit and its method
Anderson et al. Online algorithm for early stage fault detection in IGBT switches
CN110927552A (en) On-line monitoring VCE_ONFailure prediction method and device for IGBT power module of auxiliary inverter
CN115828743A (en) IGBT service life estimation method and device, electronic equipment and storage medium
CN110557058A (en) starting protection method and circuit for direct-current brushless motor
CN205800813U (en) A kind of multichannel battery temperature fault control circuit
CN112829586B (en) Method and device for monitoring fuse and electric automobile
CN108896902B (en) BMS single acquisition circuit fault diagnosis circuit, system and method
CN114069568A (en) Short-circuit protection circuit of SiC MOSFET driver
CN206074145U (en) A kind of multichannel temperature fault diagnosis circuit
O'Connor et al. Near real-time incipient fault detection in IGBT switches

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20161026

RJ01 Rejection of invention patent application after publication