CN106047281A - Sealant for power electronic devices - Google Patents
Sealant for power electronic devices Download PDFInfo
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- CN106047281A CN106047281A CN201610369271.3A CN201610369271A CN106047281A CN 106047281 A CN106047281 A CN 106047281A CN 201610369271 A CN201610369271 A CN 201610369271A CN 106047281 A CN106047281 A CN 106047281A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J191/00—Adhesives based on oils, fats or waxes; Adhesives based on derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Inorganic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention relates to a sealant for power electronic devices. The sealant is prepared from, by mass, 18-22 parts of methyl-tri-butanone-oxime silane, 20-24 parts of aluminum oxide, 16-20 parts of butyl rubber, 14-18 parts of polyisobutylene, 20-24 parts of a silane coupling agent, 16-20 parts of methylene diphenyl diisocyanate, 14-18 parts of sericite powder, 16-20 parts of bisphenol A-type epoxy resin, 14-18 parts of magnesite powder, 20-24 parts of neonicotinoid efficient pesticide, 16-20 parts of polydimethylsiloxane, 16-20 parts of toluene diisocyanate, 14-18 parts of polyoxyethylene ether, 20-24 parts of glass fibers, 16-20 parts of dimethyl adipate, 14-18 parts of trinonyl benzene-1,2,4-tricarboxylate, 20-24 parts of tributyl phosphate, 16-20 parts of aminopropyltriethoxysilane and 10000-20000 parts of castor oil. The product has good pressure flow viscosity, Shore hardness, shear strength, elongation at break and tensile strength, high pressure-resistant sealing performance and excellent properties.
Description
Technical field
The present invention relates to a kind of power electronic devices fluid sealant, belong to fluid sealant technical field.
Background technology
Power electronic devices (Power Electronic Device) is also called power semiconductor, is mainly used in electricity
(being often referred to electric current is tens of to thousands of peace, voltage for the transformation of electrical energy of power equipment and the powerful electronic device of control circuit aspect
More than hundreds of volts).Power device is almost for all of electronics manufacturing, including the notebook of computer realm, PC, service
Device, display and various peripheral hardware；The mobile phone of network communication field, phone and other various terminals and local side apparatus；Consumption
Traditional black and white household electrical appliances of electronic applications and various digital product；The Industrial PC of Industry Control apoplexy due to endogenous wind, all kinds of instrument and meter and all kinds of
Control equipment etc..Except ensure these equipment properly functioning in addition to, power device can also play effective energy-conserving action.Due to
What the demand of electronic product and efficiency required improves constantly, and China power device market is always maintained at development speed faster.
During the installation of power electronic devices and use, it is often necessary to use fluid sealant, in order to realize the sealing of power electronic devices
Install and use effect, it is necessary to provide suitable fluid sealant.
Summary of the invention
It is an object of the invention to provide a kind of power electronic devices fluid sealant, in order to power electronics device is better achieved
The sealing of part and install and use effect.
To achieve these goals, technical scheme is as follows.
A kind of power electronic devices fluid sealant, is made up of the component of following mass fraction: methyl tributanoximo silane
18～22 parts, aluminium sesquioxide 20～24 parts, butyl rubber 16～20 parts, polyisobutylene 14～18 parts, silane coupler 20～
24 parts, methyl diphenylene diisocyanate 16～20 parts, sericite in powder 14～18 parts, bisphenol A type epoxy resin 16～20 parts, Pedicellus et Pericarpium Trapae
Magnesium slag 14～18 parts, give a tongue-lashing worm quinoline 20～24 parts, polydimethylsiloxane 16～20 parts, toluene di-isocyanate(TDI) 16～20 parts,
Polyoxyethylene ether 14～18 parts, glass fibre 20～24 parts, dimethyl adipate 16～20 parts, tri trimellitate nonyl ester 14～18
Part, tributyl phosphate 20～24 parts, aminopropyl triethoxysilane 16～20 parts, Oleum Ricini 10000～20000 parts.
Further, above-mentioned power electronic devices fluid sealant, it is made up of the component of following mass fraction: methyl three butanone
Oximino silane 18 parts, aluminium sesquioxide 20 parts, butyl rubber 16 parts, polyisobutylene 14 parts, silane coupler 20 parts, diphenylmethyl
Alkane diisocyanate 16 parts, sericite in powder 14 parts, bisphenol A type epoxy resin 16 parts, magnesite powder 14 parts, give a tongue-lashing worm quinoline 20 parts, poly-
Dimethyl siloxane 16 parts, toluene di-isocyanate(TDI) 16 parts, polyoxyethylene ether 14 parts, glass fibre 20 parts, dimethyl adipate
16 parts, tri trimellitate nonyl ester 14 parts, tributyl phosphate 20 parts, aminopropyl triethoxysilane 16 parts, Oleum Ricini 10000 parts.
Further, above-mentioned power electronic devices fluid sealant, it is made up of the component of following mass fraction: methyl three butanone
Oximino silane 20 parts, aluminium sesquioxide 22 parts, butyl rubber 18 parts, polyisobutylene 16 parts, silane coupler 22 parts, diphenylmethyl
Alkane diisocyanate 18 parts, sericite in powder 16 parts, bisphenol A type epoxy resin 18 parts, magnesite powder 16 parts, give a tongue-lashing worm quinoline 22 parts, poly-
Dimethyl siloxane 18 parts, toluene di-isocyanate(TDI) 18 parts, polyoxyethylene ether 16 parts, glass fibre 22 parts, dimethyl adipate
18 parts, tri trimellitate nonyl ester 16 parts, tributyl phosphate 22 parts, aminopropyl triethoxysilane 18 parts, Oleum Ricini 15000 parts.
Further, above-mentioned power electronic devices fluid sealant, it is made up of the component of following mass fraction: methyl three butanone
Oximino silane 22 parts, aluminium sesquioxide 24 parts, butyl rubber 20 parts, polyisobutylene 18 parts, silane coupler 24 parts, diphenylmethyl
Alkane diisocyanate 20 parts, sericite in powder 18 parts, bisphenol A type epoxy resin 20 parts, magnesite powder 18 parts, give a tongue-lashing worm quinoline 24 parts, poly-
Dimethyl siloxane 20 parts, toluene di-isocyanate(TDI) 20 parts, polyoxyethylene ether 18 parts, glass fibre 24 parts, dimethyl adipate
20 parts, tri trimellitate nonyl ester 18 parts, tributyl phosphate 24 parts, aminopropyl triethoxysilane 20 parts, Oleum Ricini 20000 parts.
Further, described aluminium sesquioxide is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30～
50 mesh, 50～80 mesh, 80～100 mesh, the mixing quality ratio of above-mentioned three kinds of aluminium sesquioxide is 3～5: 4～8: 1.
Further, described sericite in powder is made up of the powder body of three kinds of particle diameter mesh numbers, and its particle diameter mesh number is respectively 30～50
Mesh, 50～80 mesh, 80～100 mesh, the mixing quality ratio of above-mentioned three kinds of sericites in powder is 3～5: 4～8: 1.
Further, described Semen Ricini oil viscosity is 12000～14000mpa.s at 25 DEG C.
Further, described magnesite powder is made up of the powder body of three kinds of particle diameter mesh numbers, and its particle diameter mesh number is respectively 20～50
Mesh, 50～70 mesh, 70～90 mesh, the mixing quality ratio of above-mentioned three kinds of magnesite powders is 2～4: 3～5: 1.
Further, the viscosity of described bisphenol A type epoxy resin is 8000～10000mpa.s at 25 DEG C.
Further, above-mentioned power electronic devices fluid sealant preparation method step is as follows:
(1) by the methyl tributanoximo silane of described mass fraction, aluminium sesquioxide, butyl rubber, polyisobutylene, silicon
Alkane coupling agent, bisphenol A type epoxy resin, magnesite powder, give a tongue-lashing worm quinoline, polydimethylsiloxane, aminopropyl triethoxysilane add
Enter in the Oleum Ricini of above-mentioned mass fraction, from room temperature to heat up the speed of 3～5 DEG C per hour, warming while stirring to 70～90
DEG C, stir, then let cool to room temperature in the way of 5～10 DEG C to lower the temperature per hour, obtain mixture A:
(2) in mixture A, the toluene di-isocyanate(TDI) of above-mentioned mass fraction, polyoxyethylene ether, glass fibre are added, from
Room temperature to heat up the speed of 5～8 DEG C per hour, warming while stirring to 80～90 DEG C, and keep 1～3h at 80～90 DEG C, from
So it is cooled to room temperature, obtains mixture B；
(3) in mixture B, add the dimethyl adipate of above-mentioned mass fraction, tri trimellitate nonyl ester, tricresyl phosphate fourth
Ester, from room temperature to heat up the speed of 8～10 DEG C per hour, warming while stirring to 70～90 DEG C, under stirring in 70～
90 DEG C keep 1～3h, naturally cool to room temperature, obtain mixture C；
(4) in mixture C, add the remaining ingredient of above-mentioned mass fraction, vacuum be-0.06～-0.1Mpa true
Under empty condition, from room temperature to heat up the speed of 1～3 DEG C per hour, warming while stirring to 50～70 DEG C, stir, cooling
To room temperature, obtain this product.
This beneficial effect of the invention is: this power electronic devices is simple with fluid sealant process of preparing, prepared
Product has good press flow viscosity, shore hardness, shear strength, elongation at break, hot strength, its pressure-resistant stopping property is high,
Excellent performance, is suitable for using at multiple fields, improves properties of product, process easy to use.
Detailed description of the invention
Below in conjunction with embodiment, the detailed description of the invention of the present invention is described, in order to be better understood from the present invention.
Embodiment 1
Power electronic devices fluid sealant in the present embodiment, is made up of the component of following mass fraction: methyl three butanone
Oximino silane 18 parts, aluminium sesquioxide 20 parts, butyl rubber 16 parts, polyisobutylene 14 parts, silane coupler 20 parts, diphenylmethyl
Alkane diisocyanate 16 parts, sericite in powder 14 parts, bisphenol A type epoxy resin 16 parts, magnesite powder 14 parts, give a tongue-lashing worm quinoline 20 parts, poly-
Dimethyl siloxane 16 parts, toluene di-isocyanate(TDI) 16 parts, polyoxyethylene ether 14 parts, glass fibre 20 parts, dimethyl adipate
16 parts, tri trimellitate nonyl ester 14 parts, tributyl phosphate 20 parts, aminopropyl triethoxysilane 16 parts, Oleum Ricini 10000 parts.
Described aluminium sesquioxide is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30～50 mesh, 50～
80 mesh, 80～100 mesh, the mixing quality ratio of above-mentioned three kinds of aluminium sesquioxide is 3: 4: 1.
Described sericite in powder is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30～50 mesh, 50～80
Mesh, 80～100 mesh, the mixing quality ratio of above-mentioned three kinds of sericites in powder is 3: 4: 1.
Described Semen Ricini oil viscosity is 12000mpa.s at 25 DEG C.
Described magnesite powder is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 20～50 mesh, 50～70
Mesh, 70～90 mesh, the mixing quality ratio of above-mentioned three kinds of magnesite powders is 2: 3: 1.
The viscosity of described bisphenol A type epoxy resin is 8000mpa.s at 25 DEG C.
Above-mentioned power electronic devices fluid sealant preparation method step is as follows:
(1) by the methyl tributanoximo silane of described mass fraction, aluminium sesquioxide, butyl rubber, polyisobutylene, silicon
Alkane coupling agent, bisphenol A type epoxy resin, magnesite powder, give a tongue-lashing worm quinoline, polydimethylsiloxane, aminopropyl triethoxysilane add
Enter in the Oleum Ricini of above-mentioned mass fraction, from room temperature to heat up the speed of 3 DEG C per hour, warming while stirring to 70 DEG C, stirring
Uniformly, then let cool to room temperature in the way of 5 DEG C to lower the temperature per hour, obtain mixture A；
(2) in mixture A, the toluene di-isocyanate(TDI) of above-mentioned mass fraction, polyoxyethylene ether, glass fibre are added, from
Room temperature to heat up the speed of 5 DEG C per hour, warming while stirring to 80 DEG C, and keep 3h at 80 DEG C, naturally cool to room temperature,
To mixture B；
(3) in mixture B, add the dimethyl adipate of above-mentioned mass fraction, tri trimellitate nonyl ester, tricresyl phosphate fourth
Ester, from room temperature to heat up the speed of 8 DEG C per hour, warming while stirring to 70 DEG C, under stirring, keep 3h in 70 DEG C, from
So it is cooled to room temperature, obtains mixture C；
(4) in mixture C, add the remaining ingredient of above-mentioned mass fraction, be the vacuum condition of-0.06Mpa in vacuum
Under, from room temperature to heat up the speed of 1 DEG C per hour, warming while stirring to 50 DEG C, stir, be cooled to room temperature, obtain this
Product.
Embodiment 2
Power electronic devices fluid sealant in the present embodiment, is made up of the component of following mass fraction: methyl three butanone
Oximino silane 20 parts, aluminium sesquioxide 22 parts, butyl rubber 18 parts, polyisobutylene 16 parts, silane coupler 22 parts, diphenylmethyl
Alkane diisocyanate 18 parts, sericite in powder 16 parts, bisphenol A type epoxy resin 18 parts, magnesite powder 16 parts, give a tongue-lashing worm quinoline 22 parts, poly-
Dimethyl siloxane 18 parts, toluene di-isocyanate(TDI) 18 parts, polyoxyethylene ether 16 parts, glass fibre 22 parts, dimethyl adipate
18 parts, tri trimellitate nonyl ester 16 parts, tributyl phosphate 22 parts, aminopropyl triethoxysilane 18 parts, Oleum Ricini 15000 parts.
Described aluminium sesquioxide is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30～50 mesh, 50～
80 mesh, 80～100 mesh, the mixing quality ratio of above-mentioned three kinds of aluminium sesquioxide is 4: 6: 1.
Described sericite in powder is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30～50 mesh, 50～80
Mesh, 80～100 mesh, the mixing quality ratio of above-mentioned three kinds of sericites in powder is 4: 6: 1.
Described Semen Ricini oil viscosity is 13000mpa.s at 25 DEG C.
Described magnesite powder is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 20～50 mesh, 50～70
Mesh, 70～90 mesh, the mixing quality ratio of above-mentioned three kinds of magnesite powders is 3: 4: 1.
The viscosity of described bisphenol A type epoxy resin is 9000mpa.s at 25 DEG C.
Above-mentioned power electronic devices fluid sealant preparation method step is as follows:
(1) by the methyl tributanoximo silane of described mass fraction, aluminium sesquioxide, butyl rubber, polyisobutylene, silicon
Alkane coupling agent, bisphenol A type epoxy resin, magnesite powder, give a tongue-lashing worm quinoline, polydimethylsiloxane, aminopropyl triethoxysilane add
Enter in the Oleum Ricini of above-mentioned mass fraction, from room temperature to heat up the speed of 4 DEG C per hour, warming while stirring to 80 DEG C, stirring
Uniformly, then let cool to room temperature in the way of 8 DEG C to lower the temperature per hour, obtain mixture A；
(2) in mixture A, the toluene di-isocyanate(TDI) of above-mentioned mass fraction, polyoxyethylene ether, glass fibre are added, from
Room temperature to heat up the speed of 6 DEG C per hour, warming while stirring to 85 DEG C, and keep 2h at 85 DEG C, naturally cool to room temperature,
To mixture B；
(3) in mixture B, add the dimethyl adipate of above-mentioned mass fraction, tri trimellitate nonyl ester, tricresyl phosphate fourth
Ester, from room temperature to heat up the speed of 9 DEG C per hour, warming while stirring to 80 DEG C, under stirring, keep 2h in 80 DEG C, from
So it is cooled to room temperature, obtains mixture C；
(4) in mixture C, add the remaining ingredient of above-mentioned mass fraction, be the vacuum condition of-0.08Mpa in vacuum
Under, from room temperature to heat up the speed of 2 DEG C per hour, warming while stirring to 60 DEG C, stir, be cooled to room temperature, obtain this
Product.
Embodiment 3
Power electronic devices fluid sealant in the present embodiment, is made up of the component of following mass fraction: methyl three butanone
Oximino silane 22 parts, aluminium sesquioxide 24 parts, butyl rubber 20 parts, polyisobutylene 18 parts, silane coupler 24 parts, diphenylmethyl
Alkane diisocyanate 20 parts, sericite in powder 18 parts, bisphenol A type epoxy resin 20 parts, magnesite powder 18 parts, give a tongue-lashing worm quinoline 24 parts, poly-
Dimethyl siloxane 20 parts, toluene di-isocyanate(TDI) 20 parts, polyoxyethylene ether 18 parts, glass fibre 24 parts, dimethyl adipate
20 parts, tri trimellitate nonyl ester 18 parts, tributyl phosphate 24 parts, aminopropyl triethoxysilane 20 parts, Oleum Ricini 20000 parts.
Described aluminium sesquioxide is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30～50 mesh, 50～
80 mesh, 80～100 mesh, the mixing quality ratio of above-mentioned three kinds of aluminium sesquioxide is 5: 8: 1.
Described sericite in powder is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30～50 mesh, 50～80
Mesh, 80～100 mesh, the mixing quality ratio of above-mentioned three kinds of sericites in powder is 5: 8: 1.
Described Semen Ricini oil viscosity is 14000mpa.s at 25 DEG C.
Described magnesite powder is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 20～50 mesh, 50～70
Mesh, 70～90 mesh, the mixing quality ratio of above-mentioned three kinds of magnesite powders is 4: 5: 1.
The viscosity of described bisphenol A type epoxy resin is 10000mpa.s at 25 DEG C.
Above-mentioned power electronic devices fluid sealant preparation method step is as follows:
(1) by the methyl tributanoximo silane of described mass fraction, aluminium sesquioxide, butyl rubber, polyisobutylene, silicon
Alkane coupling agent, bisphenol A type epoxy resin, magnesite powder, give a tongue-lashing worm quinoline, polydimethylsiloxane, aminopropyl triethoxysilane add
Enter in the Oleum Ricini of above-mentioned mass fraction, from room temperature to heat up the speed of 5 DEG C per hour, warming while stirring to 90 DEG C, stirring
Uniformly, then let cool to room temperature in the way of 10 DEG C to lower the temperature per hour, obtain mixture A；
(2) in mixture A, the toluene di-isocyanate(TDI) of above-mentioned mass fraction, polyoxyethylene ether, glass fibre are added, from
Room temperature to heat up the speed of 8 DEG C per hour, warming while stirring to 90 DEG C, and keep 1h at 90 DEG C, naturally cool to room temperature,
To mixture B；
(3) in mixture B, add the dimethyl adipate of above-mentioned mass fraction, tri trimellitate nonyl ester, tricresyl phosphate fourth
Ester, from room temperature to heat up the speed of 10 DEG C per hour, warming while stirring to 90 DEG C, under stirring, keep 1h in 90 DEG C,
Naturally cool to room temperature, obtain mixture C；
(4) in mixture C, add the remaining ingredient of above-mentioned mass fraction, be the vacuum condition of-0.1Mpa in vacuum
Under, from room temperature to heat up the speed of 3 DEG C per hour, warming while stirring to 70 DEG C, stir, naturally cool to room temperature,
To this product.
Embodiment 1, embodiment 2 and embodiment 3 and certain commercially available prod are carried out performance test as a control group, and result is such as
Under:
Result from upper table it can be seen that fluid sealant that the present invention provides have good press flow viscosity, shore hardness,
Shear strength, elongation at break, hot strength, its pressure-resistant stopping property is high, excellent performance.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (10)
1. a power electronic devices fluid sealant, it is characterised in that: it is made up of the component of following mass fraction: methyl three butanone
Oximino silane 18～22 parts, aluminium sesquioxide 20～24 parts, butyl rubber 16～20 parts, polyisobutylene 14～18 parts, silane are occasionally
Connection agent 20～24 parts, methyl diphenylene diisocyanate 16～20 parts, sericite in powder 14～18 parts, bisphenol A type epoxy resin 16
～20 parts, magnesite powder 14～18 parts, give a tongue-lashing worm quinoline 20～24 parts, polydimethylsiloxane 16～20 parts, toluene di-isocyanate(TDI)
16～20 parts, polyoxyethylene ether 14～18 parts, glass fibre 20～24 parts, dimethyl adipate 16～20 parts, tri trimellitate
Nonyl ester 14～18 parts, tributyl phosphate 20～24 parts, aminopropyl triethoxysilane 16～20 parts, Oleum Ricini 10000～20000
Part.
Power electronic devices fluid sealant the most according to claim 1, it is characterised in that: described power electronic devices is with close
Sealing is made up of the component of following mass fraction: methyl tributanoximo silane 18 parts, aluminium sesquioxide 20 parts, butyl rubber 16
Part, polyisobutylene 14 parts, silane coupler 20 parts, methyl diphenylene diisocyanate 16 parts, sericite in powder 14 parts, bisphenol A-type
Epoxy resin 16 parts, magnesite powder 14 parts, give a tongue-lashing worm quinoline 20 parts, polydimethylsiloxane 16 parts, toluene di-isocyanate(TDI) 16 parts, poly-
Oxygen vinyl Ether 14 parts, glass fibre 20 parts, dimethyl adipate 16 parts, tri trimellitate nonyl ester 14 parts, tributyl phosphate 20 parts,
Aminopropyl triethoxysilane 16 parts, Oleum Ricini 10000 parts.
Power electronic devices fluid sealant the most according to claim 1, it is characterised in that: described power electronic devices is with close
Sealing is made up of the component of following mass fraction: methyl tributanoximo silane 20 parts, aluminium sesquioxide 22 parts, butyl rubber 18
Part, polyisobutylene 16 parts, silane coupler 22 parts, methyl diphenylene diisocyanate 18 parts, sericite in powder 16 parts, bisphenol A-type
Epoxy resin 18 parts, magnesite powder 16 parts, give a tongue-lashing worm quinoline 22 parts, polydimethylsiloxane 18 parts, toluene di-isocyanate(TDI) 18 parts, poly-
Oxygen vinyl Ether 16 parts, glass fibre 22 parts, dimethyl adipate 18 parts, tri trimellitate nonyl ester 16 parts, tributyl phosphate 22 parts,
Aminopropyl triethoxysilane about 18 parts, Oleum Ricini 15000 parts.
Power electronic devices fluid sealant the most according to claim 1, it is characterised in that: described power electronic devices is with close
Sealing is made up of the component of following mass fraction: methyl tributanoximo silane 22 parts, aluminium sesquioxide 24 parts, butyl rubber 20
Part, polyisobutylene 18 parts, silane coupler 24 parts, methyl diphenylene diisocyanate about 20 parts, sericite in powder 18 parts, bisphenol-A
Type epoxy resin 20 parts, magnesite powder about 18 parts, give a tongue-lashing worm quinoline 24 parts, polydimethylsiloxane 20 parts, toluene di-isocyanate(TDI) 20
Part, polyoxyethylene ether 18 parts, glass fibre 24 parts, dimethyl adipate 20 parts, tri trimellitate nonyl ester 18 parts, tributyl phosphate
24 parts, aminopropyl triethoxysilane 20 parts, Oleum Ricini 20000 parts.
Power electronic devices fluid sealant the most according to claim 1, it is characterised in that: described aluminium sesquioxide is by three kinds
The powder body composition of particle diameter mesh number, its particle diameter mesh number is respectively 30～50 mesh, 50～80 mesh, 80～100 mesh, above-mentioned three kind of three oxidation
The mixing quality ratio of two aluminum is 3～5: 4～8: 1.
Power electronic devices fluid sealant the most according to claim 1, it is characterised in that: described sericite in powder is by three kinds of grains
The powder body composition of footpath mesh number, its particle diameter mesh number is respectively 30～50 mesh, 50～80 mesh, 80～100 mesh, above-mentioned three kinds of sericites in powder
Mixing quality ratio be 3～5: 4～8: 1.
Power electronic devices fluid sealant the most according to claim 1, it is characterised in that: described Semen Ricini oil viscosity is 25
DEG C it is 12000～14000mpa.s.
Power electronic devices fluid sealant the most according to claim 1, it is characterised in that: described magnesite powder is by three kinds of grains
The powder body composition of footpath mesh number, its particle diameter mesh number is respectively 20～50 mesh, 50～70 mesh, 70～90 mesh, above-mentioned three kinds of magnesite powders
Mixing quality ratio be 2～4: 3～5: 1.
Power electronic devices fluid sealant the most according to claim 1, it is characterised in that: described bisphenol A type epoxy resin
Viscosity be 8000～10000mpa.s at 25 DEG C.
Power electronic devices fluid sealant the most according to claim 1, it is characterised in that: described power electronic devices is used
Fluid sealant preparation method step is as follows:
(1) by the methyl tributanoximo silane of described mass fraction, aluminium sesquioxide, butyl rubber, polyisobutylene, silane occasionally
Join agent, bisphenol A type epoxy resin, magnesite powder, give a tongue-lashing in worm quinoline, polydimethylsiloxane, aminopropyl triethoxysilane addition
State in the Oleum Ricini of mass fraction, from room temperature to heat up the speed of 3～5 DEG C per hour, warming while stirring to 70～90 DEG C, stir
Mix uniformly, then let cool to room temperature in the way of 5～10 DEG C to lower the temperature per hour, obtain mixture A；
(2) in mixture A, the toluene di-isocyanate(TDI) of above-mentioned mass fraction, polyoxyethylene ether, glass fibre are added, from room temperature
To heat up the speed of 5～8 DEG C per hour, warming while stirring to 80～90 DEG C, and keep 1～3h at 80～90 DEG C, the coldest
But to room temperature, mixture B is obtained；
(3) in mixture B, add the dimethyl adipate of above-mentioned mass fraction, tri trimellitate nonyl ester, tributyl phosphate, from
Room temperature is to heat up the speed of 8～10 DEG C per hour, and warming while stirring to 70～90 DEG C, in 70～90 DEG C of guarantors under stirring
Hold 1～3h, naturally cool to room temperature, obtain mixture C；
(4) in mixture C, the remaining ingredient of above-mentioned mass fraction is added, at the vacuum bar that vacuum is-0.06～-0.1Mpa
Under part, from room temperature to heat up the speed of 1～3 DEG C per hour, warming while stirring to 50～70 DEG C, stir, be cooled to room
Temperature, obtains this product.
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| CN201610369271.3A CN106047281A (en) | 2016-05-27 | 2016-05-27 | Sealant for power electronic devices |
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| CN201610369271.3A CN106047281A (en) | 2016-05-27 | 2016-05-27 | Sealant for power electronic devices |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106634109A (en) * | 2016-11-28 | 2017-05-10 | 四川正梁机械有限公司 | Sealant for automobile part production and machining power distribution cabinet |
| CN106634800A (en) * | 2016-12-15 | 2017-05-10 | 中山市得高行知识产权中心（有限合伙） | Sealant for mounting intelligent household air conditioner pipeline |
| CN106675040A (en) * | 2016-12-15 | 2017-05-17 | 中山市得高行知识产权中心（有限合伙） | Sealing material for electric power outdoor communication cabinet |
| CN106684231A (en) * | 2016-12-30 | 2017-05-17 | 江苏稳润光电有限公司 | Chip scale package (CSP) piece and package method |
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|---|---|---|---|---|
| CN106634109A (en) * | 2016-11-28 | 2017-05-10 | 四川正梁机械有限公司 | Sealant for automobile part production and machining power distribution cabinet |
| CN106634800A (en) * | 2016-12-15 | 2017-05-10 | 中山市得高行知识产权中心（有限合伙） | Sealant for mounting intelligent household air conditioner pipeline |
| CN106675040A (en) * | 2016-12-15 | 2017-05-17 | 中山市得高行知识产权中心（有限合伙） | Sealing material for electric power outdoor communication cabinet |
| CN106684231A (en) * | 2016-12-30 | 2017-05-17 | 江苏稳润光电有限公司 | Chip scale package (CSP) piece and package method |
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