CN106032022A - Pressing plate process for high-density chipboard - Google Patents
Pressing plate process for high-density chipboard Download PDFInfo
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- CN106032022A CN106032022A CN201510112952.7A CN201510112952A CN106032022A CN 106032022 A CN106032022 A CN 106032022A CN 201510112952 A CN201510112952 A CN 201510112952A CN 106032022 A CN106032022 A CN 106032022A
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- chipboard
- pressing plate
- density
- plate process
- pressing
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Abstract
The invention provides a pressing plate process for a high-density chipboard. Specific steps comprise: (1) tiling glue-containing melamine impregnated paper on the surface of a substrate chipboard; (2) through a transmission device, sending the substrate chipboard into a double-section hot press to perform plate pressing, plate pressing conditions being heating conduction oil to 210-230 DEG C, pressure being 18-20 kg, and time being 16-25 s. The pressing plate process is good in practicability. Through specific processing conditions, the processed chipboard substrate is bonded with paper in order, and the chipboard is non-scaling and does not crack in long-time use. The pressing plate process is suitable for requirement of large-scale industrial production.
Description
Technical field
The present invention relates to field of plate manufacture, especially a kind of high-density particleboard sheeting process.
Background technology
Particieboard is again particle board, bagasse board, and particieboard is to be primary raw material with wood particulate, then oozes and add glue, the slim sheet material that additive is repressed.Extruded wood chipboard, flat-press wood chipboard two class, this type of timber intensity extreme difference can be divided into by drawing method, be mainly used in furniture and building industry and train, automobile bodies manufacture.
Particieboard classification includes: 1. particieboard is divided by product density: low-density (0.25~0.45 gram per centimeter3), Midst density (0.55~0.70 gram per centimeter3) and high density (0.75~1.3 gram per centimeters3) 3 kinds, generally produce 0.65~0.75 gram per centimeter3The particieboard of density.Monolayer, three layers (including multilamellar) and grading structure is divided by structure of plate slab.
The specification of particieboard is more, and thickness is from 1.6~75 millimeters, and with 19 millimeters as standard thickness, usual thickness is 13,16,19 millimeters 3 kinds.
The production method of particieboard is different by its plate blank molding and heat pressing process equipment, is divided into flat-press process, squeezing and pressing method and roll-in method.Flat-press process is intermittent production, and squeezing and pressing method and roll-in method are consecutive productions.Based on flat-press process in actual production.Owing to particieboard its physical property aspect such as density, moisture content, water absorption, thickness swelling etc. of different size there are differences, it is thus desirable to develop the sheeting process adapted according to the particieboard of different size, so that the sheet material outward appearance neat appearance produced and durable in use.
Summary of the invention
The technical problem to be solved is to provide a kind of high-density particleboard sheeting process.
For solving above-mentioned technical problem, the technical scheme is that
A kind of high-density particleboard sheeting process, specifically comprises the following steps that
(1) melamine impregnated paper containing glue is laid in base material surface of chipboard;
(2) send into double tangent plane hot press center platen by transmitting equipment, pressing plate condition be conduction-oil warming to 210-230 DEG C, pressure 18-20kg, time 16-25s.
Preferably, above-specified high density particieboard sheeting process, described pressing plate condition be conduction-oil warming to 215 DEG C, pressure 19kg, time 18s.
The invention has the beneficial effects as follows:
Above-specified high density particieboard sheeting process, practical, by particular process condition, make the particieboard base material after processing regular with paper bonding, use non-scale for a long time, do not ftracture, be suitable for the needs that large-scale industrial produces.
Detailed description of the invention
In order to make those skilled in the art be better understood from technical scheme, below in conjunction with detailed description of the invention, technical scheme of the present invention is described in further detail.
Embodiment 1
A kind of high-density particleboard sheeting process, specifically comprises the following steps that
(1) melamine impregnated paper containing glue is laid in base material surface of chipboard;
(2) send into double tangent plane hot press center platen by transmitting equipment, pressing plate condition be conduction-oil warming to 215 DEG C, pressure 19kg, time 18s.
Embodiment 2
A kind of high-density particleboard sheeting process, specifically comprises the following steps that
(1) melamine impregnated paper containing glue is laid in base material surface of chipboard;
(2) send into double tangent plane hot press center platen by transmitting equipment, pressing plate condition be conduction-oil warming to 210 DEG C, pressure 20kg, time 16s.
Embodiment 3
A kind of high-density particleboard sheeting process, specifically comprises the following steps that
(1) melamine impregnated paper containing glue is laid in base material surface of chipboard;
(2) send into double tangent plane hot press center platen by transmitting equipment, pressing plate condition be conduction-oil warming to 230 DEG C, pressure 18kg, time 25s.
Embodiment 1 gained sheet material carrying out baking experiment, persistently toasts 48 hours in 70-80 DEG C of gas, sheet material is without peeling and cracking phenomena.
The above-mentioned detailed description this kind of high-density particleboard sheeting process carried out with reference to detailed description of the invention; it is illustrative rather than determinate; can according to restriction scope list several embodiments; therefore changing and modifications under without departing from present general inventive concept, within should belonging to protection scope of the present invention.
Claims (2)
1. a high-density particleboard sheeting process, it is characterised in that: specifically comprise the following steps that
(1) melamine impregnated paper containing glue is laid in base material surface of chipboard;
(2) by transmitting the double tangent plane hot press center platen of equipment feeding, pressing plate condition is heat conduction
Oil is heated up to 210-230 DEG C, pressure 18-20kg, time 16-25s.
High-density particleboard sheeting process the most according to claim 1, it is characterised in that:
Described pressing plate condition be conduction-oil warming to 215 DEG C, pressure 19kg, time 18s.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510112952.7A CN106032022A (en) | 2015-03-16 | 2015-03-16 | Pressing plate process for high-density chipboard |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510112952.7A CN106032022A (en) | 2015-03-16 | 2015-03-16 | Pressing plate process for high-density chipboard |
Publications (1)
Publication Number | Publication Date |
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CN106032022A true CN106032022A (en) | 2016-10-19 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201510112952.7A Pending CN106032022A (en) | 2015-03-16 | 2015-03-16 | Pressing plate process for high-density chipboard |
Country Status (1)
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CN (1) | CN106032022A (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101349079A (en) * | 2004-09-02 | 2009-01-21 | 邱则有 | Enclosed box-shaped shuttering |
CN101444924A (en) * | 2008-12-29 | 2009-06-03 | 张友全 | A panel decorated by synchronous relief melamine and the method of producing the same |
CN102049960A (en) * | 2009-11-11 | 2011-05-11 | 吴根水 | Resin impregnated cloth veneer and manufacture technology thereof |
CN102335934A (en) * | 2011-09-07 | 2012-02-01 | 深圳市拓奇实业有限公司 | High-gloss impregnated film adhesive veneer artificial board and manufacturing process thereof |
CN102873737A (en) * | 2012-10-22 | 2013-01-16 | 常州卫星装饰材料有限公司 | Melamine veneer particle board |
CN103707382A (en) * | 2013-12-27 | 2014-04-09 | 重庆星星套装门(集团)有限责任公司 | Production technology of melamine laminated board |
-
2015
- 2015-03-16 CN CN201510112952.7A patent/CN106032022A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101349079A (en) * | 2004-09-02 | 2009-01-21 | 邱则有 | Enclosed box-shaped shuttering |
CN101444924A (en) * | 2008-12-29 | 2009-06-03 | 张友全 | A panel decorated by synchronous relief melamine and the method of producing the same |
CN102049960A (en) * | 2009-11-11 | 2011-05-11 | 吴根水 | Resin impregnated cloth veneer and manufacture technology thereof |
CN102335934A (en) * | 2011-09-07 | 2012-02-01 | 深圳市拓奇实业有限公司 | High-gloss impregnated film adhesive veneer artificial board and manufacturing process thereof |
CN102873737A (en) * | 2012-10-22 | 2013-01-16 | 常州卫星装饰材料有限公司 | Melamine veneer particle board |
CN103707382A (en) * | 2013-12-27 | 2014-04-09 | 重庆星星套装门(集团)有限责任公司 | Production technology of melamine laminated board |
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Application publication date: 20161019 |
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