CN106028677A - Chip mounting method and apparatus - Google Patents
Chip mounting method and apparatus Download PDFInfo
- Publication number
- CN106028677A CN106028677A CN201610466989.4A CN201610466989A CN106028677A CN 106028677 A CN106028677 A CN 106028677A CN 201610466989 A CN201610466989 A CN 201610466989A CN 106028677 A CN106028677 A CN 106028677A
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- China
- Prior art keywords
- paster
- tray
- sandwich plate
- hollow
- furnace
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Abstract
The invention discloses a chip mounting method and apparatus. The chip mounting apparatus comprises a chip mounting tray, a chip mounting sandwich plate and a furnace-passing tray, wherein strip-shaped fixing hollow-out parts are arranged on the chip mounting sandwich plate; multiple element fixing hollow-out parts are arranged on each strip-shaped fixing hollow-out part; the chip mounting sandwich plate is arranged on the chip mounting tray; chip components are arranged on the element fixing hollow-out parts, and the welding structures of the chip components are close to the chip mounting tray; the furnace-passing tray is arranged on the chip mounting sandwich plate; the chip mounting tray is taken away, and solder paste is printed on the welding structures; plate-like structures are inserted into the strip-shaped fixing hollow-out parts to enable the welding structures to be in contact with the welding positions of the plate-like structures; and the plate-like structures are positioned below the furnace-passing tray, and are placed in a reflow furnace to be subjected to reflow soldering so as to enable the welding structures and the welding positions to be welded through the solder paste. By adoption of the chip mounting tray, the chip mounting sandwich plate and the furnace-passing tray, the chips are mounted firstly and then are printed with the solder paste, so that the chip mounting apparatus has the advantages of high chip mounting efficiency, high percent of pass of the products, capability of avoiding faulty soldering and cold soldering, and the like.
Description
Technical field
The present invention relates to paster welding technology field, especially relate to a kind of pasting method and device thereof.
Background technology
Surface mounting technology SMT (Surface Mounted Technology) is as a new generation's circuit assembly technology
Penetrate into every field.SMT product has that compact conformation, volume be little, vibration resistance, shock resistance, high frequency characteristics are good, production efficiency
Advantages of higher, SMT has occupied leading position in circuit board dress connection technique.
Along with assembly element size diminishes, packing density is more and more higher.On market, all paster technique flow processs are all first to make
With stencil printer by paste solder printing on the connection terminal of PCB plate, carry out paster the most again, after paster completes, just by it
Put into and reflow ovens carries out Reflow Soldering so that connect terminal and weld with the welding foot of paster.This pasting method is easily caused vacation
Weldering, rosin joint, make bad product increase, and conforming product rate is low, but also can affect paster efficiency.
Summary of the invention
In order to overcome the problems referred to above, the present invention provides a kind of paster efficiency product high, bad to reduce to society, product is qualified
High, be not result in dry joint and the pasting method of rosin joint and device thereof.
A kind of technical scheme of the present invention is: provides a kind of pasting method, comprises the steps:
Paster sandwich plate is arranged on paster tray by 100., and the element at described paster sandwich plate is fixed and arranged sheet in hollow-out parts
Linear element, and make the Welding Structure of described chip component near described paster tray；
200. are arranged on crossing furnace tray on described paster sandwich plate, take described paster tray away, in the weldering of described chip component
Print solder paste on access node structure；
300. strips that platy structure is inserted into described paster sandwich plate are fixed in hollow-out parts, make described Welding Structure with described
The welding position contact of platy structure；
400. make described platy structure be positioned at described cross the lower section of furnace tray and puts it into and carry out Reflow Soldering in reflow ovens so that
Described Welding Structure is welded with described welding position by tin cream.
As improvement of the present invention, in above-mentioned steps 100, also include: use the first fixing device by described paster
Sandwich plate is fixed on described paster tray.
As improvement of the present invention, in above-mentioned steps 200, also include: when taking described paster tray away, first dismantle institute
State the first fixing device.
As improvement of the present invention, in above-mentioned steps 200, also include: use the second fixing device by described paster
Sandwich plate is fixed on described mistake on furnace tray.
As improvement of the present invention, in above-mentioned steps 300, also include: use the 3rd fixing device by described tabular
Structure is fixed on described strip and fixes in hollow-out parts.
The another kind of technical scheme of the present invention is: provide a kind of paster apparatus, including paster tray, paster sandwich plate and mistake
Furnace tray, is provided with more than one strip on described paster sandwich plate and fixes hollow-out parts, fix at strip each described
Hollow-out parts is provided with some elements and fixes hollow-out parts；
Described paster sandwich plate is arranged on paster tray, fixes that at described element hollow-out parts arranging chip component, and
Make the Welding Structure of described chip component near described paster tray；Described furnace tray of crossing is arranged on described paster sandwich plate
On, take described paster tray away, print solder paste in described Welding Structure；Platy structure is inserted into described strip and fixes hollow out
In portion, described Welding Structure is made to contact with the welding position of described platy structure；Described platy structure is made to be positioned at described furnace tray excessively
Lower section and put it into reflow ovens carry out Reflow Soldering so that described Welding Structure is welded with described welding position by tin cream.
As improvement of the present invention, described paster tray is provided with at least string the first punch column, at least string
Second punch column and some first magnetic inserts, some described first magnetic inserts are embedded in described paster tray, institute
State the first magnetic inserts and be positioned at the two ends of described second punch column.
As improvement of the present invention, described paster sandwich plate is provided with some first air-vents, some first mistakes
Stove location hole, at least string the 3rd punch column and at least string the second magnetic inserts arrange, and described in a portion, first breathes freely
Hole is arranged on described strip and fixes in hollow-out parts, and described first crosses hole, stove location is arranged on the edge of described paster sandwich plate
Place.
As improvement of the present invention, it is provided with at least string the 4th punch column, at least string described mistake on furnace tray
5th punch column, some second air-vents, the some second stove excessively position hole and at least four the second locating dowel, some 3rd magnetic
Inserts is embedded in described mistake in furnace tray, and described 3rd magnetic inserts is positioned at the two ends of described 4th punch column, and described the
Two cross hole, stove location is arranged on the described edge crossing furnace tray.
As improvement of the present invention, also including the first fixing device, described first fixing device is by described paster interlayer
Plate is fixed on described paster tray.
As improvement of the present invention, also including the second fixing device, described second fixing device is by described paster interlayer
Plate is fixed on described mistake on furnace tray.
As improvement of the present invention, also including the 3rd fixing device, described 3rd fixing device is by described platy structure
It is fixed on described strip to fix in hollow-out parts.
Due to the fact that and have employed paster tray, paster sandwich plate and cross furnace tray, during paster, first by paster
Sandwich plate is arranged on paster tray, chip component is arranged on element and fixes in hollow-out parts；Then it is arranged on crossing furnace tray
On paster sandwich plate, take paster tray away, print solder paste in Welding Structure, after tin cream brush is complete, platy structure is inserted into bar
Shape is fixed in hollow-out parts, finally puts it into and carries out Reflow Soldering in reflow ovens；Thus it is recognised that the present invention is first paster brushes again
Tin cream, has the minimizing of paster efficiency product high, bad, the qualified height of product, is not result in the advantage such as dry joint and rosin joint.
Accompanying drawing explanation
Fig. 1 is the planar structure schematic diagram of paster tray in the present invention.
Fig. 2 is the planar structure schematic diagram of paster sandwich plate in the present invention.
Fig. 3 is the planar structure schematic diagram of the first location card article in the present invention.
Fig. 4 is the side-looking structural representation of Fig. 3.
Fig. 5 is the planar structure schematic diagram of the second location card article in the present invention.
Fig. 6 is the side-looking structural representation of Fig. 5.
Fig. 7 is the planar structure schematic diagram crossing furnace tray in the present invention.
Fig. 8 is the planar structure schematic diagram of locating groove bar in the present invention.
Fig. 9 is the planar structure schematic diagram of the 3rd fixing device in the present invention.
Wherein: 1. paster tray；11. first perforation；12. second perforation；13. first magnetic inserts；2. paster interlayer
Plate；21. strips fix hollow-out parts；Hollow-out parts fixed by 22. elements；23. the 3rd perforation；24. second magnetic inserts；25. first
Air-vent；26. first hole, location；27. second hole, location；28. first cross hole, stove location；31. first location card articles；311. first
Magnetic location post；32. second location card articles；321. first fix post；322. first magnetic parts；4. cross furnace tray；41. the 4th wear
Hole；42. the 5th perforation；43. the 3rd magnetic inserts；44. second air-vents；45. second cross hole, stove location；5. locating groove
Bar；51. locating grooves；52. the 4th magnetic inserts；61. cross stove draw-in groove bar；62. card notches；63. bolts；64. position limiting structures；
65. springs；66. nuts.
Detailed description of the invention
In describing the invention, it is to be understood that " " center ", " on ", D score in term, "front", "rear", " left ",
Orientation or the position relationship of the instruction such as " right " are based on orientation shown in the drawings or position relationship, are for only for ease of and describe this
Bright and simplification describes rather than indicates or imply that the device of indication or element must have specific orientation, with specific orientation
Structure and operation, be therefore not considered as limiting the invention.Additionally, term " first ", " second " are only used for describing purpose,
And it is not intended that indicate or hint relative importance.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " is installed ", " even
Connect ", " being connected " should be interpreted broadly, connect for example, it may be fixing, it is also possible to be that dismounting connects, or be integrally connected；Permissible
It is to be mechanically connected, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible to be to be indirectly connected to by intermediary, Ke Yishi
The connection of two element internals.For the ordinary skill in the art, can understand that above-mentioned term is at this with concrete condition
The concrete meaning of invention.Additionally, in describing the invention, except as otherwise noted, " multiple ", " some " be meant that two or
Two or more.
The present invention provides a kind of pasting method, comprises the steps:
Paster sandwich plate is arranged on paster tray by 100., and the element at described paster sandwich plate is fixed and arranged sheet in hollow-out parts
Linear element, and make the Welding Structure of described chip component near described paster tray；
200. are arranged on crossing furnace tray on described paster sandwich plate, take described paster tray away, in the weldering of described chip component
Print solder paste on access node structure；
300. strips that platy structure is inserted into described paster sandwich plate are fixed in hollow-out parts, make the described of described chip component
Welding Structure contacts with the welding position of described platy structure；
400. make described platy structure be positioned at described cross the lower section of furnace tray and puts it into and carry out Reflow Soldering in reflow ovens so that
Described Welding Structure is welded with described welding position by tin cream.
In this method, in above-mentioned steps 100, also include: use the first fixing device to be fixed by described paster sandwich plate
On described paster tray.
In this method, in above-mentioned steps 200, when taking described paster tray away, first dismantle described first fixing device, and
And use the second fixing device that described paster sandwich plate is fixed on described mistake on furnace tray.And, employing stencil printer will
Paste solder printing is in the Welding Structure of described chip component, and during print solder paste, described Welding Structure is upwards.
In this method, in above-mentioned steps 300, also include: use the 3rd fixing device to be fixed on by described platy structure
Described strip is fixed in hollow-out parts.
In this method, described paster tray, described paster sandwich plate, described furnace tray, described first fixing device, institute excessively
State the second fixing device and the structure of described 3rd fixing device and using method, accompanying drawing please be participate in and following to paster apparatus
Illustrate, here repeat no more.It is emphasized that described chip component is SMD components, such as Surface-mount LED lamp, institute
The described Welding Structure stating chip component refers to the welding foot of described SMD components, the i.e. welding foot of Surface-mount LED lamp.Described plate
Shape structure is pcb board, and the welding position of described platy structure refers to that the solder terminal of pcb board, this method are primarily used at pcb board
Side on weld Surface-mount LED lamp.
Referring to disclosed in Fig. 1 to Fig. 9, Fig. 1 to Fig. 9 is a kind of paster apparatus, including paster tray 1, paster interlayer
Plate 2 and excessively furnace tray 4, be provided with more than one strip on described paster sandwich plate 2 and fix hollow-out parts 21, in each institute
State strip to fix and hollow-out parts 21 is provided with some elements fixes hollow-out parts 22；
Described paster sandwich plate 2 is arranged on paster tray 1, chip component is set in hollow-out parts 22 fixed by described element,
And make the Welding Structure of described chip component near described paster tray 1；Described furnace tray 4 of crossing is arranged on described paster folder
On laminate 2, take described paster tray 1, print solder paste in described Welding Structure away；Platy structure is inserted into described strip solid
Determine in hollow-out parts 21, make described Welding Structure contact with the welding position of described platy structure；Described platy structure is made to be positioned at described
Cross the lower section of furnace tray 4 and put it into reflow ovens carries out Reflow Soldering so that described Welding Structure is by tin cream and described weldering
Connect position welding.
In the present embodiment, described paster tray 1 rectangular (the most shown in Figure 1), at the four of described paster tray 1
It is provided with at least four the first locating dowel (invisible in figure) on angle, and is provided with at least string on described paster tray 1
First punch column, at least string the second punch column and some first magnetic inserts 13, be arranged with in described first punch column
Some first perforation 11, are arranged with some second perforation 12, some described first magnetic inserts in described second punch column
13 are embedded in described paster tray 1, and described first magnetic inserts 13 is positioned at the two ends of described second punch column.
In the present embodiment, described paster sandwich plate 2 rectangular (the most shown in Figure 2), at described paster sandwich plate 2
Corner on be provided with at least four first and position hole 26 and at least four second positions hole 27, two adjacent described strips are solid
Determine to keep at a certain distance away between hollow-out parts 21, fix the described element of adjacent two in hollow-out parts 21 at same described strip
Keep at a certain distance away between fixing hollow-out parts 22.
Be provided with some first air-vents 25 on described paster sandwich plate 2, the some first stove excessively positions hole 28, at least
Arranging the 3rd punch column and at least string the second magnetic inserts arranges, the first air-vent 25 described in a portion is arranged on described bar
Shape is fixed in hollow-out parts 21, and described first crosses hole 28, stove location is arranged on the edge of described paster sandwich plate 2, each
Arranging and be arranged with some 3rd perforation 23 in described 3rd punch column, described second magnetic inserts 24 is embedded in described paster interlayer
In plate 2, described in every string, the second magnetic inserts row are arranged with some second magnetic inserts 24.
In the present embodiment, also include that described paster sandwich plate 2 is fixed on by the first fixing device, described first fixing device
On described paster tray 1.Described first fixing device includes that the first location card article 31(specifically refers to shown in Fig. 3 and Fig. 4) and
Second location card article 32(specifically refers to shown in Fig. 5 and Fig. 6), the described first surface positioning card article 31 is provided with one
The first magnetic location post 311 that row are protruding.Described second surface positioning card article 32 is respectively arranged with string projection
First fixes post 321 and is inlaid with two the first magnetic parts 322, and two described first magnetic parts 322 are located close to described second
On the position at the two ends of location card article 32.
In the present embodiment, described furnace tray 4 rectangular (the most shown in Figure 7) excessively, set on furnace tray 4 described mistake
It is equipped with at least string the 4th punch column, at least string the 5th punch column, some second air-vents 44, the some second stove excessively and positions hole
45 and at least four the second locating dowel, described 4th punch column is arranged with some 4th perforation 41, bores a hole the described 5th
Being arranged with some 5th perforation 42 in row, some 3rd magnetic inserts 43 are embedded in described furnace tray 4 excessively, described 3rd magnetic
Property inserts 43 be positioned at the two ends of described 4th punch column, described second crosses hole 45, stove location is arranged on described furnace tray 4 of crossing
Edge, described second locating dowel is arranged on the corner of described paster tray 1.
In the present embodiment, also include that described paster sandwich plate 2 is fixed on by the second fixing device, described second fixing device
On described furnace tray 4 excessively.Described second fixing device includes that the 3rd location card article (picture) and the 4th location card article (are not drawn
Figure), described 3rd location card article is essentially identical with the structure of described first location card article, described 4th location card article and described the
The structure of two location card articles is essentially identical.Described 3rd surface positioning card article is provided with the second magnetic that string is protruding
Locating dowel.Described 4th surface positioning card article is respectively arranged with the second of string projection fix post and be inlaid with two
Second magnetic part, two described second magnetic parts are located close on the position at the described 4th two ends positioning card article.
In the present embodiment, also include that locating groove bar 5(is the most shown in Figure 8), described locating groove bar 5 is arranged on
On described paster sandwich plate 2, and on the side of described locating groove bar 5, it is provided with some locating grooves 51, described tabular
A part for the end of structure is fixed on described strip and fixes in hollow-out parts 21, and another part of the end of described platy structure is solid
It is scheduled in described locating groove 51, described locating groove article 5 is inlaid with some 4th magnetic inserts 52.
In the present embodiment, also including the 3rd fixing device (the most shown in Figure 9), described 3rd fixing device is by institute
State platy structure to be fixed on described strip and fix in hollow-out parts 21.Described 3rd fixing device included stove draw-in groove article 61, bolt
63, position limiting structure 64, nut 66 and spring 65, is provided with some card notches 62 on the described lower surface crossing stove draw-in groove bar 61,
The two ends of described stove draw-in groove bar 61 excessively are provided with bolt penetration hole, and the head of described bolt 63 is positioned at described stove draw-in groove bar 61 excessively
Side, one end of described bolt 63 sequentially passes through described position limiting structure 64, described spring 65 and described bolt penetration hole, and in institute
Stating the opposite side of stove draw-in groove bar 61, and be arranged on one end of described bolt 63 by described nut 66, described spring 65 is positioned at institute
State between position limiting structure 64 and described stove draw-in groove bar 61 excessively.
In the present embodiment, described chip component is SMD components, such as Surface-mount LED lamp, the described weldering of described chip component
Access node structure refers to the welding foot of the welding foot of described SMD components, i.e. Surface-mount LED lamp.Described platy structure is pcb board, described
The welding position of platy structure refers to the solder terminal of pcb board.It is emphasized that the described paster apparatus in the present embodiment is main
It is used on the side of pcb board weld Surface-mount LED lamp.
The operation principle of the present embodiment is as follows:
When described paster sandwich plate 2 is arranged on described paster tray 1, the most described paster sandwich plate 2 is arranged on described paster
On one surface of pallet 1, described first fixing device is arranged on another surface of described paster tray 1.Specifically, described
Described first locating dowel of paster tray 1 is arranged in described first hole 26, location of described paster sandwich plate 2；Described first is fixed
Position card article 31 is arranged on another surface of described paster tray 1, and described first magnetic location post 311 is arranged on described first and wears
In hole 11, and described second magnetic inserts 24 and the described first magnetic location post 311 of part on described paster sandwich plate 2
Attracting, described second magnetic inserts 24 is Magnet or ferrous material is made, and the most described first magnetic location post 311 is ferrum
That material is made or Magnet；Described second location card article 32 is arranged on another surface of described paster tray 1, and described the
One one end fixing post 321 is arranged in described 3rd perforation 23 of described paster sandwich plate 2 through described second perforation 12, and
And described first magnetic part 322 is attracting with described first magnetic inserts 13.
After described paster sandwich plate 2 is fixed on described paster tray 1, arrange in hollow-out parts 22 fixed by described element
Chip component, and make the Welding Structure of described chip component near described paster tray 1, described furnace tray 4 of crossing is arranged on
On described paster sandwich plate 2.
Described paster sandwich plate 2 is arranged on the described surface crossing furnace tray 4, and described second fixing device is arranged on institute
Stated on another surface of furnace tray 4.Specifically, described second locating dowel is arranged on described the of described paster sandwich plate 2
In two hole 27, location, described 3rd location card article is arranged on described another surface crossing furnace tray 4, described second magnetic location
Post is arranged in described 5th perforation 42, and the described second magnetic inserts 24 of part on described paster sandwich plate 2 and institute
Stating the second magnetic location post attracting, described second magnetic inserts 24 is Magnet or ferrous material is made, the most described second
Magnetic location post is that ferrous material is made or Magnet；Described 4th location card article is arranged on another of described furnace tray 4 excessively
On surface, described second on described 4th location card article is fixed one end of post and wears through described the described 4th of furnace tray 4 of crossing
Hole 41 is arranged in described 3rd perforation 23 of part of described paster sandwich plate 2, and described second magnetic part and the described 3rd
Magnetic inserts 43 is attracting.
After described mistake furnace tray 4 is fixed on described paster sandwich plate 2 by described second fixing device, dismounting is described
First fixing device, takes described paster tray 1 away, owing to described first fixing device is by described paster sandwich plate by magnetic force
2 are fixed on described paster tray 1, so being easy to remove described first fixing device from described paster tray 1.
Then make described paster sandwich plate 2 be positioned at the described upper surface crossing furnace tray 4, use stencil printer to be printed by tin cream
Brush is in the Welding Structure of described chip component.After being completed for printing, by described 4th magnetic inserts 52 and wherein part
Described second magnetic inserts 24 is attracting, so that described locating groove bar 5 is arranged on described paster sandwich plate 2, and institute
State locating groove 51 corresponding with the end that described strip fixes hollow-out parts 21.Described locating groove bar 5 acts the effect guided, and makes plate
Shape structure is inserted into described strip more easily and fixes in hollow-out parts 21.
It is inserted into after described strip fixes hollow-out parts 21 at platy structure, described 3rd fixing device is fixed on described patch
On sheet sandwich plate 2 and described furnace tray 4 excessively.Specifically, the described described card notch 62 crossing stove draw-in groove bar 61 is fastened on described
On platy structure, the most described platy structure is arranged in described card notch 62, then makes one end of described bolt 63 through described
First crosses stove hole 28, location and described second crosses hole 45, stove location, and described nut 66 is arranged on one end of described bolt 63
On, the most described stove draw-in groove bar 61, described paster sandwich plate 2 and the described furnace tray 4 of crossing crossed is arranged on described spring 65 and described spiral shell
Between female 66.Screwing described bolt 63, described spring 65 is resisted against described mistake on stove draw-in groove bar 61 tightly, and then makes described mistake
Platy structure is proximally disposed in described strip and fixes in hollow-out parts 21 by stove draw-in groove bar 61.
After being fixed by platy structure, described platy structure is made to be positioned at the described lower section crossing furnace tray 4 and put it into
Carrying out Reflow Soldering in reflow ovens, tin cream flows downward after being heated, thus described Welding Structure is welded with described welding position.
Due to the fact that and have employed described paster tray 1, described paster sandwich plate 2 and described furnace tray 4 excessively, at paster
During, first described paster sandwich plate 2 is arranged on paster tray 1, chip component is arranged on described element and fixes hollow out
In portion 22；Then described furnace tray 4 of crossing is arranged on described paster sandwich plate 2, takes described paster tray 1 away, in described weldering
Print solder paste on access node structure, after tin cream brush is complete, is inserted into platy structure described strip and fixes in hollow-out parts 21, finally put
Enter and reflow ovens carries out Reflow Soldering；Thus it is recognised that the present invention is first paster brush tin cream again, there is paster efficiency high, bad
Product minimizing, the qualified height of product, it is not result in the advantage such as dry joint and rosin joint.
Claims (10)
1. a pasting method, it is characterised in that comprise the steps:
Paster sandwich plate is arranged on paster tray by 100., and the element at described paster sandwich plate is fixed and arranged sheet in hollow-out parts
Linear element, and make the Welding Structure of described chip component near described paster tray；
200. are arranged on crossing furnace tray on described paster sandwich plate, take described paster tray away, in the weldering of described chip component
Print solder paste on access node structure；
300. strips that platy structure is inserted into described paster sandwich plate are fixed in hollow-out parts, make described Welding Structure with described
The welding position contact of platy structure；
400. make described platy structure be positioned at described cross the lower section of furnace tray and puts it into and carry out Reflow Soldering in reflow ovens so that
Described Welding Structure is welded with described welding position by tin cream.
Pasting method the most according to claim 1, it is characterised in that in above-mentioned steps 100, also include: use first
Described paster sandwich plate is fixed on described paster tray by fixing device.
Pasting method the most according to claim 2, it is characterised in that in above-mentioned steps 200, also include: take away described
During paster tray, first dismantle described first fixing device.
Pasting method the most according to claim 1 and 2, it is characterised in that in above-mentioned steps 200, also include: use the
Described paster sandwich plate is fixed on described mistake on furnace tray by two fixing devices.
Pasting method the most according to claim 1 and 2, it is characterised in that in above-mentioned steps 300, also include: use the
Described platy structure is fixed on described strip and fixes in hollow-out parts by three fixing devices.
6. a paster apparatus, it is characterised in that: include paster tray, paster sandwich plate and cross furnace tray, pressing from both sides at described paster
It is provided with more than one strip on laminate and fixes hollow-out parts, in strip fixes hollow-out parts each described, be provided with some units
Part fixes hollow-out parts；
Described paster sandwich plate is arranged on paster tray, fixes that at described element hollow-out parts arranging chip component, and
Make the Welding Structure of described chip component near described paster tray；Described furnace tray of crossing is arranged on described paster sandwich plate
On, take described paster tray away, print solder paste in described Welding Structure；Platy structure is inserted into described strip and fixes hollow out
In portion, described Welding Structure is made to contact with the welding position of described platy structure；Described platy structure is made to be positioned at described furnace tray excessively
Lower section and put it into reflow ovens carry out Reflow Soldering so that described Welding Structure is welded with described welding position by tin cream.
Paster apparatus the most according to claim 6, it is characterised in that: on described paster tray, it is provided with at least string
One punch column, at least string the second punch column and some first magnetic inserts, some described first magnetic inserts are embedded in
In described paster tray, described first magnetic inserts is positioned at the two ends of described second punch column.
8. according to the paster apparatus described in claim 6 or 7, it is characterised in that: it is provided with some on described paster sandwich plate
First air-vent, the some first stove location hole, at least string the 3rd punch column and at least string the second magnetic inserts row excessively, its
Middle a part of described first air-vent is arranged on described strip and fixes in hollow-out parts, and described first crosses hole, stove location is arranged on described
The edge of paster sandwich plate.
9. according to the paster apparatus described in claim 6 or 7, it is characterised in that: it is provided with at least one described mistake on furnace tray
Arrange the 4th punch column, at least string the 5th punch column, some second air-vents, some second cross stove hole, location and at least four the
Two locating dowels, some 3rd magnetic inserts are embedded in described mistake in furnace tray, and described 3rd magnetic inserts is positioned at described the
The two ends of four punch columns, described second crosses hole, stove location is arranged on the described edge crossing furnace tray.
10. according to the paster apparatus described in claim 6 or 7, it is characterised in that: also include the first fixing device, described first
Described paster sandwich plate is fixed on described paster tray by fixing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| JP2010098320A (en) * | 2008-10-17 | 2010-04-30 | Shu Kisei | Surface mounting process for flexible printed circuit board, and magnetic tool and steel mesh used in the same |
| CN202721915U (en) * | 2012-08-17 | 2013-02-06 | 腾捷（厦门）电子有限公司 | Magnetic tool used for flexible circuit board |
| CN103826394A (en) * | 2008-10-17 | 2014-05-28 | 林克治 | Method and system for mounting component on surface of flexible circuit board as well as magnetic jig |
| CN105101669A (en) * | 2015-08-14 | 2015-11-25 | 陈炜荣 | Mounting fixture for LED lamp side welding |
| CN205755096U (en) * | 2016-06-24 | 2016-11-30 | 深圳市赫尔诺电子技术有限公司 | Paster apparatus |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010098320A (en) * | 2008-10-17 | 2010-04-30 | Shu Kisei | Surface mounting process for flexible printed circuit board, and magnetic tool and steel mesh used in the same |
| CN103826394A (en) * | 2008-10-17 | 2014-05-28 | 林克治 | Method and system for mounting component on surface of flexible circuit board as well as magnetic jig |
| CN202721915U (en) * | 2012-08-17 | 2013-02-06 | 腾捷（厦门）电子有限公司 | Magnetic tool used for flexible circuit board |
| CN105101669A (en) * | 2015-08-14 | 2015-11-25 | 陈炜荣 | Mounting fixture for LED lamp side welding |
| CN205755096U (en) * | 2016-06-24 | 2016-11-30 | 深圳市赫尔诺电子技术有限公司 | Paster apparatus |
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| CN106028677B (en) | 2018-08-07 |
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