CN106028229B - Preparation method of earphone film - Google Patents
Preparation method of earphone film Download PDFInfo
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- CN106028229B CN106028229B CN201610604096.1A CN201610604096A CN106028229B CN 106028229 B CN106028229 B CN 106028229B CN 201610604096 A CN201610604096 A CN 201610604096A CN 106028229 B CN106028229 B CN 106028229B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/12—Non-planar diaphragms or cones
- H04R7/122—Non-planar diaphragms or cones comprising a plurality of sections or layers
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Abstract
The invention relates to the technical field of sound films, in particular to a receiver film and a preparation method thereof, which comprises the following steps (A): overlapping, cutting, punching and cutting the intermediate original film and the surface original film to obtain a cover film, wherein the cover film comprises an intermediate frame group formed by the intermediate original film and a surface frame group punched by the surface original film; step (B): filling engineering original sheets by using a fan-shaped pouring gate, and then punching and cutting the engineering original sheets to obtain an engineering film group; step (C): cleaning the middle frame group, the surface frame group and the engineering film group, coating powder and glue on the upper surface and the lower surface of the middle frame group, then attaching the surface frame group on the upper surface of the middle frame group, finally attaching the engineering film group on the lower surface of the middle frame group, and punching and cutting to obtain a plurality of earphone films. The preparation method of the receiver film is simple, can realize batch production, can prepare the micro receiver film, and the prepared receiver film has high elasticity, high toughness, better transient state, sensitivity, frequency response and lasting good tone quality.
Description
Technical Field
The invention relates to the technical field of sound films, in particular to a receiver film and a preparation method thereof.
Background
With the improvement of living standard of people, the requirements on a series of sound equipment such as earphones, speakers and the like are higher and higher, and especially the requirements on mobile phones and in-ear earplug speakers are higher and higher, and the development trend is to have better sound effect and smaller sound generating devices. The film is one of the key components of the sound production element, which has a crucial influence on the sound quality of the speaker, and it is more difficult to prepare a small earphone film, so the design of the small earphone film is one of the important subjects of continuous innovation in the industry.
The objective indexes such as the frequency response curve of the loudspeaker are mainly determined by the geometric shape of the film, and the subjective indexes such as the tone quality, the acoustic hearing feeling and the like of the loudspeaker are mainly determined by the material of the film. The membrane of a loudspeaker with excellent sound quality and listening sensation must be provided with two pieces: firstly, can minimize self segmentation vibrations, secondly have good enough rigidity. The split vibration is a phenomenon that the loudspeaker itself deforms in the force transmission process, and generates a lot of noise different from a sound source, so that the sound of the loudspeaker is noisy and even seriously distorted. And the rigidity is good enough, can reduce and cut apart vibrations, also is a guarantee of good tone quality simultaneously. The manufacturing materials of the films are various, such as a metal film, a paper film, a silk film, a plastic film, a biological film and the like, the material of the vibrating film has the most important part for influencing the quality of the loudspeaker unit, the vibrating films made of different materials and manufactured by different processes have different Young modulus, relative damping, density, elongation, tensile strength, tear strength and the like, and the properties directly influence the Q value of a quality factor to cause different qualities of the earphone unit.
Among them, paper films have been used widely in some speakers for a long time, but the paper films are easy to be affected with moisture, so that the sound quality thereof is unstable, and the paper films are gradually replaced by other films. The plastic film has the advantages of low cost, good plasticity, easy processing and the like, but the rigidity of the plastic film is poor, which seriously influences the sound quality of the loudspeaker. However, paper materials and plastic materials cannot reach the ultrathin thickness due to material reasons, and the set structure is unreasonable, so that the best tone quality of the voice diaphragm material cannot be achieved.
Disclosure of Invention
The invention aims to provide an earphone film and a preparation method thereof, aiming at the defects in the prior art, the preparation method can be used for preparing a microminiature earphone film, the earphone film is formed by bonding three layers of structures, the thinnest thickness is 0.02-0.04mm, and the earphone film has the advantages of high elasticity, high toughness, better transient state, sensitivity, frequency response and lasting good tone quality.
The purpose of the invention is realized by the following technical scheme:
a preparation method of an earphone film is characterized by comprising the following steps: comprises the following steps
Step (A): overlapping, cutting, punching and cutting the intermediate original film and the surface original film to obtain a cover film, wherein the cover film comprises an intermediate frame group formed by the intermediate original film and a surface frame group punched by the surface original film;
step (B): filling engineering original sheets by using a fan-shaped pouring gate, and then punching and cutting the engineering original sheets to obtain an engineering film group;
step (C): cleaning the middle frame group, the surface frame group and the engineering film group, coating powder and glue on the upper surface and the lower surface of the middle frame group, then attaching the surface frame group on the upper surface of the middle frame group, finally attaching the engineering film group on the lower surface of the middle frame group, and punching and cutting to obtain a plurality of earphone films;
the engineering film group comprises a plurality of engineering films, the middle frame group comprises a plurality of middle frames, and the surface frame group comprises a plurality of surface frames;
wherein, beryllium copper metal powder is used as the coating powder.
The invention designs a plurality of earphone films together to form a sleeve film, and then performs punch forming, wherein one sleeve film comprises 8-12 single earphone full films, the area of the formed sleeve film is large, the positioning and the fixing are convenient, fixing holes can be designed around, the position of the film is effectively fixed during the punch forming, and the production is more effective. Meanwhile, beryllium copper metal powder is used, and beryllium copper is a copper alloy taking beryllium as a main alloy element and is also called beryllium bronze. It is a high-grade elastic material with best performance in copper alloy, has a series of excellent physical, chemical and mechanical properties of high strength, elasticity, hardness, fatigue strength, small elastic hysteresis, corrosion resistance, wear resistance, cold resistance, high conductivity, no magnetism, no spark generation due to impact and the like, and is divided into processed beryllium bronze and cast beryllium bronze. Common cast beryllium bronze includes Cu-2Be-0.5Co-0.3Si, Cu-2.6Be-0.5Co-0.3Si, and Cu-0.5Be-2.5 Co. The commonly used processed beryllium bronze comprises: cu-2Be-0.3Ni, Cu-1.9Be-0.3Ni-0.2 Ti. Beryllium bronze is a heat-treated strengthened alloy. The processed beryllium bronze is mainly used as various high-grade elastic elements, particularly various elements requiring good conductivity, corrosion resistance, wear resistance, cold resistance and no magnetism, and is widely used as bellows, diaphragms, corrugated pipes, micro switches and the like. Preferably, a processed beryllium bronze of Cu97%, be2.2%, ni0.3%, 0.5Ti is used in mass fraction.
Preferably, the individual earpiece films are 15mm long and 5.9mm wide.
Wherein, the temperature for filling the sector gate in the step (B) is 110-. The liquid silica gel enters the cavity through a gradually-expanded fan shape, so that the liquid silica gel can be more uniformly distributed in the transverse direction, the internal stress of a product can be reduced, the flow lines and the directional effect are greatly reduced, the deformation is reduced, the possibility of bringing air into the cavity can be reduced, the cavity is well exhausted, and gas can be prevented from being mixed into a melt. The locking pressure is controlled within a certain force range, the thickness of the film of the receiver can be well controlled, the film is prevented from being damaged, the locking speed is 8-15s and is matched with the curing time of the liquid silica gel, and premature curing, locking and non-forming are avoided.
Wherein, the cleaning in the step (C) is to use a silica gel cleaning agent to carry out coating and cleaning twice, and the coating thickness is 0.2-0.5 mm.
The silica gel cleaning agent is composed of the following raw materials in parts by weight: 20-45 parts of silica gel, 2-20 parts of hydroxide, 1-30 parts of surfactant, 5-70 parts of water, preferably 45 parts of silica gel, 4 parts of sodium hydroxide, 1 part of sodium dodecyl benzene sulfonate, 1 part of alkylphenol polyoxyethylene ether, 1 part of fatty alcohol-polyoxyethylene ether and 58 parts of water. The silica gel cleaning agent can be prepared into liquid, paste or powder, has no organic volatile solvent, is nontoxic and pollution-free, has strong removal force on stubborn oil stains and colloidal oil stains, has no impurities on the surface after removal, does not need secondary manual cleaning, and can be directly used for subsequent film lamination.
Wherein, the powder coating in the step (C) is to spray beryllium copper metal powder on the surface frame, the spraying temperature is 20-120 ℃, and the spraying thickness is 0.01-0.03 mm.
Beryllium is a rare metal and has great potential in improving the performance of high-frequency transducers. The weight of the earpiece film is an important factor affecting the sensitivity of the earpiece. The moving mass is the main limiting factor of the sensitivity of the receiver transmission band, and the low-density material is lightThese, with aluminum (2.7 g/cm)3) And titanium (4.5 g/cm)3) In contrast, beryllium is a low density metal: 1.85g/cm3. The rigidity-to-weight ratio, called "specific rigidity", is a common advantage of high-class structural materials, but is an essential advantage for loudspeaker diaphragms, and general metals have very good rigidity, the young's modulus can reach tens of thousands, but the density is very high, while the specific rigidity of beryllium alone is high, which is about 7 times that of titanium or aluminum, and preferably, the mass ratio of beryllium copper metal powder is 7-9: 2 to 3.5, the spraying temperature is 117 ℃, and the spraying thickness is 0.02 mm. The ultrathin thickness and the proportion of the ultrathin thickness and the copper metal can save expensive rare metal, simultaneously, the earphone film has good transient state, sensitivity and frequency response, and the crispness, the penetrating power and the layering of sound are greatly improved.
Wherein, the sizing in the step (C) uses a silane adhesive, the pressure of sizing is 30-80bar, and the hardness of the silane adhesive is 40-80 degrees. The silane adhesive consists of the following raw materials in parts by weight: 60-90 parts of ethanol, 0-30 parts of isopropanol, 0.01-5 parts of methanol and 1-5 parts of silane. The alcohols in the silane adhesive have good intermiscibility with the silica gel, can form strong, durable, moisture-resistant and temperature-resistant molecular bridges with the silica gel, and the silane and the silica gel can be quickly cured at room temperature to form a firm siloxane crosslinking structure (Si-O-Si) which can enhance the mechanical property, chemical resistance and weather resistance of the earphone film. When the coating thickness of the silica gel adhesive is 25-75 micrometers, the adhesive force of a cured product of the silica gel adhesive is 1 grade, the pencil hardness is not less than 4H, and the impact resistance is not less than 50 cm. Preferably, the sizing pressure of the sizing silane adhesive is 50bar, the hardness is 60 degrees, and the coating thickness is 25 μm.
Wherein the intermediate original film is one or a mixture of more than one of FPC, PEN, PEEK, PU and PET.
The FPC is made of polyimide, so that the density is high, and the FPC has good bending property; the PEN has a high molecular chain rigidity, a planar structure and the following excellent performances: high strength, good dimensional stability and thermal stability, strong chemical resistance and hydrolysis resistance and the like; the PEEK contains chain-linked linear aromatic high molecular compounds, and is resistant to chemical corrosion and super-strong in mechanical property; the PU has low density, soft texture, excellent wear resistance and bending resistance; excellent shock absorption and anti-skid performance; PET has excellent physical and mechanical properties in a wide temperature range, the long-term use temperature can reach 120 ℃, the electrical insulation property is excellent, even under high temperature and high frequency, the electrical property is still good, but the corona resistance is poor, and the creep resistance, the fatigue resistance, the friction resistance and the dimensional stability are good. Preferably, the PET with the thickness of 0.1mm is used, the mechanical property is good, the impact strength is 3-5 times that of other films, the folding resistance is good, the strength of the earphone film can be increased, meanwhile, the creep resistance, the fatigue resistance, the abrasion resistance and the dimensional stability are good, and the service life can be prolonged.
The engineering original sheet and the surface original film are made of liquid silica gel. The liquid silica gel is methyl vinyl silica gel: the hydrogen-containing silicone oil has the mass ratio of 2-3:1.2-2.4, the methyl vinyl silicone has good moisture resistance, electrical insulation, surface non-adhesiveness and hydrophobic property, small compression deformation and saturated steam resistance, and simultaneously the hydrogen-containing silicone oil has particularly excellent hydrophobicity and is used in combination with the methyl vinyl silicone to have good adhesion and water and moisture resistance, after the intermediate ring is coated with the liquid silicone, the film has good water resistance, and the transient state of the film due to moisture influence is prevented.
The utility model provides an earphone film, this earphone film includes engineering thin slice, middle frame and surface frame, the engineering thin slice is including setting up in the middle center membrane and setting up the solid fixed ring outside the center membrane, the shape of solid fixed ring, middle frame and surface frame is identical, middle frame sets up in solid fixed ring upper surface, the surface frame sets up in middle frame upper surface, center membrane is including setting up in center membrane frame all around and setting up the sound membrane in the membrane frame.
Engineering thin slice, intermediate frame and surface frame are all made through integrated into one piece punching press back again, and the membrane frame of integrated into one piece's engineering thin slice enables with the intermediate frame of engineering thin slice laminating and the fine fixed of surface frame together, and through liquid silica gel's bonding, the fastness is stronger moreover, and transient state, sensitivity, frequency response are better, and tone quality is better, and the membrane frame of engineering thin slice is the fan-shaped runner shaping of an organic whole with the sound membrane simultaneously, and the structure is more stable, and the distortion of sound membrane is littleer, and tone quality is better.
Wherein the Young's modulus of the earphone film is 5000-2Density of 1.0-1.7g/cm3The glass transition temperature is 120-150 ℃, the relative damping is 0.45-0.65, the elongation is 250-560%, the tensile strength is 3-8MPa, and the tear strength is 30-50 kN/m.
The invention has the beneficial effects that:
(1) the invention uses three layers of annular structures, and the central film is provided with the film frame and the sound film, so that the receiver film has high elasticity, high toughness, better transient state, sensitivity, frequency response and lasting good tone quality.
(2) The preparation method of the invention has good operability, is suitable for batch production, and can prepare the receiver film with microminiature thickness and the thickness of the voice coil reaching 0.02-0.04 mm.
(3) The invention uses liquid silica gel as adhesive, the material is the same with the engineering slice and the surface frame, the influence on the tone quality of the sound film is small, and the structure is compact and the transient state is good.
(4) The liquid silica gel is waterproof and dustproof, and does not influence tone quality penetration.
(5) The middle frame of the invention uses FPC, PEN, PEEK, PU or PET to strengthen the strength of the product, so that the sound film has good transient state.
(6) The product of the invention has small volume and thin sound film, is assembled in the product and has large design space.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.
Fig. 1 is a schematic view of the overall structure of an earpiece film of the present invention.
Fig. 2 is a schematic structural view of an engineered sheet of earpiece film of the present invention.
Fig. 3 is a schematic view of a partial structure of an earpiece film of the present invention.
The reference numerals include: 1 engineering sheet, 2 middle frames, 3 surface frames, 4 center membranes, 5 membrane frames and 6 sound membranes.
Detailed Description
The invention is further described with reference to the following examples and the accompanying drawings.
Example 1
A preparation method of an earphone film comprises the following steps,
step (A): overlapping, cutting, punching and cutting the intermediate original film and the surface original film to obtain a cover film, wherein the cover film comprises an intermediate frame 2 group formed by the intermediate original film and a surface frame 3 group punched by the surface original film;
step (B): filling engineering original sheets by using a fan-shaped pouring gate, and then punching and cutting the engineering original sheets to obtain an engineering film group;
step (C): cleaning the middle frame 2 group, the surface frame 3 group and the engineering film group, coating powder and glue on the upper surface and the lower surface of the middle frame 2 group, then attaching the surface frame 3 group on the upper surface of the middle frame 2 group, finally attaching the engineering film group on the lower surface of the middle frame 2 group, and punching and cutting to obtain a plurality of receiver films;
the engineering film group comprises a plurality of engineering films, the middle frame 2 group comprises a plurality of middle frames 2, and the surface frame 3 group comprises a plurality of surface frames 3;
wherein, beryllium copper metal powder is used as the coating powder.
And (B) filling the sector gate at the temperature of 110 ℃, locking pressure of 20bar and locking speed of 10 s.
And (C) specifically, coating and cleaning twice by using a silica gel cleaning agent, wherein the coating thickness is 0.2 mm.
And (C) specifically, beryllium copper metal powder is sprayed on the surface frame 3, the spraying temperature is 20-120 ℃, and the spraying thickness is 0.01-0.03 mm.
The sizing in the step (C) uses a silane adhesive, the pressure of sizing is 50bar, and the hardness of the silane adhesive is 40 degrees.
The intermediate original film is PET.
The engineering original sheet and the surface original film are made of liquid silica gel.
The utility model provides an earphone film, this earphone film includes engineering thin slice 1, middle frame 2 and surface frame 3, engineering thin slice 1 is including setting up in the middle of the center membrane 4 with set up the solid fixed ring outside center membrane 4, gu fixed ring, middle frame 2 and surface frame 3's shape are identical, middle frame 2 sets up in solid fixed ring upper surface, surface frame 3 sets up in middle frame 2 upper surface, center membrane 4 is including setting up in center membrane 4 membrane frame 5 all around and setting up the sound membrane 6 in membrane frame 5.
The Young modulus of the earphone film is 5200N/mm2Density of 1.2g/cm3The glass transition temperature is 130 ℃, the relative damping is 0.45, the elongation is 300 percent, the tensile strength is 3.5MPa, and the tear strength is 35 kN/m.
Example 2
The present embodiment is different from embodiment 1 in that: in step (B) of this example, the temperature of the sector gate filling was 120 ℃, the lock pressure was 40bar, and the lock speed was 12 s. And (C) specifically, coating and cleaning twice by using a silica gel cleaning agent, wherein the coating thickness is 0.5 mm. And (C) specifically, beryllium copper metal powder is sprayed on the surface frame 3, the spraying temperature is 80 ℃, and the spraying thickness is 0.02 mm. The sizing in the step (C) uses a silane adhesive, the pressure of sizing is 60bar, and the hardness of the silane adhesive is 70 degrees.
The intermediate original film is PEN: the PEEK is composed of 1:2 by mass fraction.
The Young modulus of the earphone film is 5400N/mm2Density of 1.3g/cm3The glass transition temperature is 150 ℃, the relative damping is 0.48, the elongation is 400 percent, the tensile strength is 5MPa, and the tear strength is 50 kN/m.
Example 3
The present embodiment is different from embodiment 1 in that: and (B) filling the sector gate at the temperature of 110 ℃, locking pressure of 20bar and locking speed of 10 s. And (C) specifically, coating and cleaning twice by using a silica gel cleaning agent, wherein the coating thickness is 0.2 mm. And (C) specifically, beryllium copper metal powder is sprayed on the surface frame 3, the spraying temperature is 110 ℃, and the spraying thickness is 0.03 mm. The sizing in the step (C) uses a silane adhesive, the pressure of sizing is 60bar, and the hardness of the silane adhesive is 70 degrees.
The middle original film is PU: the PET is composed of 1:2 by mass fraction.
The Young modulus of the earphone film is 5200N/mm2Density of 1.2g/cm3The glass transition temperature is 130 ℃, the relative damping is 0.45, the elongation is 300 percent, the tensile strength is 3.5MPa, and the tear strength is 35 kN/m.
Example 4
The present embodiment is different from embodiment 1 in that: and (B) filling the sector gate at 130 ℃, locking pressure of 80bar and locking speed of 8 s. And (C) specifically, coating and cleaning twice by using a silica gel cleaning agent, wherein the coating thickness is 0.5 mm. And (C) specifically, beryllium copper metal powder is sprayed on the surface frame 3, the spraying temperature is 80 ℃, and the spraying thickness is 0.01 mm. The sizing in the step (C) uses a silane adhesive, the pressure of sizing is 80bar, and the hardness of the silane adhesive is 80 degrees.
The intermediate original film is PEN: PU (polyurethane): PET is 1: 1.2: 2.
The Young modulus of the earphone film is 5600N/mm2Density of 1.6g/cm3The glass transition temperature is 140 ℃, the relative damping is 0.55, the elongation is 500 percent, the tensile strength is 3.5MPa, and the tear strength is 45 kN/m.
Example 5
The present embodiment is different from embodiment 1 in that: and (B) filling the sector gate at 130 ℃, locking pressure of 60bar and locking speed of 15 s. And (C) specifically, coating and cleaning twice by using a silica gel cleaning agent, wherein the coating thickness is 0.5 mm. And (C) specifically, beryllium copper metal powder is sprayed on the surface frame 3, the spraying temperature is 80 ℃, and the spraying thickness is 0: 2 mm. The sizing in the step (C) uses a silane adhesive, the pressure of sizing is 80bar, and the hardness of the silane adhesive is 80 degrees.
The middle original film is PEEK: PEN: PU (polyurethane): PET according to mass fraction of 0.5: 1:1.2: 2.
The Young modulus of the earphone film is 5800N/mm2Density of 1.6g/cm3The glass transition temperature is 140 ℃, the relative damping is 0.55, the elongation is 550%, the tensile strength is 3.5MPa, and the tear strength is 50 kN/m.
Example 6
The present embodiment is different from embodiment 1 in that: and (B) filling the sector gate at 130 ℃, locking pressure of 50bar and locking speed of 12 s. And (C) specifically, coating and cleaning twice by using a silica gel cleaning agent, wherein the coating thickness is 0.5 mm. And (C) specifically, beryllium copper metal powder is sprayed on the surface frame 3, the spraying temperature is 120 ℃, and the spraying thickness is 0: 2 mm. The sizing in the step (C) uses a silane adhesive, the pressure of sizing is 80bar, and the hardness of the silane adhesive is 80 degrees.
The middle original film is PEEK: PET according to mass fraction of 0.5: 1.2.
The Young modulus of the earphone film is 5800N/mm2Density of 1.0g/cm3The glass transition temperature is 140 ℃, the relative damping is 0.55, the elongation is 250 percent, the tensile strength is 3.5MPa, and the tear strength is 30 kN/m.
Example 7
The present embodiment is different from embodiment 1 in that: and (B) filling the sector gate at 130 ℃, locking pressure of 30bar and locking speed of 9 s. And (C) specifically, coating and cleaning twice by using a silica gel cleaning agent, wherein the coating thickness is 0.3 mm. And (C) specifically, beryllium copper metal powder is sprayed on the surface frame 3, the spraying temperature is 40 ℃, and the spraying thickness is 0.02 mm. The sizing in the step (C) uses a silane adhesive, the pressure of sizing is 30bar, and the hardness of the silane adhesive is 40 degrees.
The middle original film is PEEK: PEN: PU (polyurethane): PET according to mass fraction of 1.5: 1:3.4: 2.
The Young modulus of the earphone film is 5000N/mm2Density of 1.6g/cm3The glass transition temperature is 140 ℃, the relative damping is 0.65, the elongation is 300 percent, the tensile strength is 3.5MPa, and the tear strength is 35 kN/m.
Example 8
The present embodiment is different from embodiment 1 in that: and (B) filling the sector gate at the temperature of 110 ℃, locking pressure of 20bar and locking speed of 8 s. And (C) specifically, coating and cleaning twice by using a silica gel cleaning agent, wherein the coating thickness is 0.2 mm. And (C) specifically, beryllium copper metal powder is sprayed on the surface frame 3, the spraying temperature is 20 ℃, and the spraying thickness is 0.03 mm. The sizing in the step (C) uses a silane adhesive, the pressure of sizing is 30bar, and the hardness of the silane adhesive is 40 degrees.
The intermediate original film is PET.
The Young modulus of the earphone film is 5500N/mm2Density of 1.1g/cm3The glass transition temperature is 120 ℃, the relative damping is 0.45, the elongation is 250%, the tensile strength is 4MPa, and the tear strength is 30 kN/m.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (7)
1. A preparation method of an earphone film is characterized by comprising the following steps: comprises the following steps
Step (A): overlapping, cutting, punching and cutting the intermediate original film and the surface original film to obtain a cover film, wherein the cover film comprises an intermediate frame group formed by the intermediate original film and a surface frame group punched by the surface original film;
step (B): filling engineering original sheets by using a fan-shaped pouring gate, and then punching and cutting the engineering original sheets to obtain an engineering film group;
step (C): cleaning the middle frame group, the surface frame group and the engineering film group, coating powder and glue on the upper surface and the lower surface of the middle frame group, then attaching the surface frame group on the upper surface of the middle frame group, finally attaching the engineering film group on the lower surface of the middle frame group, and punching and cutting to obtain a plurality of earphone films;
the engineering film group comprises a plurality of engineering films, the middle frame group comprises a plurality of middle frames, and the surface frame group comprises a plurality of surface frames; the single engineering film, the single middle frame and the single surface frame are sequentially attached;
wherein, beryllium copper metal powder is used as the coating powder.
2. The method for preparing an earpiece film as set forth in claim 1, wherein: the temperature for filling the sector gate in the step (B) is 110-.
3. The method for preparing an earpiece film as set forth in claim 1, wherein: and (C) specifically, coating and cleaning twice by using a silica gel cleaning agent, wherein the coating thickness is 0.2-0.5 mm.
4. The method for preparing an earpiece film as set forth in claim 1, wherein: and (C) specifically, beryllium copper metal powder is sprayed on the surface frame, the spraying temperature is 20-120 ℃, and the spraying thickness is 0.01-0.03 mm.
5. The method for preparing an earpiece film as set forth in claim 1, wherein: in the step (C), a silane adhesive is used for sizing, the pressure for sizing is 30-80bar, and the hardness of the silane adhesive is 40-80 degrees.
6. The method for preparing an earpiece film as set forth in claim 1, wherein: the middle original film is one or a mixture of more than one of FPC, PEN, PEEK, PU and PET.
7. The method for preparing an earpiece film as set forth in claim 1, wherein: the engineering original sheet and the surface original film are made of liquid silica gel.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1400627A (en) * | 2001-07-30 | 2003-03-05 | 旭硝子株式会社 | Film |
| CN101207944A (en) * | 2006-12-18 | 2008-06-25 | 深圳市豪恩电声科技有限公司 | Method for manufacturing microphone diaphragm |
| CN101382730A (en) * | 2007-09-05 | 2009-03-11 | 信越化学工业株式会社 | Pellicle frame |
| CN103365074A (en) * | 2012-04-04 | 2013-10-23 | 信越化学工业株式会社 | A dustproof thin film assembly frame and a dustproof thin film assembly |
| KR20150073622A (en) * | 2013-12-23 | 2015-07-01 | (주)창성 | A composite film using conductive adhesion layers, having improved heat sink capabilities with graphite layer and method of fabricating the same. |
-
2016
- 2016-07-28 CN CN201610604096.1A patent/CN106028229B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1400627A (en) * | 2001-07-30 | 2003-03-05 | 旭硝子株式会社 | Film |
| CN101207944A (en) * | 2006-12-18 | 2008-06-25 | 深圳市豪恩电声科技有限公司 | Method for manufacturing microphone diaphragm |
| CN101382730A (en) * | 2007-09-05 | 2009-03-11 | 信越化学工业株式会社 | Pellicle frame |
| CN103365074A (en) * | 2012-04-04 | 2013-10-23 | 信越化学工业株式会社 | A dustproof thin film assembly frame and a dustproof thin film assembly |
| KR20150073622A (en) * | 2013-12-23 | 2015-07-01 | (주)창성 | A composite film using conductive adhesion layers, having improved heat sink capabilities with graphite layer and method of fabricating the same. |
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