CN106023865A - Screen module, electronic equipment and micro-crack detection method for screen module - Google Patents
Screen module, electronic equipment and micro-crack detection method for screen module Download PDFInfo
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- CN106023865A CN106023865A CN201610472196.3A CN201610472196A CN106023865A CN 106023865 A CN106023865 A CN 106023865A CN 201610472196 A CN201610472196 A CN 201610472196A CN 106023865 A CN106023865 A CN 106023865A
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- detection
- detection line
- screen module
- crack
- micro
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
Abstract
The invention relates to the electronic technology field and discloses a screen module, electronic equipment and a micro-crack detection method for the screen module. The screen module comprises a glass substrate, a touch detection layer, a screen driving chip, N detection wires, N connection pins and N detection units, wherein the touch detection layer is laid on the glass substrate, the N detection units are arranged in the screen driving chip, the N detection wire and the N connection pins are respectively arranged at periphery of a display function zone of the touch detection layer, the periphery of the display function zone is provided with N detection zones, each detection zone is provided with one detection wire, one ends of the N detection wires are in ground connection, the other ends of the N detection wires are correspondingly connected with the N connection pins, the N connection pins are correspondingly connected with the N detection units, and the N detection units are used for detecting whether the N detection wires are conducted. According to the screen module, a conduction state of each detection wire is detected, whether the detection zones have micro cracks can be detected respectively, the screen module having a micro crack can be effectively detected, and the location position of the micro crack can be further detected.
Description
Technical field
The present invention relates to electronic technology field, particularly to one screen module, electronic equipment and screen module
Testing methods for tiny crack.
Background technology
In recent years, along with developing rapidly of digital technology and electron display device, Display Technique is sent out
The change of person's character of taking root, increasing screen is widely used in various field.Electronic equipment is adopted
Screen be the most all the screen module that the high accuracy device of glass processing procedure is formed, screen module is as electronics
Equipment one of critical piece, its quality plays conclusive effect.
At present, the worst screen module goes out manufacturer due to the increasing of production cost pressure, can be some
Defective, but the screen module shipment not affecting normal function shows to electronics manufacturers, non-such as screen
Show that functional areas have micro-crack.But, electronics manufacturers can not directly be investigated out in-problem
Screen module, some badness screen module can expose problem in equipment production process;And some badness screen modules
Being then the problem that just exposes after arriving in consumer's hands, thus cause user to be discontented with, visitor moves back customer complaint.Thus
Visible, bad screen module not only can cause economic loss to electronics manufacturers, and can give and produce
The brand reputation of business brings very deleterious effect.
Further, more and more higher to the appearance requirement of electronic equipment along with people so that electronics now sets
For trending towards ultra-thin, the structure design of Rimless.This has resulted in the complete machine guarantor to screen of electronic equipment
Protect more and more weak so that it is one big main that screen breakage becomes electronic equipment production process and after-sales service
Problem, easily causes bigger economic loss to people.
Summary of the invention
It is an object of the invention to provide a kind of screen module, electronic equipment and the microcrack zone of screen module
Method, it is possible to whether the periphery, display functional areas shielding module is existed micro-crack and is identified detection, and energy
Detect that peripheral which position, display functional areas exists micro-crack, effectively reduce badness screen module to
The economic loss that electronics manufacturers is brought.
For solving above-mentioned technical problem, embodiments of the present invention provide a kind of screen module, comprise: glass
Glass substrate, touch sensing layer, screen driving chip, it is characterised in that also comprise: N bar detection line, N
Individual connection pin and N number of detector unit;Wherein, N is natural number;
Touch sensing layer is laid on the glass substrate;N number of detector unit is arranged in screen driving chip;
N number of detection line may be contained within the periphery, display functional areas of touch sensing layer with N number of pin that is connected;Its
In, display periphery, functional areas is provided with N number of detection region, and each detection region is provided with a detection line;
N bar detection line one end ground connection, the other end is correspondingly connected to N number of connection pin;N number of connection pin
Connection corresponding with N number of detector unit;Wherein, N number of detector unit is used for detecting whether N bar detection line leads
Logical.
Embodiments of the present invention additionally provide a kind of electronic equipment, comprise: processor and above-mentioned
Screen module;Processor is electrically connected with screen module.
Embodiments of the present invention additionally provide the testing methods for tiny crack of a kind of screen module, are applied to above-mentioned
Group of screens, comprise the steps of
Control panel driving chip applies to detect electric current in each detector unit;
Obtain the detection parameter in each detector unit;
Whether the conducting of each detection line is judged according to each detection parameter;
Whether conducting according to each detection line, detects the position of micro-crack on screen module.
In terms of existing technologies, screen module comprises embodiment of the present invention: glass substrate, touch inspection
Survey layer, screen driving chip, N bar detection line, N number of connection pin and N number of detector unit;Wherein,
N is natural number;Touch sensing layer is laid on the glass substrate;N number of detector unit is arranged at screen and drives core
In sheet;N number of detection line may be contained within the periphery, display functional areas of touch sensing layer with N number of pin that is connected;
Wherein, display periphery, functional areas is provided with N number of detection region, and each detection region is provided with a detection line;N bar
Detection line one end ground connection, the other end is correspondingly connected to N number of connection pin;N number of connection pin and N number of inspection
Survey unit correspondence to connect;Wherein, N number of detector unit is used for detecting whether N bar detection line turns on.Pass through
This mode, is divided into multiple detection region, each detection zone by the periphery of the display functional areas of screen module
Territory is designed with detecting line, by the detection of the conduction status to each detection line, thus to each detection zone
Whether territory exists micro-crack is detected, it is possible to simple and effective detect the screen module that there is micro-crack,
And the existence position of micro-crack, in order to electronic equipment producer process in advance, it is to avoid badness screen
Module flows in next process, effectively reduces what badness screen module brought to electronics manufacturers
Economic loss, and screen module protective measure in transportation is had directivity, by each screen module
The existence position of micro-crack is added up, in order to easily occur that the position of micro-crack is carried out on screen module
Lay special stress on protecting.
It addition, touch sensing layer is formed by the etching of tin indium oxide ito film;N bar detection line and N number of company
Connect pin and be etched in tin indium oxide ito film.Owing to screen module is when making, originally it is accomplished by glass substrate
Upper spraying tin indium oxide ito film, and etch trickle figure in the tin indium oxide ito film of spraying,
To form touch layer.Therefore, in the present invention, touch sensing layer is formed by the etching of tin indium oxide ito film,
Each detection line and each pin that connects are etched in tin indium oxide ito film, are equivalent to manufacture stream at touch layer
Detection line and connection pin are etched by journey in passing, simple to operation.Further, tin indium oxide ITO
Film is hyaline membrane, less to the appearance effects of screen module.
It addition, screen driving chip is built-in with a depositor, for whether storing the conducting indicating each detection line
Id signal.In this way, it is possible to achieve in advance the detection parameter in each detector unit is carried out
Process, and be respectively stored in depositor, in order to detection device or detection device can directly read and post
Each id signal in storage, thus judge whether shield each detection region of module according to each id signal
There is micro-crack.
It addition, detection line at least encloses around corresponding detection region one, make as far as possible to detect region
Interior micro-crack can be detected.
It addition, in the testing methods for tiny crack of screen module, judging leading of detection line according to detection parameter
After the step whether led to, also comprise the steps of and corresponding each flag bit is set according to each detection parameter
Value;Wherein, the value of flag bit is used for indicating whether detection line turns on;In the conducting according to each detection line
Whether, detect on screen module in the step of the position of micro-crack, comprise following sub-step: according to
The value of each flag bit arranged, it is judged that whether the detection region that each detection line is corresponding exists micro-crack;Its
In, if the value instruction detection line conducting of flag bit, then judge that the detection region that detection line is corresponding does not exists
Micro-crack;If the value instruction detection line of the flag bit arranged is not turned on, then judge the inspection that detection line is corresponding
Survey region and there is micro-crack;Whether there is micro-crack according to the detection region corresponding to each detection line, obtain
The position of micro-crack on screen module.Whether the value utilizing flag bit indicates the conducting of detection line, energy
The flat-footed conducting state reflecting detection line, in order to detection device or detection device are by reading
To the value of each flag bit judge whether each detection region exists micro-crack.
It addition, in the testing methods for tiny crack of screen module, arrange corresponding each according to each detection parameter
In the step of the value of flag bit, screen driving chip the value of each flag bit is set;At the mark according to each setting
The value of will position, it is judged that whether the detection region corresponding to each detection line exists in the step of micro-crack, comprises
Following sub-step: the processor of electronic equipment reads the value of the flag bit of each setting;Wherein, processor with
Screen driving chip is electrically connected with by flexible circuit board;Processor according to the value of each flag bit read,
Judge whether the detection region corresponding to each detection line exists micro-crack.So, screen driving chip set
Put the value of each flag bit, provide possibility for alleviating the processing load of electronics processors.
Accompanying drawing explanation
Fig. 1 is the profile according to the screen module in first embodiment of the invention;
Fig. 2 is the front schematic view according to the screen module in first embodiment of the invention;
Fig. 3 is according to the circuit diagram in the detection region in first embodiment of the invention;
Fig. 4 is the front schematic view according to the screen module in second embodiment of the invention;
Fig. 5 is the flow process of the testing methods for tiny crack according to the screen module in four embodiment of the invention
Figure.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing to this
Each embodiment of invention is explained in detail.But, those of ordinary skill in the art can manage
Solving, in each embodiment of the present invention, in order to make reader be more fully understood that, the application proposes many skills
Art details.But, even if do not have these ins and outs and many variations based on following embodiment and
Amendment, it is also possible to realize the application each claim technical scheme required for protection.
First embodiment of the present invention relates to a kind of screen module, with reference to as shown in Figure 1 to Figure 2.This reality
Mode of executing is implemented on the basis of electronic equipment, and electronic equipment can be mobile phone, panel computer, electricity
The terminal unit such as brain, intelligent television.
Screen module in present embodiment comprises: glass substrate 1, touch sensing layer 2, screen driving chip 3,
N bar detection line 4, N number of connection pin 5 and N number of detector unit 6, wherein, N is natural number.
In present embodiment, the concrete structure of screen module is: touch sensing layer 2 is laid on glass substrate 1,
N number of detector unit 6 is arranged in screen driving chip 3, N bar detection line 4 and N number of connection pin 5
The display functional areas that may be contained within touch sensing layer 2 are peripheral.Wherein, display periphery, functional areas is provided with N number of
Detection region, the position peripheral in display functional areas corresponding to each detection region, can be stored in advance in
In electronic equipment, each detection region is provided with a detection line, and in Fig. 2, dotted line indication region is detection region.
Wherein, each detection line 4 one end is all connected with earth terminal GND, and other end correspondence connects one
Connecting pin 5, there is a detector unit 6 each connection pin 5 corresponding connection, thus defines N bar and use
The detection circuit of micro-crack whether is there is in each detection region of detection.
In present embodiment, whether detector unit 6 is turned on by the detection line 4 that detection is corresponding, thus examines
Whether the detection circuit corresponding to survey turns on.Detector unit 6 comprises the first resistance and for drawing with being connected
The detection pin that foot 5 connects, first resistance one end is connected with detection pin, other end ground connection.Therefore,
Whether each detection region existing micro-crack when detecting, each detection circuit has two circuit branch,
As it is shown on figure 3, circuit branch is respectively as follows:
First branch road: detection pin--detection line 4--earth terminal;
Second branch road: detection pin--the first resistance R1--earth terminal GND.
Specifically, owing to when arranging detection line 4, the thinner thickness of detection line 4, therefore when certain
When there is micro-crack in detection region, then the detection line 4 in this region will disconnect, and detection line 4 will not be by
Conducting, now the first branch road is off, and the second branch road is in the conduction state.Otherwise, when certain
When detection region does not exists micro-crack, then detection line 4 is normal, and now the first branch road is in the conduction state,
Second branch road is off.Therefore, different according to the circuit branch turned on, the detection list caused
The detection parameter that unit obtains is different such that it is able to by the conducting of detection line 4 whether detection, in order to
In detecting whether the detection region burying this detection line underground exists micro-crack.
When practical operation, each connection pin 5 is applied by control panel driving chip 3 by each detection pin
Certain detection electric current I.When certain detection line 4 is not at conducting state, circuit in the conduction state
Branch road is: detection pin--detection line 4--earth terminal GND;When detecting line 4 and being in the conduction state, quilt
The circuit branch of conducting is: detection pin--the first resistance R1--earth terminal GND.Drawn by detection detection
Voltage on foot just may determine that detection line 4 is the most in the conduction state.As, it is assumed that detection line 4
Resistance is 600 kilo-ohms, and the resistance of the first resistance R1 is far smaller than the resistance of detection line 4, the inspection of applying
Surveying electric current I is 1 microampere, then theoretical value U of voltage on detection pin0For:
1, when detecting line 4 and being not turned on, voltage U0Resistance-the 0=1 of=detection electric current I* detection line 4 is micro-
Pacify * 600 kilo-ohms of-0=0.6 volts;
2, when detecting line 4 and turning on, voltage U0The resistance-0 of=detection electric current I* the first resistance R1;
Because the resistance of the first resistance R1 is far smaller than the resistance of detection line 4, when detection line 4 is corresponding
Detection region when there is not micro-crack, detection line 4 is not turned on, and the voltage U on detection pin is 0.6V;
Otherwise, when the detection region detecting line 4 correspondence exists micro-crack, detection line 4 turns on, and detects pin
On voltage be far smaller than 0.6V.So, detect the virtual voltage on detection pin by voltmeter
U1, by virtual voltage U1With theoretical value U0Compare, just may determine that whether detection line 4 turns on,
It is thus possible to according to the conducting of detection line 4 whether, detect whether the detection region of detection line 4 correspondence deposits
At micro-crack, according to there is the detection region of micro-crack, inquire which position that display functional areas are peripheral
Put and there is micro-crack.
But, the concrete form of detector unit 4 is not limited thereto.Further, whether detection line 4 is located
In the detection mode of conducting state, the most do not do any restriction at this, when practical operation, it is also possible to control
System screen driving chip 3 applies certain detection voltage by each detection pin to each connection pin 5, passes through
Whether the actual current that detection detection pin goes out, exist micro-crack to detection region and detect.
Owing to screen module is when making, originally it is accomplished by spraying tin indium oxide ito film on the glass substrate, and
The tin indium oxide ito film of spraying etches trickle figure, to form touch layer.Therefore, at this
In embodiment, detection layers 2 is formed by the etching of tin indium oxide ito film, detection line 4 and connection pin
5 are etched in tin indium oxide ito film.So, being equivalent in passing will detection in flow process manufacturing of touch layer
Line and connection pin etch, simple to operation.Further, tin indium oxide ito film is hyaline membrane,
Less to the appearance effects of screen module.
It is noted that in present embodiment, screen driving chip 3 is built-in with a depositor, is used for depositing
Storage indicates the conducting whether id signal of each detection line 4.As, when practical operation, can be driven by screen
Dynamic chip 3 (i.e. detects the reality on pin according to the detection parameter in each detector unit 6 in present embodiment
Border voltage U1) id signal is set, and set each id signal is stored in depositor.Wherein,
Id signal can be the form of flag bit, utilizes the value of flag bit to indicate whether detection line 4 turns on.
When practical operation, each detection region can be numbered, and by corresponding for each detection region
Numbering be stored in advance in the electronic equipment with this screen module, and each detection region screen drive core
In the depositor that sheet 3 is built-in, it is equipped with the flag bit address of correspondence.As, when screen driving chip 3 detects
Virtual voltage U on the detection pin in " 001 " detection region1Relatively time big (such as 0.6V), now table
Show that the detection line 4 in " 001 " detection region turns on, then " 001 " is detected region by screen driving chip 3
The mark place value of corresponding flag bit address is set to 0;When screen driving chip 3 detects " 002 " detection zone
Virtual voltage U on the detection pin in territory1Time less (as close to 0V), now " 002 " detection
Detection line 4 in region is not turned on, then screen driving chip 3 is by mark corresponding for " 002 " detection region
The mark place value of bit address is set to 1.In this way so that detection device or detection device can be straight
Connect each id signal read in depositor, judge to shield whether module exists micro-crack according to each id signal,
More convenient fast.
It is not difficult to find out, in present embodiment, by screen driving chip according to the detection parameter in each detector unit
Id signal is set, to reduce the processing load of electronics processors.When practical operation, it is also possible to
By the processor of electronic equipment, id signal is set according to the detection parameter in each detector unit.As, screen drives
The processor of the detection parameter transmission in each detector unit to electronic equipment is processed by dynamic chip, now,
Screen driving chip plays the effect of a switching.In present embodiment, mark letter is set according to detection parameter
Number mode, only illustrate with this and be limited, do not do any restriction at this, any according in detector unit
Detection parameter arranges the mode of id signal, all within the protection domain of present embodiment.
In sum, in present embodiment, by the way of at the touch layer of screen module, detection line is set,
Screen module is shown that the micro-crack that periphery, functional areas exists is identified detection, by the display merit of screen module
The periphery in energy district is divided into multiple detection region, and each detection region is designed with detecting line, by each
The detection of the conduction status of detection line, thus whether each detection region is existed micro-crack and detects,
Simple and effective can detect the screen module that there is micro-crack, and the existence position of micro-crack, in order to
In electronic equipment, producer processes in advance, it is to avoid badness screen module flows in next process, effectively
Reduce the economic loss that badness screen module brings to electronics manufacturers, and to screen module in transport
During protective measure there is directivity, the existence position of each screen module micro-crack is added up,
So that easily occurring that the position of micro-crack is laid special stress on protecting on screen module.
Second embodiment of the present invention relates to a kind of screen module, as shown in Figure 4.Second embodiment exists
Improved on the basis of first embodiment, mainly theed improvement is that: the present invention the second embodiment party
In formula, detection line 4 at least encloses around corresponding detection region one, makes as far as possible to detect in region
Micro-crack can be detected.As, can by detection line more than 4 time around corresponding detection region,
Can be detected so that once having micro-crack in detection region.
Third embodiment of the present invention relates to a kind of electronic equipment, comprises: processor and such as first is in fact
Execute the screen module in mode or the second embodiment.Processor is electrically connected with screen module.
4th embodiment of the present invention relates to the testing methods for tiny crack of a kind of screen module, is applied to such as
Screen module in one embodiment or the second embodiment, shields the microcrack zone of module in present embodiment
Method, idiographic flow is as it is shown in figure 5, comprise the steps of:
Step 501, control panel driving chip applies to detect electric current in each detector unit.
Specifically, in present embodiment, screen driving chip can also be set with electronics by flexible circuit board
Standby processor connects, electronics processors control panel driving chip apply detection in detector unit
Electric current.Being connected with detector unit owing to connecting pin, respectively detection electric current is by each detector unit transmission
To each connection pin, and it is sent to each detection line from each connection pin.
Step 502, obtains the detection parameter in each detector unit.
Specifically, the detection parameter during processor control panel driving chip obtains each detector unit.Wherein,
Detector unit can comprise detection pin and the first resistance, and first resistance one end is connected with detection pin,
Other end ground connection, detection pin is used for and is connected pin connection.Therefore, whether each detection region is existed
When micro-crack detects, each detection circuit has two circuit branch, as it is shown on figure 3, circuit divides
Prop up and be respectively as follows: the first branch road: detection pin--detection line 4--earth terminal;Second branch road: detection pin--
First resistance R1--earth terminal GND.
When detecting line and being in the conduction state, circuit branch in the conduction state is: detection pin--inspection
Survey line--earth terminal;When detecting line and being not at conducting state, circuit branch switched on is: detection is drawn
Foot--first resistance--earth terminal.Further, the resistance of the first resistance is different from the resistance of detection line.Therefore,
Just may determine that detection line is the most in the conduction state by the voltage on detection detection pin, then this reality
The detection parameter executed in mode in acquired detector unit just can be: obtains the reality on detection detection pin
Border voltage.
Whether step 503, judge the conducting of each detection line according to each detection parameter, and according to each detection line
Conducting whether judge to shield the position of micro-crack on module.
Wherein, step 503 comprises sub-step 5031 and sub-step 5032.
Sub-step 5031, arranges the value of each flag bit according to each detection parameter.
In present embodiment, can be arranged the value of each flag bit by screen driving chip, the value of flag bit is used for
Whether instruction detection line turns on.As, it is assumed that the resistance of detection line 4 is 600 kilo-ohms, the first resistance R1
Resistance be far smaller than detection line 4 resistance, the detection electric current I of applying is 1 microampere, then when detection line
During conducting, the virtual voltage on detection pin is far longer than reality when detection line is not turned on detection pin
Voltage.When screen driving chip detects the virtual voltage U on detection pin1Time bigger, then screen drives core
The value of flag bit is set to 0 by sheet, now the conducting of detection line;When screen driving chip detects on detection pin
Virtual voltage U1Time less (as close to 0V), then the value of flag bit is set to 1 by screen driving chip,
Now detection line is not turned on.
It is noted that in present embodiment, screen driving chip is built-in with a depositor, according to each
After detection parameter arranges the value of flag bit, also each flag bit is arranged in depositor, in order to electronics sets
The value of the standby each flag bit set by processor reading.When practical operation, can be to each detection zone
Territory is numbered, and numbering corresponding for each detection region is stored in advance in the electronics with this screen module
In equipment, and each detection region is in the depositor that screen driving chip 3 is built-in, is equipped with the mark of correspondence
Will bit address.As, the reality on the detection pin that screen driving chip 3 detects " 001 " detection region
Voltage U1Relatively time big (such as 0.6V), now represent that the detection line 4 in " 001 " detection region turns on,
Then the mark place value of flag bit address corresponding for " 001 " detection region is set to 0 by screen driving chip 3;When
Screen driving chip 3 detects the virtual voltage U on the detection pin in " 002 " detection region1Less (as
Close to 0V) time, now the detection line 4 in " 002 " detection region is not turned on, then screen drives core
The mark place value of flag bit address corresponding for " 002 " detection region is set to 1 by sheet 3.In this way,
Make detect device or detect each id signal that device can directly read in depositor, according to each mark
Signal judges to shield whether module exists micro-crack, more convenient fast.
Sub-step 5032, according to the value of each flag bit arranged, it is judged that whether each detection region exists fine fisssure
Stricture of vagina.
Wherein, if the value instruction detection line conducting of the flag bit arranged, then judge that detection region does not exists
Micro-crack;If the value instruction detection line of the flag bit arranged is not turned on, then judge that detection region exists micro-
Crackle.
Specifically, can in advance position corresponding for each detection region be stored in electronic equipment, in order to
In by the conducting state to each detection line, it is judged that whether there is micro-crack in each detection region, determine screen
The existence position of module micro-crack.As, the coordinate axes of correspondence can be set for touch sensing layer, pass through
Each coordinate points area defined on coordinate axes, limits each detection position, region.As,
XXX detection region be rectangle, XXX detection region be: coordinate X1Y1, coordinate X2Y2, coordinate
X3Y3, coordinate X4Y4Area defined.
Owing to when arranging detection line, detecting the thinner thickness of line, therefore there is micro-crack when detection region
Time, then detection line will turn on, and now detection line can not be switched on.Otherwise, when detection region does not exists
During micro-crack, then detection line is normal, and now detection line can be switched on.Therefore, the conducting to detection line
Whether detection just can detect whether detection region exists micro-crack.
It is not difficult to find out, in present embodiment, screen driving chip flag bit is set according to each detection parameter
Value, to alleviate the processing load of electronics processors.Certainly, when practical operation, it is also possible to directly
The value of each flag bit is set by the processor of electronic equipment.As, processor and screen driving chip are by soft
Circuit board is electrically connected with, and the detection parameter in each detector unit that screen driving chip will obtain is sent to electronics
Device handler, is arranged the value of corresponding flag bit by processor according to each detection parameter.Wherein, mark
The value of position is used for indicating whether detection line turns on.
The step of the most various methods divides, and is intended merely to describe clear, it is achieved time can merge into one
Individual step or split some step, is decomposed into multiple step, closes as long as comprising identical logic
System, all in the protection domain of this patent;To add in algorithm or in flow process inessential amendment or
Person introduces inessential design, but does not change the core design of its algorithm and flow process all the guarantor of this patent
In the range of protecting.
It will be understood by those skilled in the art that the respective embodiments described above are to realize the tool of the present invention
Body embodiment, and in actual applications, can to it, various changes can be made in the form and details, and not
Deviation the spirit and scope of the present invention.
Claims (10)
1. a screen module, it is characterised in that comprise glass substrate, touch sensing layer, screen driving core
Sheet, it is characterised in that also comprise: N bar detection line, N number of connection pin and N number of detector unit;
Wherein, N is natural number;
Described touch sensing layer is laid on described glass substrate;Described N number of detector unit is arranged at institute
State in screen driving chip;
Described N number of detection line may be contained within the display of described touch sensing layer with described N number of pin that is connected
Functional areas are peripheral;Wherein, periphery, described display functional areas is provided with N number of detection region, each described detection
Region is provided with detection line described in;
Described N bar detection line one end ground connection, the other end is correspondingly connected to described N number of connection pin;Institute
State the connection corresponding with described N number of detector unit of N number of connection pin;Wherein, described N number of detector unit
For detecting whether described N bar detection line turns on.
Screen module the most according to claim 1, it is characterised in that described touch sensing layer is by oxygen
Change the etching of indium stannum ito film to form;
Described N bar detection line and described N number of connection pin are etched in described tin indium oxide ito film.
Screen module the most according to claim 1, it is characterised in that each described detector unit bag
Contain: detection pin and the first resistance;
Described first resistance one end is connected with described detection pin, other end ground connection;
Wherein, each described detection pin connects for corresponding with each described connection pin.
Screen module the most according to claim 1, it is characterised in that described screen driving chip is built-in
There is a depositor, for storing the conducting indicating each described detection line whether id signal.
Screen module the most according to claim 1, it is characterised in that described detection line at least cincture
Corresponding described detection region one is enclosed.
6. an electronic equipment, it is characterised in that comprise: processor and if claim 1 is to power
Profit requires the screen module in 5 described in any one;
Described processor is electrically connected with described screen module.
7. the testing methods for tiny crack shielding module, it is characterised in that be applied to such as claim 1
To the screen module according to any one of 5;The testing methods for tiny crack of described screen module comprises following step
Rapid:
Control described screen driving chip to apply to detect electric current in each described detector unit;
Obtain the detection parameter in each described detector unit;
Whether the conducting of each described detection line is judged according to each described detection parameter;
Whether conducting according to each described detection line, detects that on described screen module, the institute of micro-crack is in place
Put.
The testing methods for tiny crack of screen module the most according to claim 7, it is characterised in that
After the described conducting whether step judging described detection line according to described detection parameter, also comprise following
Step:
The value of corresponding each flag bit is set according to each described detection parameter;Wherein, described flag bit
Value be used for indicating whether described detection line turns on;
In the described conducting according to each described detection line whether, micro-crack on described screen module is detected
In the step of position, comprise following sub-step:
The value of the flag bit according to each described setting, it is judged that the detection region that each described detection line is corresponding is
No there is micro-crack;Wherein, if the value of described flag bit indicates the conducting of described detection line, then judge
There is not micro-crack in the detection region that described detection line is corresponding;If the value of the flag bit of described setting refers to
Show that described detection line is not turned on, then judge that the detection region that described detection line is corresponding exists micro-crack;
Whether there is micro-crack according to the detection region corresponding to each described detection line, obtain described screen mould
The position of micro-crack in group.
The testing methods for tiny crack of screen module the most according to claim 8, it is characterised in that institute
State in the step of the value that corresponding each flag bit is set according to each described detection parameter, described screen drive
Dynamic chip arranges the value of described each flag bit;
Value at the flag bit according to each described setting, it is judged that the detection zone corresponding to each described detection line
Whether territory exists in the step of micro-crack, comprises following sub-step:
The processor of described electronic equipment reads the value of the flag bit of each described setting;Wherein, described place
Reason device is electrically connected with by flexible circuit board with described screen driving chip;
Described processor is according to the value of each described flag bit read, it is judged that each described detection line institute is right
Whether the detection region answered exists micro-crack.
The testing methods for tiny crack of screen module the most according to claim 9, it is characterised in that each
Described flag bit is arranged in the depositor that described screen driving chip is built-in.
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