CN106011549A - Nanometer tungsten carbide enhanced aluminum magnesium alloy material for automobile electronic packaging and preparing method of nanometer tungsten carbide enhanced aluminum magnesium alloy material - Google Patents
Nanometer tungsten carbide enhanced aluminum magnesium alloy material for automobile electronic packaging and preparing method of nanometer tungsten carbide enhanced aluminum magnesium alloy material Download PDFInfo
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- CN106011549A CN106011549A CN201610550179.7A CN201610550179A CN106011549A CN 106011549 A CN106011549 A CN 106011549A CN 201610550179 A CN201610550179 A CN 201610550179A CN 106011549 A CN106011549 A CN 106011549A
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- tungsten carbide
- nanometer tungsten
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1026—Alloys containing non-metals starting from a solution or a suspension of (a) compound(s) of at least one of the alloy constituents
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0052—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides
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Abstract
The invention discloses a nanometer tungsten carbide enhanced aluminum magnesium alloy material for automobile electronic packaging. The alloy material comprises, by weight, 6%-8% of magnesium, 2%-4% of zinc, 1%-2% of molybdenum, 4%-5% of copper, 2%-3% of boron, 40%-60% of nanometer tungsten carbide sol, 1%-2% of a pore forming agent, 0.5%-1% of absolute ethyl alcohol and the balance aluminum.
Description
Technical field
The present invention relates to electronic package material technical field, particularly relate to a kind of automotive electronics encapsulation nanometer tungsten carbide and strengthen hydronalium and preparation method thereof.
Background technology
Automotive electronics is the general name of electronic control device for vehicle and vehicular automotive electronic device, and automotive electronics occupies vital position in automotive engineering, is exploitation new model, improves the most important technical measures of automotive performance.Owing to automotive interior exists the adverse circumstances factors such as extreme operating temperature range, strong mechanical vibration and spot be more, automobile electronics performance to be guaranteed is interference-free, must carry out the encapsulation work of product, the encapsulating material chosen is to realize the technology trends such as industry lower cost, higher function, higher reliability.
Preferably electronic package material thermal coefficient of expansion to be possessed is low, high heat conduction, air-tightness is good, enough strength and stiffness, it is easy to the advantage such as machine-shaping and welding and lightweight light weight, the most conventional a few class wrapper materials mainly have plastic encapsulant, ceramic packaging material, Materials for Metal Packaging and several big class of metal-base composites, wherein metal-based compound electronics encapsulating material has intensity height, the advantages such as heat conductivity is good become the focus of industry research, especially aluminium based metal material, the advantage of its lightweight is extensively favored at automotive field, the combination property improving aluminum-based packaging material is also study hotspot." vacuum heating-press sintering method prepares diamond/Al-Cu based composites ", a literary composition utilized the mode of vacuum heating-press sintering to improve the interface untoward reaction of diamond and aluminum, it is simultaneously introduced Cu powder and improves performance, this method uses micron-sized diamond powder body, although obtaining the composite of high heat conductance, but the intensity of alloy material, plasticity reduce the most to a certain extent, range is limited, nano grade inorganic material has prominent advantage in terms of improving alloy property, but the dispersibility that nanometer materials are in the alloy is the most not fully up to expectations.
Summary of the invention
The object of the invention is contemplated to make up the defect of prior art, it is provided that a kind of automotive electronics encapsulation nanometer tungsten carbide strengthens hydronalium and preparation method thereof.
The present invention is achieved by the following technical solutions:
A kind of automotive electronics encapsulation nanometer tungsten carbide strengthens hydronalium, and this alloy material is made up of the raw material of following weight portion: magnesium 6-8%, zinc 2-4%, molybdenum 1-2%, copper 4-5%, boron 2-3%, nanometer tungsten carbide colloidal sol 40-60%, pore creating material 1-2%, dehydrated alcohol 0.5-1, surplus are aluminum.
Described nanometer tungsten carbide colloidal sol is formulated by following methods: Dodecyl trimethyl ammonium chloride put in dehydrated alcohol, and stirring puts into nanometer tungsten carbide, sonic oscillation dispersion 10-15h to it after being completely dissolved, to obtain final product；Wherein nanometer tungsten carbide, dehydrated alcohol, the weight ratio of Dodecyl trimethyl ammonium chloride three are 1:5:0.1.
Described pore creating material is the one in sodium chloride, sodium carbonate, spherical carbamide.
Described a kind of automotive electronics encapsulation nanometer tungsten carbide strengthens the preparation method of hydronalium and comprises the following steps:
(1) first by aluminum, magnesium, zinc, molybdenum, copper, boron, pore creating material, dehydrated alcohol mixes, with 400-500 turn/rotating speed of min mixes powder 5-10min, gained mixed material obtains green compact through compacting densification, subsequently green compact are put in mould Thermocompressed sintering and forming under vacuum, sintering process is: system is warming up to 500-550 DEG C with the programming rate of 15-20 DEG C/min, pressurize when temperature reaches 500 DEG C, pressure is 40-60MPa, heat preservation sintering 50-60min, naturally cool to release after room temperature subsequently, products obtained therefrom is put in water and is dried after dissolution pore creating material, obtain Al-Mg alloy foam prefabricated component standby；
(2) the Al-Mg alloy foam prefabricated component of step (1) gained is put in mould, it is subsequently added nanometer tungsten carbide colloidal sol, long-pending 50-60min is oozed under-0.01--0.05MPa, process recovers normal pressure after terminating, and takes out prefabricated component, dried 2-3h in 80-100 DEG C of baking oven, subsequently prefabricated component is placed again in mould, 750-800 DEG C, again sinter 20-30min under 20-30MPa pressure, release of finally lowering the temperature, i.e. obtain described encapsulation alloy material after being cooled to room temperature.
The invention have the advantage that
(1) encapsulating material of the present invention is using almag as base material, and blends zinc, molybdenum, copper, boron element wherein, it is thus achieved that ultralight high-strength alloy material, has prominent application advantage in automobile component field.
(2) alloy powder is first processed into Al-Mg alloy foam prefabricated component in technique by the present invention, and nanometer tungsten carbide oozed with the form vacuum of colloidal sol amass in alloy components, finished product is prepared again after double sintering, this technological process improves nanometer tungsten carbide dispersibility in alloy material, reach efficient reinforced effects, improve the abrasion resistance properties of alloy material surface, improve the stability in use of electronic device, the most this processing method also changes alloy internal structure, improve the damping of alloy material, reach excellent encapsulation protection effect.
Detailed description of the invention
A kind of automotive electronics encapsulation nanometer tungsten carbide strengthens hydronalium, and this alloy material is made up of the raw material of following weight portion: magnesium 6%, zinc 2%, molybdenum 1%, copper 4%, boron 2%, nanometer tungsten carbide colloidal sol 40%, pore creating material 1%, dehydrated alcohol 0.5, surplus are aluminum.
Wherein nanometer tungsten carbide colloidal sol is formulated by following methods: Dodecyl trimethyl ammonium chloride put in dehydrated alcohol, and stirring puts into nanometer tungsten carbide, sonic oscillation dispersion 10h to it after being completely dissolved, to obtain final product；Wherein nanometer tungsten carbide, dehydrated alcohol, the weight ratio of Dodecyl trimethyl ammonium chloride three are 1:5:0.1.
The pore creating material used is spherical carbamide.
The preparation method of this alloy material comprises the following steps:
(1) first by aluminum, magnesium, zinc, molybdenum, copper, boron, pore creating material, dehydrated alcohol mixes, powder 5min is mixed with the rotating speed of 400 turns/min, gained mixed material obtains green compact through compacting densification, subsequently green compact are put in mould Thermocompressed sintering and forming under vacuum, sintering process is: system is warming up to 500 DEG C with the programming rate of 15 DEG C/min, pressurize when temperature reaches 500 DEG C, pressure is 40MPa, heat preservation sintering 50min, naturally cool to release after room temperature subsequently, products obtained therefrom is put in water and is dried after dissolution pore creating material, obtain Al-Mg alloy foam prefabricated component standby；
(2) the Al-Mg alloy foam prefabricated component of step (1) gained is put in mould, it is subsequently added nanometer tungsten carbide colloidal sol, long-pending 60min is oozed under-0.01MPa, process recovers normal pressure after terminating, and takes out prefabricated component, dried 2h in 80 DEG C of baking ovens, subsequently prefabricated component is placed again in mould, 750 DEG C, again sinter 30min under 20MPa pressure, release of finally lowering the temperature, i.e. obtain described encapsulation alloy material after being cooled to room temperature.
Taking obtained material and prepare standard specimen, carry out performance test according to relevant criterion, test result is:
Density: 2.62g/cm3；Bending strength: 74MPa；Thermal conductivity: 218W/m.k；Thermal coefficient of expansion: 2.52 × 10-6m/k；The most solderable: to be.
Claims (4)
1. an automotive electronics encapsulation nanometer tungsten carbide strengthens hydronalium, it is characterized in that, this alloy material is made up of the raw material of following weight portion: magnesium 6-8%, zinc 2-4%, molybdenum 1-2%, copper 4-5%, boron 2-3%, nanometer tungsten carbide colloidal sol 40-60%, pore creating material 1-2%, dehydrated alcohol 0.5-1, surplus are aluminum.
2. a kind of automotive electronics encapsulation nanometer tungsten carbide as claimed in claim 1 strengthens hydronalium, it is characterized in that, described nanometer tungsten carbide colloidal sol is formulated by following methods: Dodecyl trimethyl ammonium chloride put in dehydrated alcohol, stirring puts into nanometer tungsten carbide after being completely dissolved to it, sonic oscillation dispersion 10-15h, to obtain final product；Wherein nanometer tungsten carbide, dehydrated alcohol, the weight ratio of Dodecyl trimethyl ammonium chloride three are 1:5:0.1.
3. a kind of automotive electronics encapsulation nanometer tungsten carbide as claimed in claim 1 strengthens hydronalium, it is characterised in that described pore creating material is the one in sodium chloride, sodium carbonate, spherical carbamide.
A kind of automotive electronics encapsulation nanometer tungsten carbide the most as claimed in claim 1 strengthens the preparation method of hydronalium, it is characterised in that described preparation method comprises the following steps:
(1) first by aluminum, magnesium, zinc, molybdenum, copper, boron, pore creating material, dehydrated alcohol mixes, with 400-500 turn/rotating speed of min mixes powder 5-10min, gained mixed material obtains green compact through compacting densification, subsequently green compact are put in mould Thermocompressed sintering and forming under vacuum, sintering process is: system is warming up to 500-550 DEG C with the programming rate of 15-20 DEG C/min, pressurize when temperature reaches 500 DEG C, pressure is 40-60MPa, heat preservation sintering 50-60min, naturally cool to release after room temperature subsequently, products obtained therefrom is put in water and is dried after dissolution pore creating material, obtain Al-Mg alloy foam prefabricated component standby；
(2) the Al-Mg alloy foam prefabricated component of step (1) gained is put in mould, it is subsequently added nanometer tungsten carbide colloidal sol, long-pending 50-60min is oozed under-0.01--0.05MPa, process recovers normal pressure after terminating, and takes out prefabricated component, dried 2-3h in 80-100 DEG C of baking oven, subsequently prefabricated component is placed again in mould, 750-800 DEG C, again sinter 20-30min under 20-30MPa pressure, release of finally lowering the temperature, i.e. obtain described encapsulation alloy material after being cooled to room temperature.
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| CN201610550179.7A CN106011549A (en) | 2016-07-13 | 2016-07-13 | Nanometer tungsten carbide enhanced aluminum magnesium alloy material for automobile electronic packaging and preparing method of nanometer tungsten carbide enhanced aluminum magnesium alloy material |
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| CN201610550179.7A CN106011549A (en) | 2016-07-13 | 2016-07-13 | Nanometer tungsten carbide enhanced aluminum magnesium alloy material for automobile electronic packaging and preparing method of nanometer tungsten carbide enhanced aluminum magnesium alloy material |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107245674A (en) * | 2017-06-22 | 2017-10-13 | 苏州南尔材料科技有限公司 | A kind of preparation method of electromagnetic shielding alloy material |
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| CN104559244A (en) * | 2013-10-22 | 2015-04-29 | 中国石油化工股份有限公司 | Method for preparing TiO2 modified emulsified asphalt |
| CN104894418A (en) * | 2015-07-01 | 2015-09-09 | 天津大学 | In-situ synthesized spinel whisker reinforced aluminum-based composite foam and preparation method thereof |
| CN105296821A (en) * | 2015-12-02 | 2016-02-03 | 苏州捷德瑞精密机械有限公司 | Zinc magnesium aluminum alloy material and preparation method thereof |
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- 2016-07-13 CN CN201610550179.7A patent/CN106011549A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104559244A (en) * | 2013-10-22 | 2015-04-29 | 中国石油化工股份有限公司 | Method for preparing TiO2 modified emulsified asphalt |
| CN104894418A (en) * | 2015-07-01 | 2015-09-09 | 天津大学 | In-situ synthesized spinel whisker reinforced aluminum-based composite foam and preparation method thereof |
| CN105296821A (en) * | 2015-12-02 | 2016-02-03 | 苏州捷德瑞精密机械有限公司 | Zinc magnesium aluminum alloy material and preparation method thereof |
Non-Patent Citations (1)
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| 中国航空工业集团公司复合材料技术中心主编: "《航空复合材料技术》", 31 December 2013, 北京：航空工业出版社 * |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107245674A (en) * | 2017-06-22 | 2017-10-13 | 苏州南尔材料科技有限公司 | A kind of preparation method of electromagnetic shielding alloy material |
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Application publication date: 20161012 |