CN106001982A - High-melting-point lead-free bismuth silver tin brazing filler metal and preparation method thereof - Google Patents
High-melting-point lead-free bismuth silver tin brazing filler metal and preparation method thereof Download PDFInfo
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- CN106001982A CN106001982A CN201610536829.2A CN201610536829A CN106001982A CN 106001982 A CN106001982 A CN 106001982A CN 201610536829 A CN201610536829 A CN 201610536829A CN 106001982 A CN106001982 A CN 106001982A
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- silver tin
- brazing filler
- filler metal
- bismuth silver
- point lead
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- 238000005219 brazing Methods 0.000 title claims abstract description 35
- 239000000945 filler Substances 0.000 title claims abstract description 33
- QKAJPFXKNNXMIZ-UHFFFAOYSA-N [Bi].[Ag].[Sn] Chemical compound [Bi].[Ag].[Sn] QKAJPFXKNNXMIZ-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 11
- 239000002184 metal Substances 0.000 title claims abstract description 11
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 238000006263 metalation reaction Methods 0.000 title 1
- 229910001092 metal group alloy Inorganic materials 0.000 claims abstract description 27
- 238000002844 melting Methods 0.000 claims abstract description 24
- 150000003839 salts Chemical class 0.000 claims abstract description 17
- 230000005496 eutectics Effects 0.000 claims abstract description 16
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 claims abstract description 12
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims abstract description 10
- 239000001103 potassium chloride Substances 0.000 claims abstract description 5
- 235000011164 potassium chloride Nutrition 0.000 claims abstract description 5
- 239000010935 stainless steel Substances 0.000 claims abstract description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000008187 granular material Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 abstract description 11
- 239000000956 alloy Substances 0.000 abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052802 copper Inorganic materials 0.000 abstract description 8
- 239000010949 copper Substances 0.000 abstract description 8
- 238000001816 cooling Methods 0.000 abstract description 4
- 230000008018 melting Effects 0.000 abstract description 3
- 229910016331 Bi—Ag Inorganic materials 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 2
- 230000000704 physical effect Effects 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract 4
- 238000002156 mixing Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 238000004506 ultrasonic cleaning Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- CCXYPVYRAOXCHB-UHFFFAOYSA-N bismuth silver Chemical compound [Ag].[Bi] CCXYPVYRAOXCHB-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910017692 Ag3Sn Inorganic materials 0.000 description 1
- 235000009161 Espostoa lanata Nutrition 0.000 description 1
- 240000001624 Espostoa lanata Species 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000010813 municipal solid waste Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses high-melting-point lead-free bismuth silver tin brazing filler metal which consists of the following components in percentage by mass: 5-11% of Ag, 1-5% of Sn and the balance Bi, based on 100% in total. The invention further discloses a preparation method for the high-melting-point lead-free bismuth silver tin brazing filler metal. The preparation method comprises the following steps: heating an eutectic salt, formed by mixing lithium chloride and potassium chloride, to a molten state; adding Bi into the molten-state eutectic salt, preserving the heat after Bi is completely molten; sequentially adding Ag particles and an Sn fine wire section into the eutectic salt to obtain a mixture; cooling the mixture to a temperature being 400 DEG C and preserving the heat for one minute after preserving the heat; pouring the mixture into a stainless steel mould to remove residues and carrying out ultrasonic cleaning on the mixture, thereby obtaining the high-melting-point lead-free bismuth silver tin brazing filler metal. Compared with a Bi-Ag alloy, the bismuth silver tin brazing filler metal alloy can form an intermetallic compound with a copper base plate, so that mechanical properties of a welding point are improved; and compared with conventional brazing filler metal, physical properties, mechanical properties and the like of the high-melting-point lead-free bismuth silver tin brazing filler metal have certain advantages. The bismuth silver tin brazing filler metal alloy has a proper melting temperature and has hardness being 15.5-20.3HV.
Description
Technical field
The invention belongs to technical field of electronic materials, be specifically related to a kind of high-melting point lead-free bismuth silver tin solder,
The invention still further relates to the preparation method of this solder.
Background technology
Along with development and the reinforcement of mankind's environmental consciousness of science and technology, field of electronic materials occupies master for a long time
Lead position tin-lead solder due to the existence of wherein lead element, it has to be faced with the situation being eliminated.Japan
The most used in electronic product by phased out lead of making laws with Europe.Although RoHS is 2011
Year has temporarily exempted the use of dystectic high lead solder, but this measure is just a makeshift arrangement, it is necessary to from
Fundamentally solve high temperature lead-free solder and substitute the problem that high temperature height kupper solder uses.Current existing without lead sealing
Dress and the cost price difference of leaded encapsulation typically now between 5-15%, and pre-arcing characterisitics, wet characteristic,
The aspect such as resisting fatigue and bond strength also exists various deficiencies.So needing a kind of price to close urgently
Suitable, the high-melting point lead-free solder of function admirable makes up the vacancy in market.
Summary of the invention
In view of this, the present invention is directed to current existing Lead-free in Electronic Packaging present with the cost price difference of leaded encapsulation
General between 5-15%, and the aspect such as pre-arcing characterisitics, wet characteristic, resisting fatigue and bond strength exists
Various not enough problems, it is provided that a kind of high-melting point lead-free bismuth silver tin solder.
In order to solve above-mentioned technical problem, the invention discloses a kind of high-melting point lead-free bismuth silver tin solder, press
Composed of the following components according to mass percent: 5-11%Ag, 1-5%Sn, surplus is Bi, said components
Percent mass ratio and be 100%.
The preparation method of above-mentioned high-melting point lead-free bismuth silver tin solder, the method is through the following steps that realize
:
(1) to the lithium chloride that weight ratio is 1:1.3 and and the eutectic salts that is mixed into of potassium chloride heat,
Heating-up temperature is 430-450 DEG C, until it reaches transparent molten condition, the quality of described eutectic salts should
At least the 30% of brazing filler metal alloy quality；
(2) weighing 5-11%Ag respectively according to mass percent, 1-5%Sn, surplus is Bi, above-mentioned group
Sub-prime amount percent value and be 100%；
(3) pre-melt Bi in melted eutectic salts, after Bi is completely melt, protects at 450 DEG C
Temperature 3-5 minute；
(4) being sequentially added into Ag granule and Sn filament section wherein, temperature controls at 450-460 DEG C；
(5), when in-furnace temperature being increased to 550 DEG C, it is incubated 2-3 hour, is cooled to 400 DEG C afterwards,
It is incubated 1 minute；
(6) directly made liquid solder is poured in stainless steel mould under 400 DEG C of temperature conditionss,
The eutectic salts residue on brazing filler metal alloy surface is removed after cast, and after being carried out with ultrasonic washing instrument i.e.
?.
Compared with prior art, the present invention can obtain and include techniques below effect:
1) the bismuth silver tin solder alloy of the present invention is for other high lead substitutes solder, production cost
Relatively low, it is to avoid use noble metal and rare earth element, involved element is all easier to obtain, and economical
Property is good.
2) the bismuth silver tin solder alloy of the present invention has more suitably fusion temperature, and hardness is
15.5-20.3HV, for 1.5-2 times of conventional high lead solder Pb-5Sn hardness, as high lead high-melting-point solder
Replacement solder potentiality bigger.
3) the bismuth silver tin solder alloy of the present invention is for Bi-Ag alloy, can be with copper base shape
Become intermetallic compound, improve the mechanical property of solder joint；For traditional solder, itself
Physical property and mechanical property etc. have certain advantage.
Certainly, the arbitrary product implementing the present invention it is not absolutely required to reach all the above skill simultaneously
Art effect.
Accompanying drawing explanation
Accompanying drawing described herein is used for providing a further understanding of the present invention, constitutes of the present invention
Point, the schematic description and description of the present invention is used for explaining the present invention, is not intended that the present invention's
Improper restriction.In the accompanying drawings:
Fig. 1 is the metallographic structure figure of embodiment 1；
Fig. 2 is the metallographic structure figure of embodiment 2；
Fig. 3 is the metallographic structure figure of embodiment 3.
Detailed description of the invention
Describe embodiments of the present invention in detail below in conjunction with embodiment, thereby the present invention how should
Solve technical problem by technological means and reach the process that realizes of technology effect and can fully understand and according to this
Implement.
High-melting point lead-free bismuth silver tin solder of the present invention, composed of the following components according to mass percent: 5-11%
Ag, 1-5%Sn, surplus is Bi, said components percent mass ratio and be 100%.Gold used by the present invention
Belong to purity and form is as shown in table 1.
Metal purity and form used by table 1 present invention
| Metal | Purity (wt%) | State |
| Bi | >=99.9% | Granule |
| Ag | >=99.95% | Granule |
| Sn | >=99.99% | Filament |
The preparation method of above-mentioned high-melting point lead-free bismuth silver tin solder, the method is through the following steps that realize
:
(1) to the lithium chloride that weight ratio is 1:1.3 and and the eutectic salts that is mixed into of potassium chloride heat,
Heating-up temperature is 430-450 DEG C, until it reaches transparent molten condition, the quality of described eutectic salts should
At least the 30% of brazing filler metal alloy quality；
(2) weighing 5-11%Ag respectively according to mass percent, 1-5%Sn, surplus is Bi, above-mentioned group
Sub-prime amount percent value and be 100%；
(3) pre-melt Bi in melted eutectic salts, after Bi is completely melt, protects at 450 DEG C
Temperature 3-5 minute；
(4) being sequentially added into Ag granule and Sn filament section wherein, temperature controls at 450-460 DEG C；
(5), when in-furnace temperature being increased to 550 DEG C, it is incubated 2-3 hour, is cooled to 400 DEG C afterwards,
It is incubated 1 minute；
(6) directly made liquid solder is poured in stainless steel mould under 400 DEG C of temperature conditionss,
The eutectic salts residue on brazing filler metal alloy surface is removed after cast, and after being carried out with ultrasonic washing instrument i.e.
?.
It is 1:1.3 lithium chloride and chlorination that the bismuth silver tin solder alloy of the present invention have employed weight ratio when melting
Potassium eutectic salts, fusing point is about 450 DEG C, and surface tension is little, can be dissolved in motlten metal by absorption and aoxidize
Gas on field trash and absorption liquid metal, floats up to the page and enters in fused salt, reach deslagging and eliminating
The purpose of gas.
One, the fusion temperature of solder measures
The bismuth silver stannum high-temp leadless solder of the present invention is measured with differential scanning calorimetry instrument (DSC, TA-Q20)
Fusion temperature, required example weight is about 5mg, needs before the test is conducted sample is placed in ultrasound wave
In cleaning device, use ionized water to clean 5-8 minute, use ethanol and acetone soln to clean examination the most successively
Sample also dries up, and with greasy dirt and the moisture on thorough washed samples surface, thus ensures the accuracy of result.Examination
Process of testing uses high-purity Ar as protective atmosphere.Analysis temperature scope is 20-350 DEG C, firing rate with
Rate of cooling is 10 DEG C/min.
Two, the spreadability of solder measures
The spreadability of solder refer to liquid solder flow on mother metal surface launch ability.Assay method is held
Row GB/T 11364-2008.
First, the copper sheet of thick 0.8mm is cut into the specification of 40 × 40mm, and with dilute hydrochloric acid to copper sheet
Surface carries out pickling, removes the oxide-film on copper sheet surface.The brazing filler metal alloy of 500mg is placed in copper sheet center
Position, is completely covered with brazing flux.When furnace temperature to be heated rises to 270-280 DEG C, copper sheet is put into
On heating furnace, until solder melts completely, after insulation 15s, air cooling is to room temperature.Every kind of solder repeats this
Test three times.
Three, the mensuration of the Vickers hardness of solder
Use digital microhardness instrument that the microhardness of brazing filler metal alloy is measured.
First by the brazing filler metal alloy epoxy resin cure of bulk, the most successively with 200,400,600,
1000,1500, No. 2000 silicon carbide papers are by surface grinding, after using 0.5 μm diamond paste polishing
Concentration is the nital corrosion 3-4s of 4%, then uses ultrasonic waves for cleaning to remove surface
Mechanically deform.
The loading force set during measurement is 15s as 0.0245N, retention time, and every kind of solder takes 5 respectively
Individual different position carries out hardness measurement, and result of the test is averaged.
Four, the microstructure observation of solder
Tissue after cooling is had a very big impact by the technique of melting solder, and microstructure determines pricker
The physical and mechanical properties of material alloy.
First the brazing filler metal alloy epoxy resin of fritter is inlayed, use 600 the most successively, 800,
1000, specimen surface is polished by the ink abrasive paper for metallograph of 1200,1500, No. 2000 different thicknesses, and 0.5
Specimen surface is polished by the diamond abrasive pastes of μm, finally uses and is soaked with the nitric acid that concentration is 4%
The cotton ball of alcoholic solution specimen surface uniform application 3-4S after a polish, uses alcohol washes and dries up
The microscopic structure of rear observable solder.The instrument observing metallographic is the DM2500M that Germany Leica produces
Optical microscope.
Embodiment 1
A kind of high-melting point lead-free bismuth silver tin solder alloy, the percentage by weight of described solder is the Bi of 89%,
The Ag of 10%, the Sn of 1%.Fig. 1 is the metallographic structure figure of example 1.
Embodiment 2
A kind of high-melting point lead-free bismuth silver tin solder alloy, the percentage by weight of described solder is 87.3%
Bi, the Ag of 9.7%, the Sn of 3%.Fig. 2 is the metallographic structure figure of example 2.
Embodiment 3
A kind of high-melting point lead-free bismuth silver tin solder alloy, the percentage by weight of described solder is 85.5%
Bi, the Ag of 9.5%, the Sn of 5%.Fig. 3 is the metallographic structure figure of example 3.
Can be seen that the tissue of the brazing filler metal alloy containing 1%Sn is mainly Bi and granular primary crystal from Fig. 1-3
Ag organizes；Along with the increase of Sn content, the tissue of brazing filler metal alloy changes, when the content of Sn increases
When being added to 3%, its tissue predominantly Bi and the primary crystal Ag and the Ag of a small amount of needle-like of dendritic crystalline3Sn；With
The further increase of Sn content, in the brazing filler metal alloy containing 5%Sn, the ratio of primary crystal Ag reduces, and relatively
Large-area banding Ag3Sn becomes many.Illustrate that the content of Sn produces considerable influence to the tissue of brazing filler metal alloy.
The fusion temperature of the brazing filler metal alloy of example 1-3 is estimated, the results are shown in Table 2
The pre-arcing characterisitics of table 2 brazing filler metal alloy
It is 261.88 DEG C that measurement result according to DSC understands the fusing point of Bi-10Ag, and then demonstrates test
The true and reliable property of measurement result；The result of example 1-3 shows, the Sn of the trace fusing to brazing filler metal alloy
Temperature impact is little, and all of result of the test is between 250-270 DEG C, and this temperature range is higher than real
In the production of border, the temperature 250 DEG C of secondary back, meets the requirement to fusing point of the high-melting point lead-free solder.For
For this characteristic of fusing point, the high-melting point lead-free bismuth silver tin solder alloy that the present invention relates to is high as high-melting-point
The succedaneum of lead solder is entirely appropriate.
The spreadability of the brazing filler metal alloy of example 1-3, structure is as shown in table 3.
The angle of wetting of table 3 brazing filler metal alloy
| Alloying component | Angle of wetting |
| Bi-Ag-1Sn | 47° |
| Bi-Ag-3Sn | 45° |
| Bi-Ag-5Sn | 43° |
Illustrating: along with the increase of Sn content, brazing filler metal alloy angle of wetting on copper base is gradually reduced,
The wettability that little angle of wetting masterpiece brazing filler metal alloy is good, in brazing process, can be in solder and group
Form good combination between part, the mechanical property of soldered fitting is had the effect of greatly facilitating.Therefore,
The wettability to brazing filler metal alloy that adds of Sn plays positive role.
The Vickers hardness of the brazing filler metal alloy of embodiment 1-3, result is as shown in table 4.
The Vickers hardness of table 4 brazing filler metal alloy
| Alloying component | Vickers hardness/HV |
| Bi-Ag-1Sn | 15.5 |
| Bi-Ag-3Sn | 19.4 |
| Bi-Ag-5Sn | 20.3 |
Illustrate: increasing of amount that the hardness of brazing filler metal alloy adds along with Sn and increase, be only tradition Pb-5Sn
The twice of high lead solder hardness, appoints and belongs to actual application acceptable hardness range, it can thus be anticipated that
The bismuth silver stannum high-temp solder that the present invention relates to has preferable machinability.
Described above illustrate and describes some preferred embodiments of invention, but as previously mentioned, it should be understood that
Invention is not limited to form disclosed herein, is not to be taken as the eliminating to other embodiments, and can
For other combinations various, amendment and environment, and can pass through in invention contemplated scope described herein
Above-mentioned teaching or the technology of association area or knowledge are modified.And the change that those skilled in the art are carried out and
Change the spirit and scope without departing from invention, the most all should be in the protection domain of invention claims.
Claims (8)
1. a high-melting point lead-free bismuth silver tin solder, it is characterised in that according to mass percent by following
Component forms: 5-11%Ag, 1-5%Sn, and surplus is Bi, said components percent mass ratio and be 100%.
2. high-melting point lead-free bismuth silver tin solder as claimed in claim 1, it is characterised in that described pricker
The Bi that percentage by weight is 89%, the Ag of 10%, the Sn of 1% of material.
3. high-melting point lead-free bismuth silver tin solder as claimed in claim 1, it is characterised in that described pricker
The Bi that percentage by weight is 87.3%, the Ag of 9.7%, the Sn of 3% of material.
4. high-melting point lead-free bismuth silver tin solder as claimed in claim 1, it is characterised in that described pricker
The Bi that percentage by weight is 85.5%, the Ag of 9.5%, the Sn of 5% of material.
5. high-melting point lead-free bismuth silver tin solder as claimed in claim 1, its special type is: described
Bi purity >=99.5%, purity >=99.93 of silver, purity >=99.99% of stannum.
6. the preparation method of the high-melting point lead-free bismuth silver tin solder as described in claim 1-5 is arbitrary, it is special
Levy and be, the method through the following steps that realize:
Step 1, is heated to molten condition by the eutectic salts that lithium chloride and potassium chloride are mixed into；
Step 2, the metal needed for weighing according to the arbitrary described proportioning of claim 1-5；
Step 3, pre-melt Bi in melted eutectic salts, after Bi is completely melt, at 450 DEG C
It is incubated 3-5 minute；
Step 4, is sequentially added into Ag granule and Sn filament section wherein, and temperature controls at 450-460 DEG C；
Step 5, when in-furnace temperature is increased to 550 DEG C, is incubated 2-3 hour, is cooled to 400 DEG C afterwards,
It is incubated 1 minute；
Step 6, is directly poured into stainless steel mould by made liquid solder under 400 DEG C of temperature conditionss
In, remove the eutectic salts residue on brazing filler metal alloy surface after cast, and after being carried out with ultrasonic washing instrument
Obtain.
7. the preparation method of high-melting point lead-free bismuth silver tin solder as claimed in claim 6, its feature exists
In, in step 1, the weight ratio of lithium chloride and potassium chloride is 1:1.3；The quality of described eutectic salts is at least
The 30% of brazing filler metal alloy quality.
8. the preparation method of high-melting point lead-free bismuth silver tin solder as claimed in claim 6, its feature exists
In, the temperature adding heat fusing in step 1 is 430-450 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610536829.2A CN106001982A (en) | 2016-07-08 | 2016-07-08 | High-melting-point lead-free bismuth silver tin brazing filler metal and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610536829.2A CN106001982A (en) | 2016-07-08 | 2016-07-08 | High-melting-point lead-free bismuth silver tin brazing filler metal and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN106001982A true CN106001982A (en) | 2016-10-12 |
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| CN201610536829.2A Pending CN106001982A (en) | 2016-07-08 | 2016-07-08 | High-melting-point lead-free bismuth silver tin brazing filler metal and preparation method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307951A (en) * | 2001-02-27 | 2001-08-15 | 江苏石油化工学院 | Three-dimensional translation parallel mechanism for virtual-axis numerically controlled machine tool and coordinate measuring machine |
| CN1507499A (en) * | 2001-05-28 | 2004-06-23 | ����Τ�����ʹ�˾ | Compositions, methods and devices for high temperature lead-free solder |
| JP2006167790A (en) * | 2004-12-20 | 2006-06-29 | Matsushita Electric Ind Co Ltd | Producing method for solder material |
| JP2012172178A (en) * | 2011-02-18 | 2012-09-10 | Napra Co Ltd | Alloy material, circuit board, electronic device, and method of manufacturing the same |
| CN103084750A (en) * | 2013-02-25 | 2013-05-08 | 重庆科技学院 | High-melting-point lead free brazing filler metal used for electronic packaging and preparation method thereof |
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2016
- 2016-07-08 CN CN201610536829.2A patent/CN106001982A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307951A (en) * | 2001-02-27 | 2001-08-15 | 江苏石油化工学院 | Three-dimensional translation parallel mechanism for virtual-axis numerically controlled machine tool and coordinate measuring machine |
| CN1507499A (en) * | 2001-05-28 | 2004-06-23 | ����Τ�����ʹ�˾ | Compositions, methods and devices for high temperature lead-free solder |
| JP2006167790A (en) * | 2004-12-20 | 2006-06-29 | Matsushita Electric Ind Co Ltd | Producing method for solder material |
| JP2012172178A (en) * | 2011-02-18 | 2012-09-10 | Napra Co Ltd | Alloy material, circuit board, electronic device, and method of manufacturing the same |
| CN103084750A (en) * | 2013-02-25 | 2013-05-08 | 重庆科技学院 | High-melting-point lead free brazing filler metal used for electronic packaging and preparation method thereof |
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Application publication date: 20161012 |