CN105990564B - substrate forming method - Google Patents
substrate forming method Download PDFInfo
- Publication number
- CN105990564B CN105990564B CN201510071938.7A CN201510071938A CN105990564B CN 105990564 B CN105990564 B CN 105990564B CN 201510071938 A CN201510071938 A CN 201510071938A CN 105990564 B CN105990564 B CN 105990564B
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- China
- Prior art keywords
- base material
- precut
- cutting
- forming method
- molding
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
- H01M4/139—Processes of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/04—Processes of manufacture in general
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/531—Electrode connections inside a battery casing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The present invention provides a kind of substrate forming methods comprising step：Step 1：In the transmission process of the base material after unreeling, base material is precut along track is precut using laser, base material after precut, which is not completely cut through by laser and precut track in base material upper edge, forms precut joint-cutting, and the base material after precuting forms the molding part for being located at precut joint-cutting both sides and leftover pieces part；Step 2：In the transmission process of the base material after precut, the side Coating residing for molding part that is formed after base material at least one surface of a substrate is precut is simultaneously dried；And step 3：In the wrapup procedure of base material after coating, the precut joint-cutting in step 1 is mechanically decoupled by pulling force effect with leftover pieces part by the molding part of base material, is coated with cated molding and uses part as substrate.The cutting speed that the substrate forming method of the present invention has many advantages, such as improves, the burr size of cutting section reduces, cost is greatly lowered.
Description
Technical field
The present invention relates to energy storage device field more particularly to a kind of substrate forming methods.
Background technology
Power lithium-ion battery is widely paid close attention to because it is with energy density height, advantages of environment protection, in electricity
Electrical automobile is widely applied in hybrid electric vehicle, and with the development of electric vehicle engineering, lithium ion battery is electronic
The application of automotive field also increasingly attracts attention.
A most important part is that pole piece is molded in power lithium-ion battery production process, and existing lug molding uses
Technique be to rest on a platform after pole coating, directly required pole piece is die cut out by the way of cutter die cutting.It is so-called
Pole piece forming refers to that lug is formed, i.e., foil needs to be cut into lug after coating.
The method of currently used cutting includes that coating uses laser cutting and cutting die cutting, but two kinds of cutting methods later
All there is a problem that it is more, cutting die cutting main problem be that cutting die is easy to wear, increase lug cutting forming cost, mould
The burr for cutting rear pole piece is larger and less efficient, and it is usually to carry out after coating to use laser cutting then, is needed when cutting
It to be cut at coating edge, cause cutting speed slower, cutting needs higher energy, therefore cutting cost is relatively high.
Invention content
The problem of in view of background technology, the purpose of the present invention is to provide a kind of substrate forming methods, can carry
The Forming Quality of high substrate.
Another object of the present invention is to provide a kind of substrate forming methods, can reduce the molding cost of substrate.
To achieve the goals above, the present invention provides a kind of substrate forming methods comprising step：Step 1：It is putting
In the transmission process of base material after volume, base material is precut along track is precut using laser, the base material after precuting is not
It is completely cut through by laser and is precut track in base material upper edge and form precut joint-cutting, the base material after precuting, which is formed, is located at pre-cut
Cut off molding part and the leftover pieces part of seam both sides；Step 2：In the transmission process of the base material after precut, in base
The side Coating residing for molding part that is formed after base material at least one surface of material is precut is simultaneously dried；And
Step 3：In the wrapup procedure of base material after coating, precut joint-cutting in step 1 by the molding part of base material with
Leftover pieces part is mechanically decoupled by pulling force effect, is coated with cated molding and uses part as substrate.
Beneficial effects of the present invention are as follows：
1. cutting speed improves.Existing cutting is the cutting that base material adds coating, and base material adds the thickness of coating to be base material
10-15 times, cutting speed is low.And the precut of the present invention is only cutting to base material, thickness is smaller, is cut compared to existing
It cuts, cutting speed of the invention increases 6-10 times.
2. the burr size of cutting section reduces.Because the thickness of the base material after coating is larger, there is coating on the surface of base material,
The energy of laser acts on coating first when cutting, by being transmitted to base material after heat transfer, so cutting will produce larger heat
Amount, big heat just will produce big heat affected area, and to distil insufficient for base material, base material occurs part and melts, to
It will produce larger burr on cutting section.And the precut of the present invention is cut for base material, the heat of generation compared with
Small, the heat affected area of generation is smaller, and the energy of laser is enough to make base material vaporization, distillation, to which section burr is smaller, and cuts through
It need not cool down in journey, which thereby enhance the cut quality of the molding part of base material, to improve the Forming Quality of substrate.
3. cost is greatly lowered.Cutting needs one process of special setting to be cut by laser after coating, increases into
This.And the precut of the present invention is directly to be precut before the coating using laser, whole set equipment need not be added, not
The leftover pieces part that base material can be quickly cut off in the case of increasing process, greatly reduces the molding cost of substrate.
Description of the drawings
Fig. 1 is that the plane of the base material after precut in the embodiment according to the substrate forming method of the present invention is illustrated
Figure, wherein precut joint-cutting shown in dotted line, and schematically show the part cut hole of precut joint-cutting；
Fig. 2 is that the plane of the base material after the Coating in the embodiment according to the substrate forming method of the present invention is illustrated
Figure, wherein the remaining precut joint-cutting of the base material after Coating is shown in dotted line；
Fig. 3 is the floor map of the substrate of the formation in the embodiment according to the substrate forming method of the present invention.
Wherein, the reference numerals are as follows：
1 base material, 12 leftover pieces part
11 molding parts 2 precut joint-cutting
111 flat part, 21 cut hole
112 protruding portion, 3 coating
1121 junctions
Specific implementation mode
It is described in detail substrate forming method according to the present invention with reference to the accompanying drawings.
Referring to figs. 1 to Fig. 3, substrate forming method according to the present invention includes step：Step 1：Base material 1 after unreeling
Transmission process in, using laser along precut track base material 1 is precut, precut after base material 1 it is not complete by laser
Complete to cut off and form precut joint-cutting 2 in the precut track of 1 upper edge of base material, the formation of base material 1 after precuting cuts off positioned at pre-cut
Stitch molding part 11 and the leftover pieces part 12 (referring to Fig.1) of 2 both sides；Step 2：The conveying of base material 1 after precut
In the process, the molding formed after the base material 1 of (single or double of base material 1) is precut at least one surface of base material 1 is used
Side Coating 3 (with reference to Fig. 2) residing for part 11 is simultaneously dried；And step 3：The wrapup procedure of base material 1 after coating
In, the molding of base material 1 part 11 and leftover pieces part 12 are passed through pulling force effect machinery by the precut joint-cutting 2 in step 1
Separation, the molding for being coated with coating 3 use part 11 as substrate (with reference to Fig. 3).
The substrate forming method of the present invention first uses laser pre- along track progress is precut before 1 Coating 3 of base material
Cutting, Coating 3 directly forms precut joint-cutting 2 along precut track later, mechanically decoupled by pulling force effect.
Compared to being cut after existing Coating, the present invention has following advantages：
1. cutting speed improves.Existing cutting is the cutting that base material adds coating, and base material adds the thickness of coating to be base material
10-15 times, cutting speed is low.And the precut of the present invention is only cutting to base material 1, thickness is smaller, is cut compared to existing
It cuts, cutting speed of the invention increases 6-10 times.
2. the burr size of cutting section reduces.Because the thickness of the base material after coating is larger, there is coating on the surface of base material,
The energy of laser acts on coating first when cutting, by being transmitted to base material after heat transfer, so cutting will produce larger heat
Amount, big heat just will produce big heat affected area, and to distil insufficient for base material, base material occurs part and melts, to
It will produce larger burr on cutting section.And the precut of the present invention is cut for base material 1, the heat of generation compared with
Small, the heat affected area of generation is smaller, and the energy of laser is enough to make the vaporization of base material 1, distillation, to which section burr is smaller, and cuts
It need not cool down in the process, the cut quality of the molding part 11 of base material 1 be which thereby enhanced, to improve the molding of substrate
Quality.
3. cost is greatly lowered.Cutting needs one process of special setting to be cut by laser after coating, increases into
This.And the precut of the present invention is directly to be precut before the coating using laser, whole set equipment need not be added, not
The leftover pieces part 12 that base material 1 can be quickly cut off in the case of increasing process, greatly reduces the molding cost of substrate.
In an embodiment of substrate forming method according to the present invention, in step 1, molding part 11 includes flat
Smooth portion 111 and the multiple protruding portion 112 (referring to Fig.1) for protruding from flat part 111 and being spaced apart；In step 2, coating 3 applies
The flat part of the flat part 111 of the molding part 11 that cloth is formed after base material 1 is precut and the coating 3 from molding part 11
The 111 leftover pieces parts 12 formed after precut towards base material 1 extend, to cover between flat part 111 and leftover pieces part 12
Precut joint-cutting 2 and protruding portion 112 the part with 111 junction 1121 of flat part, the remainder of protruding portion 112
Uncoated coating 3 (with reference to Fig. 2)；In step 3, molding uses the flat part 111 for being coated with coating 3 of part 11 as substrate
(i.e. pole piece), molding use the part of the uncoated coating 3 of the protruding portion 112 of part 11 as lug (reference Fig. 3).Using the party
The molding substrate of method (i.e. pole piece) and lug, can improve the cutting speed of substrate and lug, can make substrate and pole
Ear cutting burr reduce, to ensure the Forming Quality of substrate and lug, and greatly reduce substrate and lug at
The cost of type.
In an embodiment of substrate forming method according to the present invention, coating 3 be coated on base material 1 it is precut after formed
All part 11 is used in molding.It should be noted that being coated on the part formed after base material 1 is precut as coating 3 also
It is whole molding part 11, can be determined according to practical condition, such as item is used in whole moldings part 11
Line is coated with.
In an embodiment of substrate forming method according to the present invention, base material 1 can be metal foil.In an embodiment
In, base material 1 can be Cu foils or Al foils.At this point, the embodiment is applicable to the pole of pole piece, such as lithium ion battery, capacitor etc.
Piece.
In an embodiment of substrate forming method according to the present invention, base material 1 can be polypropylene PP films or polythene PE
Film.At this point, the embodiment is applicable to the isolation film of isolation film, such as lithium ion battery, capacitor etc..
In an embodiment of substrate forming method according to the present invention, base material 1 can be lithium foil.At this point, the embodiment can
Pole piece suitable for pole piece, such as lithium metal battery.
In an embodiment of substrate forming method according to the present invention, the thickness of base material 1 can be 4 μm~500 μm.
In an embodiment of substrate forming method according to the present invention, in step 1, the base material 1 after unreeling can pass through
Roller is conveyed, and is achieved in online precut.In one embodiment, in step 1, base material 1 is being carried out using laser
Before precut, the program set in laser integrated system and inductor positioning base material 1 can be used.
In an embodiment of substrate forming method according to the present invention, the precut laser used is swashing for narrow spaces
Light.The laser energy density of the laser of narrow spaces is big, not only has the energy for making the vaporization of base material 1, distillation enough, but also generate
Heat affected area very little (almost can be ignored).
In an embodiment of substrate forming method according to the present invention, the pulsewidth of the precut laser used can be to receive
Second, picosecond or femtosecond.
In an embodiment of substrate forming method according to the present invention, the precut power of laser can be 10W~
2000W, frequency can be 1kHz~1000kHz.
In an embodiment of substrate forming method according to the present invention, it can be single cut that laser is precut.
In an embodiment of substrate forming method according to the present invention, base material 1 walks belt speed by what roller was conveyed
Degree can be 1m/min~50m/min.
In an embodiment of substrate forming method according to the present invention, it can be continuous cutting to precut, and precut joint-cutting 2
It can be continuous joint-cutting.
In an embodiment of substrate forming method according to the present invention, the depth for precuting joint-cutting 2 can be the thickness of base material 1
The 1/6~5/6 of degree.
In an embodiment of substrate forming method according to the present invention, it can be cut-space to precut.
In an embodiment of substrate forming method according to the present invention, referring to Fig.1, interval can be had by precuting joint-cutting 2
Cut hole 21.In one embodiment, the centre-to-centre spacing of adjacent cut hole 21 can be 5 μm~2mm.
In an embodiment of substrate forming method according to the present invention, cut hole 21 can be the logical of the thickness through base material 1
Hole.
In an embodiment of substrate forming method according to the present invention, the depth of cut hole 21 can be the thickness of base material 1
1/6~5/6.
In an embodiment of substrate forming method according to the present invention, referring to Fig.1, cut hole 21 can be round cut hole 21.
In one embodiment, the diameter of round cut hole 21 can be 10 μm~100 μm.
In an embodiment of substrate forming method according to the present invention, cut hole 21 can be run-track shaped cut hole.One
In embodiment, run-track shaped cut hole can be 15 μm~1000 μm along the length in 2 direction of joint-cutting is precut.
In an embodiment of substrate forming method according to the present invention, in step 3, the molding part 11 of base material 1
It can be wound with two rollers with the leftover pieces part 12 of base material 1, walked with the pulling lower edge of the roller wound at two respectively
Precut joint-cutting 2 in rapid one is mechanically decoupled by pulling force effect with leftover pieces part 12 with part 11 by the molding of base material 1.
Claims (10)
1. a kind of substrate forming method, which is characterized in that including step：
Step 1：In the transmission process of the base material after unreeling, base material is precut along track is precut using laser, in advance
Base material after cutting, which is not completely cut through by laser and precut track in base material upper edge, forms precut joint-cutting, the base after precuting
Material forms the molding part for being located at precut joint-cutting both sides and leftover pieces part；
Step 2：In the transmission process of the base material after precut, after base material at least one surface of a substrate is precut
Side Coating residing for the molding part of formation is simultaneously dried；And
Step 3：In the wrapup procedure of base material after coating, precut joint-cutting in step 1 is by the molding portion of base material
It is point mechanically decoupled by pulling force effect with leftover pieces part, it is coated with cated molding and uses partly as substrate.
2. substrate forming method according to claim 1, which is characterized in that
In step 1, molding part includes flat part and protrudes from flat part and multiple protruding portion spaced apart；
In step 2, coating is coated on the flat part of the molding part formed after base material is precut and the coating is used from molding
The leftover pieces part that partial flat part is formed towards base material after precut extends, to cover between flat part and leftover pieces part
Precut joint-cutting and protruding portion the part with flat part junction, the uncoated coating of remainder of protruding portion；
In step 3, molding uses the cated flat part of the coating of part as substrate, and the protruding portion of molding part is not
The part of Coating is as lug.
3. substrate forming method according to claim 1, which is characterized in that coating be coated on base material it is precut after formed
All molding parts.
4. substrate forming method according to claim 1, which is characterized in that base material is metal foil.
5. substrate forming method according to claim 1, which is characterized in that base material is polypropylene screen or polyethylene film.
6. substrate forming method according to claim 1, which is characterized in that precut the pulsewidth of the laser used to receive
Second, picosecond or femtosecond.
7. substrate forming method according to claim 1, which is characterized in that be pre-cut as continuously cutting, precut joint-cutting
For continuous joint-cutting.
8. substrate forming method according to claim 1, which is characterized in that be pre-cut as cut-space.
9. substrate forming method according to claim 8, which is characterized in that precut joint-cutting has spaced cut hole.
10. substrate forming method according to claim 9, which is characterized in that cut hole is the through-hole of the thickness through base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510071938.7A CN105990564B (en) | 2015-02-11 | 2015-02-11 | substrate forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510071938.7A CN105990564B (en) | 2015-02-11 | 2015-02-11 | substrate forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105990564A CN105990564A (en) | 2016-10-05 |
| CN105990564B true CN105990564B (en) | 2018-10-26 |
Family
ID=57041152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510071938.7A Active CN105990564B (en) | 2015-02-11 | 2015-02-11 | substrate forming method |
Country Status (1)
| Country | Link |
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| CN (1) | CN105990564B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102162773B1 (en) * | 2016-10-07 | 2020-10-07 | 주식회사 엘지화학 | Method for Manufacturing Electrode for Secondary Battery Comprising Pre-Slitting Process |
| KR102510296B1 (en) * | 2018-12-07 | 2023-03-15 | 주식회사 엘지에너지솔루션 | Apparatus and method for preparing lithium electrode |
| CN112059442B (en) * | 2020-09-17 | 2022-05-06 | 浙江水晶光电科技股份有限公司 | Method for coating film on crystal |
| CN112614965A (en) * | 2020-11-27 | 2021-04-06 | 惠州市豪鹏科技有限公司 | Preparation method of battery pole piece |
| CN112894166B (en) * | 2021-01-22 | 2023-10-20 | 深圳市吉祥云科技有限公司 | Multi-point laser cutting method and device for small parts and readable storage medium |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101615664A (en) * | 2009-03-31 | 2009-12-30 | 深圳市吉阳自动化科技有限公司 | Lug processing method |
| EP2448042A1 (en) * | 2008-11-14 | 2012-05-02 | Kabushiki Kaisha Toshiba | Nonaqueous electrolyte battery |
| CN202695602U (en) * | 2012-05-15 | 2013-01-23 | 深圳市吉阳自动化科技有限公司 | Machine for forming tab on plate of lithium battery |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060080092A (en) * | 2005-01-04 | 2006-07-07 | 엘지전자 주식회사 | Cutter for electrode |
-
2015
- 2015-02-11 CN CN201510071938.7A patent/CN105990564B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2448042A1 (en) * | 2008-11-14 | 2012-05-02 | Kabushiki Kaisha Toshiba | Nonaqueous electrolyte battery |
| CN101615664A (en) * | 2009-03-31 | 2009-12-30 | 深圳市吉阳自动化科技有限公司 | Lug processing method |
| CN202695602U (en) * | 2012-05-15 | 2013-01-23 | 深圳市吉阳自动化科技有限公司 | Machine for forming tab on plate of lithium battery |
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| Publication number | Publication date |
|---|---|
| CN105990564A (en) | 2016-10-05 |
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