CN105980098A - Beam shaping mask, laser processing device, and laser processing method - Google Patents
Beam shaping mask, laser processing device, and laser processing method Download PDFInfo
- Publication number
- CN105980098A CN105980098A CN201580007681.7A CN201580007681A CN105980098A CN 105980098 A CN105980098 A CN 105980098A CN 201580007681 A CN201580007681 A CN 201580007681A CN 105980098 A CN105980098 A CN 105980098A
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- China
- Prior art keywords
- laser
- machined object
- beam shaping
- opening
- laser processing
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
A beam shaping mask (1) having apertures (4) similar in shape to that of an aperture pattern (20) formed by laser processing a film (15), wherein the apertures (4) are formed such that the optical transmittance within the apertures (4) gradually decreases from the center toward the edges of the apertures, and such that the optical transmittance at the edges of the apertures is capable of ensuring at least the minimal laser intensity capable of laser processing the film (15). Thus, it is possible to prevent burrs (22) from being generated at the edges of the holes after laser processing is performed.
Description
Technical field
The shape that the present invention relates to a kind of hole having and be lasered on machined object is similar
The beam shaping mask of opening of shape, particularly relate to be intended to prevent hole after laser machining
Edge part produces beam shaping mask, laser processing device and the laser processing of burr.
Background technology
In the past, this beam shaping mask is the mask for projection imaging laser ablation system, tool
The pattern of the shape that the aperture that has and be formed on pliability thin film is similar, by becoming this pattern
As on the above-mentioned films, after thin film is by laser ablation, above-mentioned aperture can be formed with on thin film
Hole (for example, referring to patent documentation 1).
Patent documentation 1: Japanese Unexamined Patent Publication table 2005-517810 publication
But, in the most conventional beam shaping mask, above-mentioned pattern is and is formed on
The opening of the shape that aperture on thin film is similar, is solid owing to the light transmission in opening spreads all over entirety
Fixed, therefore can pass through the through thin film of laser of pattern (opening) and processed hole in utilization
Inequality that the edge part in footpath is distributed because of the in-plane strength of laser and produce cutting residual (hereinafter referred to as
" burr ").Therefore, it is impossible to precision forms the through of fine above-mentioned aperture well on thin film
Hole.
Summary of the invention
Therefore, in order to tackle such problem points, it is an object of the invention to provide one and be intended to prevent
The edge part in hole after laser machining produce the beam shaping mask of burr, laser processing device with
And laser processing.
To achieve these goals, the beam shaping mask of the present invention be have be lasered in
The beam shaping mask of the opening of the shape that the shape in the hole on machined object is similar, above-mentioned opening quilt
The light transmission be formed as in this opening successively decreases to circumference from central part, even and if at circumference
Also have and be able to ensure that the most MIN laser that can laser machine above-mentioned machined object is strong
The light transmission of degree.
It addition, the laser processing device of the present invention is the opening that will be formed on beam shaping mask
Reduced projection, on machined object, laser machines the laser processing device in hole on this machined object,
For above-mentioned beam shaping mask, above-mentioned opening is formed as light transmission in this opening from
Central part successively decreases to circumference, even and if also having at circumference and be able to ensure that and can laser machine
The light transmission of the most MIN laser intensity of above-mentioned machined object.
Additionally, the laser processing of the present invention is the opening that will be formed on beam shaping mask
Reduced projection, on machined object, laser machines the laser processing in hole on this machined object,
The laser transmission repeatedly launched is made to pass to circumference from central part with the light transmission in above-mentioned opening
Subtract, even and if also having at circumference and be able to ensure that and can laser machine above-mentioned machined object extremely
The mode of the light transmission of few MIN laser intensity is formed on above-mentioned beam shaping mask
Above-mentioned opening, the above-mentioned laser repeatedly launched that will transmit through above-mentioned opening exposes to above-mentioned being added
Work thing and above-mentioned machined object process above-mentioned hole.
In accordance with the invention it is possible to prevent the edge part in hole after laser machining from producing burr.Therefore,
Fine hole can be formed well in machined object precision.
Accompanying drawing explanation
Fig. 1 is the figure of an embodiment of the beam shaping mask representing the present invention, (a) of Fig. 1
Being top view, (b) of Fig. 1 is the O-O line section direction view of Fig. 1 (a).
Fig. 2 is to illustrate the light transmission in the opening of the beam shaping mask of the present invention
Figure, (a) of Fig. 2 is the example representing the light transmittance characteristic along centrage in opening
Chart, (b) of Fig. 2 is the explanatory diagram representing halftoning, and (c) of Fig. 2 is to represent Fig. 2
The explanatory diagram of formation example of halftoning of (b).
Fig. 3 is the explanation briefly constituted of an embodiment of the laser processing device representing the present invention
Figure.
Fig. 4 is the figure of the beam shaping mask representing prior art, and (a) of Fig. 4 is top view,
(b) of Fig. 4 is the figure of the example representing the light transmittance characteristic along centrage in opening
Table.
Fig. 5 is the explanatory diagram of the Laser Processing example representing the beam shaping mask using prior art,
(a) of Fig. 5 represents when laser irradiates beginning, and (b) of Fig. 5 represents the Laser Processing midway stage,
(c) of Fig. 5 represents the state after Laser Processing.
Fig. 6 is the explanation of the Laser Processing example representing the beam shaping mask using the present invention with section
Figure.
Fig. 7 is the explanation of the Laser Processing example of the beam shaping mask using the present invention with planar representation
Figure.
Detailed description of the invention
Hereinafter, based on accompanying drawing, embodiments of the present invention are described in detail.Fig. 1 is to represent
The figure of one embodiment of the beam shaping mask of the present invention, (a) of Fig. 1 is top view, Fig. 1
(b) be the O-O line section direction view of Fig. 1 (a).It addition, Fig. 2 is to the present invention
Beam shaping mask opening in the figure that illustrates of light transmission, (a) of Fig. 2 is table
Show the chart of an example of the light transmittance characteristic along centrage in opening, (b) of Fig. 2
Being the explanatory diagram representing halftoning, (c) of Fig. 2 is the shape of the halftoning representing Fig. 2 (b)
Become the explanatory diagram of example.This beam shaping mask 1 has and the hole being lasered on machined object
The opening of the similar shape of shape, consist of and possess transparency carrier 2, photomask 3, opening 4.
Above-mentioned transparency carrier 2 is especially, processed for can melt as lamellar using high-transmission rate
The wavelength of the resinous thin film of thing is at the laser transmission of below 400nm, e.g. quartz base plate.
Or can also be transparent glass substrate.
In the way of covering the one side of above-mentioned transparency carrier 2, photomask 3 is set.This photomask 3 hinders
The transmission of disconnected laser, the metal that thickness is about 100nm being e.g. made up of chromium (Cr) etc.
Film, utilizes the known film technique such as sputter, evaporation by film forming on transparency carrier 2.
Above-mentioned photomask 3 arranges opening 4.This opening 4 for be radiated on thin film
The shape of cross section that the optical axis of laser intersects carries out shaping, is that the confession being formed on photomask 3 swashs
The hole that light passes through, has similar to the shape in the hole of the patterns of openings being lasered on thin film
Shape, as shown in (a) of Fig. 1, multiple by spread configuration in length and breadth.
Specifically, as shown in (a) of Fig. 2, opening 4 is formed the light in this opening 4
Absorbance is successively decreased to circumference from central part, even and if also having at circumference that be able to ensure that can
Such as about the 60% of the most MIN laser intensity of Laser Processing (melting) above-mentioned thin film
Light transmission.The decreasing fashion of above-mentioned light transmission can be linear, it is also possible to is non-linear.
In order to have what the light transmission in opening 4 successively decreased to circumference from central part as described above
Characteristic, it is also possible to form halftoning in the opening 4 shown in (b) of Fig. 2.Thus, such as this
Shown in (c) of figure, it is also possible to opening 4 in becoming greatly to its size of circumference from central part or
The mode that configuration density uprises forms the multiple shadings that metal film are made up of identical with above-mentioned photomask 3
Point 5.Additionally, the size of chopping point 5 is formed less than the light being made up of imaging len 9 and object lens 10
The size of the resolution of system.Or, in order to make the light transmission in opening 4 from central authorities
Successively decrease to circumference in portion, it is also possible to circumference, multiple shading lines are formed as its width from central part
Become greatly or configuration density uprises.In order to form opening 4 as described above on photomask 3,
At painting photoresist in the way of covering photomask 3, photomask is used to expose and imaging
Above-mentioned photoresist and after forming Etching mask, utilize the erosion that wet etching, dry ecthing etc. are known
Lithography removes the part of the above-mentioned photomask 3 being exposed to surface such that it is able to form opening 4.
In the case of the laser by repeatedly launching irradiates the patterns of openings of formation thin film, even if
During the Laser Processing of once irradiating, it is also desirable to make to be projected the circumference of the above-mentioned opening 4 in thin film
The minimum value being to melt thin film of laser intensity.Thus, thin film above-mentioned that be projected with open
The part of mouth 4 correspondences is melted completely by the repeatedly irradiation of laser and is removed, thus on thin film
Form above-mentioned patterns of openings.In this case, for thin film, due to patterns of openings hole from which
Centre portion gradually expands to circumference and is formed, and the most there is not the circumference in patterns of openings and produces hair
The worry of thorn.
Secondly, just possesses the embodiment of the laser processing device of the beam shaping mask 1 of the present invention
Illustrate.Fig. 3 is the brief composition of an embodiment of the laser processing device representing the present invention
Explanatory diagram.
Above-mentioned laser processing device possesses XY mounting table 6 according to this order, is positioned at this XY mounting
The upstream of the direct of travel from laser L of the top of platform 6 towards downstream LASER Light Source 7, coupling
Optical unit 8, beam shaping mask 1, imaging len 9 and object lens 10.It addition, from thing
Mirror 10 is configured with shooting photograph towards the light path of imaging len 9 in the light path of half-reflecting mirror 11 branch
Camera 12, from object lens 10 towards the light path of imaging len 9 at the wavelength for below 400nm
Laser L transmission is also configured with illumination light in the light path of dichroic mirror 13 branch by reflection visible ray
Source 14.
Herein, XY mounting table 6 is to supply the resinous thin film of visible light-transmissive in upper surface mounting
15, the mounting table moved along X, Y-direction in the face parallel with X/Y plane, it is omitted diagram
Control device control, stepping is moved and is previously entered and stored amount of movement.
Above-mentioned LASER Light Source 7 is that radiation produces the laser L of below wavelength 400nm such as
The excimer laser of KrF248nm, the triple-frequency harmonics of 1064nm, the laser of four-time harmonic
The YAG laser of L.Laser L can be infrared ray, luminous ray, but in order to melt thin film 15,
And preferred ultraviolet.
It addition, above-mentioned coupling optical unit 8 comprises the extension laser beam from LASER Light Source 7 radiation
Optical beam expander, make laser L illuminance distribution expose to following beam shaping mask 1
Light integrator and collecting lens.
The laser L exposing to thin film 15 is shaped as by above-mentioned beam shaping mask 1 to be had and is swashed
The a plurality of laser L of the section configuration of the similar shape of patterns of openings of light processing also penetrates, such as figure
Shown in (a) of 1, it is configured to be positioned at multiple patterns of openings of the unit area being previously set
The spacing of M times of arrangement pitches configure relative to be formed on thin film 15 patterns of openings and with
Multiple openings 4 that the enlargement ratio M of the regulation being previously set is formed, and transparent being covered in
Above-mentioned opening 4 is formed on the photomask 3 of the chromium (Cr) etc. of quartz base plate.
Specifically, above-mentioned beam shaping mask 1 has the shape similar to patterns of openings as previously mentioned
The opening 4 of shape, be configured to obtain as scheme to make shown in (2) light transmission in this opening 4 from
Central part successively decreases to circumference, even and if can also ensure that at circumference and can laser machine thin film
The light transmission of such as about the 60% of the most MIN laser intensity of 15.
Above-mentioned imaging len 9 collaborates with following object lens 10 will be formed on beam shaping mask 1
Multiple openings 4 with the multiplying power M reduced projection that is previously set on thin film 15, and imaging is saturating
Mirror 9 is collecting lens.
And, above-mentioned object lens 10 and above-mentioned imaging len 9 collaborate that will to be formed on light beam whole
Multiple openings 4 of shape mask 1 with the multiplying power M reduced projection that is previously set on thin film 15, and
And such as it is configured in the rear side of thin film 15, obtain the location of the irradiation being set to laser L
The picture of the said reference pattern of the transparent reference substrate 16 of the reference pattern of benchmark, and can lead to
Cross following shooting photographing unit 12 to shoot.Then, the image space of object lens 10 is whole with light beam
Shape mask 1 becomes the relation of conjugation.
The shooting of above-mentioned shooting photographing unit 12 is arranged at the said reference pattern of reference substrate 16, example
Shoot the CCD camera of two dimensional image, CMOS camera etc. in this way.Then, object lens 10
The shooting face of image space and shooting photographing unit 12 become the relation of conjugation.
Above-mentioned lighting source 14 is the such as Halogen light etc. launching visible ray, to shooting photographing unit 12
Shooting area be illuminated, and can carry out based on shooting photographing unit 12 shooting.
Additionally, in figure 3, reference 17 is to collaborate with object lens 10 to make reference substrate 16
Reference pattern picture, formed by Laser Processing patterns of openings 20 as etc. image in shooting
Imaging len on the shooting face of photographing unit 12, reference 18 is relay lens, reference
19 is completely reflecting mirror.
Then, the laser processing with regard to using the laser processing device constituted like this to carry out is carried out
Explanation.Herein, the situation forming patterns of openings on thin film 15 is illustrated.
First, so that the face 16a forming reference pattern is loaded as XY in XY mounting table 6
The mode of platform 6 side loads and fixed reference substrate 16, and reference substrate 16 with form base
It is close to thin film 15 on the face 16b of the face 16a opposite side of quasi-pattern.
Secondly, make XY mounting table 6 move, the Laser Processing that object lens 10 are placed in thin film 15 is left
Beginning position.Specifically, by the way of shooting photographing unit 12 is with through thin film 15, laser is shot
Processing starting position unit area be such as arranged at said reference accordingly with center
Reference pattern on substrate 16, is positioned at shooting center by this reference pattern.Additionally, this shooting
Center is consistent with the optical axis of object lens 10.
It follows that make the laser optical unit of laser processing device along the optical axis of object lens 10 at Z axis
Rise the distance being previously set on direction, and the image space of object lens 10 is positioned at thin film 15 He
On the interface of said reference substrate 16.
Then, start LASER Light Source 7 and carry out pulse oscillating, thus launch the laser repeatedly irradiated
L.The laser L being launched is coupled optical unit 8 and extends, to become swashing of uniform intensity distribution
The mode of light L exposes to beam shaping mask 1.
Expose to the laser L of beam shaping mask 1, by through this beam shaping mask more than 1
Individual opening 4, the shape of cross section intersected to optical axis is shaped as similar to the shape of patterns of openings
Shape, penetrates from beam shaping mask in the way of becoming multiple laser L.Then, by object lens
10 optically focused are on thin film 15.
In this case, the light transmission such as this figure in shown in (a) of Fig. 4, opening 4
(b) as shown in spread all in the beam shaping mask 1 of the most approximately fixed prior art,
Inequality and entirety that the in-plane strength distribution of the laser L being shaped has in permissible range are the most equal
Even.Therefore, when carrying out film processed 15 by such laser L, from (a) institute of Fig. 5
The laser that shows irradiate the time started to this figure (b) shown in the Laser Processing midway stage in, time
The overall hole 21 forming patterns of openings 20 with the approximately fixed degree of depth of cloth.But, in patterns of openings
Before the through thin film in hole 21 15 of 20, the inequality being distributed because of the in-plane strength of laser L can produce
Part that the hole 21 of patterns of openings 20 is through and do not have through part.Therefore, such as (c) of this figure
Shown in, burr 22 can be produced at the edge part with laser irradiation side opposite side of patterns of openings 20.
On the other hand, in the present invention, as shown in (a) of Fig. 2, due to above-mentioned opening 4
Interior light transmission successively decreases to circumference from central part, even and if can also ensure that energy at circumference
The mode of the laser intensity enough melting thin film 15 obtain minimum be also about 60% light transmission,
Therefore, as shown in (a) of Fig. 6 and (a) of Fig. 7, on thin film 15, strong from laser
Spend strong central part processing hole 21, the irradiation of the laser L by repeatedly irradiating, hole 21 such as Fig. 6
(b)～Fig. 6 (d) and (b) of Fig. 7～Fig. 7 (d) shown in, be incrementally increased the degree of depth
And become big, thus as shown in Fig. 6 (e) and Fig. 7 (e), final through thin film 15 and shape
Become patterns of openings 20.
Thus, according to the present invention, on thin film 15, owing to the hole 21 of patterns of openings 20 is from it
Central part gradually expands to circumference and is formed, and the most there is not the circumference in patterns of openings 20
Produce the worry of burr 22.
Thus, if the unit area in Laser Processing starting position forms multiple patterns of openings 20, then
XY mounting table 6 stepping on X or Y direction is made to move the distance being previously set, and can
At second unit area, the 3rd unit area ... wait in constituent parts region laser in order to add
The multiple patterns of openings of work 20.In such manner, it is possible on the assigned position being previously set of thin film 15 shape
Become multiple patterns of openings 20.
The formation of multiple patterns of openings 20, as it was previously stated, by shooting photographing unit 21 shooting with sharp
Light processing starting position unit area be such as arranged at above-mentioned base accordingly with center
Reference pattern on quasi-substrate 16, behind the position confirming said reference pattern, with this reference map
On the basis of the position of case, limit makes XY mounting table move limit carry out to X, Y-direction stepping.Now,
Can be based on the mechanical precision of XY mounting table 6, the predetermined distance limit being previously set is moved in limit stepping
Multiple patterns of openings 20 is formed in constituent parts region, or can also be by shooting photographing unit 12
The reference pattern being arranged at reference substrate 16 with center accordingly in shooting constituent parts region,
The such as shooting center (consistent with the optical axis of object lens 10) of shooting photographing unit 12 is being positioned this
After reference pattern, laser machine multiple patterns of openings 20.In addition it is also possible to limit makes XY mounting table
The predetermined distance being previously set is moved in stepping, while irradiate by being arranged at light beam whole to thin film 15
One laser L of one opening 4 of shape mask 1, and form multiple patterns of openings 20.
Additionally, in the above-described embodiment, though to making the XY mounting table 6 two-dimensional directional to XY
The situation of movement is illustrated, but the present invention is not limited to this, both can move containing object lens
The laser optical unit side of 10, it is also possible to relatively move mounting table and laser optical unit is double
Side.
It addition, in the above-described embodiment, though being the feelings of resinous thin film 15 to machined object
Condition is illustrated, but the present invention is not limited to this, and machined object can be to be laminated to be provided with
The metal mask and the resin-made that comprise the through hole of the size of at least one above-mentioned patterns of openings 20 are thin
The above-mentioned thin film 15 of the layered product of film 15.Or, machined object can also be the metal forming of lamellar.
Description of reference numerals
1 ... beam shaping mask；4 ... opening；15 ... thin film (machined object)；20 ... patterns of openings
(hole of machined object)；L ... laser.
Claims (10)
1. a beam shaping mask, it has and the shape in the hole being lasered in machined object
The opening of the shape that shape is similar, described beam shaping mask is characterised by,
The light transmission that described opening is formed in this opening successively decrease to circumference from central part and
Even and if circumference also have be able to ensure that can laser machine described machined object
The light transmission of the laser intensity of low limit.
Beam shaping mask the most according to claim 1, it is characterised in that
Described opening is provided with multiple in vertical and horizontal arrangement.
Beam shaping mask the most according to claim 1 and 2, it is characterised in that
The hole of described machined object is formed by the repeatedly irradiation of laser.
Beam shaping mask the most according to claim 1 and 2, it is characterised in that
Described machined object is resinous thin film.
Beam shaping mask the most according to claim 3, it is characterised in that
Described machined object is resinous thin film.
6. a laser processing device, the opening being formed on beam shaping mask is reduced throwing by it
Shadow, on machined object, laser machines hole, the spy of described laser processing device on this machined object
Levy and be,
For described beam shaping mask, described opening is formed as the light transmission in this opening
Even if rate is successively decreased to circumference from central part and also has at circumference that be able to ensure that can laser
Process the light transmission of the most MIN laser intensity of described machined object.
Laser processing device the most according to claim 6, it is characterised in that
The hole of described machined object is formed by the repeatedly irradiation of laser.
8. according to the laser processing device described in claim 6 or 7, it is characterised in that
Described machined object is resinous thin film.
9. a laser processing, the opening being formed on beam shaping mask is reduced throwing by it
Shadow, on machined object, laser machines hole, the spy of described laser processing on this machined object
Levy and be,
Make the laser transmission repeatedly irradiated with the light transmission in described opening from central part to periphery
Even if successively decreasing in portion and also has at circumference and be able to ensure that and can laser machine described machined object
The mode of light transmission of the most MIN laser intensity be formed on described beam shaping
Described opening on mask,
The described laser repeatedly irradiated that will transmit through described opening expose to described machined object and
Described machined object is processed described hole.
Laser processing the most according to claim 9, it is characterised in that
Described machined object is resinous thin film.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014095137A JP6533644B2 (en) | 2014-05-02 | 2014-05-02 | Beam shaping mask, laser processing apparatus and laser processing method |
| JP2014-095137 | 2014-05-02 | ||
| PCT/JP2015/060165 WO2015166759A1 (en) | 2014-05-02 | 2015-03-31 | Beam shaping mask, laser processing device, and laser processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105980098A true CN105980098A (en) | 2016-09-28 |
Family
ID=54358496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580007681.7A Pending CN105980098A (en) | 2014-05-02 | 2015-03-31 | Beam shaping mask, laser processing device, and laser processing method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6533644B2 (en) |
| KR (1) | KR20160146654A (en) |
| CN (1) | CN105980098A (en) |
| TW (1) | TWI669181B (en) |
| WO (1) | WO2015166759A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107385391A (en) * | 2017-07-14 | 2017-11-24 | 京东方科技集团股份有限公司 | Mask plate, oled display substrate and preparation method thereof, display device |
| CN109175718A (en) * | 2018-11-01 | 2019-01-11 | 重庆大学产业技术研究院 | A kind of picture laser carving method based on halftone technique |
| CN113399829A (en) * | 2021-07-09 | 2021-09-17 | 东莞市中麒光电技术有限公司 | Welding device and welding method using same |
| CN113805438A (en) * | 2021-08-30 | 2021-12-17 | 武汉理工大学 | Deep ultraviolet micro projection photoetching parallel manufacturing system and method adopting single-step method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074370B (en) | 2018-06-05 | 2023-03-14 | 伊雷克托科学工业股份有限公司 | Laser processing apparatus, method of operating the same, and method of processing workpiece using the same |
| JP2020175412A (en) * | 2019-04-18 | 2020-10-29 | 株式会社ブイ・テクノロジー | Apparatus for laser lift-off and laser lift-off method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5378137A (en) * | 1993-05-10 | 1995-01-03 | Hewlett-Packard Company | Mask design for forming tapered inkjet nozzles |
| CN2562917Y (en) * | 2002-09-30 | 2003-07-30 | 华中科技大学 | Laser punching device for plaster material |
| CN1435292A (en) * | 2002-01-30 | 2003-08-13 | Uht株式会社 | Laser working component and working device with same |
| JP2009061775A (en) * | 2007-08-09 | 2009-03-26 | Ricoh Co Ltd | Method of manufacturing liquid droplet discharge head, liquid droplet discharge head, liquid droplet discharge device, and image forming apparatus |
| WO2011132601A1 (en) * | 2010-04-20 | 2011-10-27 | 旭硝子株式会社 | Method for manufacturing glass substrate used for forming through-electrode of semiconductor device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6821348B2 (en) | 2002-02-14 | 2004-11-23 | 3M Innovative Properties Company | In-line deposition processes for circuit fabrication |
| US8318536B2 (en) * | 2007-12-31 | 2012-11-27 | Intel Corporation | Utilizing aperture with phase shift feature in forming microvias |
-
2014
- 2014-05-02 JP JP2014095137A patent/JP6533644B2/en active Active
-
2015
- 2015-03-31 KR KR1020167022337A patent/KR20160146654A/en not_active Application Discontinuation
- 2015-03-31 WO PCT/JP2015/060165 patent/WO2015166759A1/en active Application Filing
- 2015-03-31 CN CN201580007681.7A patent/CN105980098A/en active Pending
- 2015-04-29 TW TW104113633A patent/TWI669181B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5378137A (en) * | 1993-05-10 | 1995-01-03 | Hewlett-Packard Company | Mask design for forming tapered inkjet nozzles |
| CN1435292A (en) * | 2002-01-30 | 2003-08-13 | Uht株式会社 | Laser working component and working device with same |
| CN2562917Y (en) * | 2002-09-30 | 2003-07-30 | 华中科技大学 | Laser punching device for plaster material |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20160146654A (en) | 2016-12-21 |
| WO2015166759A1 (en) | 2015-11-05 |
| TWI669181B (en) | 2019-08-21 |
| TW201545829A (en) | 2015-12-16 |
| JP6533644B2 (en) | 2019-06-19 |
| JP2015211978A (en) | 2015-11-26 |
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Application publication date: 20160928 |